Heat dissipation device of infrared detector for spaceflight
By designing the heat dissipation device of the infrared detector for aerospace, using flexible heat dissipation parts and driving components to realize the movement and heat dissipation of the infrared detector, the problem of the infrared detector affecting the imaging due to excessive temperature is solved, improving the detection effect and reducing costs.
Patent Information
- Application Number
- CN202421912070.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-28
- Filing Date
- 2024-08-08
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-08-08
AI Technical Summary
The existing infrared detectors are too high during operation due to long-term high power operation, which affects the imaging accuracy and cannot move, resulting in poor detection results.
A heat dissipation device for an infrared detector for aerospace is designed, including a translation mechanism, a first-level flexible heat dissipation member and a driving component. The heat of the infrared detector is transferred to the translation mechanism and the driving component through the flexible heat dissipation member, and the detector is driven to move through the driving component to achieve two-dimensional movement and heat dissipation.
While detecting the movement of infrared detectors, heat is discharged in time, ensuring the stability and imaging effect of the detector, reducing material and emission costs, and adapting to the needs of miniaturization of satellites.
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Figure CN223231466U_ABST
Abstract
Description
[0001] The utility model relates to a heat dissipation device for an infrared detector for aerospace use. This application claims priority. The application number of the prior application is: 202421509140.7, and the title is: A heat dissipation device and monitoring system for an infrared detector for aerospace use. The priority date is: 2024-6-28. Technical Field
[0002] The utility model relates to the technical field of star sensors, in particular to a heat dissipation device for aerospace infrared detectors. Background Art
[0003] With the continuous development of aerospace technology, people's exploration of space is increasingly moving towards deep space, which requires accurate spatial positioning information. Currently, astronomical navigation is mainly used to measure celestial bodies for carrier orientation and navigation. It has many advantages such as high measurement accuracy, no interference, no time drift, and high reliability.
[0004] Among them, astronomical navigation sensor star measurement technology is the key to achieving high-precision, all-day navigation. Star measurement sensors (star sensors) generally use infrared detectors. The fixed image noise generated by the imaging of this type of detector is caused by the uneven dark current of each pixel in the sensor. However, this type of infrared detector needs to operate at high power for a long time during operation, resulting in excessively high temperature of the infrared detector, which has an adverse effect on its imaging accuracy. In the existing technology, most infrared detectors are installed on heat dissipation brackets. However, due to space limitations, the heat dissipation effect is poor, and the infrared detector cannot be moved relative to the heat dissipation bracket, which has an adverse effect on the detection effect of the infrared detector.
[0005] Therefore, the present invention is dedicated to providing a heat dissipation device for an aerospace infrared detector to solve the above problems. Utility Model Content
[0006] The purpose of the utility model is to provide a heat dissipation device for an infrared detector for aerospace use. The heat dissipation device has a simple structure and an ingenious design. While ensuring that the infrared detector moves to perform detection work, it also realizes the heat dissipation of the infrared detector, improves the heat dissipation of the infrared detector when working on the move, and thus improves the imaging effect of the infrared detector.
[0007] The technical solutions provided by this utility model are as follows:
[0008] A heat dissipation device for an aerospace infrared detector, comprising:
[0009] Translation mechanism.
[0010] A first-level flexible heat sink, the first-level flexible heat sink includes a mounting part and a first-level conductive belt, connecting parts are provided at both ends of the first-level conductive belt in the length direction, the mounting part is provided on the first-level conductive belt, the connecting part is used to connect with the end of the translation mechanism to set the first-level flexible heat sink on the translation mechanism, and the mounting part of the first-level flexible heat sink is provided with a mounting surface for placing an infrared detector, which is used to conduct the heat of the infrared detector to the translation mechanism.
[0011] A driving assembly is arranged on the lower end surface of the translation mechanism to drive the translation mechanism to move, thereby driving the infrared detector to move, and the mounting member is arranged on a side of the translation mechanism away from the driving assembly.
[0012] A secondary flexible heat sink is used to connect the translation mechanism and the drive assembly to conduct the heat collected by the translation mechanism to the drive assembly.
