MiniLED backlight device

Abstract

The utility model relates to the technical field of backlight devices, and particularly discloses a mini LED backlight device which comprises an installation frame, two ventilation dustproof plates are symmetrically installed on the side end portions of the installation frame, an installation plate is clamped in the installation frame in a sliding mode, a heat dissipation cavity is formed in the installation plate, a PCB substrate is fixedly installed on the upper end portion of the installation frame, a reflection film is arranged on the PCB substrate, and a light source is arranged on the reflection film. The LED chip is mounted on the PCB substrate, then a layer of fluorescent glue is sprayed on the surface of the LED chip, the white wall glue is arranged on the periphery of the LED chip in a surrounding mode, and finally the transparent silica gel is injected into the white wall, due to the fact that the heat conductivity coefficient of the transparent silica gel is small, heat generated by the fluorescent powder excited by blue light of the LED chip is mainly concentrated on the fluorescent glue layer on the surface of the LED, and the fluorescent glue layer is arranged on the surface of the LED. Most of heat is conducted through the PCB substrate for heat dissipation, and only a small part of heat is transmitted to the packaging surface through the transparent silica gel, so that the temperature of the packaging surface is much lower, and better heat dissipation performance is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight devices, and in particular to a miniLED backlight device. Background Art

[0002] MiniLED backlight devices refer to high-end direct-lit backlight display technologies and products with local dimming functions that are made using miniLED chips (usually flip chips) or LED packaging devices (which may use face-mounted or flip-chips).

[0003] As an emerging technology in the backlight field, Mini LED technology has developed rapidly and been widely used in recent years. Currently, in backlight applications such as TV, monitor, and car display, white light Mini LED technology is mainly based on the mounting of white light LED lamp beads, that is, POB technology. In addition, in the application of white light COB light strips, it is mainly to solidify the LED chip on the PCB substrate, then apply white wall glue on the outside of the chip, and finally inject fluorescent glue into the LED chip surrounded by the wall.

[0004] As for the current application of Mini white light LEDs, both POB and COB technologies produce white light by stimulating phosphors or QDs with blue light. While the blue light excites the phosphors, the heat generated by the LED chip stimulating the phosphors accumulates on the surface of the silicone because the phosphors are evenly mixed in the silicone and the silicone has a low thermal conductivity. This causes the silicone surface temperature to be too high, affecting the application of the entire backlight LED module. Therefore, the existing white light Mini LED technology still faces some challenges in heat dissipation.

[0005] At the same time, the main drawback of existing miniLED backlight devices when operating at high efficiency is their limited heat dissipation efficiency. Although LED lamp beads and PCB substrates perform excellently in improving display effects, they generate a large amount of heat when continuously outputting high brightness and high contrast. If this heat cannot be dissipated in a timely and effective manner, it will not only affect the stability and service life of the device, but may also lead to performance degradation or even damage caused by overheating. Therefore, to solve the above problems, we propose a miniLED backlight device. Utility Model Content

[0006] (1) Technical problems solved

[0007] In response to the shortcomings of the existing technology, the present invention provides a miniLED backlight device that solves the technical problem that a large amount of heat will be generated when the miniLED backlight outputs continuous high brightness and high contrast. If this heat cannot be dissipated in a timely and effective manner, it will not only affect the stability and service life of the device, but may also lead to performance degradation or even damage due to overheating.

[0008] (2) Technical solution

[0009] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0010] A miniLED backlight device includes a mounting frame, two ventilation and dustproof plates are symmetrically installed on the side ends of the mounting frame, a mounting plate is slidably clamped in the mounting frame, a heat dissipation cavity is opened in the mounting plate, a PCB substrate is fixedly mounted on the upper end of the mounting frame, a reflective diaphragm is provided on the PCB substrate, LED lamp beads are provided on the PCB substrate, a heat-conducting copper column is provided on the PCB substrate, heat dissipation fins are provided in the heat dissipation cavity, the LED lamp beads include LED chips, a fluorescent adhesive layer is sprayed on the surface of the LED chip, white wall adhesive is provided on the periphery of the LED chip, and a transparent silicone layer is filled in the white wall adhesive, the heat-conducting copper column passes through the upper end of the mounting plate, the heat-conducting copper column is fixedly connected to the heat dissipation fin, and the reflective diaphragm is located below the LED lamp beads.

[0011] Preferably, a card interface is provided at the side end of the installation frame, a limit plate is card-mounted in the card interface, a fixing screw is threadedly mounted at the side end of the installation frame, and the fixing screw is threadedly mounted to the limit plate.

[0012] Preferably, a card slot is provided on one side of the card interface, a diffusion plate is inserted and installed in the card slot, an optical film is inserted and installed in the card slot, and a liquid crystal panel is inserted and installed in the card slot.

