Display device including a cushion pad layer

Abstract

The utility model relates to a display device. The display device includes: a display panel including a substrate and a display layer disposed on the substrate and configured to display an image; a cover window disposed on the display panel; a protective film disposed under the display panel; and a cushion layer disposed on the protective film, in which the cover window includes: a first cover window portion overlapping the protective film; and a second cover window portion at least partially surrounding the first cover window portion, in which the cushion layer includes: a first cushion layer portion overlapping the protective film; and a second cushion layer portion including a grounded metal material and protruding outward from the first cushion layer portion, and wherein the second cover window portion and the second cushion layer portion are spaced apart from each other.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2023-0124258 filed on September 18, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments of the present disclosure relate to a display device, and more particularly, to a display device including a buffer layer. Background Art

[0004] Mobile electronic devices have been growing exponentially in popularity. Recently, in addition to small electronic devices such as mobile phones, tablet personal computers (PCs) are widely used as mobile electronic devices.

[0005] Many mobile electronic devices include display devices to provide users with visual information such as images or videos. Recently, as the size of other components for driving the display device has decreased, the area occupied by the display device in the electronic device has gradually increased, and a structure that can be bent at a certain angle from a flat state may be included in the electronic device. Utility Model Content

[0006] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a substrate and a display layer arranged on the substrate and configured to display an image; a cover window arranged on the display panel; a protective film arranged under the display panel; and a buffer pad layer arranged on the protective film, wherein the cover window includes: a first cover window portion overlapping with the protective film; and a second cover window portion at least partially surrounding the first cover window portion, wherein the buffer pad layer includes: a first buffer pad layer portion overlapping with the protective film; and a second buffer pad layer portion including a grounded metal material and protruding outward from the first buffer pad layer portion, and wherein the second cover window portion and the second buffer pad layer portion are spaced apart from each other.

[0007] In one or more embodiments of the present disclosure, a cushion opening is arranged between the second cover window portion and the second cushion layer portion.

[0008] In one or more embodiments of the present disclosure, at least a portion of the second cushion layer portion does not overlap with the protection film.

[0009] In one or more embodiments of the present disclosure, the first cushion layer portion and the second cushion layer portion include the same material as each other.

[0010] In one or more embodiments of the present disclosure, the second buffer layer portion includes a copper material.

[0011] In one or more embodiments of the present disclosure, the second cushion layer portion is provided in plurality.

[0012] In one or more embodiments of the present disclosure, at least two of the plurality of second cushion layer portions have shapes different from each other.

[0013] In one or more embodiments of the present disclosure, the second cushion layer portion has a rectangular shape in a plane.

[0014] In one or more embodiments of the present disclosure, the second cushion layer portion has a portion of a triangular shape or an elliptical shape in a plane.

[0015] In one or more embodiments of the present disclosure, the second cushion layer portion surrounds at least a portion of the first cushion layer portion.

[0016] According to one or more embodiments of the present disclosure, a display device includes: a display panel, including a substrate and a display layer panel arranged on the substrate and configured to display an image; a cover window, arranged on the display panel; a protective film, arranged under the display panel; and a buffer pad layer, arranged under the protective film, wherein the cover window includes: a first cover window portion, overlapping with the protective film; and a second cover window portion, at least partially surrounding the first cover window portion, wherein the buffer pad layer includes: a first buffer pad layer portion, overlapping with the protective film; and a second buffer pad layer portion, including a grounded metal material and protruding outward from the first buffer pad layer portion, and wherein at least a portion of the second buffer pad layer portion does not overlap with the protective film.

[0017] In one or more embodiments of the present disclosure, the second cover window portion and the second cushion layer portion are spaced apart from each other.

[0018] In one or more embodiments of the present disclosure, a cushion opening is arranged between the second cover window portion and the second cushion layer portion.

[0019] In one or more embodiments of the present disclosure, the first cushion layer portion and the second cushion layer portion include the same material as each other.

