Wire breaking machine for processing locally bad PCB (Printed Circuit Board)

Abstract

The utility model belongs to the technical field of printed circuit board manufacturing, and relates to a wire breaking machine for processing a local bad PCB, which comprises a wire breaking unit, the wire breaking unit comprises a PCB translation mechanism for moving the PCB along the X direction and a wire breaking assembly positioned above the middle part of the PCB translation mechanism, the wire breaking assembly comprises an X-direction walking mechanism located above the PCB translation mechanism, a Y-direction walking mechanism driven by the X-direction walking mechanism to move in the X direction, a Z-direction lifting mechanism driven by the Y-direction walking mechanism to move in the Y direction, and a scanning galvanometer and a laser driven by the Z-direction lifting mechanism to ascend and descend. The cutting direction of the laser is downward, and the cutting range is within the view field range of the scanning galvanometer. Compared with the common copper bean pasting operation, the device needs less manpower in the wire breaking process of the bad area, the working efficiency is higher, and the cost of the copper beans is also saved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a wire breaking machine for processing locally defective PCB boards. Background Art

[0002] To simplify the mass production of small PCBs, many are typically assembled onto a single large PCB, which is then cut into smaller PCBs. During the manufacturing process, individual defective PCBs are inevitable. However, before being discharged, the defective areas must be kept intact alongside the qualified areas, completing the entire process. Defective products only need to be removed during cutting. To avoid material waste, identified defective areas are marked during the production process.

[0003] Chinese patent CN104890372A discloses a PCB scrap marking device and method. The marking head uses inkjet, labeling, indentation, punching, or cutting methods. These methods create visible marks on the surface of the scrap PCB. However, inkjet and labeling increase material costs, while indentation, punching, or cutting can cause premature cracks in the substrate, potentially affecting quality.

[0004] Our company previously employed a method of manually applying copper beads to defective areas of PCBs, intentionally short-circuiting them. This allowed us to identify defective boards by detecting resistance anomalies during electrical testing. However, the use of copper beads increased material and waste, and manual application was inefficient. This method was increasingly unable to meet production efficiency requirements.

[0005] Therefore be necessary to design a kind of new equipment to solve above problems. Utility Model Content

[0006] The main purpose of the utility model is to provide a wire breaking machine for processing locally defective PCB boards, which can deliberately cut off the circuit layer of the defective area after visual inspection to cause a short circuit, so that the defective area can be more easily distinguished in subsequent processing, saving labor, improving work efficiency, and saving raw material costs.

[0007] The utility model achieves the above-mentioned object through the following technical solution: a wire breaking machine for processing locally defective PCB boards, comprising a wire breaking unit, the wire breaking unit comprising a PCB board translation mechanism for moving the PCB board along the X direction and a wire breaking assembly located above the middle portion of the PCB board translation mechanism, the X direction being located in a horizontal plane, the wire breaking assembly comprising an X-direction traveling mechanism located above the PCB board translation mechanism, a Y-direction traveling mechanism driven by the X-direction traveling mechanism to move along the X direction, a Z-direction lifting mechanism driven by the Y-direction traveling mechanism to move along the Y direction, and a scanning galvanometer and a laser driven to be lifted and lowered by the Z-direction lifting mechanism, the Y direction being located in the horizontal plane and perpendicular to the X direction, the Z direction being a vertical direction, the cutting direction of the laser being downward, and the cutting range being located within the field of view of the scanning galvanometer.

[0008] Specifically, it further comprises a loading unit and a unloading unit, wherein the loading unit, the line breaking unit and the unloading unit are sequentially arranged along the X direction.

[0009] Furthermore, the feeding side of the PCB board translation mechanism is the feeding area, and the discharging side is the discharging area; the loading unit includes a loading lifting mechanism and a loading suction and release mechanism, and the loading suction and release mechanism is located above the loading lifting mechanism and the feeding area, and the loading suction and release mechanism includes a first suction and release component, a first lifting cylinder that drives the first suction and release component to be lifted and lowered, and a first translation module that drives the first lifting cylinder to move along the X direction; the unloading unit includes a unloading lifting mechanism and a unloading suction and release mechanism, and the unloading suction and release mechanism is located above the unloading lifting mechanism and the discharging area, and the unloading suction and release mechanism includes a second suction and release component, a second lifting cylinder that drives the second suction and release component to be lifted and lowered, and a second translation module that drives the second lifting cylinder to move along the X direction.

