Automatic sheet feeding mechanism
By using the combination of vacuum transmission cavity and atmospheric transmission fingers in the etching process, the high cost problem caused by the robot is solved, and the precise pick-up and placement of the wafer is achieved, and the production cost is reduced.
Patent Information
- Application Number
- CN202422390528.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-30
AI Technical Summary
In the existing etching process, the use of robots leads to high cost and large volume, making it difficult to efficiently and economically realize wafer pick-up and drop operation.
The vacuum transmission chamber and vacuum process chamber are arranged side by side, combined with movable vacuum transmission fingers and atmospheric transmission fingers, to achieve accurate wafer pick-up and placement sheets, eliminating the procurement of robots.
Through the cooperation of atmospheric transmission fingers and vacuum transmission fingers, precise operation of the wafer is achieved, significantly reducing production costs.
Smart Images
Figure CN223245579U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of etching, in particular to an automatic film feeding mechanism. Background Art
[0002] Etching, also known as etching in English, is a critical step in semiconductor manufacturing, microelectronic IC manufacturing, and micro-nano manufacturing. Etching, in a narrower sense, is essentially photolithographic etching. The photoresist is first exposed through photolithography, and then the desired portions are etched away using other methods. Etching selectively removes unwanted material from the silicon wafer surface using chemical or physical methods. Its fundamental goal is to accurately replicate the mask pattern on the resist-coated silicon wafer.
[0003] Currently, in existing etching processes, a robot is usually used to remove and place wafers. However, the robot is expensive and bulky. Utility Model Content
[0004] In order to solve the above problems, the utility model discloses an automatic film feeding mechanism.
[0005] The specific plan is as follows:
[0006] An automatic wafer feeding mechanism, characterized in that it includes a vacuum transmission chamber and a vacuum process chamber arranged side by side, wherein the interior of the vacuum transmission chamber is provided with a vacuum transmission finger that can move horizontally left and right, and the front side of the vacuum transmission chamber is provided with an atmospheric transmission finger that can move horizontally back and forth, rotate, and vertically rise and fall, the vacuum transmission finger and the atmospheric transmission finger are used to stably carry wafers, and the vacuum process chamber is provided with a wafer carrier for carrying wafers; wherein, the atmospheric transmission finger is used to take out wafers from a wafer box and transfer them to the vacuum transmission finger, and the vacuum transmission finger is used to transfer the wafers transferred by the atmospheric transmission finger to the wafer carrier of the vacuum process chamber; when the atmospheric transmission finger is placed directly above the vacuum transmission finger, the vertical rising and falling movement of the atmospheric transmission finger and the vacuum transmission finger do not interfere with each other.
[0007] Furthermore, a finger fixing plate is provided within the vacuum transfer chamber. This plate is a horizontally arranged rectangular plate that can slide left and right on a linear slide. A rack is provided on its rear edge. The vacuum transfer finger is positioned in the middle of one end of the finger fixing plate, which is adjacent to the vacuum process chamber. A drive motor is provided at the rear of the vacuum transfer chamber. The motor shaft end of the drive motor is provided with a gear that meshes with the rack, and the motor shaft end is sealed with a magnetic fluid. During operation, the drive motor drives the gear to rotate, and through the meshing of the gear and rack, the finger fixing plate moves on the linear slide.
[0008] Furthermore, the bottom of the atmospheric transfer finger is equipped with a horizontal motion mechanism to control its horizontal forward and backward movement. The bottom of the horizontal motion mechanism is equipped with a rotary motor to control its rotation. The rotary motor is mounted on the top of the support mechanism. One side of the support mechanism is equipped with a vertical mechanism to control its lifting. During operation, the support mechanism controls the atmospheric finger to move to the position in the wafer box where the wafer needs to be removed. The horizontal motion mechanism controls the atmospheric finger to move into the wafer box. The support mechanism rises, allowing the atmospheric finger to lift the wafer. The horizontal mechanism then controls the atmospheric finger to move outside the wafer box. The motor controls the atmospheric finger to rotate, so that the atmospheric finger faces the first gate valve of the atmospheric transfer chamber, and the subsequent process is carried out.
[0009] Furthermore, a first gate valve is provided at a position corresponding to the atmospheric transfer finger on the front side of the vacuum transfer chamber, and a second gate valve is provided between the vacuum transfer chamber and the vacuum process chamber. When a wafer is transferred from the atmospheric transfer finger to the vacuum transfer finger, the first gate valve opens, the vacuum transfer chamber is exposed to atmospheric air, and the second gate valve closes. When the wafer is transferred into the vacuum process chamber, both gate valves close and the vacuum transfer chamber is evacuated. After evacuation, the second gate valve between the vacuum transfer chamber and the vacuum process chamber is opened to transfer the wafer.
