FDC flexible die-cutting double-layer circuit board

Abstract

The utility model discloses an FDC flexible die-cutting double-layer circuit board, which relates to the technical field of circuit boards and comprises insulating films and circuit layers, the insulating films comprise a first insulating film, a second insulating film and a third insulating film, and the circuit layers comprise a first circuit layer and a second circuit layer. The first circuit layer is arranged between the first insulating film and the second insulating film, the second circuit layer is arranged between the second insulating film and the third insulating film, and the second insulating film is arranged between the first circuit layer and the second circuit layer; according to the technical scheme provided by the utility model, the installation space occupied by the flexible circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an FDC flexible die-cut double-layer circuit board. Background Art

[0002] With the development of modern society, electric vehicles have become increasingly popular. The power battery system is an important component of electric vehicles. The power battery system typically includes a battery module and a flexible circuit board electrically connected to the battery module.

[0003] As the functions of electronic products gradually diversify, existing flexible circuit boards occupy a larger installation space, thereby increasing the volume of the battery module. Utility Model Content

[0004] The main purpose of the utility model is to provide an FDC flexible die-cut double-layer circuit board, aiming to reduce the installation space occupied by the flexible circuit board.

[0005] To achieve the above objectives, the FDC flexible die-cut double-layer circuit board proposed in the present invention includes:

[0006] an insulating film including a first insulating film, a second insulating film, and a third insulating film; and

[0007] a circuit layer, the circuit layer comprising a first circuit layer and a second circuit layer, the first circuit layer being disposed between the first insulating film and the second insulating film, the second circuit layer being disposed between the second insulating film and a third insulating film, and the second insulating film being disposed between the first circuit layer and the second circuit layer;

[0008] Among them, the first circuit layer and the second circuit layer each include multiple circuit segments, and the circuit segments include a first connecting segment, a main segment and a second connecting segment that are connected to each other. The first connecting segment and the second connecting segment are respectively located at both ends of the main segment. The first connecting segment is used to connect to the nickel sheet, and the second connecting segment is used to connect to the connector pin, and the width of the first connecting segment and the second connecting segment is greater than the width of the main segment.

[0009] In one embodiment, the first insulating film, the second insulating film and the third insulating film all include a first film body and a second film body, the first connecting segments are all arranged on the first film body, the multiple second connecting segments of the first circuit layer and the multiple second connecting segments of the second circuit layer are respectively arranged side by side on the second film body, and the width of the second film body is greater than the width of the first film body.

[0010] In one embodiment, a plurality of insertion holes are provided on the second membrane body, and one insertion hole is provided corresponding to at least one second connecting segment so that the second connecting segment is exposed to the outside, and reinforcing ribs are provided between the plurality of insertion holes.

[0011] In one embodiment, the second connecting section is arranged in a ring shape.

[0012] In one embodiment, a plurality of welding holes are provided on the first film body, and one welding hole is provided corresponding to one first connecting segment, so that the first connecting segment is at least partially exposed to the outside.

[0013] In one embodiment, the first connecting section is arranged in a square shape.

[0014] In one embodiment, the welding hole is provided on the first film body of the second insulating film and the third insulating film.

[0015] In one embodiment, the first circuit layer and the second circuit layer each further include at least one supporting segment, and the supporting segment is spaced apart from the plurality of circuit segments.

[0016] In one embodiment, a mounting hole is provided on the third insulating film, and the mounting hole is provided through the first insulating film, the first circuit layer, the second insulating film, the second circuit layer, and the third insulating film.

[0017] In one embodiment, at least one of the first insulating film, the second insulating film, and the third insulating film is made of a PI material.