[0020] In one or more embodiments of the present disclosure, the second buffer layer portion includes a copper material.

[0021] In one or more embodiments of the present disclosure, the second cushion layer portion is provided in plurality.

[0022] In one or more embodiments of the present disclosure, at least two of the plurality of second cushion layer portions have shapes different from each other.

[0023] In one or more embodiments of the present disclosure, the second cushion layer portion has a rectangular shape in a plane.

[0024] In one or more embodiments of the present disclosure, the second cushion layer portion has a portion of a triangular shape or an elliptical shape in a plane.

[0025] In one or more embodiments of the present disclosure, the second cushion layer portion surrounds at least a portion of the first cushion layer portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other aspects and features of the embodiments of the present disclosure will become more apparent by describing in detail the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0027] Figure 1 is a plan view schematically showing a display device according to an embodiment of the present disclosure;

[0028] Figure 2 is a rear view schematically showing a portion of a display device according to an embodiment of the present disclosure;

[0029] Figure 3 、 Figure 4 and Figure 5 is a cross-sectional view schematically showing a portion of a display device according to an embodiment of the present disclosure;

[0030] Figure 6 is a cross-sectional view schematically showing a display device according to an embodiment of the present disclosure;

[0031] Figure 7 is a circuit diagram of a pixel of a display device according to an embodiment of the present disclosure; and

[0032] Figure 8 、 Figure 9 、 Figure 10 and Figure 11 is a rear view schematically showing a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] Exemplary embodiments of the present disclosure will now be described more fully with reference to the accompanying drawings. It should be understood that the present disclosure can be implemented in different forms and should therefore not be construed as being limited to the embodiments set forth herein. It should be understood that throughout the specification, the same reference numerals may refer to the same elements and therefore redundant descriptions may be omitted. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout this disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0034] It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, the first element, first component, first region, first layer, or first part described below may be referred to as a second element, second component, second region, second layer, or second part without departing from the spirit and scope of the present disclosure.

[0035] It will be understood that a singular expression includes a plural expression unless the context clearly differs.

[0036] It will be understood that when an element or layer is referred to as being “on” another element or layer, it can be directly on the other element or layer, or intervening elements or layers may also be present.

[0037] In the drawings, various thicknesses, lengths, and angles are shown, and while the arrangements shown do represent embodiments of the present disclosure, it should be understood that modifications of the various thicknesses, lengths, and angles may be possible within the spirit and scope of the present disclosure, and the present disclosure is not necessarily limited to the specific thicknesses, lengths, and angles shown.

[0038] It should be understood that the x-axis, y-axis, and z-axis are not limited to the three axes on the Cartesian coordinate system and can be interpreted in a broader sense including the same. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, but can refer to different directions that are not orthogonal to each other.

[0039] It should be understood that in some embodiments, the order of specific processes may be performed differently from the order described. For example, two consecutively described processes may be performed substantially simultaneously, or in an order opposite to the order described.

[0040] Figure 1 is a plan view schematically showing a display device 1 according to an embodiment of the present disclosure.

[0041] refer to Figure 1 The display device 1 manufactured according to an embodiment of the present disclosure may include a display area DA and a peripheral area PA outside the display area DA. The display device 1 may provide an image through an array of a plurality of pixels PX two-dimensionally arranged in the display area DA.

[0042] The peripheral area PA may be an area where no image is provided and may completely or partially surround the display area DA. A driver for providing an electrical signal or power to each pixel circuit corresponding to each pixel PX may be arranged in the peripheral area PA. Pads, which are areas where electronic devices or printed circuit boards can be electrically connected, may be arranged in the peripheral area PA.

