Coating film layer structure of heat dissipation device

Abstract

The utility model provides a coating layer structure of a heat dissipation device, which comprises the following components: a heat dissipation device of which the heat dissipation surface is provided with a fine rough surface; the coating layer is a film body which is formed on the fine rough surface by indium metal in an electroplating, vacuum sputtering, physical evaporation or chemical evaporation mode, and the surface of the coating layer is a flat smooth surface; and the protective coating is coated on the surface of the film coating layer. Therefore, the heat dissipation capacity of the heat dissipation device can be improved, long-term oxidation resistance is achieved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to a coating layer structure of a heat dissipation device, in particular to a protective coating structure with an indium coating layer and long-term oxidation resistance. Background Art

[0002] To address chip overheating, various heat sinks and materials are needed to improve chip heat dissipation. Generally speaking, when two solid surfaces come into contact, factors such as uneven machining, roughness, and fine scratches can prevent them from achieving complete surface contact. This results in only point contact, significantly reducing the intended surface contact. The areas beyond point contact between the two solid surfaces—that is, the areas not actually in contact—are typically filled with air, which conducts heat poorly.

[0003] Therefore, when heat flow is transferred from one solid to the interface between two solids, the actual contact area between the two solids is too small. In addition, air, with a thermal conductivity of only 0.025W / m·K, is a poor heat transfer medium. This will lead to a large temperature difference between the two adjacent solid surfaces, resulting in a high interfacial thermal resistance, which affects heat transfer. In order to reduce the interfacial thermal resistance between the two solids to solve the problem of poor heat dissipation.

[0004] Conventional technology involves inserting a thermal interface material between two solid contact surfaces to replace the original air layer with poor thermal conductivity, thereby improving the thermal conductivity of the original air interface layer and effectively reducing the interface thermal resistance from the chip to the substrate or to the heat dissipation element.

[0005] Furthermore, one existing heat dissipation method for fiber optic interface heat sinks is to adhere a metal thermal pad to its surface with adhesive tape. However, using adhesive tape to adhere the metal thermal pad does not allow for a tight fit, allowing air to seep in, and the adhesive creates thermal resistance, which prevents improved heat dissipation. Furthermore, the adhesive tape combined with the metal thermal pad creates a relatively thick raised layer. Consequently, after repeated insertion and removal of the heat sink, the metal thermal pad is susceptible to friction and compression, making it easily damaged, thereby reducing the heat sink's service life.

[0006] In view of the above problems, the author has actively researched and improved the above shortcomings, with solving them as the main topic. Utility Model Content

[0007] The main purpose of the present invention is to provide a coating layer structure for a heat sink, which can make indium metal tightly bonded to the surface of the heat sink without adhesive, has excellent pull-out resistance and friction resistance, is not easy to be damaged, can increase the service life of the heat sink, and reduces the thermal resistance caused by air and adhesives. It can also solve the problem of easy oxidation of indium metal, thereby improving the heat dissipation effect.

[0008] Another object of the present invention is to provide a coating layer structure of a heat dissipation device, wherein the coating layer is formed on the surface of the heat dissipation module, so that the coating layer can be very thin and tightly adhered to meet special product requirements.

[0009] To achieve the above-mentioned objectives, the technical means adopted by the present invention include: a heat dissipation device having a finely roughened surface on its heat dissipation surface; a coating layer, which is a thin film of indium metal formed on the finely roughened surface by electroplating, vacuum sputtering, physical vapor deposition, or chemical vapor deposition, and the surface of the coating layer is smooth and glossy; and a protective coating layer applied to the surface of the coating layer.

[0010] According to the aforementioned features, the heat dissipation device includes a radiator or a heat sink.

[0011] According to the aforementioned characteristics, the thickness of the coating layer is 0.01 mm to 0.2 mm.

[0012] According to the above characteristics, the thickness of the protective coating is 0.5μm to 7μm.