[0013] In some embodiments, the mounting member includes a mounting frame disposed above the primary thermal conductive belt and a thermal conductive pressure plate disposed below the primary thermal conductive belt.
[0014] The heat-conducting pressure plate is suitable for snap-fitting with the mounting frame to set the mounting part on the primary heat-conducting belt. The side of the mounting frame away from the heat-conducting pressure plate is the mounting surface. The heat-conducting pressure plate is connected and fixed to the end of the translation mechanism away from the driving assembly.
[0015] In some embodiments, the primary thermal conductive tape has two spaced-apart bending portions in the length direction to form a protrusion between the two bending portions, and the protrusion extends into the mounting frame and contacts the infrared detector located on the mounting surface.
[0016] In some embodiments, the mounting member further includes an elastic gasket, which is disposed between the heat-conducting pressure plate and the primary heat-conducting belt.
[0017] In some embodiments, the translation mechanism includes a first translation frame and a second translation frame spaced apart below the first translation frame, the two ends of the primary thermal conductive belt in the length direction are connected to the two ends of the second translation frame through the connecting members, and the side of the first translation frame away from the second translation frame is connected and fixed to the mounting member of the primary flexible heat sink, so that the first translation frame can move along the length direction of the primary flexible heat sink.
[0018] In some embodiments, the secondary flexible heat sink is used to connect the second translation frame and the driving assembly, and the second translation frame is suitable for moving along the width direction of the primary flexible heat sink.
[0019] In some embodiments, the drive assembly includes a mounting seat, and a first drive member and a second drive member arranged on the mounting seat, the mounting seat is movably arranged below the second translation frame, and the first drive member is transmission-connected to the first translation frame to drive the first translation frame to move along the length direction of the primary thermal conductive belt.
[0020] The second driving member is in transmission connection with the second translation frame member, and is used to drive the second translation frame member to move along the width direction of the primary thermal conductive belt.
[0021] In some embodiments, the secondary flexible heat dissipation element includes two secondary thermal conductive strips, which are arranged at both ends of the primary thermal conductive strip in a width direction to connect the second translation frame and the driving assembly.
[0022] In some embodiments, the driving assembly further includes a heat dissipation base plate disposed at an end of the mounting base away from the second translation frame.
[0023] One end of the secondary thermal conductive belt is connected to the second translation frame, and the other end of the secondary thermal conductive belt is connected to the heat dissipation base plate.
[0024] The heat dissipation device for aerospace infrared detectors provided by the utility model has the following beneficial effects:
[0025] 1. The utility model provides a heat dissipation device for an aerospace infrared detector. The heat dissipation device for an aerospace infrared detector is achieved by arranging the infrared detector on the upper end surface of a first-level flexible heat dissipation member, and connecting the two ends of the first-level conductive belt of the first-level flexible heat dissipation member in the length direction to the translation mechanism through a connecting member. The second-level flexible heat dissipation member is used to connect the translation mechanism and the driving assembly, so that the heat generated by the infrared detector is transferred to the translation mechanism through the first-level flexible heat dissipation member, and the heat transferred to the translation mechanism is further transferred to the driving assembly through the second-level flexible heat dissipation member. The driving assembly can drive the infrared detector to move. While realizing the movement of the infrared detector, the heat generated by the infrared detector can also be discharged in time, thereby ensuring the stability and reliability of the infrared detector and meeting the imaging requirements of the infrared detector.
[0026] 2. The utility model provides a heat dissipation device for an infrared detector for aerospace use. The infrared detector can be directly installed on the heat dissipation device. The structure is simple and does not require additional connecting devices. It reduces material costs and also reduces satellite launch costs.
[0027] 3. The utility model provides a heat dissipation device for an aerospace infrared detector, in which a first translation frame is arranged at intervals on the upper end surface of a second translation frame, and both ends of the length direction of a primary thermal conductive tape are arranged at both ends of the second translation frame. The primary thermal conductive tape has good flexibility, so that the first translation frame and the infrared detector can move along the length direction of the primary thermal conductive tape, and the second translation frame moves along the width direction of the primary thermal conductive tape, which can drive the first translation frame and the infrared detector to move along the width direction of the primary thermal conductive tape, thereby realizing two-dimensional movement of the infrared detector, with higher flexibility, and further meeting the detection requirements of the infrared detector.
