15results about "Printed circuit assemblies" patented technology

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: an upper phase multi-chip module including: a low-voltage upper phase controller; a high-voltage upper phase A controller; an upper phase A galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase A controller; a high-voltage upper phase B controller; an upper phase B galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase B controller; a high-voltage upper phase C controller; and an upper phase C galvanic isolator connecting the low-voltage upper phase controller to the high-voltage upper phase C controller.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first phase switch including one or more first phase power switches on a first side of a substrate; and a second phase switch including one or more second phase power switches on a second side of the substrate opposite to the first side.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module, the first power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first conductive layer and the second conductive layer, the power switch including a gate connection, wherein the power switch is configured to selectively electrically connect the first conductive layer to the second conductive layer based on a signal to the gate connection; and a point-of-use controller between the first conductive layer and the second conductive layer, the point-of-use controller configured to provide the signal to the gate connection to control the power switch.

The embodiment of the invention provides a circuit board assembly, electronic equipment and a manufacturing method of the circuit board assembly, the circuit board assembly comprises a frame plate and at least two circuit boards, the frame plate and all the circuit boards are stacked, each frame plate is located between two circuit boards, and the frame plate is located between the two circuit boards. Each frame plate is connected with the two adjacent circuit boards through solder, a filling gap is formed between the frame plate and the two adjacent circuit boards, each frame plate is provided with a flowing channel, the filling gaps of each frame plate and the two adjacent circuit boards are communicated through the flowing channels to form a filling flow channel, the circuit board assembly is provided with at least one injection port, and the injection port is communicated with the filling flow channel. Flowable filling materials can flow into the injection ports, and each filling runner can be communicated with at least one injection port, so that solder between each frame plate and the two adjacent circuit boards can be wrapped by the filling materials.

A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a flex layer including a gate trace providing an electrical connection to a gate input connection of the power module, a first substrate, a second substrate including a source plane, the source plane including a step trench, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate trace, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery configured to supply the DC power to the inverter; and a motor configured to receive the AC power from the inverter.

The invention discloses a novel soft and hard connection circuit board prepared based on weldable silver paste, and the circuit board comprises a rigid circuit board which is provided with a splicing groove, the splicing groove is internally provided with a splicing block, positioning teeth are adaptively distributed between the front end of the splicing block and the splicing groove, and the upper side of the splicing block is provided with a flexible circuit board. Sintered silver paste circuit layers are arranged on the rigid circuit board and the flexible circuit board, flexible welding discs are arranged on the sintered silver paste circuit layers at the front ends of the positioning teeth, and rigid welding discs are arranged at the ends of the sintered silver paste circuit layers on the rigid circuit board on the front sides of the positioning teeth. The mechanical splicing structure is matched with the silver paste sintering bonding force, the bonding strength is effectively improved, meanwhile, the production process is simplified, the production cost is effectively reduced, through wiring and sintering combination of the silver paste capable of being sintered at low temperature, heat of an electrical element produced integrally can be rapidly dissipated through the thermal conductivity of silver, the service life of a product is prolonged, and the production cost is reduced. And the influence of high temperature on temperature-sensitive electrical elements can be reduced.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate.

A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including a drain terminal and a source terminal; one or more phase switches configured to control a current flow between the drain terminal and the source terminal; and a point-of-use controller including two or more thermal sensors on the point-of-use controller, the point-of-use controller configured to determine a temperature of the one or more phase switches using the two or more thermal sensors.

The invention provides a rigid-flex board and a manufacturing method thereof, and the manufacturing method comprises the steps: providing an auxiliary supporting plate which is provided with a first through hole; a first buffer pad, a hard substrate and an adhesive plate are sequentially stacked on the auxiliary supporting plate, and a second through hole and a hard plate via hole are formed in the first buffer pad and the hard substrate respectively; enabling a pin to pass through the adhesive plate, and then to pass through the hard board via hole, the second through hole and the first through hole in sequence; the soft substrate and the second buffer pad are continuously stacked to obtain a combined plate, and soft plate conduction holes corresponding to the conductive pins are formed in the soft substrate; the composition board is pre-cured; the rigid-flex board is obtained by press-fitting the hard substrate and the soft substrate through press-fitting forming, the technical problems that in the prior art, traditional pin insertion needles need additional procedure welding and auxiliary material fixing, and the assembly space and cost are increased can be solved, the uncovering process in the traditional rigid-flex board manufacturing process can be omitted, the production cost is reduced, and the production efficiency is improved.

A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

The invention discloses a printed circuit board assembly, a circuit board module and electronic equipment, and belongs to the technical field of electronics. The printed circuit board assembly comprises a substrate used for installing an electronic device, the substrate is provided with a shielding cover bonding pad, and the shielding cover bonding pad is provided with a plurality of first signal pins; the shielding cover is arranged on the shielding cover bonding pad, and the shielding cover is used for surrounding an electronic device arranged on the substrate; and the flexible printed circuit board is provided with a plurality of second signal pins, the flexible printed circuit board is arranged between the shielding case bonding pad and the shielding case, and the plurality of second signal pins are correspondingly connected with the plurality of first signal pins.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.