[0010] The beneficial effects of the present invention are: novel and unique structure, through the cooperation of atmospheric transmission fingers and vacuum transmission fingers, wafer picking and placing are realized, while ensuring precise operation, the purchase of robots is eliminated, and production costs are greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a schematic diagram of the vacuum transfer finger and the atmospheric transfer finger transferring wafers to each other in this application.
[0012] Figure 2 This is a schematic diagram of the vacuum transfer finger transferring the wafer to the wafer stage in this application.
[0013] Figure 3 This is a schematic diagram of the supporting structure of the atmospheric transmission finger in this application.
[0014] Figure 4 Combination of vacuum transmission finger and atmospheric transmission finger in this application Figure 2 .
[0015] List of reference numerals:
[0016] 1-vacuum transfer chamber, 2-vacuum process chamber, 3-vacuum transfer finger, 4-atmospheric transfer finger, 5-wafer, 6-carrier stage, 7-wafer box, 8-finger fixing plate, 9-linear slide, 10-rack, 11-drive motor, 12-gear, 13-horizontal motion mechanism, 14-rotation motor, 15-support mechanism, 16-vertical mechanism, 17-first gate valve, 18-second gate valve. DETAILED DESCRIPTION
[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.
[0018] As shown in the figure, the present application provides an automatic film feeding mechanism, including a vacuum transmission chamber 1 and a vacuum process chamber 2 arranged side by side, the interior of the vacuum transmission chamber 1 is provided with a vacuum transmission finger 3 that can move horizontally left and right, and the front side of the vacuum transmission chamber 1 is provided with an atmospheric transmission finger 4 that can move horizontally forward and backward, rotate and vertically lift and lower. The vacuum transmission finger 3 and the atmospheric transmission finger 4 are used to stably carry the wafer 5, and the vacuum process chamber 2 is provided with a wafer carrier 6 for carrying the wafer 5; wherein, the atmospheric transmission finger 4 is used to take out the wafer 5 from the wafer box 7 and transfer it to the vacuum transmission finger 3, and the vacuum transmission finger 3 is used to transfer the wafer 5 transferred by the atmospheric transmission finger 4 to the wafer carrier 6 of the vacuum process chamber 2. When the atmospheric transmission finger 4 is placed directly above the vacuum transmission finger 3, the vertical lifting and lowering movement of the atmospheric transmission finger 4 does not interfere with the vacuum transmission finger 3.
[0019] In this embodiment, the vacuum transfer fingers 3 are U-shaped, with the front side shorter than the rear side, while the atmospheric transfer fingers 4 are inverted C-shaped or T-shaped. Alternatively, the vacuum transfer fingers 3 may be inverted C-shaped or T-shaped, while the vacuum transfer fingers 3 are U-shaped, with the left side shorter than the right side. When the atmospheric transfer fingers descend and are positioned on the same plane as the vacuum transfer fingers during wafer transfer, they will not interfere with each other. Those skilled in the art may also design different structures based on actual needs, ensuring that the atmospheric transfer fingers and vacuum transfer fingers can not only stably support wafers independently but also do not interfere with each other during transfer.
[0020] In this embodiment, a finger fixing plate 8 is provided within the vacuum transfer chamber 1. The finger fixing plate 8 is a horizontally arranged rectangular plate that can slide left and right on a linear slide 9. A rack 10 is provided on its rear edge. The vacuum transfer finger 3 is positioned in the middle of one end of the finger fixing plate 8 near the vacuum process chamber 2. A drive motor 11 is provided on the rear side of the vacuum transfer chamber 1. The end of the motor shaft of the drive motor 11 is provided with a gear 12 that meshes with the rack 10, and the outer side of the drive motor 11 is sealed with a magnetic fluid. During operation, the drive motor drives the gear to rotate, and through the meshing of the gear and rack, the finger fixing plate moves on the linear slide. The drive motor is a servo motor. Those skilled in the art may also use other devices capable of driving the gear, such as a stepper motor, a brushless DC motor, etc.