[0018] The FDC flexible die-cut double-layer circuit board in the technical solution of the present invention includes an insulating film and a circuit layer, the insulating film includes a first insulating film, a second insulating film and a third insulating film, the circuit layer includes a first circuit layer and a second circuit layer, the first circuit layer is arranged between the first insulating film and the second insulating film, the second circuit layer is arranged between the second insulating film and the third insulating film, and the second insulating film is arranged between the first circuit layer and the second circuit layer, so that the first circuit layer and the second circuit layer are integrated on an FDC flexible die-cut double-layer circuit board at the same time, so that more functional modules can be integrated on an FDC flexible die-cut double-layer circuit board, on the one hand, the width direction of the flexible circuit board is reduced, and on the other hand, the number of flexible circuit boards used in electronic products is reduced, thereby reducing the installation space occupied by the flexible circuit board, so that the FDC flexible die-cut double-layer circuit board can realize more circuit arrangements in a smaller space, so that the product can realize more functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 This is a front view of an embodiment of the FDC flexible die-cut double-layer circuit board provided by the utility model;

[0021] Figure 2 for Figure 1 Rear view;

[0022] Figure 3 for Figure 1 Partial exploded view in ;

[0023] Figure 4 for Figure 1 All exploded views in .

[0024] Description of Figure Numbers:

[0025] 11. First insulating film; 12. Second insulating film; 13. Third insulating film; 14. First film body; 141. Welding hole; 15. Second film body; 151. Insertion hole; 152. Reinforcement rib; 16. Mounting hole; 21. First circuit layer; 22. Second circuit layer; 23. First connecting section; 24. Main body section; 25. Second connecting section; 26. Support section.

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0030] Reference Figures 1 to 4 The utility model proposes an FDC flexible die-cut double-layer circuit board, comprising:

[0031] an insulating film including a first insulating film 11, a second insulating film 12, and a third insulating film 13; and

[0032] a circuit layer, the circuit layer comprising a first circuit layer 21 and a second circuit layer 22, the first circuit layer 21 being disposed between the first insulating film 11 and the second insulating film 12, the second circuit layer 22 being disposed between the second insulating film 12 and the third insulating film 13, and the second insulating film 12 being disposed between the first circuit layer 21 and the second circuit layer 22;

[0033] The first circuit layer 21 and the second circuit layer 22 each include multiple circuit segments, each comprising a first connecting segment 23, a main segment 24, and a second connecting segment 25. The first connecting segment 23 and the second connecting segment 25 are located at either end of the main segment 24. The first connecting segment 23 is used to connect to the nickel sheet, and the second connecting segment 25 is used to connect to the connector pins. The width of the first connecting segment 23 and the second connecting segment 25 is greater than that of the main segment 24. FDC stands for Flexible Die-cutted Circuit.

[0034] The FDC flexible die-cut double-layer circuit board in the technical solution of the present invention includes an insulating film and a circuit layer, the insulating film includes a first insulating film 11, a second insulating film 12 and a third insulating film 13, the circuit layer includes a first circuit layer 21 and a second circuit layer 22, the first circuit layer 21 is arranged between the first insulating film 11 and the second insulating film 12, the second circuit layer 22 is arranged between the second insulating film 12 and the third insulating film 13, and the second insulating film 12 is arranged between the first circuit layer 21 and the second circuit layer 22, so that the first circuit layer 21 and the second circuit layer 22 are integrated on an FDC flexible die-cut double-layer circuit board at the same time, so that more functional modules can be integrated on an FDC flexible die-cut double-layer circuit board, on the one hand, the size of the flexible circuit board in the width direction is reduced, and on the other hand, the number of flexible circuit boards used in electronic products is reduced, thereby reducing the installation space occupied by the flexible circuit board, so that the FDC flexible die-cut double-layer circuit board can realize more circuit arrangements in a smaller space, so that the product can realize more functions.

[0035] Among them, the nickel sheet can be a nickel sheet in a battery, or a nickel sheet in other electronic devices; it should be noted that one main segment 24 can correspond to only one first connecting segment 23 and / or one second connecting segment 25; at the same time, one main segment 24 can also correspond to multiple first connecting segments 23 and / or multiple second connecting segments 25 at the same time.

