Nozzle

Abstract

The utility model provides a nozzle which is communicated with an air hole at the bottom of a wafer box, and a machine table can inflate or exhaust the wafer box through the nozzle. The nozzle comprises a base, a connecting part and a bearing part. The base comprises a base body, a vent hole and an embedding part, the vent hole penetrates through the base body, the embedding part is arranged in the base body, and the embedding part is connected to the machine table in a sleeved mode. The bearing part comprises a bearing part body, a through hole, an inner ring and an outer ring, the bearing part body is provided with the through hole, the through hole is communicated with the vent hole, the bearing part body is connected with the base through the connecting part, and the inner ring and the outer ring are arranged on the top face of the bearing part body and are in butt joint with the wafer box. The inner ring, the outer ring, the through hole and the vent hole respectively take the central axis of the nozzle as the center, the position of the outer ring is far away from the through hole relative to the position of the inner ring, and the inner ring height of the inner ring closest to the through hole is higher than the outer ring height of the outer ring.

Description

Technical Field

[0001] The utility model relates to a nozzle, in particular to a nozzle used for performing gas exchange on a wafer carrier. Background Art

[0002] Manufacturers utilize nozzles on specialized machines that connect to wafer cassettes to exchange gas within the cassette, ensuring the cassette is fully filled with air. Currently, most commercially available cassettes are made of plastic, which can deform over time, increasing geometric tolerances. This can prevent the nozzles from fitting tightly against the cassette's air inlet, leading to gas leakage.

[0003] Furthermore, the weight of the wafer cassette varies depending on the process, resulting in different conditions for each wafer cassette used. Since the nozzle is attached to the bottom of the wafer cassette, the pressure on the nozzle varies depending on the weight of the wafer cassette. However, if nozzles are manufactured to accommodate different weights of wafer cassettes for each process, it will be time-consuming and wasteful. However, if the same specification nozzle is used, it may not be able to match and withstand the heavier wafer cassette, causing the nozzle to deform. This will also cause geometric tolerances in the nozzle, making it impossible for the nozzle to fit tightly with the wafer cassette's air inlet.

[0004] To address the above issues, even using materials with enhanced sealing performance cannot overcome the geometric tolerances between the wafer box and the nozzle, as well as the weight differences of the wafer box. A pressure control system may be used, but this requires additional circuit design. In addition, the existing nozzle does not have a structure that can adapt to the different shapes and sizes of wafer boxes and the different weight distributions. Utility Model Content

[0005] The purpose of the utility model is to provide a nozzle which can improve the airtightness of the connection between the nozzle and the wafer box.

[0006] The utility model provides a nozzle, which is used to be set on a machine, and the machine is used to support a wafer box, and the nozzle can be connected to the air hole at the bottom of the wafer box, and the machine can inflate or exhaust the wafer box through the nozzle. The nozzle includes a base, a connecting portion, and a receiving portion. The base includes a base body, a vent, and a fitting portion. The vent is provided in the base body, and the fitting portion is provided inside the base body. The fitting portion is used to be sleeved and provided on the machine. The receiving portion includes a receiving portion body, a through hole, an inner ring, and an outer ring. The receiving portion body is provided with a through hole, and the through hole is connected to the vent hole. The opposite ends of the receiving portion body are respectively provided with a bottom surface and a top surface. The bottom surface of the receiving portion body is connected to the base via the connecting portion. The inner ring and the outer ring are respectively provided on the top surface of the receiving portion body. The inner ring and the outer ring are used to dock the wafer box. The nozzle is defined by a central axis, and the inner ring, outer ring, perforation and vent are respectively centered on the central axis. The position of the outer ring is farther away from the position of the perforation relative to the position of the inner ring, and the height of the inner ring closest to the perforation is higher than the height of the outer ring.

[0007] In one embodiment of the present invention, the connecting portion is necked relative to the receiving portion or the base.

[0008] In one embodiment of the present invention, the receiving portion and the connecting portion are integrally formed.