[0028] 4. The utility model provides a heat dissipation device for an aerospace infrared detector. A protrusion is formed between the two bent parts of the primary thermal conductive belt, so that the protrusion is in full contact with the infrared detector, ensuring the heat dissipation effect of the primary thermal conductive belt and further improving the heat dissipation effect of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The preferred implementation scheme will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of this solution.
[0030] Figure 1 This is a schematic structural diagram of a heat dissipation device for an aerospace infrared detector provided by the utility model;
[0031] Figure 2 This is a structural schematic diagram of a first-level flexible heat sink of a heat dissipation device for an aerospace infrared detector provided by the utility model;
[0032] Figure 3 This is an exploded view of a first-level flexible heat sink of a heat dissipation device for an aerospace infrared detector provided by the utility model;
[0033] Figure 4 This is a front view of a heat dissipation device for an aerospace infrared detector provided by the utility model;
[0034] Figure 5 The utility model is a schematic diagram of a module of a monitoring system for a heat dissipation device of an aerospace infrared detector.
[0035] Description of Figure Numbers:
[0036] Translation mechanism 1, first translation frame 11, second translation frame 12;
[0037] Primary flexible heat sink 2, mounting member 21, mounting frame 211, heat-conducting pressure plate 212, elastic gasket 213, primary heat-conducting belt 22, bending portion 221, protruding portion 222, connecting member 223, first pressure plate 23;
[0038] Drive assembly 3, mounting base 31, heat dissipation base plate 32;
[0039] Secondary flexible heat sink 4, secondary heat conducting belt 41, second pressing plate 42;
[0040] Infrared detector 5;
[0041] Control module 61 , first acquisition module 62 , second acquisition module 63 , third acquisition module 64 , first calculation module 65 , second calculation module 66 , processing module 67 . DETAILED DESCRIPTION
[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without inventive work.
[0043] To simplify the drawings, only the parts relevant to the present invention are schematically shown in each figure. They do not represent the actual structure of the product. In addition, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically depicted or labeled. In this document, "one" not only means "only one" but also "more than one."
[0044] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.
[0045] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0046] In one embodiment, a heat dissipation device for an aerospace infrared detector is described, which can not only enable the infrared detector 5 to move to ensure detection by the infrared detector 5, but also promptly discharge the heat generated by the infrared detector 5 during operation, reduce heat accumulation, and thus ensure the imaging requirements of the infrared detector 5.
[0047] Specifically, see the accompanying drawings Figures 1 to 4A heat dissipation device for an aerospace infrared detector includes a translation mechanism 1, a primary flexible heat sink 2, a secondary flexible heat sink 4, and a drive assembly 3. The primary flexible heat sink 2 is located on the translation mechanism 1 and is provided with a mounting surface for mounting an infrared detector 5, thereby mounting the infrared detector 5 on the primary flexible heat sink 2. The primary flexible heat sink 2 includes a mounting member 21 and a primary heat conducting belt 22. The primary heat conducting belt 22 has connecting members 223 at both ends of its length, and the connecting members 223 are used to connect to the ends of the translation mechanism 1 to mount the primary flexible heat sink 2 on the translation mechanism 1. Accordingly, the mounting member 21 is disposed on the primary heat conducting belt 22, and the mounting surface is disposed on the mounting member 21, thereby mounting the infrared detector 5 on the mounting member 21. Heat generated by the infrared detector 5 during operation can be transferred to the primary flexible heat sink 2, and then transferred to the translation mechanism 1 through the primary flexible heat sink 2.
[0048] Accordingly, the drive assembly 3 is disposed on the lower end surface of the translation mechanism 1 to drive the translation mechanism 1, and thereby drive the infrared detector 5 to move, thereby adjusting the position of the infrared detector 5 and adjusting the detection area of the infrared detector 5. Furthermore, a secondary flexible heat sink 4 connects the translation mechanism 1 and the drive assembly 3, so that heat transferred from the infrared detector 5 to the translation mechanism 1 is then transferred to the drive assembly 3 via the secondary flexible heat sink 4, thereby achieving secondary heat dissipation of the infrared detector 5.
