Circuit substrate pressing contact detection machine

Abstract

The utility model relates to a circuit substrate pressing contact detection machine which comprises a test machine base, a test loading disc, a feeding assembly, a pressing contact assembly, an electrical bayonet socket and a power-up test instrument, the middle part of the upper end face of the test machine base is provided with the test loading disc, and the upper end face of the test loading disc is provided with a plurality of positioning grooves; the pressing contact assembly comprises a lifting air cylinder, a positioning plate, a guide rod and guide sleeve assembly, a lifting plate, a supporting seat and a contact probe, and the electric bayonet socket comprises a plurality of standard communication sockets and communication seats. The pressing contact assembly is used to directly face the circuit substrate which is fed in place to implement upper and lower position contact pressing and electrical conduction, and the standard communication socket is used to communicate with the plurality of contact probes, so that standardized adaptation of a communication line and power-up test equipment is realized, non-standard redesign is avoided, the equipment manufacturing and maintenance cost is reduced, and the detection efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of automated detection equipment, in particular to a circuit substrate pressing contact detection machine. Background Art

[0002] Before circuit boards are etched and cut, the metal layer's conductivity needs to be tested to ensure proper electrical continuity after soldering to components. This ensures proper, qualified production can continue, avoiding poor conductivity and the resulting waste of subsequent production steps and costs. To quickly and efficiently test mass-produced circuit boards, it's necessary to design a device that can perform electrical continuity testing on both ends of the board, ensuring high-efficiency testing. Utility Model Content

[0003] The purpose of this utility model is: in view of the technical requirements of conducting necessary metal layer conductivity tests on plate-shaped circuit substrates to ensure the subsequent normal and effective production process of qualified products, improve the qualified rate of finished circuit substrates, and reduce the production costs wasted due to defective products, we design a circuit substrate press contact detection machine to perform end-to-end power-on testing on each circuit substrate to ensure that each circuit substrate flows into the next process as a qualified product, ensure the safety, stability and reliability of the product, increase the qualified rate of products leaving the factory, and prevent problematic circuit substrates from being put into the subsequent welding of components, so as to reduce the subsequent production of defective products, reduce raw material loss, reduce production costs, and improve product qualified rate.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A circuit substrate press contact tester includes a test base, a test carrier, a feeding assembly, a press contact assembly, an electrical socket and a power-on test instrument.

[0006] A test carrier is provided in the middle of the upper end surface of the test base, and a plurality of positioning grooves are provided on the upper end surface of the test carrier for placing the circuit substrate to be tested. The test carrier is set on the screw slider of the feed assembly and is driven by the slide rail of the feed assembly to slide linearly to realize feeding.

[0007] The feeding assembly includes a feeding motor, a screw rod, a screw rod slider and slider rail assemblies arranged in parallel on both sides.

[0008] The press contact assembly includes a lifting cylinder, a positioning plate, a guide rod and guide sleeve assembly, a lifting plate and a support seat, as well as a contact probe that is electrically connected to the circuit substrate to be tested. The lifting cylinder drives the lifting plate to lift and lower, and the four corners of the lifting plate are limited by the guide rod and guide sleeve assembly to slide in a vertical direction. The guide rod is fixedly connected to the positioning plate, and a fixed support seat is provided under the lifting plate. After the test carrier is fed into place, it is between the support seat and the lifting plate. A number of contact probes are provided on the lower surface of the lifting plate, and the contact probes are connected through a buffer plate provided with a buffer spring to ensure good positioning while achieving soft contact connection with the electrical terminal to be tested on the circuit substrate.

[0009] The electrical socket is arranged on the rear side of the support base, and includes several standard communication sockets and communication sockets. The standard communication sockets are arranged on the communication sockets, and the internal pins of the communication sockets are connected to the contact probes through wires. The communication sockets are connected to the powered test instrument through standard communication lines to achieve modular standard connection, making it more convenient to replace the test instrument.

[0010] Furthermore, laser sensors are provided on both sides of the test carrier to ensure that the feeding assembly remains stationary when the circuit substrate to be tested is placed, and the feeding assembly feeds the material after obtaining an electrical signal after the material is placed.

