Quality detection device for gold bonding wire

By designing a bonded wire quality detection device, using a bonded wire quality detection device with a wavy block and a screw, the error problem caused by loosening of the bonded wire during stretch detection is solved, and more accurate detection results are achieved.

CN223244130UActive Publication Date: 2025-08-19SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202421497514.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-08-19
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

In the existing bonded wire stretch detection method, bonded wire is prone to loosening halfway after the tension increases, resulting in inaccurate detection results.

Method used

A bonded wire quality detection device is designed, including a base plate, a block, a tension sensor and a display. Through the cooperation of the wavy block and a screw, the bonded wire remains stable during the stretching process, and the tension sensor and a display are used to monitor the tension data in real time.

Benefits of technology

The accuracy of bonded wire stretch detection is improved, the reliability and stability of the detection results are ensured, and errors caused by loosening are avoided.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a gold bonding wire quality detection device, which comprises a bottom plate, two groups of pressing blocks are arranged in the bottom plate, two groups of placing blocks are arranged at the bottoms of the two groups of pressing blocks, an L-shaped block is arranged at the bottom of one group of placing blocks, a tension sensor is fixedly arranged at the top of the inner wall of the L-shaped block, and a tension sensor is fixedly arranged at the bottom of the inner wall of the L-shaped block. The right side of the tension sensor makes contact with the left side of the containing block, a screw block is fixedly installed at the bottom of the L-shaped block, a displayer is fixedly installed on the front side of the bottom plate, and the output end of the tension sensor is electrically connected with the input end of the displayer. The device has the advantage of detecting the stretching quality of the gold bonding wire, and solves the problems that when the stretching quality of the gold bonding wire is detected, one end of the gold bonding wire is mostly fixed, then the other end of the gold bonding wire is pulled for stretching quality, and due to the fact that the tension is continuously increased, the gold bonding wire in the second half process is prone to loosening; therefore, the gold bonding wire detection result is not accurate.
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Description

Technical Field

[0001] The utility model belongs to the technical field of gold bonding wires, in particular to a gold bonding wire quality detection device. Background Art

[0002] Gold bonding wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball solder gold wire or lead gold wire. Its gold content is ≥99.99%, and the total trace elements are <0.01%. There are three types: γ type, C type and FA type. The latter two are used for high-speed bonding. Trace elements include beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Bonding gold wire is vacuum melted in a high-frequency furnace, remelted twice and directionally crystallized. The ingot is cold-processed into material after homogenization, or manufactured by liquid extrusion process. It is an important material in the microelectronics industry and is used as a connecting wire between chips and lead frames.

[0003] However, there are some problems with the existing technology: bonding wire is a connecting material commonly used in the manufacture of electronic devices, and its strength testing is an important link to ensure the quality and reliability of the bonding wire. Bonding wire is widely used in electronic fields such as integrated circuits and semiconductor devices, and its strength needs to be tested to ensure its reliability in harsh environments such as high temperature. However, when testing the tensile quality of existing bonding wires, most of them fix one end of the bonding wire and then pull the other end for tensile testing. As the tension continues to increase, the bonding wire is prone to loosening in the second half, resulting in inaccurate bonding wire detection results. Therefore, we propose a bonding wire quality detection device. Utility Model Content

[0004] In response to the problems existing in the prior art, the purpose of the present invention is to provide a bonding wire quality detection device, which has the advantage of detecting the tensile quality of the bonding wire and solves the problem that when detecting the tensile quality of the bonding wire, most of the time, one end of the bonding wire is fixed and then the other end is pulled to perform the tensile quality test. As the pulling force continues to increase, the bonding wire is prone to loosening in the second half, resulting in inaccurate bonding wire detection results.

[0005] The utility model is implemented as follows: a bonding wire quality detection device comprises:

[0006] A bottom plate, wherein two groups of pressure blocks are provided inside the bottom plate, and two groups of placement blocks are provided at the bottom of the two groups of pressure blocks, wherein an L-shaped block is provided at the bottom of one group of placement blocks, a tension sensor is fixedly installed on the top of the inner wall of the L-shaped block, the right side of the tension sensor contacts the left side of the placement block, a screw block is fixedly installed at the bottom of the L-shaped block, and a display is fixedly installed on the front side of the bottom plate, and the output end of the tension sensor is electrically connected to the input end of the display;

[0007] The pushing component and the moving component, the pushing component is located on the top of the base plate, the pushing component is used to drive the pressure block to move up and down, so that it contacts or separates from the placement block, the moving component is located on the top of the base plate, the moving component is used to drive the screw block to move to the left or right, thereby stretching the bonding wire to test whether its tensile strength is qualified.