[0009] In an embodiment of the present invention, the connecting portion has an inner diameter and an outer diameter relative to the central axis, and a ratio of the outer diameter to the inner diameter ranges from 0.6 to 0.9.

[0010] In an embodiment of the present invention, an inner surface of the connecting portion is flush with an inner surface of the through hole.

[0011] In one embodiment of the present invention, the inner ring and the outer ring are respectively formed by the top surface protruding and extending in a direction away from the base, so that the inner ring has an inner ring height, and the outer ring has the outer ring height.

[0012] In one embodiment of the present invention, the height of the inner ring is higher than the height of the outer ring by a range of 0.1 mm to 0.6 mm.

[0013] In an embodiment of the present invention, the receiving portion includes a groove, and the groove is located between the outer ring and the inner ring.

[0014] In one embodiment of the present invention, the height of the outer ring is higher than that of the groove by a range of 0.6 mm to 1.2 mm.

[0015] In one embodiment of the present invention, the inner ring has a first height to a bottom surface of the base body, and the outer ring has a second height to the bottom surface of the base body. The first height and the second height have a height ratio, and the range of the height ratio is between 1.01 and 1.11.

[0016] In one embodiment of the present invention, the diameter of the engaging portion is not equal to the diameter of the through hole.

[0017] In one embodiment of the present invention, the diameter of the engaging portion is larger than the diameter of the through hole.

[0018] Based on the above, the nozzle of the present invention is designed with an inner ring and an outer ring with a height difference. The higher inner ring serves as the main supporting member, and the lower outer ring serves as the secondary supporting member. Through structural coordination, the inner ring is deformed under pressure, and the outer ring can cooperate with the deformation of the inner ring to allow the structures of the inner ring and the outer ring to form a coplanar surface and support the bottom of the wafer box, thereby improving air tightness.

[0019] Furthermore, the connecting portion of the present invention is in a necked-down state relative to one of the receiving portion or the base, so that when the inner ring and the outer ring of the receiving portion are subjected to the pressure of the wafer box, the groove of the connecting portion functions like a universal joint. The horizontal tolerance of the wafer box can be absorbed through the groove of the connecting portion, allowing the inner ring and the outer ring structure to be passively fitted to fit tightly to the bottom of the wafer box, thereby improving the airtightness.

[0020] In order to make the present invention more clearly understood, embodiments are listed below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of an embodiment of a nozzle according to the present invention.

[0022] Figure 2 It is a cross-sectional schematic diagram of an embodiment of a nozzle according to the present invention.

[0023] Figure 3 It is a three-dimensional diagram of an embodiment of a nozzle setting machine according to the present invention.

[0024] Figure 4 FIG2 is a schematic diagram showing an embodiment of a nozzle being assembled in a wafer box and a machine respectively according to the present invention.

[0025] Figure 5 FIG2 is a schematic diagram showing another embodiment of the nozzle being assembled in a wafer box and a machine respectively according to the present invention.

[0026] Figure 6 It is a cross-sectional schematic diagram of another embodiment of the nozzle according to the present invention.

[0027] Figure 7 It is a cross-sectional schematic diagram of another embodiment of the nozzle according to the present invention.

[0028] Explanation of reference numerals: 60 - wafer cassette; 62 - cassette body; 62A, 62B - bottom; 64 - air hole; 70 - machine platform; 72 - wafer cassette carrier; 74 - joint; 76 - neck; 100, 200, 300 - nozzle; 110 - base; 112 - base body; 112A - top surface; 112B - bottom surface; 112C - outer surface; 114 - fitting portion; 114A - structural shape; 120, 220, 320 - connecting portion; 122, 222, 322 - connecting body; 122A, 222A, 322A - inner surface; 122B, 222B, 322B - outer surface; 124 , 224-groove; 130-supporting part; 130C-outer surface; 132-supporting part body; 132A-bottom surface; 132B-top surface; 134-inner ring; 136-outer ring; 138-groove; 324A-first groove; 324B-second groove; AX-center axis; GA-structural shape; H1-vent; H2-through hole; LX-horizontal direction; LY-joining direction; M1-inner ring height; M2-outer ring height; M3-height difference; N11, N12, N13-inner diameter; N21, N22, N23-outer diameter; SA-inner surface; T1-first height; T2-second height. DETAILED DESCRIPTION

[0029] The following examples are illustrated in detail with accompanying figures. However, these examples are not intended to limit the scope of the present invention. Furthermore, the figures are for illustrative purposes only and are not drawn to scale. For ease of understanding, identical components will be designated by the same reference numerals throughout this description.