[0011] Furthermore, positioning pins are provided at the four corners of the screw slider, and cooperate with the test carrier to complete the positioning and placement action of disassembly and replacement.

[0012] Furthermore, a position sensor facing the lifting plate is provided on one side of the positioning plate.

[0013] Compared with the prior art, the above technical solution adopted by the present invention has the following technical effects:

[0014] The circuit substrate press contact testing machine positions and feeds the circuit substrate through a test carrier, and can simultaneously perform power-on testing on multiple circuit substrates produced in batches on the production line. It also uses a press contact component to perform upper and lower contact pressing on the fed circuit substrate to achieve electrical conduction, and uses a standard communication socket to connect with several contact probes, so that the communication line and the power-on test equipment can be standardized and adapted, eliminating non-standard redesign, reducing equipment manufacturing and maintenance costs, and improving detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a side plan view of the circuit substrate pressing contact detection machine of this embodiment;

[0016] Figure 2 A side plan view of the circuit substrate and the contact probe in contact with each other according to this embodiment;

[0017] Figure 3A side plan view of the contact probe and electrical socket of this embodiment;

[0018] Figure 4 is a side plan view of the test carrier described in this embodiment;

[0019] Figure 5 This is a side plan view of the lifting plate described in this embodiment;

[0020] Among them: 1-powered test instrument, 2-feeding assembly, 3-laser sensor, 4-position sensor, 5-touch screen, 6-lifting cylinder, 7-positioning plate, 8-press contact assembly, 9-screw slider, 10-screw, 11-slider rail assembly, 12-test carrier, 13-circuit board, 14-communication socket, 15-communication base, 16-pin, 17-screw, 18-circuit board power terminal to be tested, 19-contact probe positioning block, 20-contact probe, 21-manual drawer, 22-positioning slot, 23-lifting plate. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be described clearly and completely in the following by way of embodiments in conjunction with the accompanying drawings.

[0022] See also Figures 1 to 5 The present embodiment provides a circuit substrate press contact detection machine, including a test machine base, a test carrier 12, a feeding assembly 2, a press contact assembly 8, an electrical socket and a power-on test instrument 1. The test carrier is used to position and feed the circuit substrate, and power-on testing can be performed on multiple circuit substrates produced in batches on the production line at the same time. The press contact assembly is used to perform upper and lower contact pressing on the circuit substrate that has been fed into place, and electrical conduction is achieved. The standard communication socket is used to connect with several contact probes, so that the communication line and the power-on test equipment can be standardized and adapted, and the detection efficiency is high.

[0023] See Figure 4 A test carrier 12 is provided in the middle of the upper end surface of the test machine base, and a plurality of positioning grooves 22 are provided on the upper end surface of the test carrier 12 for placing the circuit substrate 13 to be tested. The test carrier 12 is set on the screw slider 9 of the feeding assembly 2, and is driven by the slide rail of the feeding assembly 2 to slide linearly to realize feeding. Laser sensors 3 are provided on both sides of the test carrier 12 to ensure that the feeding assembly 2 remains stationary when the circuit substrate 13 to be tested is placed. After the discharge is completed, the feeding assembly 2 feeds the material after obtaining the electrical signal.

[0024] In order to achieve stable feeding of the test carrier, the feeding assembly 2 includes a feeding motor, a screw 10, a screw slider 9 and slider rail assemblies 11 arranged in parallel on both sides.

[0025] See Figure 2 and Figure 3 The pressing contact assembly 8 includes a lifting cylinder 6, a positioning plate 7, a guide rod and guide sleeve assembly, a lifting plate 23 and a support seat, as well as a contact probe 20 that is electrically conductive with the circuit substrate 13 to be tested. The lifting cylinder 6 drives the lifting plate 23 to lift and lower. The four corners of the lifting plate 23 are limited by the guide rod and guide sleeve assembly to slide linearly in the vertical direction. The guide rod is fixedly connected to the positioning plate 7. A fixed support seat is provided under the lifting plate 23. After the test carrier 12 is fed into place, it is between the support seat and the lifting plate 23. A number of contact probes 20 are provided on the lower surface of the lifting plate 23, and the contact probes 20 are connected by a buffer plate provided with a buffer spring to ensure good positioning while achieving soft contact connection with the electrical terminal to be tested of the circuit substrate 13.