[0013] (3) Beneficial effects

[0014] 1. Due to the low thermal conductivity of transparent silicone, the heat generated by the blue light from the LED chip stimulating the phosphor is mainly concentrated in the fluorescent glue layer on the LED surface. Most of the heat is dissipated through the PCB substrate, and only a small amount is transferred to the package surface through the transparent silicone. Therefore, the package surface temperature will be much lower. Compared with the existing white light Mini LED technology, this technology will make the package surface temperature lower. From the perspective of temperature performance, it is reduced by 20% to 25%, which will have better heat dissipation performance on the LED module.

[0015] Second, by adding heat dissipation fins to the miniLED backlight device design, the heat dissipation fins and thermal copper columns can effectively conduct and dissipate the heat generated by the PCB substrate and LED lamp beads during operation during the use of the miniLED backlight device, thereby effectively protecting the miniLED backlight device and avoiding the adverse effects of overheating during operation.

[0016] 3. By designing the installation method of the miniLED backlight device to be filled and fixed by a limiting plate, the various parts of the miniLED backlight device can be quickly disassembled when the miniLED backlight device is inspected and maintained, thereby effectively improving the work efficiency of inspection and maintenance, and further improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings.

[0018] Figure 1 This is a structural diagram of the installation frame of the utility model;

[0019] Figure 2 This is a structural diagram of the card interface of the utility model;

[0020] Figure 3 This is a structural diagram of the heat dissipation cavity of the utility model;

[0021] Figure 4 This is a structural diagram of the thermal conductive copper column of the utility model;

[0022] Figure 5 This is the anatomical structure diagram of the LED lamp bead of this utility model.

[0023] Legend: 1. Installation frame; 11. Limit plate; 12. Fixing screw; 13. Ventilation and dustproof plate; 14. Card interface; 15. Card slot; 2. Installation plate; 21. Heat dissipation cavity; 22. PCB substrate; 23. Reflective film; 24. LED lamp beads; 25. Thermal conductive copper column; 26. Heat dissipation fins; 27. Diffuser plate; 28. Optical film; 29. LCD panel; 3. LED chip; 31. Fluorescent adhesive layer; 32. White wall adhesive; 33. Transparent silicone layer. DETAILED DESCRIPTION

[0024] The embodiment of the present application provides a miniLED backlight device, which effectively solves the technical problem that a large amount of heat will be generated when the miniLED backlight continuously outputs high brightness and high contrast. If this heat cannot be dissipated in a timely and effective manner, it will not only affect the stability and service life of the device, but may also lead to performance degradation or even damage due to overheating.

[0025] Example

[0026] according to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown, the technical solution in the embodiment of the present application effectively solves the technical problem that the miniLED backlight generates a large amount of heat when continuously outputting high brightness and high contrast. If this heat cannot be dissipated in a timely and effective manner, it will not only affect the stability and service life of the device, but may also cause performance degradation or even damage due to overheating. The overall idea is as follows:

[0027] In response to the problems existing in the prior art, the utility model provides a mini LED backlight device, comprising a mounting frame 1, two ventilation dustproof plates 13 are symmetrically installed on the side ends of the mounting frame 1, a mounting plate 2 is slidably connected in the mounting frame 1, a heat dissipation cavity 21 is provided in the mounting plate 2, a PCB substrate 22 is fixedly installed on the upper end of the mounting frame 1, a reflective film 23 is provided on the PCB substrate 22, an LED lamp bead 24 is provided on the PCB substrate 22, a heat-conducting copper column 25 is provided on the PCB substrate 22, and a heat dissipation fin 26 is provided in the heat dissipation cavity 21, wherein the LED lamp bead (24) comprises an LED chip 3, a fluorescent glue layer 31 is sprayed on the surface of the LED chip 3, a white wall glue 32 is provided on the periphery of the LED chip 3, and a transparent silica gel layer 33 is filled in the white wall glue 32. When the LED is lit, the blue light directly excites the fluorescent powder on the chip surface to convert it into white light. Since the thermal conductivity of the transparent silica gel is small, the heat generated by the blue light of the LED chip exciting the fluorescent powder is mainly concentrated on the surface of the LED. The heat dissipated by the heat transfer device 20 is transmitted to the heat sink 26 by the heat transfer device 21.

[0028] The side end of the mounting frame 1 is provided with a card interface 14, and a limit plate 11 is installed in the card interface 14. The side end of the mounting frame 1 is threadedly installed with a fixing screw 12, and the fixing screw 12 is threadedly installed with the limit plate 11. A card slot 15 is provided on one side of the card interface 14, and a diffuser plate 27 is installed in the card slot 15, an optical film 28 is installed in the card slot 15, and a liquid crystal panel 29 is installed in the card slot 15. Install the mounting plate 2 in the mounting frame 1, and then install the mounting plate 2 in sequence. The diffuser plate 27 is inserted and installed in the bottom card slot 15, and then the optical film 28 is installed in the middle card slot 15. Finally, the liquid crystal panel 29 is inserted and installed in the top card slot 15. Then the limit plate 11 is installed in the card interface 14. The limit plate 11 fills and limits the mounting plate 2, the diffuser plate 27, the optical film 28 and the liquid crystal panel 29. Then, the fixing screw 12 is rotated and the fixing screw 12 is used to limit and fix the mounting frame 1 and the limit plate 11.