[0043] Hereinafter, in the case where the display device 1 includes a light-emitting element, the display device 1 may include an organic light-emitting diode (OLED), but the display device 1 according to the embodiment of the present disclosure is not limited thereto. In the embodiment of the present disclosure, the display device 1 may be a light-emitting display device including an inorganic light-emitting diode, for example, an inorganic light-emitting display device. The inorganic light-emitting diode may include a PN diode, which includes a material based on an inorganic material semiconductor. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons may be injected, and the energy generated by the recombination of holes and electrons may be converted into light energy, so that light having a specific color may be emitted. The above-mentioned inorganic light-emitting diode may have a width of several to several hundred microns, and in the embodiment of the present disclosure, the inorganic light-emitting diode may be referred to as a micro light-emitting diode (LED). In the embodiment of the present disclosure, the display device 1 may be a quantum dot light-emitting device.

[0044] The display device 1 can be applied to various products such as mobile phones, smart phones, desktop personal computers (PCs), mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, ultra-mobile PCs, televisions (TVs), laptops, monitors, billboards, the Internet of Things (IOT), and the like. In addition, the display device 1 according to an embodiment of the present disclosure can be used in wearable devices such as smart watches, watch phones, glasses-type displays, or head-mounted displays (HMDs). In addition, the display device 1 according to an embodiment of the present disclosure can be used as an instrument panel of a vehicle, a central information display (CID) display set on a central instrument panel or dashboard of a vehicle, a mirror display for replacing a side mirror of a vehicle, and a display screen for one or more rear seats of a vehicle and set on the rear surface of a front seat or another surface facing the rear seat.

[0045] Figure 2 is a rear view schematically showing a portion of the display device 1 according to an embodiment of the present disclosure, and Figures 3 to 5 is a cross-sectional view schematically showing a portion of the display device 1 according to an embodiment of the present disclosure.

[0046] Specifically, Figure 3 Can correspond to Figure 2 Part III-III'. Figure 4 Can correspond to Figure 2 Part IV-IV', and Figure 5 Can correspond to Figure 2 Part V-V'.

[0047] refer to Figures 2 to 5 The display device 1 may include a display panel DP, a cover window CW, a protective film PTF, a buffer layer CSL, a printed circuit board PCB, a sensor driver SND, and a display driver DPD. Of course, the display device 1 may also include a bracket or a main circuit board, etc., which are not shown.

[0048] The display panel DP may display (e.g., output) information to be processed by the display device 1. For example, the display panel DP may display the execution or operation of an application, and the display panel DP may be driven by a driver. In addition, the execution or operation may be performed through a user interface (UI), and for example, graphical user interface (GUI) information based on the execution or operation screen information may be provided. The display panel DP may include a substrate 100, a display layer DISL, a sensor electrode layer SENL, and a color filter layer CL.

[0049] The substrate 100 may include an insulating material such as glass, quartz, and polymer resin. The substrate 100 may be a rigid substrate 100 or a flexible substrate 100 that can be bent, folded, or rolled. For your reference, Figure 3 It is shown that only a portion of the substrate 100 is bent. However, the present disclosure is not limited thereto.

[0050] The display layer DISL may be disposed on the substrate 100 and may display an image. The display layer DISL may be understood as a layer including a display element located on the substrate 100. For example, the display layer DISL may include a thin film transistor layer including a thin film transistor, a display element layer including a display element such as an organic light-emitting device, and an encapsulation layer for encapsulating the display element layer.

[0051] The display element may include, for example, a light-emitting element. For example, the display panel DP may be an organic light-emitting display panel DP including an organic light-emitting layer using an organic light-emitting diode, an ultra-small light-emitting diode display panel DP using a micro light-emitting diode (LED), a quantum dot light-emitting display panel DP including a quantum dot light-emitting layer using a quantum dot light-emitting diode, or an inorganic light-emitting display panel DP including an inorganic semiconductor using an inorganic light-emitting device.