[0021] In this embodiment, the bottom of the atmospheric transfer finger 4 is equipped with a horizontal motion mechanism 13 to control its horizontal forward and backward movement. A rotary motor 14 is installed at the bottom of the horizontal motion mechanism 13 to control its rotation. The rotary motor 14 is mounted on the top of a support mechanism 15. A vertical mechanism 16 is installed on one side of the support mechanism 15 to control its elevation. During operation, the support mechanism controls the movement of the atmospheric finger to the desired wafer removal position within the wafer cassette. The horizontal motion mechanism controls the movement of the atmospheric finger into the wafer cassette. The support mechanism rises, allowing the atmospheric finger to lift the wafer. The horizontal mechanism then controls the movement of the atmospheric finger outside the wafer cassette. The motor controls the rotation of the atmospheric finger, directing it toward the first valve port of the atmospheric transfer chamber for the subsequent process. The horizontal motion mechanism is a horizontal cylinder, and the vertical mechanism is a lifting cylinder. Those skilled in the art may also use other devices capable of achieving horizontal motion or vertical elevation, such as electric cylinders, linear motor modules, and linear motor platforms. The rotary motor is a servo motor. Those skilled in the art may also use other devices capable of driving the horizontal motion mechanism, such as stepper motors or brushless DC motors.
[0022] In this embodiment, a first gate valve 17 is provided at a position on the front side of the vacuum transfer chamber 1 corresponding to the atmospheric transfer finger 4, and a second gate valve 18 is provided between the vacuum transfer chamber 1 and the vacuum process chamber 2. When a wafer is transferred from the atmospheric transfer finger to the vacuum transfer finger, the first gate valve opens, exposing the vacuum transfer chamber to atmospheric air, and the second gate valve closes. When the wafer is transferred into the vacuum process chamber, both gate valves close, and the vacuum transfer chamber is evacuated. After evacuation, the second gate valve between the vacuum transfer chamber and the vacuum process chamber is opened to transfer the wafer.
[0023] In actual use of this application, the atmospheric transfer finger first takes out the wafer from the wafer box, and then moves the wafer to directly above the vacuum transfer finger. After that, the atmospheric transfer finger descends so that the wafer falls on the vacuum transfer finger; then, after the atmospheric transfer finger descends to a certain position, it returns to its initial position. Finally, the vacuum transfer finger moves the wafer to the wafer carrier of the vacuum process chamber.
[0024] The technical means disclosed in the solutions of the present invention are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered to be within the scope of protection of the present invention.
Claims
1. An automatic film feeding mechanism, characterized in that: The invention comprises a vacuum transmission chamber (1) and a vacuum process chamber (2) arranged side by side, wherein a vacuum transmission finger (3) capable of horizontally moving left and right is provided inside the vacuum transmission chamber (1), and an atmospheric transmission finger (4) capable of horizontally moving forward and backward, rotating, and vertically lifting is provided on the front side of the vacuum transmission chamber (1), wherein the vacuum transmission finger (3) and the atmospheric transmission finger (4) are used to stably carry a wafer (5), and a wafer carrier (6) for carrying the wafer (5) is provided inside the vacuum process chamber (2); wherein the atmospheric transmission finger (4) is used to take out the wafer (5) from the wafer box (7) and transfer it to the vacuum transmission finger (3), and the vacuum transmission finger (3) is used to transfer the wafer (5) transferred by the atmospheric transmission finger (4) to the wafer carrier (6) of the vacuum process chamber (2); when the atmospheric transmission finger (4) is placed directly above the vacuum transmission finger (3), the vertical lifting movement of the atmospheric transmission finger (4) and the vacuum transmission finger (3) do not interfere with each other.
2. The automatic film feeding mechanism according to claim 1, characterized in that: A finger fixing plate (8) is provided inside the vacuum transmission chamber (1). The finger fixing plate (8) is a horizontally arranged rectangular plate and can be slid left and right on a linear slide rail (9). A rack (10) is provided on the rear edge of the finger fixing plate (8). The vacuum transmission finger (3) is placed in the middle of one end of the finger fixing plate (8) close to the vacuum process chamber (2). A drive motor (11) is provided on the rear side of the vacuum transmission chamber (1). A gear (12) meshing with the rack (10) is provided at the end of the motor shaft of the drive motor (11), and the outer side of the drive motor (11) is sealed by a magnetic fluid.
3. The automatic film feeding mechanism according to claim 1, characterized in that: The bottom of the atmospheric transmission finger (4) is provided with a horizontal motion mechanism (13) for controlling its horizontal movement forward and backward, the bottom of the horizontal motion mechanism (13) is provided with a rotary motor (14) for controlling its rotation, the rotary motor (14) is mounted on the top of a support mechanism (15), and one side of the support mechanism (15) is provided with a vertical mechanism (16) for controlling its lifting.
4. The automatic film feeding mechanism according to claim 1, characterized in that: A first gate valve (17) is provided at a position corresponding to the front side of the vacuum transmission chamber (1) and the atmosphere transmission finger (4), and a second gate valve (18) is provided between the vacuum transmission chamber (1) and the vacuum process chamber (2).