[0049] In existing technologies, aerospace infrared detectors are often mounted on dedicated brackets that are heat-dissipating. This allows the heat generated by the infrared detector 5 during operation to be dissipated through the brackets. However, the infrared detector 5 needs to move during operation to obtain a wider detection range, and existing technologies often fail to take this into account. As a result, the infrared detector 5 is fixed to the bracket and cannot be moved, significantly reducing the observation effect of the infrared detector 5. Even in some cases where the need for the infrared detector 5 to move is taken into account, a drive assembly is often provided to drive the infrared detector 5 and the bracket together. However, the bracket is bulky and heavy, resulting in a larger and heavier overall device consisting of the drive assembly and infrared detector, which is not conducive to satellite miniaturization.
[0050] In this embodiment, the infrared detector 5 is mounted on the primary flexible heat sink 2 of the heat sink. The drive assembly 3 drives the translation mechanism 1, which in turn drives the infrared detector 5. This eliminates the need to move both the infrared detector 5 and the heat sink together. This reduces the size and weight of the heat sink, enables mobile detection by the infrared detector 5, ensures the detection effectiveness of the infrared detector 5, and facilitates the miniaturization of devices such as satellites. Furthermore, the heat generated by the infrared detector 5 during operation is transferred sequentially to the drive assembly 3 via the primary flexible heat sink 2 and the secondary flexible heat sink 4, achieving two-stage heat dissipation and improving heat transfer and dissipation efficiency. This allows the infrared detector 5 to maintain a stable temperature range, meeting the temperature requirements for optimal imaging.
[0051] In one embodiment, see the accompanying drawings Figure 1 This embodiment further describes the translation mechanism 1. The translation mechanism 1 includes a first translation frame 11 and a second translation frame 12, with the first translation frame 11 spaced apart from the upper end surface of the second translation frame 12, and the first and second translation frames 12 are not in contact with each other. Accordingly, the two ends of the first flexible heat sink 2 in the longitudinal direction are disposed opposite each other at the two ends of the second translation frame 12, and the side of the first translation frame 11 away from the second translation frame 12 is connected to the first flexible heat sink 2 (the middle of the first flexible heat sink 2 is connected), so that the portion of the first flexible heat sink 2 facing the infrared detector 5 is fixed to the side of the first translation frame 11 away from the second translation frame 12. It is understood that by spacing the first and second translation frames 11 and providing a certain degree of flexibility to the first flexible heat sink 2, the first translation frame 11 can be moved relative to the second translation frame 12 along the longitudinal direction of the first flexible heat sink 2, thereby driving the infrared detector 5 to move along the longitudinal direction of the first flexible heat sink 2.
[0052] In addition, the second translation frame 12 is movably arranged on the upper end surface of the driving assembly 3, and the secondary flexible heat sink 4 is used to connect the second translation frame 12 and the driving assembly 3, so that the heat transferred from the infrared detector 5 to the second translation frame 12 through the primary flexible heat sink 2 is transferred to the driving assembly 3 through the secondary flexible heat sink 4.
[0053] Furthermore, the second translation frame 12 is capable of moving along the width of the primary flexible heat sink 2. After the second translation frame 12 moves a certain distance along the width of the primary flexible heat sink 2, it drives the first translation frame 11 and the infrared detector 5 to move along the width of the primary flexible heat sink 2. Therefore, installing the infrared detector 5 on this heat sink device allows the infrared detector 5 to move along the length and width of the primary flexible heat sink 2, facilitating the adjustment of the infrared detector 5's position and thus its detection range.