[0052] The sensor electrode layer SENL may be arranged on the display layer DISL. The sensor electrode layer SENL detects a user's touch input. The sensor electrode layer SENL may detect the user's touch input using at least one of various touch methods, such as a resistive method and a capacitive method. Due to the display layer DISL and the sensor electrode layer SENL, the display panel DP can function as an input device providing an input interface between the display device 1 and the user, and simultaneously as an output device providing an output interface between the display device 1 and the user. The color filter layer CL may be arranged on the sensor electrode layer SENL. For example, the color filter layer CL may be configured to reduce external light reflection; however, the present disclosure is not limited thereto.

[0053] The cover window CW may be disposed on the display panel DP. The cover window CW may cover the upper surface of the display panel DP. Therefore, the cover window CW may protect the display panel DP.

[0054] The cover window CW may have relatively high light transmittance to transmit light emitted from the display panel DP and may have a relatively thin thickness to minimize the weight of the display device 1. In addition, the cover window CW may have high strength and hardness to protect the display panel DP from external impact.

[0055] For example, the cover window CW may be a flexible window. The cover window CW may be easily bent by external forces without cracking while protecting the display panel DP. For example, the cover window CW may be made of glass or plastic. For example, the cover window CW may be ultra-thin tempered glass (UTG) strengthened by a method such as chemical or thermal strengthening.

[0056] The cover window CW may include a first cover window portion CW1 and a second cover window portion CW2. The first cover window portion CW1 may overlap the protection film PTF and the display panel DP. The first cover window portion CW1 may be arranged in the center of the cover window CW.

[0057] The second cover window portion CW2 may at least partially surround the first cover window portion CW1. For example, the second cover window portion CW2 may be arranged outside the first cover window portion CW1. The second cover window portion CW2 may not overlap with the protection film PTF and the display panel DP.

[0058] The protective film PTF may be disposed under the display panel DP and attached to the rear surface of the substrate 100. The protective film PTF may include, for example, at least one of polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), and / or polyethylene terephthalate (PET).

[0059] The cushion layer CSL may be disposed below the protective film PTF. For example, a portion of the substrate 100 may be secured to the upper surface of the cushion layer CSL by the protective film PTF. The cushion layer CSL may absorb external impacts to reduce damage to the display panel DP. The cushion layer CSL may have a single-layer structure or a multi-layer structure.

[0060] A portion of the substrate 100 may be bent and fixed to the lower surface of the buffer layer CSL. A protective film PTF may be arranged between the lower surface of the buffer layer CSL and the substrate 100. A portion of the substrate 100 may be arranged below the buffer layer CSL, and the protective film PTF may fix the lower surface of the buffer layer CSL and the substrate 100 to each other. For example, the protective film PTF may be attached to a portion of the substrate 100 other than the bent region of the substrate 100.

[0061] The printed circuit board PCB can be electrically connected to the display panel DP. The printed circuit board PCB can be fixed to the substrate 100. For example, the printed circuit board PCB can be electrically connected to the display panel DP through the substrate 100, and the substrate 100 may include pads and circuits connected to the printed circuit board PCB and the display panel DP. For example, the printed circuit board PCB can be a flexible printed circuit board (FPCB) that can bend, a rigid printed circuit board (PCB) that is hard and not easily bent, or a composite PCB that includes both a rigid PCB and an FPCB.

[0062] The sensor driving unit SND may be disposed on a printed circuit board (PCB). The sensor driving unit SND may include an integrated circuit (IC). The sensor driving unit SND may be electrically connected to the sensor electrodes of the sensor electrode layer SENL of the display panel DP via the PCB. The sensor driving unit SND may transmit sensor data to a host processor based on the detected voltage, and the host processor may analyze the sensor data to calculate the touch coordinates where the touch input occurred.

[0063] The display driver (or display driver circuit) DPD can be electrically connected to the display panel DP. The display driver DPD can be fixed to the substrate 100. For example, the display driver DPD can be electrically connected to the display panel DP through the substrate 100, and the substrate 100 may include pads and circuits electrically connected to the display driver DPD and the display panel DP. Control signals and power supply voltages can be applied to the display driver DPD, and the display driver DPD can generate signals and voltages for driving the display panel DP and output the signals and voltages. The display driver DPD may include an integrated circuit (IC).

