Interconnection member and power device having same

Abstract

The utility model provides an interconnection member and a power device with the same, and the interconnection member comprises a first interconnection segment, the lower surface of which is a first interconnection surface; the second interconnection section and the first interconnection section are arranged in a spaced mode in the first direction, the lower surface of the second interconnection section is a second interconnection face, a solder groove is formed in the first interconnection section and / or the second interconnection section, and the solder groove penetrates through the lower surface of the first interconnection section or the lower surface of the second interconnection section; the connecting section comprises an arc-shaped section, the two ends of the arc-shaped section are connected with the first interconnection section and the second interconnection section respectively, and the middle of the arc-shaped section protrudes upwards. Through the technical scheme provided by the invention, the problem of low connection reliability of the bonding wire in the related technology can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power devices, in particular to an interconnection component and a power device having the same. Background Art

[0002] Power modules are devices used in power electronics to control and convert electrical energy. They perform power conversion functions such as rectification, inversion, chopping, and frequency conversion. They are widely used in power management, motor drives, solar inverters, power systems, energy storage, and other fields.

[0003] In related technologies, to achieve the goal of passing high current through a single device, multiple chips are usually connected in parallel. Traditional power devices generally use aluminum wire bonding for internal electrical interconnection. This method is used to connect the chip to the copper layer and to interconnect multiple parallel chips.

[0004] However, aluminum wires are difficult to ball due to their unique oxidation properties. Furthermore, aluminum wire bonding can be affected by temperature, vibration, and mechanical stress, making it prone to breakage or loosening, which can affect device reliability. Consequently, bonding wires cannot withstand high currents and are therefore unreliable. Utility Model Content

[0005] The utility model provides an interconnection component and a power device having the same, so as to solve the problem of low reliability of bonding wire connection in the related art.

[0006] According to one aspect of the present utility model, an interconnection component is provided, which includes: a first interconnection section, the lower surface of the first interconnection section is a first interconnection surface; a second interconnection section, which is spaced apart from the first interconnection section along a first direction, the lower surface of the second interconnection section is a second interconnection surface, a solder groove is provided on the first interconnection section and / or the second interconnection section, and the solder groove passes through the lower surface of the first interconnection section or the lower surface of the second interconnection section; a connecting section, which includes an arc segment, the two ends of the arc segment are respectively connected to the first interconnection section and the second interconnection section, and the middle part of the arc segment is provided to protrude upward.

[0007] Furthermore, the connecting section also includes a first straight section and a second straight section, which are respectively connected to the two ends of the arc section, the lower end of the first straight section is connected to the first interconnected section, and the lower end of the second straight section is connected to the second interconnected section.

[0008] Furthermore, the connecting segment also includes a first arc segment and a second arc segment, the two ends of the first arc segment are respectively connected to the first interconnected segment and the first straight segment, the two ends of the second arc segment are respectively connected to the second interconnected segment and the second straight segment, and the lower surface of the first arc segment is higher than the first interconnected surface.

[0009] Furthermore, an avoidance groove is provided on the lower surface of the second interconnection section. The avoidance groove runs through two side walls of the second interconnection section along the second direction, and an angle is formed between the first direction and the second direction.

[0010] Further, the solder groove passes through the upper surface of the first interconnection segment or the upper surface of the second interconnection segment.

[0011] Furthermore, the solder groove is a strip-shaped groove, which passes through the upper surface of the second interconnection segment and passes through the side wall of the second interconnection segment away from the first interconnection segment along the first direction.

[0012] Furthermore, the second interconnection surface is higher than the first interconnection surface; or, the second interconnection surface is flush with the first interconnection surface.

[0013] Furthermore, a ratio between the height of the avoidance groove and the height of the second interconnection section is between 0.1 and 0.3.

[0014] Furthermore, a ratio of a width of the avoidance groove to a length of the second interconnection section in the first direction is between 0.1 and 0.2.

[0015] According to another aspect of the present invention, a power device is provided, comprising: a liner having a first conductive layer and a second conductive layer spaced apart; a chip disposed on the liner, wherein the lower surface of the chip is connected to the first conductive layer; an interconnection member disposed on the liner, wherein a first interconnection surface of the interconnection member is connected to the second conductive layer, and a second interconnection surface of the interconnection member is connected to the upper surface of the chip, wherein the interconnection member is the interconnection member provided above.