[0030] The terms “including”, “comprising”, “having”, etc. mentioned in this utility model are open terms, which means “including but not limited to”.

[0031] In the description of each embodiment, when terms such as “first,” “second,” “third,” and “fourth” are used to describe elements, they are only used to distinguish these elements from one another and do not limit the order or importance of these elements.

[0032] In the description of each embodiment, the so-called "coupling" or "connection" may refer to two or more elements making direct physical or electrical contact with each other, or making indirect physical or electrical contact with each other, and "coupling" or "connection" may also refer to two or more elements operating or acting on each other.

[0033] Figure 1 This is a three-dimensional schematic diagram of an embodiment of a nozzle according to the present invention. Figure 1 The nozzle 100 of the present invention is cylindrical in shape and defines a central axis AX. The "central axis" AX generally refers to a specific reference line that indicates the center of symmetry, rotation, or equilibrium of the nozzle 100. The shape of the nozzle 100 can be adjusted based on actual process requirements and the type of machine being used.

[0034] The nozzle 100 of the present invention includes a base 110, a connecting portion 120, and a receiving portion 130. The connecting portion 120 is located between the base 110 and the receiving portion 130, and the connecting portion 120 is necked relative to the receiving portion 130 and the base 110. "Necking," in terms of shape and structural design, generally refers to a component or structure where the cross-section or dimensions of a certain area are reduced, forming a "neck" or relatively slender portion.

[0035] like Figure 1 As shown, the connecting portion 120 is actually a groove on the outer surface of the nozzle 100 , so that the connecting body 122 of the connecting portion 120 is recessed in the outer surface 112C of the base 110 and the outer surface 130C of the receiving portion 130 .

[0036] In addition, the receiving portion 130 is provided with a through hole H2, and an inner ring 134 and an outer ring 136 are provided on the side of the receiving portion 130 away from the base 110, wherein the inner ring 134 and the outer ring 136 are both a ring body of the receiving portion 130, and the inner ring 134 and the outer ring 136 are respectively centered on the central axis AX, so that the inner ring 134 and the outer ring 136 are two concentric circles, the circle with a smaller radius is called the inner ring 134, and the circle with a larger radius is called the outer ring 136. Figure 1 For example, the position of the outer ring 136 is away from the position of the through hole H2 relative to the position of the inner ring 134 .

[0037] In addition, a groove 138 is defined between the outer ring 136 and the inner ring 134 . The surface of the groove 138 is lower than the surface of the outer ring 136 and the surface of the inner ring 134 .

[0038] The nozzle 100 is further structured to further cooperate with Figure 2 , Figure 2 This is a cross-sectional view of an embodiment of a nozzle according to the present invention. Figure 1 and Figure 2 In the cross-section of the nozzle 100, the cross-sectional dimensions of the connecting portion 120 are smaller than those of the receiving portion 130 and the base 110. In one embodiment, the receiving portion 130 and the connecting portion 120 are integrally formed. In other embodiments, the connecting portion 120 can be considered a groove structure on the outer surface 130C of the receiving portion 130.

[0039] The base 110 of the present invention includes a base body 112, a fitting portion 114, and a vent hole H1. The vent hole H1 is provided through the base body 112, centered on the central axis AX. The term "through" refers to a through-hole arrangement such that the vent hole H1 extends through the top surface 112A and the bottom surface 112B of the base body 112. The fitting portion 114 is provided within the base body 112.

[0040] by Figure 2 For example, the fitting portion 114 itself is a part of the vent hole H1, and the fitting portion 114 is a partial inner surface of the vent hole H1, and its shape can be determined according to the actual structure to be joined (such as Figure 4 The engaging portion 74 in the machine 70 shown is adjustable, and the engaging portion 114 does not penetrate the top surface 112A and the bottom surface 112B of the base body 112.

