Heat dissipation mechanism for solder mask LDI

Abstract

The utility model relates to the technical field of heat dissipation mechanisms, and discloses a heat dissipation mechanism for solder mask LDI, which comprises a lattice lens, a laser + LED module, an LED module and a DMD reflection module, a protective shell is sleeved on the lattice lens, the middle part of the protective shell is downward to form an opening, a rotary air injection mechanism is arranged in the protective shell, and the DMD reflection module is arranged in the rotary air injection mechanism. And the protective shell communicates with an air supply pipe. According to the heat dissipation mechanism for the solder mask LDI provided by the utility model, the rotary air injection mechanism is arranged, so that the lattice lens can be cooled, and the use stability of the lattice lens is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation mechanisms, in particular to a heat dissipation mechanism for solder-proof LDI. Background Art

[0002] Laser direct imaging (LDI), or laser direct imaging, plays a crucial role in the exposure phase of PCB (printed circuit board) manufacturing. It differs from traditional film-contact exposure methods. During PCB fabrication, to create windows that allow soldering, the solder mask layer must be exposed, exposing the solder mask in specific areas. This process typically utilizes a combination of lasers and LEDs, along with a DMD (digital micromirror device) reflective module.

[0003] In practice, the DMD module is responsible for accurately projecting the desired light onto the product's exposure film while reflecting unwanted light back onto the inner surface of the lens. However, this reflection causes the lens to absorb energy and deform, resulting in a deviation between the actual light path and the theoretically designed path. Furthermore, dot-matrix lenses generate significant heat during operation, which can cause lens deformation, affecting the output position of the light and causing deviations.

[0004] In order to solve the above problems, this application proposes a heat dissipation mechanism for solder-proof LDI. Utility Model Content

[0005] (1) Purpose of the utility model

[0006] In order to solve the technical problems existing in the background technology, the utility model proposes a heat dissipation mechanism for solder-proof LDI. The utility model is provided with a rotating air-jet mechanism to facilitate cooling of the dot matrix lens and increase its stability in use.

[0007] (2) Technical solution

[0008] To solve the above problems, the utility model provides a heat dissipation mechanism for solder-proof LDI, including a dot matrix lens, a laser + LED module, an LED module and a DMD reflective module. The dot matrix lens is covered with a protective shell, the middle part of the protective shell is opened downward, a rotating jet mechanism is provided inside the protective shell, and an air supply duct is connected to the protective shell.

[0009] Preferably, the rotary jet mechanism includes a rotating shell, the rotating shell is downwardly opened, the rotating shell is rotatably sleeved on the lattice lens, and an air inlet is opened on the outer periphery of the rotating shell.

[0010] Preferably, a guide plate is fixedly installed at the air inlet.

[0011] Preferably, there are two air supply pipes, and the two air supply pipes are symmetrically arranged about the rotation center.

[0012] Preferably, the guide plate is arranged in an arc shape.

[0013] The above technical solution of the utility model has the following beneficial technical effects:

[0014] Air is sent into the space enclosed by the protective shell and the rotating shell through the air supply pipe. In this space, the air exerts force on the guide plate, driving the rotating shell to start rotating. At the same time, air enters the interior of the rotating shell through the air inlet. Inside the rotating shell, the air is rotated and sprayed toward the dot matrix lens, achieving a heat dissipation effect on the dot matrix lens, thereby enhancing the stability of the dot matrix lens during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural schematic diagram of a heat dissipation mechanism for solder-proof LDI proposed by the present invention.

[0016] Figure 2 The utility model provides a schematic cross-sectional view of a protective shell in a heat dissipation mechanism for solder-proof LDI.

[0017] Figure 3 The utility model is a schematic diagram of a side cross-sectional structure of a protective shell in a heat dissipation mechanism for solder-proof LDI.

[0018] Figure numerals: 1. dot matrix lens; 2. laser + LED module; 3. LED module; 4. DMD reflection module; 5. protective shell; 6. rotating jet mechanism; 61. rotating shell; 611. air inlet; 62. guide plate; 7. air supply duct. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0020] like Figure 1-3 As shown, the present invention proposes a heat dissipation mechanism for solder-proof LDI, including a dot matrix lens 1, a laser + LED module 2, an LED module 3 and a DMD reflector module 4. The dot matrix lens 1 is provided with a protective shell 5, the middle portion of which is downwardly opened. A rotating jet mechanism 6 is provided inside the protective shell 5, and an air supply duct 7 is connected to the protective shell 5.

[0021] Specifically, the rotating jet mechanism 6 includes a rotating shell 61, which forms an opening downward. The rotating shell 61 is rotatably mounted on the dot matrix lens 1. An air inlet 611 is provided on the outer periphery of the rotating shell 61. There are multiple air inlets 611, and the multiple air inlets 611 are evenly spaced. A guide plate 62 is fixedly installed at the air inlet 611.

[0022] In an optional embodiment, the number of the air supply pipes 7 is two, and the two air supply pipes 7 are symmetrically arranged about the rotation center, and the guide plate 62 is arranged in an arc shape.

[0023] In the present invention, air is sent into the space enclosed by the protective shell 5 and the rotating shell 61 through the air supply pipe 7. In this space, the air exerts force on the guide plate 62, driving the rotating shell 61 to start rotating. At the same time, the air enters the interior of the rotating shell 61 through the air inlet 611. Inside the rotating shell 61, the air is rotated and sprayed toward the dot matrix lens 1, achieving a heat dissipation effect on the dot matrix lens 1, thereby enhancing the stability of the dot matrix lens 1 during use.

[0024] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. A heat dissipation mechanism for solder-proof LDI, comprising a dot matrix lens (1), a laser + LED module (2), an LED module (3) and a DMD reflection module (4), characterized in that: The dot matrix lens (1) is provided with a protective shell (5), the middle portion of the protective shell (5) is downwardly opened, a rotating jet mechanism (6) is provided inside the protective shell (5), and the protective shell (5) is connected to an air supply pipe (7).

2. A heat dissipation mechanism for solder-proof LDI according to claim 1, characterized in that: The rotating jet mechanism (6) comprises a rotating shell (61), the rotating shell (61) is downwardly opened, the rotating shell (61) is rotatably sleeved on the dot matrix lens (1), and an air inlet (611) is formed on the outer periphery of the rotating shell (61).

3. A heat dissipation mechanism for solder-proof LDI according to claim 2, characterized in that: A guide plate (62) is fixedly installed at the air inlet (611).

4. A heat dissipation mechanism for solder-proof LDI according to any one of claims 1 to 3, characterized in that: The number of the air supply pipes (7) is two, and the two air supply pipes (7) are arranged symmetrically with respect to the rotation center.

5. The heat dissipation mechanism for solder-proof LDI according to claim 3, characterized in that: The guide plate (62) is arranged in an arc shape.

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