[0016] According to another aspect of the present invention, a power device is provided, comprising: a first liner and a second liner, the first liner having a first conductive layer and a second conductive layer spaced apart, the second liner having a third conductive layer and a fourth conductive layer spaced apart; a first chip and a second chip, the first chip being arranged on the first liner, the lower surface of the first chip being electrically connected to the first conductive layer, and the upper surface of the first chip being electrically connected to the second conductive layer, the second chip being arranged on the second liner, the lower surface of the second chip being electrically connected to the third conductive layer, and the upper surface of the second chip being electrically connected to the fourth conductive layer; an interconnection member, the first interconnection surface of the interconnection member being connected to the second conductive layer, the second interconnection surface of the interconnection member being electrically connected to the third conductive layer, the interconnection member being the interconnection member provided above.

[0017] The present invention employs a technical solution comprising a first interconnection member comprising a first interconnection segment, a second interconnection segment, and a connecting segment. The first interconnection surface of the first interconnection segment is electrically connected to the second conductive layer of the substrate, and the second interconnection surface of the second interconnection segment is electrically connected to the source electrode of the chip. Current flows through the first conductive layer of the substrate, the drain electrode of the chip, the source electrode of the chip, the second interconnection segment, the connecting segment, the first interconnection segment, and the second conductive layer of the substrate, forming a current path. Compared to wire bonding, the interconnection member can form surface contact at the interconnection interface, thereby increasing the connection area and supporting greater current. The increased contact area also makes the connection more stable, making it less susceptible to breakage or loosening even under the influence of temperature, vibration, and mechanical stress, thereby increasing the reliability of the interconnection. Furthermore, since at least one of the first or second interconnection segments is provided with a solder groove, the solder groove can increase the contact length between the first or second interconnection segment and the solder, allowing the solder to form a solder column in the solder groove, thereby increasing the welding strength and further enhancing the reliability of the interconnection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0019] Figure 1 A schematic structural diagram of an interconnection component provided according to an embodiment of the present utility model is shown;

[0020] Figure 2 A bottom view of an interconnection member provided according to an embodiment of the present utility model is shown;

[0021] Figure 3 FIG2 shows a side view of a power device provided according to an embodiment of the present utility model;

[0022] Figure 4 FIG2 shows a top view of a power device provided according to an embodiment of the present utility model;

[0023] Figure 5 FIG2 shows another top view of a power device provided according to an embodiment of the present utility model;

[0024] Figure 6 Another top view of a power device provided according to an embodiment of the present utility model is shown.

[0025] The above drawings include the following reference numerals:

[0026] 10. First interconnection section;

[0027] 20. Second interconnection section; 21. Avoidance groove;

[0028] 30. Solder tank;

[0029] 40. Connecting segment; 41. Arc segment; 42. First straight segment; 43. Second straight segment; 44. First arc segment; 45. Second arc segment;

[0030] 50. Lining plate; 51. First conductive layer; 52. Second conductive layer;

[0031] 60. Chip. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] like Figures 1 to 6 As shown, an embodiment of the present invention provides an interconnection component, which includes a first interconnection segment 10, a second interconnection segment 20, and a connecting segment 40. The lower surface of the first interconnection segment 10 is a first interconnection surface; the second interconnection segment 20 is spaced apart from the first interconnection segment 10 along a first direction, and the lower surface of the second interconnection segment 20 is a second interconnection surface. A solder groove 30 is provided on the first interconnection segment 10 and / or the second interconnection segment 20, and the solder groove 30 passes through the lower surface of the first interconnection segment 10 or the lower surface of the second interconnection segment 20; the connecting segment 40 includes an arc segment 41, and the two ends of the arc segment 41 are respectively connected to the first interconnection segment 10 and the second interconnection segment 20, and the middle part of the arc segment 41 is protruding upward.

[0034] Applying the technical solution of the present invention, the interconnection component includes a first interconnection segment 10, a second interconnection segment 20 and a connecting segment 40. The first interconnection surface of the first interconnection segment 10 is electrically connected to the second conductive layer 52 of the liner 50, and the second interconnection surface of the second interconnection segment 20 is electrically connected to the source of the chip 60. The current flows through the first conductive layer 51 of the liner 50, the drain of the chip 60, the source of the chip 60, the second interconnection segment 20, the connecting segment 40, the first interconnection segment 10, and the second conductive layer 52 of the liner 50 to form a current path. Compared with the method of using bonding wires for connection, the interconnection component can form surface contact at the interconnection interface, thereby increasing the connection area and bearing a larger current. The increase in contact area also makes the connection more stable. Even if affected by temperature, vibration and mechanical stress, it is not easy to break or loosen, thereby increasing the reliability of the interconnection. At the same time, since at least one of the first interconnection segment 10 and the second interconnection segment 20 is provided with a solder groove 30, the solder groove 30 can be used to increase the contact length between the first interconnection segment 10 or the second interconnection segment 20 and the solder, so that the solder forms a solder column in the solder groove 30, thereby increasing the welding strength and further increasing the reliability of the interconnection.

