Glue dipping mechanism
Through the cooperation of Hall sensor and magnetic ring, the problem of inaccurate judgment of the dipping needle and product position in the dipping mechanism is solved, and accurate dipping and efficient continuous dipping are achieved.
Patent Information
- Application Number
- CN202422282579.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-19
AI Technical Summary
In the existing glue dipping mechanism, the relative position of the dipping needle and the product depends on manual judgment, resulting in poor consistency of the glue point and the inability to achieve accurate dipping.
The Hall sensor is used to cooperate with the magnetic ring, and the magnetic field changes when the dipping needle comes into contact with the product, determine the spacing and accurately dip the glue, and combine the low-speed rotation of the glue plate to ensure the continuity of the dipping glue.
The precise alignment between the dipping needle and the product is achieved, ensuring the consistency of the glue point and improving the dipping efficiency and continuity.
Smart Images
Figure CN223234231U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of glue dipping machines, in particular to a glue dipping mechanism. Background Art
[0002] Adhesives are widely used in a variety of fields, from industrial production to crafts. Traditional gluing operations often rely on manual application of glue using simple tools like brushes and cotton swabs, then applying the glue to the workpiece or material surface. However, this manual gluing method has numerous drawbacks.
[0003] Existing semiconductor packaging equipment must first stick silver paste on the frame before pasting the chip. When pasting small chips, only a dipping mechanism can be used. The relative position of the dipping needle and the product is judged by the operator. Because different people have different judgment standards, the consistency of the glue points is poor. In view of this, a dipping mechanism is needed. Utility Model Content
[0004] The purpose of the present utility model is to provide a glue dipping mechanism to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a glue dipping mechanism, comprising a Z-axis fixing frame, a Z-axis motion block being slidably connected to the Z-axis fixing frame, a glue disc fixing frame being fixedly mounted on the outer wall of the Z-axis fixing frame, a first motor being fixedly mounted on the glue disc fixing frame, a glue disc being provided at the bottom of the first motor, the first motor and the glue disc being fixedly connected via a first coupling, and a glue dipping mechanism being provided on the outer wall of the Z-axis motion block.
[0006] Preferably, the glue dipping mechanism includes a fixing frame, and the fixing frame is fixedly mounted on the outer wall of the Z-axis motion block.
[0007] Preferably, a second motor is fixedly mounted on the fixing frame, a rotating shaft is provided at the bottom of the second motor, the second motor and the rotating shaft are fixedly connected via a second coupling, and a Hall sensor is fixedly mounted on the outer wall of the rotating shaft.
[0008] Preferably, a shaft sleeve is fixedly installed on the rotating shaft, a glue needle fixing shaft is slidably passed through the interior of the shaft sleeve, a positioning pin is passed through the interior of the shaft sleeve, a locking nut is threadedly connected to the outer wall of the shaft sleeve, a compression spring is sleeved on the outer wall of the glue needle fixing shaft, one end of the compression spring is fitted with the inner wall of the locking nut, and the other end of the compression spring is fitted with the outer wall of the glue needle fixing shaft.
[0009] Preferably, the glue dipping needle fixed shaft and the magnetic ring bracket are fixedly connected via threads, and a magnetic ring is fixedly mounted on the magnetic ring bracket.
[0010] Preferably, a top screw is inserted into the interior of the shaft sleeve, and a glue dipping needle is fixedly installed on the bottom of the glue dipping needle fixing shaft.
[0011] Compared with the prior art, the present invention provides a glue dipping mechanism with the following beneficial effects:
[0012] 1. The glue dipping mechanism can reduce the gap between the Hall sensor and the magnetic ring by squeezing the glue needle in the glue dipping mechanism after it contacts the product. The change in the magnetic field detected by the Hall sensor can be fed back to the system as a signal to determine the distance between the glue dipping needle and the product. Then, the glue dipping needle completes the glue dipping on the product, which can accurately complete the glue dipping on the chip to prevent the staff from making inaccurate judgments.