[0054] Furthermore, this embodiment further explains the driving component 3. Figure 4 The driving assembly 3 includes a mounting base 31, a first driving member, and a second driving member, and the first driving member and the second driving member are arranged on the mounting base 31. The mounting base 31 is movably arranged on the lower end surface of the second translation frame 12, and the first driving member is transmission-connected with the first translation frame 11 to drive the first translation frame 11 to move along the length direction of the primary flexible heat sink 2. The second driving member is transmission-connected with the second translation frame 12 to drive the second translation frame 12 to move along the width direction of the primary flexible heat sink 2.
[0055] Specifically, the lower end surface of the second translation frame 12 is provided with two oppositely arranged sliding rails, and the two sliding rails are located at both ends of the length direction of the first-level flexible heat dissipation member 2. Each sliding rail is extended along the width direction of the first-level flexible heat dissipation member 2. The mounting seat 31 is close to one end of the second translation frame 12 and is provided with a slider that cooperates with the sliding rail. The slider is set in the sliding rail so that the second translation frame 12 can move along the width direction of the first-level flexible heat dissipation member 2.
[0056] Further, see the accompanying drawings Figure 4 The driving assembly 3 also includes a heat dissipation base plate 32, which is arranged at one end of the mounting seat 31 away from the second translation frame 12, and one end of the secondary flexible heat dissipation element 4 is connected to the second translation frame 12, and the other end of the secondary flexible heat dissipation element 4 is connected to the heat dissipation base plate 32, so that the heat generated by the infrared detector 5 is transferred to the heat dissipation base plate 32 after passing through the action of the primary flexible heat dissipation element 2 and the secondary flexible heat dissipation element 4. The setting of the heat dissipation base plate 32 can timely disperse the heat transferred to the secondary flexible heat dissipation element 4, and timely cool the primary flexible heat dissipation element 2 and the secondary flexible heat dissipation element 4, thereby ensuring the heat dissipation effect of the primary flexible heat dissipation element 2 and the secondary flexible heat dissipation element 4.
[0057] In one embodiment, see the accompanying drawings Figures 2 to 4 , this embodiment further illustrates the primary flexible heat sink 2. The primary flexible heat sink 2 includes a mounting member 21 and a primary heat conducting belt 22. The two ends of the primary heat conducting belt 22 in the length direction are connecting members 223, and the connecting members 223 are used to connect with the two opposite ends of the second translation frame 12. Correspondingly, the mounting member 21 is arranged on the primary heat conducting belt 22 and is arranged opposite to the first translation frame 11. The infrared detector 5 is arranged on the side of the mounting member 21 away from the first translation frame 11, and the mounting member 21 is suitable for snap-fitting with the first translation frame 11, so that the middle part of the primary flexible heat sink 2 is mounted on the first translation frame 11, and the connecting member 223 on the primary flexible heat sink 2 is fixed on the second translation frame 12, thereby driving the infrared detector 5 to move when the first translation frame 11 moves.
[0058] The infrared detector 5 and the mounting member 21 can be fixed by screws, and the mounting member 21 and the first translation frame member 11 can also be fixed by screws. Of course, in actual production applications, other structures can also be used to achieve the purpose of connecting and fixing the infrared detector 5, the mounting member 21 and the first translation frame member 11. They are not explained one by one here, and they are all within the protection scope of this utility model.
[0059] It should be pointed out that the connecting parts 223 at both ends of the primary thermal conductive belt 22 in the length direction are set as the first pressure plate 23. The first pressure plate 23 has a certain rigidity and can serve as a force support point. Through holes are set on the second translation frame 12, the first pressure plate 23 and the primary thermal conductive belt 22, and the three are connected and fixed by bolts.
[0060] Furthermore, the mounting member 21 includes a mounting frame 211 and a heat-conducting pressure plate 212. The mounting frame 211 is disposed above the primary heat-conducting belt 22, and the heat-conducting pressure plate 212 is disposed below the primary heat-conducting belt 22. The heat-conducting pressure plate 212 is adapted to engage with the mounting frame 211, thereby positioning the central portion of the primary heat-conducting belt 22 between the mounting frame 211 and the heat-conducting pressure plate 212, thereby achieving a secure connection between the mounting member 21 and the primary heat-conducting belt 22. Furthermore, a side of the mounting frame 211 away from the heat-conducting pressure plate 212 is provided as a mounting surface, allowing the infrared detector 5 to be mounted on the mounting surface of the mounting frame 211. The heat-conducting pressure plate 212 is connected and secured to the first translation frame 11, thereby achieving secure connection between the mounting member 21 and the first translation frame 11.