[0010] Furthermore, the loading unit also includes a first partition lifting mechanism, the first partition lifting mechanism and the feeding area are located on both sides of the loading lifting mechanism in the X direction, and the loading suction and release mechanism extends from above the first partition lifting mechanism to above the feeding area; the unloading unit also includes a second partition lifting mechanism, the discharging area and the second partition lifting mechanism are located on both sides of the unloading lifting mechanism in the X direction, and the unloading suction and release mechanism extends from above the discharging area to above the second partition lifting mechanism.

[0011] The beneficial effects of the technical solution of this utility model are:

[0012] Once the location of the defective area on the PCB has been identified in the previous steps, the X- and Y-axis travel mechanisms will first move the scanning mirror and laser over the defective area. Assisted by the precise positioning of the scanning mirror, the laser will burn through the circuitry in the defective area without burning through the substrate, intentionally short-circuiting the circuitry in the defective area. This creates a noticeable electrical anomaly in the defective area while essentially maintaining substrate integrity, facilitating subsequent processing. Furthermore, this process requires less manpower than conventional copper bean placement, resulting in higher efficiency and reduced copper bean costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is the usage status diagram of the wire breaking machine;

[0014] Figure 2 This is a three-dimensional diagram of the core structure of the wire breaking machine;

[0015] Figure 3 It is a top view of the broken line unit;

[0016] Figure 4 This is the main view of the loading unit;

[0017] Figure 5 This is the main view of the blanking unit.

[0018] The following are marked in the figure:

[0019] 1-Wire breaking machine,

[0020] 11-feeding unit, 111-first partition lifting mechanism, 112-feeding lifting mechanism, 113-feeding suction and release mechanism, 1131-first suction and release assembly, 1132-first lifting cylinder, 1133-first translation module,

[0021] 12-breaking line unit, 121-PCB board translation mechanism, 1211-feeding area, 1212-discharging area, 122-breaking line assembly, 1221-X-direction walking mechanism, 1222-Y-direction walking mechanism, 1223-Z-direction lifting mechanism, 1224-scanning galvanometer, 1225-laser,

[0022] 13- unloading unit, 131- unloading lifting mechanism, 132- second partition lifting mechanism, 133- unloading suction and release mechanism, 1331- second suction and release assembly, 1332- second lifting cylinder, 1333- second translation module,

[0023] 14- Partition moving trolley;

[0024] 2-PCB board,

[0025] 3- Partition. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to specific embodiments.

[0027] Example:

[0028] like Figure 1 and Figure 2 As shown, a wire breaking machine 1 for processing partially defective PCB boards of the present invention comprises a loading unit 11, a wire breaking unit 12 and a unloading unit 13 arranged in sequence along the X direction, and the X direction is located in a horizontal plane.

[0029] like Figure 2 As shown, the line breaking unit 12 includes a PCB board translation mechanism 121 for moving the PCB board 2 along the X direction and a line breaking assembly 122 located above the middle part of the PCB board translation mechanism 121. The feeding side of the PCB board translation mechanism 121 is a feeding area 1211, and the discharging side is a discharging area 1212. The line breaking assembly 122 includes an X-direction walking mechanism 1221 located above the PCB board translation mechanism 121, a Y-direction walking mechanism 1222 driven by the X-direction walking mechanism 1221 to move along the X direction, a Z-direction lifting mechanism 1223 driven by the Y-direction walking mechanism 1222 to move along the Y direction, and a scanning galvanometer 1224 and a laser 1225 driven to rise and fall by the Z-direction lifting mechanism 1223. The Y direction is located in the horizontal plane and is perpendicular to the X direction, and the Z direction is the vertical direction. The cutting direction of the laser 1225 is downward, and the cutting range is located within the field of view of the scanning galvanometer 1224.

