306results about "Earth/grounding circuits" patented technology

Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%.

An electronic component including at least one first conductor for operating at a first voltage applied thereto and at least one second conductor for operating at a second voltage applied thereto. The second voltage is smaller than the first voltage and at least a portion of the second conductor is located on at least one side of the first conductor whereby the second conductor acts as a shield to substantially inhibit at least one of magnetic and electric field from passing from the first conductor to a surrounding medium.

An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

An electronic device includes a substrate, a structure arranged near the substrate and includes at least one electronic component, a conductive structure provided in the electronic device, and a conductor arranged in the structure, grounding the conductive structure to a ground of the substrate. Electronic components spaced within the electronic device are electrically connected to each other using the existing structure to be installed, so that a mounting space for preparing an electrical connector is prevented from being wasted, thereby making the electronic device slim. The embodiments according to the present disclosure can reduce the number of assembling processes and manufacturing costs.

An interface card securing device including a grounding element is disclosed. The grounding element may reduce the interference during high speed signal transmission of the interface card. The grounding element is integrally formed with the securing device as single unit using a plastic injection molding process. Thus, the assembly of the securing device is simplified, and the fabrication cost of the interface card securing device is significantly reduced, and the signal transmission quality is significantly promoted.

An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.

A plasma display module having an improved grounding structure suitable for manufacturing a lightweight and slim plasma display module. The plasma display module includes: a chassis base formed of a plastic material; a plasma display panel disposed in front of the chassis base to display images; a plurality of circuit substrates disposed on a rear surface of the chassis base to drive the plasma display panel; a grounding member which is disposed corresponding to the circuit substrates so that the chassis base is disposed between the grounding member and the circuit substrates and is formed of a conductive material so that the grounding member can provide a ground voltage to the circuit substrates grounded to the grounding member; and a screw member that electrically connects the circuit substrates to the grounding member through the chassis base and fixes the circuit substrates to the chassis base.

A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

A plasma display apparatus including: a plasma display panel; a non-conductive chassis disposed on a rear portion of the plasma display panel to support the plasma display panel; a circuit unit disposed on a rear portion of the chassis to drive the plasma display panel; and a conductive member disposed between the plasma display panel and the chassis, having at least a part that is slit and protruded toward the chassis. In addition, the circuit unit includes a grounding portion having a grounding voltage and the grounding portion is electrically connected to the protruding portion of the conductive member.

In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and / or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%.

In the field of wideband microwave circuits placed in a housing, an electromagnetic protection device able to protect a microwave connection between a coaxial microwave connector placed on a housing and at least one element of a microwave circuit contained in said housing is provided. The device is formed by a separate pipe made of a resilient electrically conductive material, and it ensures ground continuity between the electric ground of the microwave circuit and the mechanical ground of the housing.

A power and signal distribution system is adaptable to existing building areas and provides a shielded, low resistance and low inductance grounding structure. The distribution system comprises two or more electrically conductive enclosed channels; one for lower current signals and power distribution and one for high current signals and power distribution. The enclosed channels are electrically coupled and are configured as crosses or spokes with branches extending substantially over the length and width of the building area. The earth ground for the building has a direct connection to one of the enclosures. The ground of each device in the building area is directly connected to the enclosed channels by a low impedance connection. Cables are routed through the enclosures and extended to the devices. The walls of the enclosed channels have a thickness that is greater than the skin depth of a predetermined low frequency.

The embodiment of the invention provides a touch substrate, a preparation method thereof and a touch display device, relates to the technical field of touch, and can improve the antistatic capability of the touch display device. The touch substrate comprises an underlying substrate, wherein the underlying substrate is divided into a touch area and a shading area which surrounds the touch area; a first ground wire is arranged in the shading area of the underlying substrate and comprises a first terminal exposed out of the surface of the touch substrate; a second ground wire which is positioned in different layers with the first ground wire is also arranged in the shading area; and the second ground wire comprises a second terminal exposed out of the surface of the touch substrate, wherein the first terminal and the second terminal are not overlapped along a direction vertical to the underlying substrate. The touch substrate is used for improving the antistatic capability.

The invention provides a liquid crystal display panel and device, which belongs to the technical field of liquid crystal display and can solve the problem that the traditional liquid crystal display panel has a starting white line. The liquid crystal display panel disclosed by the invention is provided with a display zone and an access zone and comprises an array base plate and a colorful base plate which are arranged oppositely, wherein the array base plate is provided with a film transistor array limited by a gate electrode line and a source electrode line in the display zone; and the access zone is provided with a gate electrode lead connected with the gate electrode line. The liquid crystal display panel also comprises a shielding layer which is positioned in the access zone, is earthed, conducted and is used for shielding a sensing electromagnetic field caused by the voltage variation of the gate electrode lead. The liquid crystal display device comprises the liquid crystal display panel. The liquid crystal display and device can be used for a horizontal electric field liquid crystal display panel, such as a high-gradient switching-type liquid crystal display panel and a fringing field switching-type liquid crystal display panel.

An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.

A housing of a controller serving as electronic equipment is made up of an upper case and a lower case that are formed from a resin and fitted together. An accommodation recess is formed in a bottom surface of the lower case, and a metal plate is fixed to the accommodate recess. Conduction pillars that are formed from a conductive material and that protrude into the housing by penetrating through the lower case are formed on the metal plate. A lower board is electrically, physically connected to the conduction pillars. The upper board is electrically, physically connected to the lower board fixed to the conduction pillars by way of a connecting fitting formed from a conductive material.