[0064] Of course, the pixels PX of the display panel DP, the scan driving unit (or scan driving circuit), and the power supply unit (or power supply circuit) for supplying the driving voltage for driving the display driving part DPD can be arranged on the printed circuit board PCB. In addition, the power supply unit can be integrated with the display driving part DPD. In this case, the display driving part DPD and the power supply unit can be formed by a single IC.

[0065] The printed circuit board PCB can be electrically connected to the main printed circuit board. For example, the main printed circuit board may include a main processor including an IC, a camera device, a wireless communication unit, an input unit, an output unit, an interface unit, a memory, a power supply unit, etc.

[0066] refer to Figure 2 、 Figure 4 and Figure 5 , the cushion layer CSL may include a first cushion layer portion CSL1 and a second cushion layer portion CSL2 .

[0067] The first buffer layer portion CSL1 may overlap the protective film PTF and the display panel DP. The first buffer layer portion CSL1 may be arranged in the center of the buffer layer CSL. The second buffer layer portion CSL2 may protrude outward from the first buffer layer portion CSL1. At least a portion of the second buffer layer portion CSL2 may not contact the protective film PTF and the display panel DP.

[0068] The second cover window portion CW2 and the second buffer layer portion CSL2 may be spaced apart from each other. The buffer opening OPCS may be disposed between the second cover window portion CW2 and the second buffer layer portion CSL2. For example, the thickness of the buffer opening OPCS may be substantially equal to the combined thickness of the display panel DP and the protective film PTF. Therefore, the lower surface of the second cover window portion CW2 and the upper surface of the second buffer layer portion CSL2 may face each other.

[0069] The second buffer layer portion CSL2 may include a grounded metal material. Therefore, when static electricity is introduced into the cover window CW, electrons may move toward the second buffer layer portion CSL2 (rather than toward the protective film PTF). Therefore, the phenomenon of the protective film PTF and the substrate 100 being sequentially charged by static electricity can be reduced. As a result, the phenomenon of leakage in the display panel DP due to the charged protective film PTF and the substrate 100 can be reduced. Therefore, the occurrence of a greenish color displayed by the display device 1 can be reduced.

[0070] For example, the second buffer layer portion CSL2 may include a copper material. The first buffer layer portion CSL1 and the second buffer layer portion CSL2 may include the same material as each other. For example, all of the first buffer layer portion CSL1 and the second buffer layer portion CSL2 may include a copper material and may be provided integrally. For example, the first buffer layer portion CSL1 and the second buffer layer portion CSL2 may be a single body. However, this is an example, and the materials used for the first buffer layer portion CSL1 and the second buffer layer portion CSL2 are not limited thereto.

[0071] For example, the first cushion layer portion CSL1 and the second cushion layer portion CSL2 may include different materials from each other. For example, unlike the second cushion layer portion CSL2, the first cushion layer portion CSL1 may include at least one of polydimethylsiloxane (PDMS), thermoplastic polyurethane rubber (TPU) and / or polyethylene terephthalate (PET), or may include a material having elasticity such as a sponge molded with rubber, urethane material, or acrylic material.

[0072] Figure 6 is a cross-sectional view schematically showing a display device 1 according to an embodiment of the present disclosure, and may correspond to a cross-sectional view of the display device 1 along Figure 1 A cross-sectional view taken along line VI-VI'.

[0073] refer to Figure 6 The display device 1 may include a substrate 100 and a display layer DISL. For example, the display layer DISL may include a stacked structure including a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300.