[0035] In this embodiment, the first straight section 42 and the second straight section 43 are used to raise the distance between the connecting section 40 and the first conductive layer 51 of the liner 50, thereby avoiding the generation of a high-intensity electric field between the connecting section 40 and the first conductive layer 51 connected to the lower surface of the chip 60, thereby improving the insulation performance while ensuring mechanical strength.

[0036] It should be noted that the interconnection member provided in this embodiment is not limited to the connection between the chip 60 and the second conductive layer 52 of the substrate 50, but can also be used for the connection between different conductive layers on the substrate.

[0037] Among them, the interconnection components can adopt processes such as welding, sintering, and terminal bonding.

[0038] like Figure 1 As shown, the connecting section 40 further includes a first straight section 42 and a second straight section 43. The first straight section 42 and the second straight section 43 are respectively connected to the two ends of the arc section 41. The lower end of the first straight section 42 is connected to the first interconnecting section 10, and the lower end of the second straight section 43 is connected to the second interconnecting section 20. The first straight section 42 and the second straight section 43 can be used to quickly increase the distance between the arc section 41 and the upper surface of the liner 50, making the interconnecting member more reliable.

[0039] In this embodiment, the first straight section 42 and the second straight section 43 are both vertical sections. The first straight section 42 and the second straight section 43 have the same structure and size. The ratio of the height of the first straight section 42 and the second straight section 43 to the height of the connecting section is in the range of 0.1-0.6.

[0040] like Figure 1As shown, connecting segment 40 further includes a first arc segment 44 and a second arc segment 45. The ends of first arc segment 44 are connected to first interconnecting segment 10 and first straight segment 42, respectively. The ends of second arc segment 45 are connected to second interconnecting segment 20 and second straight segment 43, respectively. The lower surface of first arc segment 44 is higher than the first interconnecting surface. The first arc segment 44 and second arc segment 45 form a transition structure, reducing mechanical stress between first straight segment 42 and first interconnecting segment 10, and between second straight segment 43 and second interconnecting segment 20.

[0041] In other embodiments, only the arc segment 41 may be provided.

[0042] like Figure 1 As shown, a relief groove 21 is provided on the lower surface of the second interconnection segment 20. The relief groove 21 extends through both sidewalls of the second interconnection segment 20 along the second direction, with an angle formed between the first and second directions. The relief groove 21 prevents the gate lead on the upper surface of the chip 60 from contacting the interconnection member, improving insulation performance.

[0043] In this embodiment, the first direction and the second direction are perpendicular to each other.

[0044] like Figure 1 As shown, the solder groove 30 passes through the upper surface of the first interconnection section 10 or the upper surface of the second interconnection section 20. The above structure can release the internal stress of the interconnection component and improve the reliability of the interconnection component.

[0045] In this embodiment, solder grooves 30 are provided on both the first interconnection segment 10 and the second interconnection segment 20. The solder grooves 30 may be provided through the upper surface of one of the first interconnection segment 10 and the second interconnection segment 20, or may be provided through the upper surfaces of both the first interconnection segment 10 and the second interconnection segment 20.

[0046] Furthermore, on the first interconnection section 10 or the second interconnection section 20 , the number of the solder slots 30 may be one or more. When multiple solder slots 30 are used, the multiple solder slots 30 may be arranged in an array.

[0047] like Figure 6 As shown, the solder groove 30 is a strip-shaped groove that extends through the upper surface of the second interconnecting segment 20 and along the first direction through the sidewall of the second interconnecting segment 20 on the side away from the first interconnecting segment 10. The strip-shaped groove structure increases the length of the solder wetting between the first interconnecting segment 10 or the second interconnecting segment 20, thereby forming a longer solder column and making the connection of the interconnected components more stable.

[0048] Among them, the form of the solder groove 30 is not limited to a strip groove or a cylindrical groove, but can also be any other groove type, for example, an elliptical groove, a conical groove, a five-pointed star groove and other structures, as long as the contact length between the first interconnecting section 10 or the second interconnecting section 20 and the solder can be increased, so that the solder forms a solder column in the solder groove 30 and the welding strength is increased.