[0008] The pushing assembly includes a connecting plate, the top of the connecting plate contacts the top of the inner wall of the base plate, an electric push rod is fixedly installed on the top of the connecting plate, the top of the electric push rod passes through the top of the base plate, and the bottom of the electric push rod is fixedly installed on the top of the base plate.

[0009] The top of one group of pressing blocks is fixedly installed with the bottom of the connecting plate, and the top of the other group of pressing blocks is fixedly installed with a slider, and the bottom of the connecting plate is provided with a slide groove, and the slider and the slide groove are slidably installed.

[0010] The pushing assembly includes a motor, the bottom of the motor and the base plate are fixedly installed, the output end of the motor is fixedly installed with a screw rod, the left end of the screw rod passes through the left side of the screw block, and the screw rod and the screw block are threadedly installed.

[0011] The left end of the screw rod is rotatably mounted with a connecting block via a bearing, and the bottom of the connecting block is fixedly mounted to the top of the inner wall of the bottom plate.

[0012] The front side and the rear side of the placement block are both fixedly installed with limit plates, and the bottom of one group of the limit plates is fixedly installed with the top of the base plate.

[0013] The front side and the rear side of the right side of the bottom plate are both provided with limiting grooves, and the bottom of the other group of limiting plates extends into the interior of the limiting grooves and is slidably installed with the limiting grooves.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. The bottom of the pressing block and the top of the placing block are both wavy. When the bottom of the pressing block and the top of the placing block are in contact, the two sides of the bonding wire on the top of the placing block can be pressed into a wavy shape, thereby improving the stability of the pressing block and the placing block when pressing the bonding wire.

[0016] 2. First, cut a section of the rolled bonding wire, and then place the cut bonding wire on the top of the placement block. Then, you can push the assembly to move the pressure block to the bottom. The movement of the pressure block to the bottom will first press the two sides of the bonding wire into a wavy shape. At this time, the bonding wire can be limited, and then the screw block can be driven to move to the right by the moving assembly. The movement of the screw block will drive the L-shaped block to move to the right. The movement of the L-shaped block to the right will allow the tension sensor to contact the left side of the placement block. When the tension sensor is subjected to pressure from the L-shaped block and the placement block, the tension sensor will transmit a signal to the display, and then the display can display the pressure applied to the tension sensor at this time to determine whether the bonding wire of this roll meets the standard.

[0017] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is an overall schematic diagram of the base plate provided by the utility model;

[0019] Figure 2 This is an internal diagram of the base plate provided by the present invention;

[0020] Figure 3 This is a structural diagram of the push component and the moving component provided by the utility model;

[0021] Figure 4 This utility model Figure 3 Enlarged view of point A in the middle.

[0022] In the figure: 1. Base plate; 2. Limiting groove; 3. Pressure block; 4. Placement block; 5. L-shaped block; 6. Tension sensor; 7. Screw block; 8. Display; 9. Pushing assembly; 91. Connecting plate; 92. Electric push rod; 93. Slider; 94. Slide groove; 10. Moving assembly; 101. Motor; 102. Screw; 103. Connecting block; 11. Limiting plate. DETAILED DESCRIPTION

[0023] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0024] like Figures 1 to 4 As shown, the bonding wire quality detection device provided by the embodiment of the present invention includes:

[0025] The bottom plate 1 has two groups of pressing blocks 3 arranged inside, and two groups of placement blocks 4 arranged at the bottom of the two groups of pressing blocks 3;

[0026] The bottom of the pressing block 3 and the top of the placing block 4 are both wavy. When the bottom of the pressing block 3 and the top of the placing block 4 are in contact, the two sides of the bonding wire on the top of the placing block 4 can be pressed into a wavy shape, thereby improving the stability of the pressing block 3 and the placing block 4 when pressing the bonding wire.

[0027] An L-shaped block 5 is provided at the bottom of one set of placement blocks 4. A tension sensor 6 is fixedly mounted on the top of the inner wall of the L-shaped block 5. The right side of the tension sensor 6 contacts the left side of the placement block 4. A screw block 7 is fixedly mounted on the bottom of the L-shaped block 5. A display 8 is fixedly mounted on the front side of the base plate 1. The output end of the tension sensor 6 is electrically connected to the input end of the display 8.