[0074] The substrate 100 may have a multilayer structure including a layer containing the above-mentioned polymer resin and an inorganic layer. For example, the substrate 100 may include a base layer containing a polymer resin and a barrier layer containing an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked in sequence. For example, each of the first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate, triacetyl cellulose (TAC), and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 may have flexible properties.

[0075] The pixel circuit layer PCL may be disposed on the substrate 100 . Figure 6 The pixel circuit layer PCL includes a thin film transistor TFT and a buffer layer 111 , a first gate insulating layer 112 , a second gate insulating layer 113 , an interlayer insulating layer 114 , a first planarization insulating layer 115 , and a second planarization insulating layer 116 arranged on a substrate 100 .

[0076] The buffer layer 111 may reduce or block penetration of foreign matter, moisture, or external air from a lower portion of the substrate 100, and may provide a flat surface onto the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer structure or a multi-layer structure including the above materials.

[0077] The thin film transistor TFT disposed on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon (poly-Si). Alternatively, the semiconductor layer Act may include amorphous silicon (a-Si), an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region C and a drain region D and a source region S on opposite sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0078] The gate electrode GE may include a low-resistance metal material, a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multilayer structure or a single layer structure including the above materials.

[0079] The first gate insulating layer 112 disposed between the semiconductor layer Act and the gate electrode GE may include a material such as silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0080] The second gate insulating layer 113 may be provided to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0081] The upper electrode Cst2 of the storage capacitor Cst may be disposed above the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE disposed below the upper electrode Cst2. At this time, the gate electrode GE and the upper electrode Cst2, which overlap each other with the second gate insulating layer 113 therebetween, may form the storage capacitor Cst. That is, the gate electrode GE may function as the lower electrode Cst1 of the storage capacitor Cst.

[0082] In this manner, the storage capacitor Cst and the thin film transistor TFT may overlap each other. In an embodiment of the present disclosure, the storage capacitor Cst may not overlap with the thin film transistor TFT.

[0083] The upper electrode Cst2 may include, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer structure or a multi-layer structure including the above materials.

[0084] The interlayer insulating layer 114 may be provided to cover the upper electrode Cst2. The interlayer insulating layer 114 may include a material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ). The interlayer insulating layer 114 may have a single layer structure or a multilayer structure including the above-mentioned inorganic insulating material.

[0085] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S, respectively, through contact holes formed in the insulating layers 112, 113, and 114 disposed below the drain electrode DE and the source electrode SE. The drain electrode DE and the source electrode SE may include a good conductive material. For example, each of the drain electrode DE and the source electrode SE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multilayer structure or a single layer structure including the above materials. In an embodiment of the present disclosure, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0086] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material such as a general polymer (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and a combination thereof.

[0087] The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulating material such as a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and a combination thereof.

[0088] The display element layer DEL may be provided on the pixel circuit layer PCL having the above-described structure. The display element layer DEL may include an organic light-emitting diode OLED as a display element (e.g., a light-emitting device), and the organic light-emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. For example, the organic light-emitting diode OLED may emit red light, green light, or blue light, or may emit red light, green light, blue light, or white light. The organic light-emitting diode OLED may emit light through an emission region, and the emission region may be defined as a pixel PX.

[0089] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115 .

[0090] The pixel electrode 210 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In an embodiment of the present disclosure, the pixel electrode 210 may include a reflective layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a mixture thereof. In an embodiment of the present disclosure, the pixel electrode 210 may further include a layer formed of ITO, IZO, ZnO, or In2O3 above / below the reflective layer.

[0091] A bank layer 117 having an opening 117OP for exposing the center of the pixel electrode 210 may be disposed on the pixel electrode 210. The bank layer 117 may include an organic insulating material and an inorganic insulating material. The opening 117OP may define an emission region from which light is emitted from the organic light emitting diode OLED. For example, the size / width of the opening 117OP may correspond to the size / width of the emission region. Therefore, the size / width of the pixel PX may depend on the size / width of the opening 117OP of the bank layer 117.