[0013] By means of the above technical means, the utility model has the following benefits:

[0014] 1. The coating layer of the present invention can make the coating structure very thin and close-fitting, meeting the requirements of special products.

[0015] 2. The coating layer of the present invention has excellent tensile strength and friction resistance, is not easily damaged, and can extend the service life of electronic equipment.

[0016] 3. The coating layer of the present invention tightly bonds the indium metal to the heat sink, eliminating the need for adhesives to fix the thermal conductive sheet. In addition, the indium metal has certain ductility and gap-filling capabilities, and can minimize surface thermal resistance, thereby improving heat dissipation capacity and reducing the impact of thermal resistance caused by air and adhesives, thereby enhancing heat dissipation efficiency.

[0017] Fourth, the coating layer of the present invention is brushed / immersed on the surface of the protective coating, which can solve the problem of metal indium oxidation and has the effect of extending the service life of the indium thermal conductive sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a heat dissipation device of the present utility model.

[0019] Figure 2 A schematic diagram of another heat dissipation device of the present invention.

[0020] Figure 3 A schematic diagram of the coating state of the heat dissipation device of the present invention.

[0021] Figure 4A A cross-sectional view of a preferred embodiment of the coating layer of the present invention.

[0022] Figure 4B A schematic diagram showing the mirror roller pressing the coating layer of the present invention.

[0023] Figure 5A A schematic diagram showing the coating layers of the present invention after lamination.

[0024] Figure 5B A cross-sectional view showing the application of a protective coating according to the present invention.

[0025] Explanation of the reference numerals: 11 - heat dissipation device; 10a - heat sink; 10b - radiator; 11 - slightly rough surface; 20 - coating layer; 21 - smooth surface; 22 - protective coating; 30 - coating equipment; 40 - mirror roller; 41 - PET sheet. DETAILED DESCRIPTION

[0026] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other embodiments, and the details herein may be modified and altered based on different perspectives and applications without departing from the spirit of the present invention.

[0027] First, see Figures 1 to 5B As shown, the present invention provides a coating layer structure for a heat dissipation device, comprising: a heat dissipation device 10. In this embodiment, the heat dissipation module 10 comprises a heat sink 10a or a heat sink 10b, such as, but not limited to, a fiber optic module interface heat sink. The present invention polishes the surface of the heat dissipation device 10 to form a finely roughened surface 11. In this embodiment, sandpaper or a grinder is used to polish the indium metal coating area to increase the roughness of the area. The fine indentations enhance the adhesion of the indium metal.

[0028] Figure 3 The schematic diagram shows that the heat dissipation device 10 is placed in a coating device 30 for coating. Figure 4A As shown, a coating layer 20 is a thin film of indium metal formed on the fine rough surface 11 by electroplating, vacuum sputtering, physical evaporation or chemical evaporation, and the surface of the coating layer 20 is a smooth surface 21.

[0029] like Figure 5B As shown, a protective coating 22 is coated on the coating layer 20. In a preferred embodiment, the coating layer 20 has a thickness of 0.01 mm to 0.2 mm. The protective coating 22 has a thickness of 0.5 μm to 7 μm.

[0030] Because indium metal has a thermal conductivity of 86 W / mK and is four times softer than lead, its ductility, gap-filling properties, and thermal conductivity make it an ideal compressible thermal interface material, minimizing surface thermal resistance and thus improving thermal conductivity. However, the key issue is how to securely attach the indium metal to the finely roughened surface 11 of the heat sink 10 without interfering with access to the optical fiber module. The main technical feature of the present invention is to overcome this technical challenge.

[0031] In a preferred embodiment, but not limited thereto, the heat dissipation device 10 can be further pressed by a mirror roller 40, such as Figure 4B As shown. Because the indium metal coating layer 20 is uneven when formed on the finely roughened surface 11, and gaps and air remain at the interface with the finely roughened surface 11, thermal resistance cannot be reduced and adhesion is insufficient. Therefore, some specific heat dissipation devices require the use of a mirrored roller 40 for rolling. However, this is not limiting; other heat dissipation devices can achieve heat dissipation efficiency without the use of a mirrored roller 40 for rolling.