[0041] Furthermore, the cross-section of the outer surface 112C of the base body 112 gradually decreases from the top surface 112A to the bottom surface 112B rather than being equidistant. In other embodiments, the cross-section of the outer surface 112C of the base body 112 is uniform or gradually increases from the top surface 112A to the bottom surface 112B. The structural configuration of the base body 112 can be adjusted based on actual process requirements or to suit the machine type.

[0042] The receiving portion 130 of the present invention includes a receiving portion body 132, a through-hole H2, an inner ring 134, an outer ring 136, and a groove 138. The receiving portion body 132 is provided with a through-hole H2. A bottom surface 132A and a top surface 132B are respectively provided at opposite ends of the receiving portion body 132. The bottom surface 132A of the receiving portion body 132 is connected to the base 110 via the connecting body 122 of the connecting portion 120. The through-hole H2 is axially provided in the receiving portion body 132 along the central axis AX and extends into the interior of the connecting body 122, so that the through-hole H2 is connected to the vent hole H1. The through-hole H2 and the vent hole H1 are respectively centered on the central axis AX, that is, the through-hole H2 and the vent hole H1 share the same central axis AX, but the aperture of the through-hole H2 is not equal to the aperture of the vent hole H1. In one embodiment, the aperture of the interlocking portion 114 is larger than the aperture of the through-hole H2.

[0043] The inner ring 134 and the outer ring 136 are respectively disposed on the top surface 132B of the receiving portion body 132, and the inner ring 134 and the outer ring 136 are respectively formed by protruding from the top surface 132B in a direction away from the base 110, so that the inner ring 134 has an inner ring height M1, and the outer ring 136 has an outer ring height M2. In the present invention, there is a height difference between the inner ring 134 and the outer ring 136, that is, the inner ring height M1 of the inner ring 134 is not equal to the outer ring height M2 of the outer ring 136. Figure 2For example, the inner ring height M1 of the inner ring 134 is higher than the outer ring height M2 of the outer ring 136. In one embodiment, the inner ring height M1 is higher than the outer ring height M2 and has a height difference value M3. The height difference value M3 ranges from 0.1 mm to 0.6 mm, but this range does not limit the present invention.

[0044] Furthermore, the groove 138 is located between the outer ring 136 and the inner ring 134. The bottom of the groove 138 is a portion of the top surface 132B of the receiving portion body 132. In one embodiment, the outer ring height M2 of the outer ring 136 is higher than the bottom surface of the groove 138 in a range of 0.6 mm to 1.2 mm, but this range is not intended to limit the present invention.

[0045] In addition, with respect to the integral nozzle 100, the inner ring 134 has a first height T1 from the bottom surface 112B of the base body 112, and the outer ring 136 has a second height T2 from the bottom surface 112B of the base body 112. The first height T1 and the second height T2 have a height ratio, and the range of the height ratio is between 1.01 and 1.11, but this range does not limit the present invention.

[0046] The connecting portion 120 includes a connecting body 122 and a recess 124. The connecting body 122 is connected between the base 110 and the receiving portion 130. The connecting body 122 has an inner surface 122A and an outer surface 122B that oppose each other. The inner surface 122A of the connecting body 122 is flush with the inner surface SA of the through-hole H2. The outer surface 122B of the connecting body 122 serves as the bottom surface of the recess 124. The outer surface 112C of the base body 112 and the outer surface 130C of the receiving portion 130 each protrude beyond the recess 124.

[0047] In addition, the connecting portion 120 has an inner diameter N11 and an outer diameter N21 relative to the central axis AX. A ratio of the outer diameter N21 to the inner diameter N11 ranges from 0.6 to 0.9, but this range does not limit the present invention.