[0092] The intermediate layer 220 may include a light emitting layer 222 formed to correspond to the pixel electrode 210. The light emitting layer 222 may include a polymer or a low molecular weight organic material that emits light of a specific color. In addition, the light emitting layer 222 may include an inorganic light emitting material or quantum dots.

[0093] In an embodiment of the present disclosure, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 arranged below and above the light-emitting layer 222. For example, the light-emitting layer 222 may be arranged between the first functional layer 221 and the second functional layer 223. The first functional layer 221 may include, for example, a hole transport layer (HTL) and a hole injection layer (HIL). The second functional layer 223 may be a component arranged above the light-emitting layer 222 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Similar to the common electrode 230 to be described later, the first functional layer 221 and / or the second functional layer 223 may be a common layer formed to cover the substrate 100. For example, the first functional layer 221 and / or the second functional layer 223 may completely cover the upper surface of the substrate 100.

[0094] The common electrode 230 may be arranged on the pixel electrode 210 and may overlap with the pixel electrode 210. The common electrode 230 may include a conductive material having a low work function. For example, the common electrode 230 may include a (semi) transparent layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, or an alloy thereof. In addition, the common electrode 230 may further include a layer such as ITO, IZO, ZnO, or In2O3 on the (semi) transparent layer comprising the above-mentioned materials. For example, the common electrode 230 may be formed integrally to completely cover the substrate 100.

[0095] The encapsulation layer 300 may be disposed on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and in an embodiment of the present disclosure, Figure 6 It is shown that the encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 , which are sequentially stacked.

[0096] For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acryl-based resin, an epoxy-based resin, polyimide, polyethylene, and the like. In an embodiment of the present disclosure, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 may be formed by reinforcing a monomer or by coating a polymer. The organic encapsulation layer 320 may have transparency.

[0097] The touch sensor layer can be arranged on the encapsulation layer 300, and the optical functional layer can be arranged on the touch sensor layer. The touch sensor layer can obtain coordinate information based on external input (e.g., a touch event). The optical functional layer can reduce the reflectivity of light (e.g., external light) incident from the outside toward the display device 1, and / or can enhance the color purity of the light emitted from the display device 1. In an embodiment of the present disclosure, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include an elongated synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a specific arrangement. The phase retarder and the polarizer may also include a protective film.

[0098] The adhesive member may be disposed between the touch sensor layer and the optical functional layer. The adhesive member may be a common adhesive known in the art without limitation. The adhesive member may be a pressure sensitive adhesive (PSA).

[0099] Figure 7 is a circuit diagram of a pixel PX of the display device 1 according to an embodiment of the present disclosure.

[0100] Each pixel PX may include a pixel circuit PC and a display element (e.g., an organic light emitting diode OLED) connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light through the organic light emitting diode OLED.

[0101] The second thin film transistor T2 may be a switching thin film transistor and may be connected to the scan line SL and the data line DL. Furthermore, the second thin film transistor T2 may be configured to transmit a data voltage input from the data line DL to the first thin film transistor T1 in response to a switching voltage input from the scan line SL. A storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL and may store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0102] The first thin film transistor T1 may be a driving thin film transistor and may be connected to the driving voltage line PL and the storage capacitor Cst. Furthermore, the first thin film transistor T1 may control a driving current flowing from the driving voltage line PL through the organic light emitting diode OLED in response to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a specific brightness by using the driving current. An opposing electrode (e.g., a cathode) of the organic light emitting diode OLED may receive a second power supply voltage ELVSS.

[0103] Figure 7 The pixel circuit PC is shown as including two thin film transistors T1 and T2 and one storage capacitor Cst, but the present disclosure is not limited thereto. The number of thin film transistors and the number of storage capacitors can be variously changed according to the design of the pixel circuit PC. For example, the pixel circuit PC may also include three, four, five, or more thin film transistors.