[0030] The feed zone 1211 is where the loading unit 11 delivers the PCB board 2 to be broken onto the PCB board translation mechanism 121. The discharge zone 1212 is where the unloading unit 13 delivers the PCB board 2 with broken wires out of the PCB board translation mechanism 121. The movement of the PCB board 2 from the feed zone 1211 to the discharge zone 1212 inevitably passes beneath the laser 1225. After the location of the defective area on the PCB board 2 has been determined in the previous step, the X-axis travel mechanism 1221 and the Y-axis travel mechanism 1222 first move the scanning mirror 1224 and the laser 1225 above the defective area. Assisted by the precise positioning of the scanning mirror 1224, the laser 1225 burns through the wiring in the defective area without burning through the substrate, intentionally short-circuiting the wiring in the defective area. This creates a noticeable electrical anomaly in the defective area while essentially maintaining substrate integrity, facilitating subsequent processing. Furthermore, this process requires less manpower than conventional copper bean lamination, resulting in higher efficiency and reduced copper bean costs.

[0031] like Figure 1 、 Figure 2 and Figure 4As shown, the loading unit 11 includes a first partition lifting mechanism 111, a loading lifting mechanism 112 and a loading suction and release mechanism 113. The first partition lifting mechanism 111 and the feeding area 1211 are located on both sides of the X direction of the loading lifting mechanism 112. The loading suction and release mechanism 113 extends from above the first partition lifting mechanism 111 to above the feeding area 1211. The loading suction and release mechanism 113 includes a first suction and release component 1131, a first lifting cylinder 1132 for driving the first suction and release component 1131 to rise and fall, and a first translation module 113 that drives the first lifting cylinder 1132 to move along the X direction.

[0032] To prevent the PCB boards 2 from scratching each other when stacked, they are separated by a relatively flexible partition 3. Therefore, each time the loading and dispensing mechanism 113 removes a PCB board 2, it also removes a partition 3. The PCB boards 2 are placed in the feed area 1211 for breaking, and the partitions 3 are placed on the first partition lifting mechanism 111 for temporary storage and reuse. The partitions 3 should preferably be a color that contrasts sharply with the PCB boards 2 to avoid confusion during scanning. The stacked PCB boards 2 and partitions 3 are transported to the loading and dispensing mechanism 112 by a cart. Each time a PCB board 2 or partition 3 is removed, the cart is raised to the corresponding plate thickness to accommodate the suction height of the first suction and dispensing assembly 1131. When sucking or putting down, the first lifting cylinder 1132 will drive the first suction and placement component 1131 to drop slightly. In the process of the first translation module 113 driving the first suction and placement component 1131 to move horizontally, the first lifting cylinder 1132 will keep the first suction and placement component 1131 in a high position to avoid knocking down the PCB board 2 or the partition 3.

[0033] like Figure 1 、 Figure 2 and Figure 5 As shown, the unloading unit 13 includes a unloading lifting mechanism 131, a second partition lifting mechanism 132 and a unloading suction and release mechanism 133. The discharge area 1212 and the second partition lifting mechanism 132 are located on both sides of the X direction of the unloading lifting mechanism 131. The unloading suction and release mechanism 133 extends from above the discharge area 1212 to above the second partition lifting mechanism 132. The unloading suction and release mechanism 133 includes a second suction and release component 1331, a second lifting cylinder 1332 for driving the second suction and release component 1331 to rise and fall, and a second translation module 133 for driving the second lifting cylinder 1332 to move along the X direction.

[0034] The first partition lifting mechanism 111, the loading lifting mechanism 112, the unloading lifting mechanism 131, and the second partition lifting mechanism 132 have similar structures, with the same lifting principles but different functions. The structure of the unloading suction and release mechanism 133 is similar to that of the loading suction and release mechanism 113, except that the second partition lifting mechanism 132 is used to stack the PCB boards 2 and partitions 3 with broken lines on the unloading lifting mechanism 131. At the first partition lifting mechanism 111, the temporarily stored partitions 3 are placed on the partition moving cart 14 and then moved to the second partition lifting mechanism 132. However, in order to maintain the continuity of work, at least two partition moving carts 14 will be kept in reserve, and there will also be a sufficient number of spare partitions 3.