The invention provides a device and method for improving the grounding reliability of a display screen. The device comprises a circuit board, conductive foam, a conductive fabric and a display screen,wherein the conductive foam is stuck on a ground point of the circuit board by virtue of first conductive adhesive; the conductive fabric is stuck on a backboard of the display screen by virtue of second conductive adhesive; and the conductive fabric is pasted on the conductive foam. The device provided by the invention has the advantages that the conductive fabric is arranged between the conductive foam and the backboard of the display screen, the conductive fabric is closely stuck with the backboard of the display screen together by virtue of the second conductive adhesive, a region coveredby the conductive adhesive on the backboard of the display screen is not completely blocked by an insulating oxidation film, the conductive fabric and the second conductive adhesive can conduct electricity and be grounded by virtue of a broken and leaked part on the oxidation film, reliable connection of the backboard of the display screen and the conductive fabric is realized, and the technicalproblem that a rear housing cannot be effectively grounded as the rear housing of a TFT display screen is an aluminized zinc plate in the traditional grounding manner is solved.

The present invention relates to an electronic device, including a body including an inner frame, a circuit board disposed inside the body to transmit a signal, an electronic component disposed on the circuit board, and a shield can disposed between the circuit board and the inner frame, and covering the electronic component such that a current induced from the electronic component flows toward the circuit board, wherein the shield can includes a base portion including a first region fixed to the circuit board, and a second region covering the electronic component, and at least one magnet portion overlapping the second region of the base portion, and forming a magnetic field in a direction from inside to outside of the base portion so as to disperse the current on the base portion.

A camera module is provided with a lens part including a lens and a lens barrel, a holder coupled with the lens part and formed with a first conductive layer, and a printed circuit board electrically connected to the first conductive layer while supporting the holder.

Interference shielded, for example a RFI and / or EMI shielded, electronics module, such as a circuit board (10) or a printed circuit or a corresponding electronics module, which interference shield forms a contact (4) with at least one edge zone (11) of the circuit board layers (12, 13, 14) of the circuit board, which contact functions in the electronics module as a means of grounding and which circuit board comprises: an outermost electrically conductive layer (3) providing the interference shield of the electronics module; at least one circuit card layer (12, 13, 14) unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer: and encapsulating activation material layer (2), which is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer (12), and which is arranged into a space between the outermost layer (3) and topmost circuit board layer (12) to be therein conformingly against the inner surface of the outermost layer (3) for isolating the electronic components and the wiring pattern from outermost layer, whereby for providing the interference shield, there is a direct conductive contact (4) at the side edge (21) of the circuit board between the outermost layer (3) and the edge zone (11) of the circuit board layer (12, 13, 14) providing the grounding. Characteristic to the shielded module is that the outermost shield layer (3) is essentially a single-layered covering and an outermost surface layer of the circuit board unit (10). Characteristic to the method is that the same comprises steps: a panel (1) comprising several circuit board units (10) is covered by an encapsulating layer (2); individual circuit boards (10) are separated from the panel along separation lines (A-A, B-B) of the circuit board units; and a surrounding shield layer is applied as the outermost layer, which forms an electrically conductive interference shield.

An electromagnetic shield termination assembly includes a wire assembly having an electrically conductive wire. An electromagnetic shield extends coaxially with the electrically conductive wire and covers at least a portion of a circumference of the electrically conductive wire, the electromagnetic shield and the electrically conductive wire covered thereby defining a shielded portion of the wire assembly. A non-shielded portion of the wire assembly extends outward of a terminal end of the electromagnetic shield. A termination device has an electrically conductive housing mounted to the wire assembly about the terminal end of the electromagnetic shield such that a portion of the housing engages a portion of the electromagnetic shield, and wherein the housing provides a flow path for an electrical current flowing in the electromagnetic shield.

A shielded electrical cable (2) includes one or more conductor sets (4) extending along a length (L) of the cable (2) and being spaced apart from each other along a width (W) of the cable (2). Each conductor set (4) has one or more conductors (6) having a size no greater than 24 AWG and each conductor set (4) has an insertion loss of less than about -20 dB / meter over a frequency range of 0 to 20GHz. First and second shielding films (8) are disposed on opposite sides of the cable (2), the first and second films (8) including cover portions (7) and pinched portions (9) arranged such that, in transverse cross section, the cover portions (7) of the first and second films (8) in combination substantially surround each conductor set (4), and the pinched portions (9) of the first and second films (8) in combination form pinched portions of the cable (2) on each side of each conductor set (4).

An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.

The invention provides a terminal device, comprising the following parts: a display module, comprising a display structure and a flexible circuit board; a metal structure, arranged between the displaystructure and the flexible circuit board and respectively attached to the display structure and the flexible circuit board, wherein the area of the attaching end surface of the metal structure the islarger than the area of the attaching end surface of the preset area of the flexible circuit board, and is smaller than the area of the attaching end surface of the display structure; a metal middleframe, comprising a groove and ends disposed on both sides of the groove, wherein the predetermined area of the flexible circuit board and the metal structure are disposed in the groove, and the endsare in contact with the display structure. The terminal device provided by the embodiment of the invention can reduce the stack thickness of the whole machine, provide a ground return path and excellent shielding performance, and can improve the temperature rise problem of the terminal device and improve the heat dissipation effect of the terminal device.