[0013] 2. The glue dipping mechanism drives the glue disc to rotate continuously at a low speed through the first motor, and then continuously dips glue into the glue disc through the glue dipping needle, which ensures the continuity of the chip dipping and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall front view structure of the utility model;
[0015] Figure 2 It is a partial structural diagram of the utility model;
[0016] Figure 3 This is a schematic diagram of the shaft sleeve structure of the utility model;
[0017] Figure 4 This is a schematic diagram of the cross-sectional structure of the shaft sleeve of the utility model.
[0018] In the figure: 1. Second motor; 2. Second coupling; 3. Rotating shaft; 4. Hall sensor; 5. Magnetic ring; 6. Magnetic ring bracket; 7. Compression spring; 8. Locking nut; 9. Bushing; 10. Glue needle fixing shaft; 11. Glue needle; 12. Positioning pin; 13. Fixing bracket; 14. Top screw; 101. Z-axis fixing bracket; 102. Z-axis moving block; 103. Glue disc fixing bracket; 104. First motor; 105. First coupling; 106. Glue disc; 107. Glue dipping mechanism. DETAILED DESCRIPTION
[0019] like Figures 1-4As shown, the utility model provides a technical solution: a glue dipping mechanism, including a Z-axis fixed frame 101, a Z-axis motion block 102 is slidably connected to the Z-axis fixed frame 101, a glue disc fixed frame 103 is fixedly installed on the outer wall of the Z-axis fixed frame 101, and a first motor 104 is fixedly installed on the glue disc fixed frame 103. A glue disc 106 is provided at the bottom of the first motor 104. By starting the first motor 104, the glue disc 106 can be driven to rotate at a low speed. The first motor 104 and the glue disc 106 are fixedly connected through a first coupling 105. Glue is added to the inside of the glue disc 106 for dipping. A glue dipping mechanism 107 is provided on the outer wall of the Z-axis motion block 102, and the glue dipping mechanism 107 is driven to move upward by the Z-axis motion block 102.
[0020] In this embodiment, a dipping mechanism 107 is provided on the outer wall of the Z-axis motion block 102. After the dipping needle 11 in the dipping mechanism 107 contacts the product, the gap between the Hall sensor 4 and the magnetic ring 5 can be reduced by squeezing. The magnetic field detected by the Hall sensor 4 changes, and a signal can be fed back to the system to determine that the distance between the dipping needle 11 and the product is 0, and then the dipping needle 11 completes dipping the product, and can accurately complete dipping the chip.
[0021] The above-mentioned dipping mechanism 107 includes a fixing frame 13, which is fixedly mounted on the outer wall of the Z-axis motion block 102, and a second motor 1 is fixedly mounted on the fixing frame 13. A rotating shaft 3 is provided at the bottom of the second motor 1, and the second motor 1 and the rotating shaft 3 are fixedly connected by a second coupling 2. A Hall sensor 4 is fixedly mounted on the outer wall of the rotating shaft 3. After the dipping needle 11 contacts the product, the fixing frame 13 drives the dipping needle 11 to continue to move, which can squeeze and reduce the gap between the Hall sensor 4 and the magnetic ring 5. The magnetic field detected by the Hall sensor 4 changes, and a signal is fed back to the system, which can be used to determine that the distance between the dipping needle 11 and the product is 0, so that the dipping needle 11 is in contact with the product. The glue needle 11 completes the gluing on the product, and a sleeve 9 is fixedly installed on the rotating shaft 3. A gluing needle fixing shaft 10 is slidably penetrated inside the sleeve 9, and a positioning pin 12 is penetrated inside the sleeve 9. A locking nut 8 is threadedly connected to the outer wall of the sleeve 9, and a compression spring 7 is sleeved on the outer wall of the gluing needle fixing shaft 10. One end of the compression spring 7 fits with the inner wall of the locking nut 8, and the other end of the compression spring 7 fits with the outer wall of the gluing needle fixing shaft 10. The gluing needle fixing shaft 10 and the magnetic ring bracket 6 are fixedly connected by threads. A magnetic ring 5 is fixedly installed on the magnetic ring bracket 6. A top screw 14 is inserted into the inside of the sleeve 9, and a gluing needle 11 is fixedly installed on the bottom of the gluing needle fixing shaft 10.