[0104] Figures 8 to 11 is a rear view schematically showing the display apparatus 1 according to an embodiment of the present disclosure.

[0105] exist Figures 8 to 11 In, with Figures 2 to 5 The same reference numerals as those in the accompanying drawings denote the same elements, and thus, redundant descriptions thereof are omitted or briefly discussed.

[0106] refer to Figure 2 as well as Figures 8 to 11 , the second cushion layer portion CSL2 may have various shapes.

[0107] First, refer to Figure 2 as well as Figures 8 to 10 The second cushion layer portion CSL2 may be provided in plurality and may be arranged to be spaced apart from each other along an outer edge or rim of the first cushion layer portion CSL1.

[0108] like Figure 2 As shown in FIG, the second cushion layer portion CSL2 may have a rectangular shape in a plane, and as shown in FIG. Figure 8As shown in FIG, the second cushion layer portion CSL2 may have a triangular shape on a plane, and as shown in FIG. Figure 9 As shown in FIG, the second cushion layer portion CSL2 may have a portion of an elliptical shape or a curved shape in a plane.

[0109] In addition, if Figure 10 As shown in FIG, shapes of at least two of the plurality of second cushion layer portions CSL2 may be different from each other. For example, on a plane, the second cushion layer portion CSL2 may have at least two of a rectangular shape, a triangular shape, and / or a portion of an elliptical shape.

[0110] refer to Figure 11 The number of the second cushion layer portion CSL2 may be one. The second cushion layer portion CSL2 may be arranged along the outer edge or the edge of the first cushion layer portion CSL1. The second cushion layer portion CSL2 may surround at least a portion of the first cushion layer portion CSL1.

[0111] However, in Figure 2 as well as Figures 8 to 11 The shape of the second cushion layer portion CSL2 shown in FIG. 1 is an example, and the shape of the second cushion layer portion CSL2 is not limited thereto. The shape of the second cushion layer portion CSL2 may be variously designed in consideration of the shape of the display device 1 and the like.

[0112] According to one or more embodiments of the present disclosure, the occurrence of a greenish phenomenon displayed due to leakage unintentionally generated in a display device can be reduced.

[0113] The effects of the present disclosure are not limited to the aforementioned purposes, and other effects that are not mentioned can be clearly understood from the present disclosure by those having ordinary skill in the art.

[0114] While the present disclosure has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure.

Claims

1. A display device, characterized in that: include: A display panel including a substrate and a display layer disposed on the substrate and configured to display an image; a cover window, arranged on the display panel; a protective film, arranged under the display panel; as well as a cushion layer, arranged on the protective film, Wherein, the cover window comprises: a first cover window portion overlapping the protective film; and a second cover window portion, at least partially surrounding the first cover window portion, Wherein, the buffer layer comprises: a first cushion layer portion overlapping the protective film; and a second cushion layer portion comprising a grounded metal material and protruding outward from the first cushion layer portion, and The second cover window portion and the second buffer layer portion are spaced apart from each other.

2. The display device according to claim 1, wherein A cushion opening is disposed between the second cover window portion and the second cushion layer portion.

3. The display device according to claim 1, wherein At least a portion of the second cushion layer does not overlap with the protection film.

4. The display device according to claim 1, wherein The first cushion layer portion and the second cushion layer portion include the same material as each other.

5. The display device according to claim 1, wherein The second buffer layer portion includes a copper material.

6. The display device according to claim 1, wherein The second buffer layer portion is provided in plurality.

7. The display device according to claim 6, wherein: At least two of the plurality of second cushion layer portions have shapes different from each other.

8. The display device according to claim 1, wherein In plan, the second cushion layer portion has a rectangular shape.

9. The display device according to claim 1, wherein In a plane, the second cushion layer portion has a triangular shape or a portion of an elliptical shape.

10. The display device according to claim 1, wherein The second cushioning layer portion surrounds at least a portion of the first cushioning layer portion.

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