[0035] The working process of this equipment is as follows: the alternately stacked PCB boards 2 and partitions 3 are first placed on the loading and lifting mechanism 112, the loading and sucking mechanism 113 sends the partitions 3 to the first partition lifting mechanism 111 for stacking, and the PCB boards 2 to be broken are sent to the feeding area 1211; the PCB board translation mechanism 121 sends the PCB boards 2 to be broken through the bottom of the breaking component 122, and the scanning galvanometer 1224 automatically reads the board edge material number (the middle of the long side or the middle of the short side) to identify the board type, and reads the typesetting file (the file is) according to the board material number. The laser 1225 obtains the graphics of each daughter board and identifies whether there are manual line marks in it. When manual marks are found on the daughter board, the laser 1225 breaks the line in the defective area of the PCB board 2 according to the position of the mark. After the line breaking is completed, the PCB board 2 flows to the discharge area 1212 and is then taken away by the unloading suction and placement mechanism 133. It is then placed again at the unloading lifting mechanism 131 together with the partition 3. After the line breaking of a batch of products is completed, the entire stack of PCB boards 2 is removed from the equipment.

[0036] The above descriptions are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A wire breaking machine for processing partially defective PCB boards, comprising a wire breaking unit, characterized in that: The line breaking unit includes a PCB board translation mechanism that moves the PCB board along the X direction and a line breaking assembly located above the middle part of the PCB board translation mechanism. The X direction is located in a horizontal plane. The line breaking assembly includes an X-direction walking mechanism located above the PCB board translation mechanism, a Y-direction walking mechanism driven by the X-direction walking mechanism to move along the X direction, a Z-direction lifting mechanism driven by the Y-direction walking mechanism to move along the Y direction, and a scanning galvanometer and a laser driven to be lifted and lowered by the Z-direction lifting mechanism. The Y direction is located in a horizontal plane and perpendicular to the X direction, and the Z direction is a vertical direction. The cutting direction of the laser is downward and the cutting range is located within the field of view of the scanning galvanometer.

2. The wire breaking machine for processing partially defective PCB boards according to claim 1, characterized in that: It also includes a loading unit and a unloading unit, and the loading unit, the line breaking unit and the unloading unit are arranged in sequence along the X direction.

3. The wire breaking machine for processing partially defective PCB boards according to claim 2, characterized in that: The feeding side of the PCB board translation mechanism is the feeding area, and the discharging side is the discharging area; the loading unit includes a loading lifting mechanism and a loading suction and release mechanism, and the loading suction and release mechanism is located above the loading lifting mechanism and the feeding area, and the loading suction and release mechanism includes a first suction and release component, a first lifting cylinder that drives the first suction and release component to rise and fall, and a first translation module that drives the first lifting cylinder to move along the X direction; the unloading unit includes a unloading lifting mechanism and a unloading suction and release mechanism, and the unloading suction and release mechanism is located above the unloading lifting mechanism and the discharging area, and the unloading suction and release mechanism includes a second suction and release component, a second lifting cylinder that drives the second suction and release component to rise and fall, and a second translation module that drives the second lifting cylinder to move along the X direction.

4. The wire breaking machine for processing partially defective PCB boards according to claim 3, characterized in that: The loading unit also includes a first partition lifting mechanism, the first partition lifting mechanism and the feeding area are located on both sides of the loading lifting mechanism in the X direction, and the loading suction and release mechanism extends from above the first partition lifting mechanism to above the feeding area; the unloading unit also includes a second partition lifting mechanism, the discharging area and the second partition lifting mechanism are located on both sides of the unloading lifting mechanism in the X direction, and the unloading suction and release mechanism extends from above the discharging area to above the second partition lifting mechanism.

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