[0061] It can be understood that the heat generated by the infrared detector 5 is transferred to the mounting frame 211 and then to the primary thermal conductive tape 22 .
[0062] Preferably, the primary thermal conductive tape 22 has two oppositely arranged bending portions 221 in the length direction of the primary thermal conductive tape 22 to form a protrusion 222 between the two bending portions 221 of the primary thermal conductive tape 22. When the primary thermal conductive tape 22 is set between the mounting frame 211 and the thermal conductive pressure plate 212, the protrusion 222 can extend into the interior of the mounting frame 211, so that the protrusion 222 contacts the infrared detector 5 located on the mounting surface.
[0063] It should be pointed out that when the mounting member 21 is arranged on the primary thermal conductive tape 22, the protrusion 222 of the primary thermal conductive tape 22 can directly contact the infrared detector 5, so that the heat of the infrared detector 5 can not only be transferred to the primary thermal conductive tape 22 through the mounting frame 211, but also be directly transferred to the protrusion 222, and then transferred to the second translation frame 12 through the end of the primary thermal conductive tape 22.
[0064] In addition, see the accompanying drawings Figure 3The present embodiment further describes the mounting member 21, which further includes an elastic gasket 213 disposed between the heat-conducting pressure plate 212 and the primary heat-conducting belt 22. The provision of the elastic gasket 213 can protect the primary heat-conducting belt 22.
[0065] Preferably, the elastic gasket 213 can be made of silicone material. Silicone material has good thermal conductivity and certain elasticity, and can play a role in buffering and shock absorption. Other materials can also be used in actual production applications. They are not described one by one here, and they are all within the protection scope of this utility model.
[0066] In one embodiment, see the accompanying drawings Figures 1 to 3 This embodiment further describes the secondary flexible heat sink 4. The secondary flexible heat sink 4 includes two secondary heat conducting belts 41, which are disposed at both ends of the primary flexible heat sink 2 in the width direction. One end of each secondary heat conducting belt 41 is fixedly connected to the second translation frame 12, and the other end of each secondary heat conducting belt 41 is fixedly connected to the heat dissipation base plate 32.
[0067] In addition, a second pressure plate 42 is provided at both ends of the length direction of each secondary conductive belt 41. The second pressure plate 42 also has a certain rigidity to provide a force support point. The second pressure plate 42 and the second translation frame 12 and the heat dissipation base plate 32 can be fixed by bolt connection.
[0068] Preferably, the end of the protrusion 222 away from the first translation frame 11 is provided with thermally conductive grease, and the connection between the primary heat conductive belt 22 and the second translation frame 12 is also provided with thermally conductive grease. The thermally conductive grease has high thermal conductivity and can quickly transfer the heat generated by the infrared detector 5 to the heat dissipation base plate 32.
[0069] In one embodiment, see Figure 5 This embodiment provides a monitoring system for a heat dissipation device of an aerospace infrared detector, including a control module 61, a first acquisition module 62, a second acquisition module 63, a third acquisition module 64, a first calculation module 65, a second calculation module 66 and a processing module 67, as well as a heat dissipation device for an aerospace infrared detector described in any of the above embodiments.
[0070] The heat dissipation device of the aerospace infrared detector includes a first-level flexible heat dissipation member 2, a second-level flexible heat dissipation member 4, a mounting seat 31, a heat dissipation base plate 32, a first translation frame member 11 and a second translation frame member 12. The first translation frame member 11, the second translation frame member 12, the mounting seat 31 and the heat dissipation base plate 32 are arranged in sequence from top to bottom.