[0032] A PET sheet 41 is positioned between the surface of the indium metal coating layer 20 and the mirror roller 40. In this embodiment, the material characteristic of the PET sheet 41 is that there is no adhesive on the surface, so it will not stick to the surface of the indium metal coating layer 20. Its function is to assist the lamination process of the mirror roller 40 to improve the surface flatness of the indium metal coating layer 20, so that the surface of the coating layer 20 has a flat and smooth surface 21. Figure 5A shown.

[0033] The mirror roller 40 is pressed back and forth, as shown in FIG. Figure 4B As shown, the surface of the mirror roller 40 is mirror-polished, and the PET sheet 41 is used as a contact medium between the mirror roller 40 and the indium metal coating layer 20, and then the indium metal coating layer 20 is pressed with a roller pressure of 40 to 110 kgf to improve its surface flatness; and the roller pressure will vary depending on the change in the shape of the heat dissipation device 10.

[0034] An anti-oxidation protective coating 22 is applied on the surface of the coating layer 20, such as Figure 5B As shown, this is to prevent oxidation of the coating layer 20; and this film thickness can reduce the thermal resistance of the indium metal coating layer 20 (the thermal resistance before and after coating is 0.121°C / W and 0.069°C / W), and can exceed 30 days under an 85°C / 85% RH aging environment, which is equivalent to extending the shelf life from 6 months before treatment to more than 10 years under storage conditions (30°C / 60% RH). In this embodiment, the anti-oxidation protective coating 22 may include a fluorinated liquid coating, but is not limited to this.

[0035] By means of the above technical means, the utility model has the following benefits:

[0036] 1. The coating layer 20 of the present invention is formed on the surface of the heat sink 10 by "coating" or "mirror pressing roller", so the coating structure can be very thin and tight, fully meeting product requirements.

[0037] Second, the present invention uses indium metal to adhere to the surface of the heat sink 10. Its heat dissipation performance can replace the current solution of using traditional thermal conductive materials in heat sinks. Indium metal has excellent tensile strength and friction resistance, is not easy to be damaged, and can increase the service life of electronic devices.

[0038] 3. The present invention uses a coating to adhere the indium metal to the heat sink 10, without the need for adhesive fixation. In addition, the indium metal has a certain ductility and can minimize the surface thermal resistance, thereby improving the heat dissipation capacity. After being pressed by a roller, it is tightly attached to the surface of the heat sink 10, reducing the thermal resistance caused by air and adhesives, thereby improving the heat dissipation effect.

[0039] Fourth, the present invention applies / immerses the surface of the coating layer 20 with an anti-oxidation protective coating 22 to solve the problem of metal indium oxidation. The coating thickness is 0.5 to 7 μm, which can reduce the thermal resistance of indium metal and extend the service life of the indium metal coating layer 20.

[0040] The drawings and descriptions disclosed above are only preferred embodiments of the present invention. Any modifications or equivalent changes made by those skilled in the art within the spirit and scope of the present invention should still be included in the scope of the patent application of the present invention.

Claims

1. A coating layer structure of a heat dissipation device, characterized in that: Include: A heat dissipation device, the heat dissipation surface of which has a fine rough surface; a coating layer, which is a thin film of indium metal formed on the fine rough surface by electroplating, vacuum sputtering, physical vapor deposition or chemical vapor deposition, and the surface of the coating layer is smooth and glossy; and A protective coating is coated on the surface of the coating layer.

2. The coating layer structure of the heat dissipation device according to claim 1, wherein: The heat dissipation device is a radiator or a heat sink.

3. The coating layer structure of the heat dissipation device according to claim 1, wherein: The thickness of the coating layer is 0.01 mm to 0.2 mm.

4. The coating layer structure of the heat dissipation device according to claim 1, wherein: The thickness of the protective coating is 0.5 μm to 7 μm.

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