[0026] See Figure 3 In order to achieve standardized adaptation of communication lines and powered test equipment, eliminate non-standard redesign, and reduce equipment manufacturing and maintenance costs, the electrical socket is arranged on the rear side of the support base, including 4 standard communication sockets 14 and a communication base 15. The standard communication sockets 14 are arranged on the communication base 15, and the internal pins 16 of the communication sockets 14 are connected to the contact probe 20 through a wire. The communication socket 14 is connected to the powered test instrument 1 through a standard communication line, realizing modular standard connection, making it more convenient to replace the test instrument.

[0027] See Figure 4 The four corners of the screw slider 9 are provided with positioning pins, and cooperate with the test carrier 12 to complete the positioning and placement action of disassembly and replacement.

[0028] See Figure 1 In order to detect whether the circuit substrate 13 to be tested is in the correct testing position, a position sensor 4 is provided on one side of the positioning plate 7 facing the lifting plate 23.

[0029] The above describes the embodiments of the present invention in detail in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in this field, various changes, modifications, substitutions and variations can be made without departing from the purpose of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A circuit substrate press contact tester, comprising a test base, a test carrier (12), a feed assembly (2), a press contact assembly (8), an electrical socket, and a power-on test instrument (1), characterized in that: A test carrier (12) is provided in the middle of the upper end surface of the test base, and a plurality of positioning grooves (22) for placing the circuit substrate (13) to be tested are opened on the upper end surface of the test carrier (12). The test carrier (12) is set on the screw rod (10) slider (9) of the feeding assembly (2), and is driven by the slide rail of the feeding assembly (2) to slide linearly to realize feeding. The pressing contact assembly (8) includes a lifting cylinder (6), a positioning plate (7), a guide rod and guide sleeve assembly, a lifting plate (23) and a support seat, as well as a contact probe (20) that is electrically connected to the circuit substrate (13) to be tested. The lifting cylinder (6) drives the lifting plate (23) to lift and lower. The four corners of the lifting plate (23) are limited by the guide rod and guide sleeve assembly to slide linearly in the vertical direction. The guide rod is fixedly connected to the positioning plate (7). A fixed support seat is provided below the lifting plate (23). After the test carrier (12) is fed into place, it is located between the support seat and the lifting plate (23). A plurality of contact probes (20) are provided on the lower surface of the lifting plate (23), and the contact probes (20) are connected through a buffer plate provided with a buffer spring to achieve soft contact connection with the electrical terminal to be tested of the circuit substrate (13). The electrical socket is arranged at the rear side of the support base, and includes a plurality of standard communication sockets (14) and a communication base (15). The standard communication sockets (14) are arranged on the communication base (15), and the internal pins (16) of the communication sockets (14) are connected to the contact probe (20) through a wire. The communication sockets (14) are connected to the powered test instrument (1) through a standard communication line.

2. The circuit substrate pressure contact detection machine according to claim 1, characterized in that: The feeding assembly (2) comprises a feeding motor, a screw rod (10), a screw rod (10) slider (9), and slider rail assemblies (11) arranged in parallel on both sides.

3. The circuit substrate pressure contact detection machine according to claim 1, characterized in that: Laser sensors (3) are provided on both sides of the test carrier (12).

4. The circuit substrate pressure contact detection machine according to claim 1, characterized in that: The four corners of the screw rod (10) and the slider (9) are provided with positioning pins, and cooperate with the test carrier (12) to complete the positioning and placement action of disassembly and replacement.

5. The circuit substrate pressure contact detection machine according to claim 1, characterized in that: A position sensor (4) facing the lifting plate (23) is provided on one side of the positioning plate (7).

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