[0048] Figure 3 For a perspective view of an embodiment of a nozzle setting machine according to the present invention, please refer to Figure 3 The nozzle 100 of the present invention is mounted on a platform 70. The platform 70 includes a wafer cassette carrier 72 for holding a wafer cassette 60. The wafer cassette 60 includes a housing 62 and a plurality of air holes 64. These air holes 64 are located at the bottom of the housing 62 so as to communicate with the interior of the housing 62. To illustrate the nozzle 100, the wafer cassette 60 is shown in dotted lines. The nozzle 100 is connected to the air holes 64 at the bottom of the housing 62 of the wafer cassette 60, and the platform 70 can inflate or exhaust the wafer cassette 60 through the nozzle 100.

[0049] Figure 4 This is a schematic diagram of an embodiment of the nozzle of the present invention being assembled on a wafer box and a machine, illustrating the arrangement relationship between the nozzle 100 and the machine 70, and the arrangement relationship between the nozzle 100 and the bottom 62A of the wafer box 60. Figure 3 and Figure 4 The platform 70 further includes a joint 74 and a neck 76 , wherein the neck 76 is connected between the joint 74 and the wafer box carrier 72 , and the structural shapes of the joint 74 and the neck 76 can be adjusted according to the process requirements.

[0050] The interlocking portion 114 of the present invention is configured to be sleeved onto the joint portion 74 disposed on the machine 70 , and the structural shape 114A of the interlocking portion 114 conforms to the structural shape of the joint portion 74 , where "structural shape" refers to the external shape or structural features of an object, including its geometric features (e.g., shape, size, aspect ratio, etc.). The structural shape GA of a portion of the vent H1 conforms to the structural shape of the neck 76 . Thus, the interlocking portion 114 is sleeved onto the joint portion 74 , and the elasticity of the nozzle 100 material allows the joint portion 74 to be positioned within the interlocking portion 114 . The neck 76 is accommodated within the structural shape GA of the vent H1 , thereby securing the nozzle 100 to the machine 70 .

[0051] When the machine 70 supplies or extracts gas through the vent hole H1 of the nozzle 100, since the vent hole H1 is connected to the through hole H2, gas can flow from the vent hole H1 to the outside of the through hole H2, and gas can be extracted from the vent hole H1, so that the gas outside the through hole H2 flows from the through hole H2 to the vent hole H1 and is extracted into the machine 70. In other embodiments, the neck 76 may not be provided depending on actual circumstances.

[0052] The bottom 62A of the wafer box 60 of the present invention is parallel to a horizontal direction LX. The wafer box 60 moves toward the nozzle 100 in a bonding direction LY, wherein the bonding direction LY is Figure 4 For example, the vertical direction is perpendicular to the horizontal direction LX. The air holes 64 of the wafer cassette 60 are positioned directly opposite the through-hole H2 of the nozzle 100. During bonding, because the inner ring height M1 of the inner ring 134 closest to the through-hole H2 is higher than the outer ring height M2 of the outer ring 136, the inner ring 134 of the nozzle 100 will first approach and rest against the bottom 62A of the wafer cassette 60. When the wafer cassette 60 is bonded to the nozzle 100, the air holes 64 of the wafer cassette 60 will connect to the through-hole H2 of the nozzle 100.

[0053] Furthermore, since the inner ring 134 closest to the through-hole H2 is supported by the bottom 62A of the wafer box 60, if it continues to move toward the joining direction LY, the inner ring 134 is compressed and deformed, resulting in a decrease in the inner ring height M1 of the inner ring 134. At the same time, the outer ring 136 can cooperate with the deformation of the inner ring 134 to form a coplanar shape with the inner ring 134. That is, at this time, the inner ring height M1 of the inner ring 134 will be the same as the outer ring height M2 of the outer ring 136, so that the inner ring 134 and the outer ring 136 are supported by the bottom 62A of the wafer box 60 at the same time, that is, the inner ring 134 serves as the main supporting member, and the outer ring 136 serves as the secondary supporting member. Through structural coordination, the structures of the inner ring 134 and the outer ring 136 are coordinated to form a coplanar shape and support the bottom 62A of the wafer box 60, thereby improving airtightness.