[0022] In this embodiment, glue is first added to the inside of the glue disc 106, and then the Z-axis motion block 102 drives the glue dipping mechanism 107 to move upward. When it moves to the set value, the first motor 104 is started to drive the glue disc 106 to rotate at a low speed. When the glue dipping mechanism 107 rotates a certain angle, the Z-axis motion block 102 drives the glue dipping mechanism 107 to move downward, so that the glue dipping needle 11 moves downward to dip the glue in the glue disc 106, and then the Z-axis motion block 102 drives the glue dipping mechanism 107 to move upward to the set value. At this time, the glue dipping mechanism 107 rotates back to its original angle. When the glue dipping needle 11 contacts the product, the fixing frame 13 drives the glue dipping needle 11 to continue moving, and then the gap between the Hall sensor 4 and the magnetic ring 5 is reduced by squeezing. The magnetic field detected by the Hall sensor 4 changes, and a signal is fed back to the system to determine that the distance between the glue dipping needle 11 and the product is 0, and then the glue dipping needle 11 completes the glue dipping on the product.
[0023] The above generally describes the present invention in detail. However, it is obvious to those skilled in the art that modifications or improvements may be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.
Claims
1. A glue dipping mechanism, comprising a Z-axis fixing frame (101), wherein a Z-axis motion block (102) is slidably connected to the Z-axis fixing frame (101), characterized in that: A glue disc fixing frame (103) is fixedly mounted on the outer wall of the Z-axis fixing frame (101), a first motor (104) is fixedly mounted on the glue disc fixing frame (103), a glue disc (106) is provided at the bottom of the first motor (104), the first motor (104) and the glue disc (106) are fixedly connected via a first coupling (105), and a glue dipping mechanism (107) is provided on the outer wall of the Z-axis motion block (102).
2. The glue dipping mechanism according to claim 1, characterized in that: The glue dipping mechanism (107) includes a fixing frame (13), and the fixing frame (13) is fixedly mounted on the outer wall of the Z-axis motion block (102).
3. The glue dipping mechanism according to claim 2, characterized in that: A second motor (1) is fixedly mounted on the fixing frame (13); a rotating shaft (3) is provided at the bottom of the second motor (1); the second motor (1) and the rotating shaft (3) are fixedly connected via a second coupling (2); and a Hall sensor (4) is fixedly mounted on the outer wall of the rotating shaft (3).
4. A glue dipping mechanism according to claim 3, characterized in that: A shaft sleeve (9) is fixedly mounted on the rotating shaft (3), a glue needle fixed shaft (10) is slidably penetrated inside the shaft sleeve (9), a positioning pin (12) is penetrated inside the shaft sleeve (9), a locking nut (8) is threadedly connected to the outer wall of the shaft sleeve (9), a compression spring (7) is sleeved on the outer wall of the glue needle fixed shaft (10), one end of the compression spring (7) is in contact with the inner wall of the locking nut (8), and the other end of the compression spring (7) is in contact with the outer wall of the glue needle fixed shaft (10).
5. The glue dipping mechanism according to claim 4, characterized in that: The glue dipping needle fixed shaft (10) and the magnetic ring bracket (6) are fixedly connected via threads, and the magnetic ring bracket (6) is fixedly mounted with a magnetic ring (5).
6. The glue dipping mechanism according to claim 5, characterized in that: A top screw (14) is inserted into the interior of the shaft sleeve (9), and a glue needle (11) is fixedly mounted on the bottom of the glue needle fixing shaft (10).