[0071] The control module 61 is used to preset the working power consumption Q of the infrared detector and control the driving component to drive the infrared sensor to move;
[0072] A first acquisition module 62 is used to acquire the temperature of the infrared detector 5;
[0073] A second acquisition module 63 is used to acquire the temperature of the second translation frame 12;
[0074] A third acquisition module 64 is used to obtain the temperature of the heat dissipation base plate 32;
[0075] The first calculation module 65 is used to calculate the heat conduction Q of the first-level flexible heat sink 2 according to the temperature of the infrared detector 5 and the temperature of the second translation frame 12. A ;
[0076] The second calculation module 66 is used to calculate the heat conduction Q of the secondary flexible heat dissipation element 4 according to the temperature of the second translation frame 12 and the temperature of the heat dissipation base plate 32. B ;
[0077] The processing module 67 is used to convert the heat conduction Q of the first-level flexible heat sink 2 into A , the heat conduction Q of the secondary flexible heat sink 4 B Compare with the preset Q working power consumption of the infrared detector 5 to obtain the heat value absorbed by the heat dissipation device of the aerospace infrared detector. This heat value is used for users to judge the working status of the infrared detector and the heat dissipation effect of the heat dissipation device of the aerospace infrared detector.
[0078] It is understood that the power consumption of the infrared detector 5 mainly includes the power consumption of the detector itself and the power consumption of the TEC inside the detector body. The power consumption of the infrared detector 5 is set by the control module 61, and the operating power consumption of the infrared detector 5 is set to Q. Then, the drive component 3 is controlled to drive the infrared detector 5 to move. The first acquisition module 62 is used to obtain the temperature of the infrared detector, the second acquisition module 63 is used to obtain the temperature of the second translation frame 12, and the third acquisition module 64 is used to obtain the temperature of the heat dissipation base plate 32. The first calculation module 65 then calculates the heat conduction Q of the primary flexible heat dissipation element 2 based on the temperature of the infrared detector 5 and the temperature of the second translation frame 12. A Then, the heat conduction Q of the secondary flexible heat sink 4 is calculated by the temperature of the second translation frame 12 and the temperature of the heat sink bottom plate 32. B .
[0079] It should be noted that the temperature of the infrared detector 5, the temperature of the second translation frame 12 and the temperature of the heat dissipation base plate 32 can be the temperature during the movement of the infrared detector 5, and the Q obtained by the first calculation module 65 A is the heat conduction of the first-level flexible heat sink 2 in a certain working period, and the Q obtained by the second calculation module 66 is BThe heat conduction of the secondary flexible heat sink 4 during a specific operating period can be measured and calculated multiple times to accurately reflect the heat dissipation effect of the primary and secondary flexible heat sinks 2 and 4 during the operation of the infrared detector 5, thereby enabling monitoring of the heat dissipation device. Furthermore, the temperature of the infrared detector 5, the temperature of the second translation frame 12, and the temperature of the heat dissipation base plate 32 can also be the temperature after the infrared detector 5 stops operating. The first and second calculation modules 65 and 66 can then reflect the overall heat dissipation effect of the infrared detector 5 after it stops operating.
[0080] Moreover, in Q A and Q B After the calculation is completed, the heat conduction Q of the first-level flexible heat sink 2 is calculated by the processing module 67. A , the heat conduction Q of the secondary flexible heat sink 4 B Comparing with the preset Q working power consumption of the infrared detector 5 can reflect the heat absorbed by the heat sink 5 under the action of the heat sink, so that the staff can judge the working status of the infrared detector 5 and the heat dissipation effect of the heat sink.
[0081] Furthermore, assuming that the temperature of the infrared detector 5 is T1, the temperature of the second translation frame 12 is T2, and the temperature of the heat dissipation base 32 is T3, the contact area between the infrared detector 5 and the primary flexible heat dissipation element 2 is Aa, the contact heat transfer coefficient is Ka, the distance between the infrared detector 5 and the second translation frame 12 is La, the contact area between the second translation frame 12 and the drive assembly 3 is Ab, the contact heat transfer coefficient is Kb, and the distance between the second translation frame 12 and the heat dissipation base 32 is Lb, the heat conduction Q of the primary flexible heat dissipation element 2 can be obtained. A The calculation formula is:
[0082] Q A =[Aa*Ka*(T1-T2)] / La.