[0054] In this way, when the tool 70 provides gas through the vent hole H1 of the nozzle 100, the gas can flow from the vent hole H1 to the through hole H2, and then to the air hole 64 of the wafer pod 60, thereby inflating the wafer pod 60. Conversely, when the tool 70 extracts gas from the vent hole H1, the internal gas of the wafer pod 60 flows from the air hole 64 to the through hole H2 and the vent hole H1 through the through hole H2, and is extracted into the tool 70. Thus, the tool 70 can inflate or exhaust the wafer pod 60 through the nozzle 100.

[0055] Figure 5 This is a schematic diagram of another embodiment of the nozzle being assembled on a wafer box and a machine according to the present invention. Figure 5 , Figure 5 and Figure 4 The difference is that the wafer box 60 has a positional offset relative to the horizontal direction LX, resulting in horizontal tolerance. However, the connection portion 120 of the present invention is necked relative to either the receiving portion 130 or the base 110. When the inner ring 134 and outer ring 136 of the receiving portion 130 are subjected to pressure from the wafer box 60, the groove 124 of the connection portion 120 functions like a universal joint. The groove 124 of the connection portion 120 can absorb the horizontal tolerance of the wafer box 60, allowing the inner ring 134 and outer ring 136 on the receiving portion body 132 to passively rotate. The nozzle 100 is fitted in a manner such that the inner ring 134 and the outer ring 136 of the nozzle 100 can fit tightly against the bottom 62B of the wafer box 60, thereby improving the airtightness. It is further explained that, in response to the positional deviation of the bottom 62B of the box body 62, in addition to utilizing the elastic deformation of the inner ring 134 and the outer ring 136 to achieve the purpose of airtightness as mentioned above, the elastic deformation of the material of the connecting portion 120 itself can also be used to share the force on the receiving portion 130, thereby increasing the airtightness between the receiving portion 130 and the box body 62.

[0056] Figure 6 This is a cross-sectional view of another embodiment of the nozzle according to the present invention. Figure 6 The nozzle 200 of the present invention is similar to the aforementioned Figure 1 and Figure 2 The difference between the nozzle 100 and the nozzle 100 is that the necking pattern of the connecting portion 220 is different. Figures 3 to 5 100 sets of nozzles for Figure 6 Nozzle 200.

[0057] In this embodiment, the groove 224 in the connecting portion 220 is formed within the nozzle 200, connecting the groove 224 to the through-hole H2 and the vent hole H1. This results in the inner surface 222A of the connecting body 222 in the connecting portion 220 not being flush with the inner surface SA of the through-hole H2, while the outer surface 222B of the connecting body 222 is flush with the outer surface 130C of the receiving portion 130. Furthermore, the connecting portion 220 has an inner diameter N12 and an outer diameter N22 relative to the central axis AX. The ratio of the outer diameter N22 to the inner diameter N12 ranges from 0.6 to 0.9, but this range is not intended to limit the present invention.

[0058] Figure 7 This is a cross-sectional view of another embodiment of the nozzle according to the present invention. Figure 7 The nozzle 300 of the present invention is similar to the aforementioned Figure 1 and Figure 2 Nozzle 100, and Figure 6 The difference between the nozzle 200 and the nozzle 200 is that the necking pattern of the connecting portion 320 is different. Figures 3 to 5 100 sets of nozzles for Figure 7 Nozzle 300.

[0059] In this embodiment, the inner surface 322A of the connecting body 322 of the connecting portion 220 is not flush with the inner surface SA of the through-hole H2, and the outer surface 322B of the connecting body 322 is not flush with the outer surface 130C of the receiving portion 130. This forms a first groove 324A and a second groove 324B. The first groove 324A is provided on the outer surface 322B of the connecting body 322, and the second groove 324B is provided on the inner surface 322A of the connecting body 322, such that the second groove 324B communicates with the through-hole H2 and the vent H1. Furthermore, the connecting portion 320 has an inner diameter N13 and an outer diameter N23 relative to the central axis AX. The ratio of the outer diameter N23 to the inner diameter N13 ranges from 0.6 to 0.9, but this range is not intended to limit the present invention.