[0049] Meanwhile, the solder groove 30 can be in a through-type or non-through-type form, and its direction can also be horizontal, vertical, oblique, etc.

[0050] Furthermore, the first interconnection section 10 is not limited to being provided with only one type of solder groove 30 , and multiple types of solder grooves 30 may be used in combination.

[0051] In this embodiment, the thickness of the first interconnecting section 10 and the second interconnecting section 20 is 0.8 mm to 2 mm, and the ratio of the thickness of the first interconnecting section 10 and the second interconnecting section 20 to the connecting section 40 is in the range of 1 to 1.5 to ensure sufficient pressure bearing strength.

[0052] like Figure 1 As shown, the second interconnection surface is higher than the first interconnection surface. The above structure can adapt to the height of the chip 60 and the height of the second conductive layer 52 of the liner 50, thereby facilitating the connection of the interconnection components and keeping them in the best state.

[0053] In other embodiments, the second interconnection surface can be flush with the first interconnection surface, and the interconnection member can be used to connect different conductive layers on the substrate. For example, the first interconnection surface is connected to one conductive layer of the substrate, and the second interconnection surface is connected to another conductive layer of the substrate.

[0054] In this embodiment, the ratio of the height of the avoidance groove 21 to the height of the second interconnection segment 20 is between 0.1 and 0.3. With this ratio range, the gate lead can be avoided while ensuring the structural strength of the interconnection component and the stability of the interconnection interface.

[0055] The ratio of the height of the avoidance groove 21 to the height of the second interconnection section 20 may be 0.1, 0.2, 0.3, or any value between 0.1 and 0.3.

[0056] Specifically, the ratio of the width of the avoidance groove 21 to the length of the second interconnection segment 20 in the first direction is between 0.1 and 0.2. With the above size range, the gate lead can be avoided while ensuring the structural strength of the interconnection component and the stability of the interconnection interface.

[0057] The ratio of the width of the avoidance groove 21 to the length of the second interconnection section 20 in the first direction may be 0.1, 0.15, 0.2, or any value between 0.1 and 0.2.

[0058] The specific dimensions of the avoidance groove 21 and the second interconnection section 20 depend on the ratio of the width of the gate lead-out region on the chip to the width of the entire chip top surface bonding area.

[0059] like Figures 3 to 6 As shown, another embodiment of the present invention provides a power device, which includes a substrate 50, a chip 60, and an interconnection member. The substrate 50 has a first conductive layer 51 and a second conductive layer 52 spaced apart. The chip 60 is disposed on the substrate 50, with the lower surface of the chip 60 connected to the first conductive layer 51. The interconnection member is disposed on the substrate 50, with the conductive connection surface of the interconnection member connected to the second conductive layer 52, and the interconnection surface of the interconnection member connected to the upper surface of the chip 60. The interconnection member is the interconnection member provided above. Compared with the method of using bonding wires, the use of this power device can form surface contact at the interconnection interface, thereby increasing the connection area and being able to withstand greater current. The increased contact area also makes the connection more stable. Even under the influence of temperature, vibration, and mechanical stress, it is not easy to break or loosen, thereby increasing the reliability of the interconnection. At the same time, since at least one of the first interconnection segment 10 and the second interconnection segment 20 is provided with a solder groove 30, the solder groove 30 can be used to increase the contact length between the first interconnection segment 10 or the second interconnection segment 20 and the solder, so that the solder forms a solder column in the solder groove 30, thereby increasing the welding strength and further increasing the reliability of the interconnection.

[0060] Another embodiment of the present invention provides a power device, comprising: a first substrate and a second substrate, the first substrate having a first conductive layer and a second conductive layer spaced apart, the second substrate having a third conductive layer and a fourth conductive layer spaced apart; a first chip and a second chip, the first chip being disposed on the first substrate, the lower surface of the first chip being electrically connected to the first conductive layer, the upper surface of the first chip being electrically connected to the second conductive layer, the second chip being disposed on the second substrate, the lower surface of the second chip being electrically connected to the third conductive layer, and the upper surface of the second chip being electrically connected to the fourth conductive layer; and an interconnection member, the first interconnection surface of the interconnection member being electrically connected to the second conductive layer, the second interconnection surface of the interconnection member being electrically connected to the third conductive layer, the interconnection member being the interconnection member provided above. Compared to wirebond connections, the use of this power device enables surface contact at the interconnection interface, thereby increasing the connection area and allowing it to withstand greater current. The increased contact area also makes the connection more stable, making it less susceptible to breakage or loosening even under the influence of temperature, vibration, and mechanical stress, thereby increasing the reliability of the interconnection. At the same time, since at least one of the first interconnection segment 10 and the second interconnection segment 20 is provided with a solder groove 30, the solder groove 30 can be used to increase the contact length between the first interconnection segment 10 or the second interconnection segment 20 and the solder, so that the solder forms a solder column in the solder groove 30, thereby increasing the welding strength and further increasing the reliability of the interconnection.

