92results about How to "Reduce noise radiation" patented technology

Low-cost connector apparatus for passing electrical signals from one device over another via a cable. In one embodiment, the connector apparatus comprises a coaxial type connector that mates with a host device, such as via the motherboard thereof. In one variant, the connector further comprises a plurality of electrical components including an integrated circuit adapted to condition (e.g., equalize) the signals being transmitted over the cable. The connector (and hence internal electrical components) is shielded so as to mitigate the effects of EMI or RFI on the host device circuitry itself. In another variant, the signals comprise IEEE-Std. 1394 “FireWire” high speed data signals, and the use of the shielded connector in the signal pathway allows the use of lower cost cabling than would otherwise be required with a non-shielded (non-integrated) connector.

A reduction in noise radiating from a side of a deployed aircraft flap is achieved by locating a slot adjacent the side of the flap, and then forcing air out through the slot with a suitable mechanism. One, two or even three or more slots are possible, where the slot is located at one or more locations selected from a group of locations comprising a top surface of the flap, a bottom surface of the flap, an intersection of the top and side surface of the flap, an intersection of the bottom and side surfaces of the flap, and a side surface of the flap. In at least one embodiment the slot is substantially rectangular. A device for adjusting a rate of the air forced out through the slot can also be provided.

A PCB layout structure for suppressing EMI and a method thereof is disclosed. The PCB layout structure for suppressing EMI includes a multi-layer PCB, a plurality of electric grids, and a plurality of conductive vias. The multi-layer PCB has a plurality of signal layers and a grounding layer. Each of the signal layers is disposed with a plurality of signal lines. The plurality of electric grids are disposed on each of the signal layers and cover the signal lines on each of the signal layers. The plurality of conductive vias are located between the layers of the multi-layer PCB to electrically connect the grounding layer with the electric grids on each of the signal layers. Thereby, electromagnetic waves of a specific wavelength are shielded by appropriately choosing the dimensions of the electric grids.

A flap of the type that is movably connected to an aircraft wing to provide control of an aircraft in flight includes opposite ends, wherein at least a first opposite end includes a plurality of substantially rigid, laterally extending protrusions that are spaced apart to form a plurality of fluidly interconnected passageways. The passageways have openings adjacent to upper and lower sides of the flap, and the passageways include a plurality of bends such that high pressure fluid flows from a high pressure region to a low pressure region to provide a boundary condition that inhibits noise resulting from airflow around the end of the flap.

A printed circuit board has separate first, second and third sections arranged in a predetermined direction. A connector is mounted at the first section. A noise cut filter is mounted at the second section and connected to the connector. An electronic circuit component is mounted at the third section and connected to the noise cut filter. An electrically conductive power source layer is formed within the printed circuit board at a position outside a peripheral section adjacent the second section. The noise cut filter is allowed to operate without receiving any influence of noise from the power source layer. Noise is sufficiently removed at the noise cut filter. Noise is suppressed to the utmost in electric signals in the connector. Radiation of noise is reliably reduced at the connector. Electromagnetic interference can be suppressed.

In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

PCT No. PCT/DE96/02378 Sec. 371 Date Jan. 14, 1998 Sec. 102(e) Date Jan. 14, 1998 PCT Filed Dec. 11, 1996 PCT Pub. No. WO97/43542 PCT Pub. Date Nov. 20, 1997A fuel injection valve which is provided for high pressure injection in self-igniting internal combustion engines and has a solenoid valve for controlling the injection. To trigger this solenoid valve, a control circuit is provided which is subdivided into a first circuit part and a second circuit part. The second circuit part is separate from the first circuit part, which jointly serves to control a number of injection valves, and are disposed on each individual injection valve. The housing is clipped onto the fuel injection valve and fuel flows through its interior for cooling purposes.

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

An airplane propelled by a turbine engine having at least one fan, the turbine engine being integrated in the rear of a fuselage of the airplane, extending it rearwards, the airplane further including at least one acoustic baffle forming panel connected to the fuselage of the airplane and arranged below the turbine engine.

A TM microstrip antenna which having a pair of mode suppression slots for transmitting telemetry data to an external source, which is adapted for use in a small area on a weapons system such as a missile. The mode suppression slots reduce noise from the TM microstrip antenna at the GPS L-1 band providing increased isolation between the TM microstrip antenna and a GPS receiving antenna mounted in proximity to the TM microstrip antenna.

The invention relates to a technique of automobile engine vibration reduction and noise reduction. Its main technical characteristic all are made up of torsion vibration damper and longitudinal-direction-bend damper; rubber layer is nests between the outside hub and inside hub, the torsion vibration damper is made up of torsion vibration outside hub, torsion vibration rubber layer, and torsion vibration inside hub; longitudinal bending bowing inertia block is connected to the longitudinal bending bowing inside hub through the rubber layer, and made up of longitudinal-direction-bend vibration damper; compound damper is made up of the torsion vibration damper and the longitudinal-direction-bend vibration damper connected by bolt; we can equip the longitudinal bending bowing inertia block in the cavity of the inside hub, its left end is cling to the rubber layer, the outside is sealed by seal ring to form the longitudinal-direction-bend damper; we also can equip the rubber layer between the torsion vibration inside hub and the longitudinal bending bowing inertia block to form the longitudinal-direction-bend vibration damper.

There is provided a headphone device including a first housing and a second housing; a headband connected to the first and second housings; a first headphone unit and a second headphone unit disposed in the first and second housings, respectively; a first microphone and a second microphone arranged in the vicinity of the first and second headphone units; and a signal processing unit disposed in the first housing for processing input audio signals from the outside and microphone signals detected by the first and second microphones, and generating first and second noise-canceled audio signals to be supplied to the first and second headphone units.

Various embodiments provide systems and methods for noise reduction for lift-augmentation wing-sections (e.g., flaps, slats, elevons, etc.) by the use of flow disruption devices placed upstream of vortex generation locations. The flow disruption devices may reduce the noise radiating from side edges of lift-augmentation control wing sections. An embodiment flow disruption device may include a body configured to protrude into a flow over a vehicle's surface, wherein the body is coupled to the vehicle upstream of a side edge of a structure of the vehicle such that a wake produced by the body introduces unsteadiness and a flow velocity deficit in a vortex formation region of the side edge of the structure.

The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.

A cylindrical shell main body constituting a muffler main body is formed of two layers of an inner shell and an outer shell and has a cylindrical shape with a cross section that is not a perfect circle but is defined by alternated small arc portions and large arc portions similarly to an oval, or the like. The outer shell of the shell main body has, in each of their small arc portions, four radially projecting beads continuously extending in a circumferential direction along the small arc portions and being a predetermined distance apart from one another in an axial direction, thereby allowing an upper and lower gaps between the inner shell and the outer shell in the respective large arc portions of the shell main body to communicate with each other through passages formed by the beads.