[0060] To sum up, the nozzle of the present invention is designed with an inner ring and an outer ring with a height difference. The higher inner ring serves as the main supporting member, while the lower outer ring serves as the secondary supporting member. Through structural coordination, the inner ring is deformed under pressure, and the outer ring can cooperate with the deformation of the inner ring to allow the structures of the inner ring and the outer ring to form a coplanar surface and support the bottom of the wafer box, thereby improving air tightness.

[0061] Furthermore, the connecting portion of the present invention is in a necked-down state relative to one of the receiving portion or the base, so that when the inner ring and the outer ring of the receiving portion are subjected to the pressure of the wafer box, the groove of the connecting portion functions like a universal joint. The horizontal tolerance of the wafer box can be absorbed through the groove of the connecting portion, allowing the inner ring and the outer ring structure to be passively fitted to fit tightly to the bottom of the wafer box, thereby improving the airtightness.

[0062] Although the present invention has been disclosed above by the embodiments, they are not intended to limit the present invention. Any person skilled in the art with ordinary knowledge in the relevant field should be able to make slight changes and modifications without departing from the spirit and scope of the present invention, and they should still fall within the scope of protection of the present invention.

Claims

1. A nozzle, which is used to be set on a machine, the machine is used to support a wafer box, and the nozzle can be connected to the air hole at the bottom of the wafer box, and the machine can inflate or exhaust the wafer box through the nozzle, characterized in that The nozzle includes: A base, comprising a base body, a vent hole, and a fitting portion, wherein the vent hole is provided through the base body, the fitting portion is provided inside the base body, and the fitting portion is used for being sleeved and provided on the machine; a connecting portion; and a receiving portion comprising a receiving portion body, a through-hole, an inner ring, and an outer ring, wherein the receiving portion body is provided with a through-hole connected to the vent hole, a bottom surface and a top surface are respectively provided at opposite ends of the receiving portion body, the bottom surface of the receiving portion body being connected to the base via the connecting portion, the inner ring and the outer ring being respectively provided on the top surface of the receiving portion body, and the inner ring and the outer ring being used to dock with the wafer box; The nozzle is defined by a central axis, and the inner ring, the outer ring, the through-hole and the vent are respectively centered on the central axis. The position of the outer ring is away from the position of the through-hole relative to the position of the inner ring, and the height of an inner ring of the inner ring closest to the through-hole is higher than the height of an outer ring of the outer ring.

2. The nozzle according to claim 1, wherein: The connecting portion is necked relative to the receiving portion or the base.

3. The nozzle according to any one of claims 1 or 2, characterized in that: The receiving portion and the connecting portion are integrally formed.

4. The nozzle according to claim 3, wherein: The connecting portion has an inner diameter and an outer diameter relative to the central axis, and a ratio of the outer diameter to the inner diameter ranges from 0.6 to 0.

9.

5. The nozzle according to claim 3, wherein: An inner surface of the connecting portion is flush with an inner surface of the through hole.

6. The nozzle according to claim 3, wherein: The inner ring and the outer ring are respectively formed by protruding and extending from the top surface in a direction away from the base, so that the inner ring has the inner ring height and the outer ring has the outer ring height.

7. The nozzle according to claim 6, characterized in that: The height of the inner ring is higher than the height of the outer ring by a range of 0.1 mm to 0.6 mm.

8. The nozzle according to claim 7, wherein: The receiving portion includes a groove, and the groove is located between the outer ring and the inner ring.

9. The nozzle according to claim 8, wherein: The height of the outer ring is higher than that of the groove and ranges from 0.6 mm to 1.2 mm.

10. The nozzle according to claim 3, wherein: The inner ring has a first height to a bottom surface of the base body, the outer ring has a second height to the bottom surface of the base body, the first height and the second height have a height ratio, and the range of the height ratio is between 1.01 and 1.

11.

11. The nozzle according to claim 3, wherein: The aperture of the engaging portion is not equal to the aperture of the through hole.

12. The nozzle according to claim 3, wherein: The aperture of the engaging portion is larger than the aperture of the through hole.

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