[0061] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0062] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0063] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0064] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0065] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0066] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An interconnection component, characterized in that: The interconnection member comprises: A first interconnection section (10), wherein the lower surface of the first interconnection section (10) is a first interconnection surface; a second interconnection segment (20) spaced apart from the first interconnection segment (10) along a first direction, the lower surface of the second interconnection segment (20) being a second interconnection surface, a solder groove (30) being provided on the first interconnection segment (10) and / or the second interconnection segment (20), the solder groove (30) penetrating the lower surface of the first interconnection segment (10) or the lower surface of the second interconnection segment (20); The connecting section (40) comprises an arc section (41), both ends of the arc section (41) are respectively connected to the first interconnection section (10) and the second interconnection section (20), and the middle portion of the arc section (41) is protruding upward.

2. The interconnection member according to claim 1, wherein The connecting section (40) further comprises a first straight section (42) and a second straight section (43), wherein the first straight section (42) and the second straight section (43) are respectively connected to the two ends of the arc section (41), the lower end of the first straight section (42) is connected to the first interconnecting section (10), and the lower end of the second straight section (43) is connected to the second interconnecting section (20).

3. The interconnection member according to claim 2, wherein: The connecting section (40) further comprises a first arc section (44) and a second arc section (45), wherein two ends of the first arc section (44) are respectively connected to the first interconnecting section (10) and the first straight section (42), and two ends of the second arc section (45) are respectively connected to the second interconnecting section (20) and the second straight section (43), and the lower surface of the first arc section (44) is higher than the first interconnecting surface.

4. The interconnection member according to claim 1, wherein The lower surface of the second interconnected section (20) is provided with an avoidance groove (21), and the avoidance groove (21) passes through the two side walls of the second interconnected section (20) along a second direction, and an angle is formed between the first direction and the second direction.

5. The interconnection member according to any one of claims 1 to 4, characterized in that The solder groove (30) penetrates the upper surface of the first interconnection section (10) or the upper surface of the second interconnection section (20).

6. The interconnection member according to any one of claims 1 to 4, characterized in that The solder groove (30) is a strip-shaped groove that passes through the upper surface of the second interconnection section (20) and passes through the side wall of the second interconnection section (20) away from the first interconnection section (10) along the first direction.

7. The interconnection member according to any one of claims 1 to 4, characterized in that The second interconnection surface is higher than the first interconnection surface; or, the second interconnection surface is flush with the first interconnection surface.

8. The interconnection member according to claim 4, wherein: The ratio between the height of the avoidance groove (21) and the height of the second interconnection section (20) is between 0.1 and 0.

3.

9. The interconnection member according to claim 4, wherein: The ratio between the width of the avoidance groove (21) and the length of the second interconnection section (20) in the first direction is between 0.1 and 0.

2.

10. A power device, characterized in that: The power device includes: A liner (50) having a first conductive layer (51) and a second conductive layer (52) spaced apart from each other; A chip (60) is disposed on the liner (50), and a lower surface of the chip (60) is connected to the first conductive layer (51); An interconnection member is provided on the liner (50), a first interconnection surface of the interconnection member is connected to the second conductive layer (52), and a second interconnection surface of the interconnection member is connected to the upper surface of the chip (60), and the interconnection member is the interconnection member according to any one of claims 1 to 9.

11. A power device, characterized in that: The power device includes: a first lining plate and a second lining plate, wherein the first lining plate has a first conductive layer and a second conductive layer spaced apart from each other, and the second lining plate has a third conductive layer and a fourth conductive layer spaced apart from each other; a first chip and a second chip, wherein the first chip is disposed on the first substrate, a lower surface of the first chip is electrically connected to the first conductive layer, and an upper surface of the first chip is electrically connected to the second conductive layer; and the second chip is disposed on the second substrate, a lower surface of the second chip is electrically connected to the third conductive layer, and an upper surface of the second chip is electrically connected to the fourth conductive layer. An interconnection member, wherein the first interconnection surface of the interconnection member is connected to the second conductive layer, and the second interconnection surface of the interconnection member is electrically connected to the third conductive layer. The interconnection member is the interconnection member according to any one of claims 1 to 9.

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