Interference shielded electronics module and method for providing the same

Abstract

Interference shielded, for example a RFI and / or EMI shielded, electronics module, such as a circuit board (10) or a printed circuit or a corresponding electronics module, which interference shield forms a contact (4) with at least one edge zone (11) of the circuit board layers (12, 13, 14) of the circuit board, which contact functions in the electronics module as a means of grounding and which circuit board comprises: an outermost electrically conductive layer (3) providing the interference shield of the electronics module; at least one circuit card layer (12, 13, 14) unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer: and encapsulating activation material layer (2), which is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer (12), and which is arranged into a space between the outermost layer (3) and topmost circuit board layer (12) to be therein conformingly against the inner surface of the outermost layer (3) for isolating the electronic components and the wiring pattern from outermost layer, whereby for providing the interference shield, there is a direct conductive contact (4) at the side edge (21) of the circuit board between the outermost layer (3) and the edge zone (11) of the circuit board layer (12, 13, 14) providing the grounding. Characteristic to the shielded module is that the outermost shield layer (3) is essentially a single-layered covering and an outermost surface layer of the circuit board unit (10). Characteristic to the method is that the same comprises steps: a panel (1) comprising several circuit board units (10) is covered by an encapsulating layer (2); individual circuit boards (10) are separated from the panel along separation lines (A-A, B-B) of the circuit board units; and a surrounding shield layer is applied as the outermost layer, which forms an electrically conductive interference shield.

Description

technical field [0001] The invention relates to interference shielded, for example RFI (RFI, Radio Frequency Interference) and / or EMI (EMI, Electromagnetic Interference) shielded electronic modules, such as circuit board units (10) or printed circuits or corresponding electronic Module, refers to electronic modules that are shielded from interference, in particular for the protection of electronic modules such as circuit boards or printed circuits or corresponding electronic modules from EM interference (EM, "electromagnetic interference") and / or RF interference (RF, "radio frequency Interference"), in other words, the invention relates to solutions for shielding electronic modules from RFI and / or EM interference. [0002] More precisely, according to the preamble of independent claim 1, the invention relates to interference shielded electronic modules, for example to RFI shielded and / or EMI shielded circuit boards. According to the preamble of independent claim 11, the inven...

AI Technical Summary

Problems solved by technology

The most fundamental problem and weakness of this solution is that, according to this disclosure, the shield is the above-mentioned multilayer arrangement and it is produced by different coating techniques, so the manufacturing process is technically complex and slow and requires a large line spacing

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