[0083] Furthermore, the heat conduction capacity Q of the secondary flexible heat sink 4 is B The calculation formula is:
[0084] Q B =[Ab*Kb*(T2-T3)] / Lb.
[0085] It should be noted that the above embodiments can be freely combined as needed. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention, and such improvements and modifications should also be considered as the scope of protection of the present invention.
Claims
1. A heat dissipation device for an aerospace infrared detector, characterized in that: include: Translation mechanism; A primary flexible heat sink, comprising a mounting member and a primary conductive belt, with connecting members provided at both ends of the primary conductive belt in the longitudinal direction, the mounting member being provided on the primary conductive belt, the connecting member being used to connect to the end of the translation mechanism so as to place the primary flexible heat sink on the translation mechanism, the mounting member of the primary flexible heat sink being provided with a mounting surface for placing an infrared detector, so as to conduct heat from the infrared detector to the translation mechanism; A driving assembly, the driving assembly being arranged on the lower end surface of the translation mechanism, for driving the translation mechanism to move, thereby driving the infrared detector to move, and the mounting member being arranged on a side of the translation mechanism away from the driving assembly; A secondary flexible heat sink is used to connect the translation mechanism and the drive assembly to conduct the heat collected by the translation mechanism to the drive assembly.
2. The heat dissipation device for aerospace infrared detector according to claim 1, characterized in that: The mounting member includes a mounting frame arranged above the primary heat-conducting belt and a heat-conducting pressure plate arranged below the primary heat-conducting belt; The heat-conducting pressure plate is suitable for snap-fitting with the mounting frame to set the mounting part on the primary heat-conducting belt. The side of the mounting frame away from the heat-conducting pressure plate is the mounting surface. The heat-conducting pressure plate is connected and fixed to the end of the translation mechanism away from the driving assembly.
3. The heat dissipation device for aerospace infrared detector according to claim 2, characterized in that: The primary thermal conductive belt has two spaced-apart bending portions in the length direction to form a protrusion between the two bending portions. The protrusion extends into the installation frame and contacts the infrared detector located on the installation surface.
4. The heat dissipation device for aerospace infrared detector according to claim 2, characterized in that: The mounting member further includes an elastic gasket, which is arranged between the heat-conducting pressure plate and the primary heat-conducting belt.
5. The heat dissipation device for aerospace infrared detector according to claim 4, characterized in that: The translation mechanism includes a first translation frame and a second translation frame arranged at an interval below the first translation frame. The two ends of the primary thermal conductive belt in the length direction are connected to the two ends of the second translation frame through the connecting members, and the side of the first translation frame away from the second translation frame is connected and fixed to the mounting member of the primary flexible heat dissipation member so that the first translation frame can move along the length direction of the primary flexible heat dissipation member.
6. The heat dissipation device for aerospace infrared detector according to claim 5, characterized in that: The secondary flexible heat sink is used to connect the second translation frame and the driving assembly, and the second translation frame is suitable for moving along the width direction of the primary flexible heat sink.
7. The heat dissipation device for aerospace infrared detector according to claim 6, characterized in that: The driving assembly includes a mounting seat, and a first driving member and a second driving member provided on the mounting seat, wherein the mounting seat is movably provided below the second translation frame member, and the first driving member is in transmission connection with the first translation frame member to drive the first translation frame member to move along the length direction of the primary thermal conductive belt; The second driving member is in transmission connection with the second translation frame member, and is used to drive the second translation frame member to move along the width direction of the primary thermal conductive belt.
8. The heat dissipation device for aerospace infrared detector according to claim 7, characterized in that: The secondary flexible heat dissipation element includes two secondary thermal conductive belts, which are arranged at both ends of the primary thermal conductive belt in the width direction to connect the second translation frame and the driving assembly.
9. The heat dissipation device for aerospace infrared detector according to claim 8, characterized in that: The driving assembly further comprises a heat dissipation base plate provided at an end of the mounting base away from the second translation frame; One end of the secondary thermal conductive belt is connected to the second translation frame, and the other end of the secondary thermal conductive belt is connected to the heat dissipation base plate.