[0028] The pushing component 9 and the moving component 10, the pushing component 9 is located at the top of the base plate 1, and the pushing component 9 is used to drive the pressing block 3 to move up and down so that it contacts or separates from the placing block 4, and the moving component 10 is located at the top of the base plate 1, and the moving component 10 is used to drive the screw block 7 to move to the left or right, thereby stretching the bonding wire to test whether its tensile strength is qualified.

[0029] First, cut a section of the rolled bonding gold wire, and then place the cut bonding gold wire on the top of the placement block 4. Then, the pressing block 3 can be moved to the bottom by pushing the component 9. The movement of the pressing block 3 to the bottom will first press the two sides of the bonding gold wire into a wavy shape. At this time, the bonding gold wire can be limited. Then, the screw block 7 is driven to move to the right by the moving component 10. The movement of the screw block 7 will drive the L-shaped block 5 to move to the right. The movement of the L-shaped block 5 to the right will allow the tension sensor 6 to contact the left side of the placement block 4. When the tension sensor 6 is subjected to pressure from the L-shaped block 5 and the placement block 4, the tension sensor 6 will transmit a signal to the display 8, and then the display 8 can display the pressure applied to the tension sensor 6 at this time. Finally, based on the breakage of the stretched bonding gold wire, it is determined whether this roll of bonding gold wire meets the standards.

[0030] Finally, after the bonding wire is inspected, the pressing block 3 and the placing block 4 are moved to the left to the maximum stroke by moving the assembly 10. Then, the bonding wire will change from a straight state to an arc state. Then, the pressing block 3 and the placing block 4 are separated by pushing the assembly 9. Finally, when the bonding wire is no longer under the pressure of the pressing block 3 and the placing block 4, the inspected bonding wire can be taken out for replacement.

[0031] The pushing assembly 9 includes a connecting plate 91, the top of the connecting plate 91 contacts the top of the inner wall of the base plate 1, an electric push rod 92 is fixedly installed on the top of the connecting plate 91, the top of the electric push rod 92 passes through the top of the base plate 1, and the bottom of the electric push rod 92 is fixedly installed on the top of the base plate 1.

[0032] Through the cooperation between the connecting plate 91 and the electric push rod 92, when the bonding gold wire needs to be compressed and tested, the electric push rod 92 is first started, and the telescopic end of the electric push rod 92 drives the connecting plate 91 to move to the bottom, and the connecting plate 91 drives the pressure block 3 to move to the bottom. The pressure block 3 moves to the bottom to compress the bonding gold wire on the top of the placement block 4. Then, the tension sensor 6 will be subjected to the squeezing force of the L-shaped block 5 and the placement block 4, and then the tension sensor 6 will transmit the signal to the display 8, and the display 8 will display the tension received by the tension sensor 6, so as to judge whether the bonding gold wire is qualified.

[0033] The top of one group of pressing blocks 3 is fixedly installed with the bottom of the connecting plate 91, and the top of the other group of pressing blocks 3 is fixedly installed with a slider 93. The bottom of the connecting plate 91 is provided with a slide groove 94, and the slider 93 and the slide groove 94 are slidably installed.

[0034] Through the cooperation between the slider 93 and the slide groove 94, the pressing block 3 can be limited, and the pressing block 3 can also be separated from the connecting plate 91 when moving to detect the bonding wire, so that the connecting plate 91 cannot drive the pressing block 3 to reset.

[0035] The pushing assembly 9 includes a motor 101, the bottom of the motor 101 is fixedly installed on the base plate 1, the output end of the motor 101 is fixedly installed with a screw rod 102, the left end of the screw rod 102 passes through the left side of the screw block 7, and the screw rod 102 and the screw block 7 are threadedly installed.

[0036] Through the mutual cooperation of the motor 101 and the screw 102, the motor 101 can be started at this time, and the output shaft of the motor 101 will drive the screw 102 to rotate. The rotation of the screw 102 drives the screw block 7 to move to the right, and the movement of the screw block 7 to the right drives the placement block 4, the L-shaped block 5 and the tension sensor 6 to move. At this time, the tension signal received by the tension sensor 6 is transmitted to the display 8, thereby judging whether the bonding gold wire meets the quality requirements.