[0029] Working principle:

[0030] In the first step, this design mainly mounts the LED chip on the PCB substrate, then sprays a layer of fluorescent glue on the surface of the LED chip, bakes it dry, surrounds the LED chip with white wall glue, and finally injects transparent silicone into the white wall. This design only sprays a layer of fluorescent glue on the surface of the LED chip and the nearby peripheral substrate, and then surrounds it with a white wall and injects transparent silicone into the upper layer of the fluorescent glue. When the LED is lit, the blue light directly excites the phosphor on the surface of the chip and converts it into white light. Due to the low thermal conductivity of transparent silicone, the heat generated by the blue light of the LED chip to excite the phosphor is mainly concentrated in the fluorescent glue layer on the surface of the LED. Most of the heat is dissipated through conduction of the PCB substrate, and only a small part will be transferred to the package surface through the transparent silicone. Therefore, the package surface temperature will be much lower. Compared with the existing white light Mini LED technology, this technology will make the temperature of the package surface lower. From the temperature performance point of view, it is reduced by 20% to 25%, which will have better heat dissipation performance on the LED module.

[0031] In the second step, when the miniLED backlight device is in use, the PCB substrate 22 and the LED lamp beads 24 generate heat during operation. The PCB substrate 22 and the LED lamp beads 24 are connected to the thermal conductive copper pillars 25. The PCB substrate 22 and the LED lamp beads 24 transfer heat to the thermal conductive copper pillars 25. After being heated, the thermal conductive copper pillars 25 conduct heat. The thermal conductive copper pillars 25 transfer heat to the heat dissipating fins 26. The heat dissipating fins 26 are located in the heat dissipation cavity 21. Because the heat dissipation cavity 21 is connected to the ventilation and dustproof plates 13 on both sides, the fresh air enters the heat dissipation cavity 21 after being filtered by the ventilation and dustproof plates 13 on both sides, thereby dissipating heat to the heat dissipating fins 26, thereby achieving the purpose of dissipating heat to the PCB substrate 22 and the LED lamp beads 24.

[0032] In the third step, when the miniLED backlight device is installed, the mounting plate 2 is installed in the mounting frame 1, and then the diffuser plate 27 is plugged and installed in the bottom card slot 15 in turn, and then the optical film 28 is installed in the middle card slot 15, and finally the liquid crystal panel 29 is plugged and installed in the top card slot 15, and then the limit plate 11 is installed in the card interface 14. The limit plate 11 fills and limits the mounting plate 2, the diffuser plate 27, the optical film 28 and the liquid crystal panel 29, and then the fixing screw 12 is turned, and the fixing screw 12 is used to limit and fix the mounting frame 1 and the limit plate 11.

[0033] Finally, it should be noted that the above embodiments are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to enumerate all embodiments here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A miniLED backlight device, comprising a mounting frame (1), characterized in that: Two ventilation and dustproof plates (13) are symmetrically mounted on the side ends of the mounting frame (1); a mounting plate (2) is slidably engaged in the mounting frame (1); a heat dissipation cavity (21) is provided in the mounting plate (2); a PCB substrate (22) is fixedly mounted on the upper end of the mounting frame (1); a reflective film (23) is provided on the PCB substrate (22); an LED lamp bead (24) is provided on the PCB substrate (22); a heat-conducting copper column (25) is provided on the PCB substrate (22); and heat dissipation fins (26) are provided in the heat dissipation cavity (21); The LED lamp bead (24) comprises an LED chip (3), a fluorescent adhesive layer (31) is sprayed on the surface of the LED chip (3), a white wall adhesive (32) is arranged on the periphery of the LED chip (3), and a transparent silicone layer (33) is filled in the white wall adhesive (32), the heat-conducting copper column (25) passes through the upper end of the mounting plate (2), the heat-conducting copper column (25) is fixedly connected to the heat dissipation fin (26), and the reflective film (23) is located below the LED lamp bead (24).

2. The miniLED backlight device according to claim 1, wherein: A card interface (14) is provided at the side end of the installation frame (1).

3. The miniLED backlight device according to claim 2, wherein: A limiting plate (11) is mounted in the card interface (14).

4. The miniLED backlight device according to claim 3, wherein: A fixing screw (12) is threadedly mounted on the side end portion of the mounting frame (1), and the fixing screw (12) is threadedly mounted on the limiting plate (11).

5. The miniLED backlight device according to claim 4, characterized in that: A card slot (15) is provided on one side of the card interface (14), and a diffusion plate (27) is inserted and installed in the card slot (15).

6. The miniLED backlight device according to claim 5, characterized in that: An optical film (28) is inserted and installed in the snap-in slot (15), and a liquid crystal panel (29) is inserted and installed in the snap-in slot (15).

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