A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive
layers, a first
dielectric core layer and a first conductive via, the first
dielectric core layer is formed between the two first conductive
layers, and the first conductive via connects the two first conductive
layers. The second circuit board includes two second conductive layers, a second
dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.