[0037] The left end of the screw rod 102 is rotatably mounted with a connecting block 103 via a bearing, and the bottom of the connecting block 103 is fixedly mounted to the top of the inner wall of the base plate 1 .

[0038] By setting the connecting block 103, the screw rod 102 can be limited to prevent the screw rod 102 from shaking when rotating, thereby causing the screw rod 102 to be unable to stably drive the screw block 7 to move when rotating.

[0039] Limiting plates 11 are fixedly mounted on the front and rear sides of the placement block 4 , wherein the bottom of one set of limiting plates 11 is fixedly mounted on the top of the base plate 1 .

[0040] By setting the limiting plate 11, the placement block 4 can be supported and limited to prevent the placement block 4 from separating from the pressing block 3 during operation, thereby allowing the pressing block 3 and the placement block 4 to continue to limit the bonding wire.

[0041] Limiting slots 2 are provided on the front and rear sides of the right side of the bottom plate 1 , and the bottoms of the other set of limiting plates 11 extend into the limiting slots 2 and are slidably mounted therewith.

[0042] By setting the limiting groove 2, the screw block 7 and the limiting plate 11 can be limited to prevent the screw block 7 from moving and causing the L-shaped block 5 and the tension sensor 6 to separate, thereby causing the tension sensor 6 to be unable to continue to detect the tensile quality of the bonding wire.

[0043] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A gold bonding wire quality detection device, characterized in that: include: A bottom plate (1), wherein two groups of pressing blocks (3) are provided inside the bottom plate (1), two groups of placement blocks (4) are provided at the bottom of the two groups of pressing blocks (3), an L-shaped block (5) is provided at the bottom of one group of placement blocks (4), a tension sensor (6) is fixedly installed on the top of the inner wall of the L-shaped block (5), the right side of the tension sensor (6) contacts the left side of the placement block (4), a screw block (7) is fixedly installed on the bottom of the L-shaped block (5), a display (8) is fixedly installed on the front side of the bottom plate (1), and the output end of the tension sensor (6) is electrically connected to the input end of the display (8); A pushing component (9) and a moving component (10), wherein the pushing component (9) is located on the top of the base plate (1), and the pushing component (9) is used to drive the pressing block (3) to move up and down so that it contacts or separates from the placing block (4); the moving component (10) is located on the top of the base plate (1), and the moving component (10) is used to drive the screw block (7) to move to the left or right, thereby stretching the bonding wire to test whether its tensile strength is qualified.

2. The bonding wire quality detection device according to claim 1, characterized in that: The pushing assembly (9) includes a connecting plate (91), the top of the connecting plate (91) contacts the top of the inner wall of the base plate (1), an electric push rod (92) is fixedly installed on the top of the connecting plate (91), the top of the electric push rod (92) passes through the top of the base plate (1), and the bottom of the electric push rod (92) is fixedly installed on the top of the base plate (1).

3. The bonding wire quality detection device according to claim 2, characterized in that: The top of one group of pressing blocks (3) and the bottom of the connecting plate (91) are fixedly installed, and the top of another group of pressing blocks (3) is fixedly installed with a slider (93), and the bottom of the connecting plate (91) is provided with a slide groove (94), and the slider (93) and the slide groove (94) are slidably installed.

4. The bonding wire quality detection device according to claim 1, characterized in that: The pushing assembly (9) comprises a motor (101), the bottom of the motor (101) and the bottom plate (1) are fixedly mounted, a screw rod (102) is fixedly mounted on the output end of the motor (101), the left end of the screw rod (102) passes through the left side of the screw block (7), and the screw rod (102) and the screw block (7) are threadedly mounted.

5. The bonding wire quality detection device according to claim 4, characterized in that: The left end of the screw rod (102) is rotatably mounted with a connecting block (103) via a bearing, and the bottom of the connecting block (103) is fixedly mounted to the top of the inner wall of the bottom plate (1).

6. The bonding wire quality detection device according to claim 1, characterized in that: Limiting plates (11) are fixedly mounted on the front and rear sides of the placement block (4), wherein the bottom of one set of the limiting plates (11) is fixedly mounted on the top of the bottom plate (1).

7. The bonding wire quality detection device according to claim 6, characterized in that: The front side and the rear side of the right side of the bottom plate (1) are both provided with a limiting groove (2), and the bottom of the other set of limiting plates (11) extends into the interior of the limiting groove (2) and is slidably mounted with the limiting groove (2).