[0036] Furthermore, the widths of the first connecting segment 23 and the second connecting segment 25 are greater than the width of the main body segment 24. It is understood that the first connecting segment 23 and the second connecting segment 25 are primarily used for electrical connection to the nickel plate and connector pins of other electronic devices, and therefore require a certain amount of connection space; while the main body segment 24 primarily serves to connect the first connecting segment 23 and the second connecting segment 25. Therefore, the main body segment 24 is generally long and narrow. Therefore, this arrangement allows for more circuit segments to be arranged on a single circuit layer, thereby enabling the FDC flexible die-cut double-layer circuit board to implement more circuit layouts in a smaller space, thereby enabling the product to achieve more functions.

[0037] Among them, the main section 24 is located in the middle area of the FDC flexible die-cut double-layer circuit board, and the first connecting section 23, the second connecting section 25 and the supporting section 26 are arranged on the peripheral side of the main section 24, thereby playing a protective role for the FDC flexible die-cut double-layer circuit board, thereby reducing damage to the main section 24 when the FDC flexible die-cut double-layer circuit board is scratched, thereby improving the stability and reliability of the FDC flexible die-cut double-layer circuit board.

[0038] In the first embodiment, the first insulating film 11, the second insulating film 12, and the third insulating film 13 each include a first film body 14 and a second film body 15. The first connecting segments 23 are all provided on the first film body 14. The plurality of second connecting segments 25 of the first circuit layer 21 and the plurality of second connecting segments 25 of the second circuit layer 22 are respectively provided side by side on the second film body 15. The width of the second film body 15 is greater than the width of the first film body 14. That is, the plurality of second connecting segments 25 of the first circuit layer 21 and the plurality of second connecting segments 25 of the second circuit layer 22 are also provided side by side, and they are located on different straight lines. Since the multiple second connecting sections 25 are arranged side by side, they occupy a larger space in the width direction, and the main section 24 mainly serves to connect the first connecting section 23 and the second connecting section 25. It is in the shape of a long strip, so it occupies a smaller width space. Therefore, the width of the first film body 14 is smaller than the width of the second film body 15, thereby reducing the size of the flexible circuit board, which is beneficial to the miniaturization of the flexible board, and thus enables the FDC flexible die-cut double-layer circuit board to realize more circuit arrangements in a smaller space, so that the product can realize more functions.

[0039] Furthermore, in the second embodiment, the plurality of second connection segments 25 on the first circuit layer 21 are arranged side by side and in multiple rows; and / or the plurality of second connection segments 25 on the second circuit layer 22 are arranged side by side and in multiple rows.

[0040] In one embodiment, the second film body 15 is provided with multiple insertion holes 151, each of which corresponds to at least one of the second connecting segments 25, thereby exposing the second connecting segment 25. Reinforcing ribs 152 are provided between the multiple insertion holes 151. As can be understood, since the multiple second connecting segments 25 are arranged side by side and adjacent second connecting segments 25 are isolated from each other, this prevents cross-contamination between adjacent second connecting segments 25, which could damage the first circuit layer 21 and / or the second circuit layer 22 and reduce the safety of the FDC flexible die-cut double-layer circuit board. The reinforcing ribs 152 are provided between the multiple insertion holes 151. Specifically, the reinforcing ribs 152 can be provided on at least one of the first insulating film 11, the second insulating film 12, and the third insulating film 13. These reinforcing films not only strengthen the structural strength of the corresponding first insulating film 11, the second insulating film 12, and the third insulating film 13, but also isolate adjacent second connecting segments 25, thereby improving the stability, reliability, and safety of the FDC flexible die-cut double-layer circuit board.

[0041] Furthermore, the second connecting section 25 is annular in shape. By configuring the second connecting section 25 in an annular shape, the second connecting section 25 not only limits the position of the pin when it is inserted into the second connecting section 25, but also ensures that the pin can contact the second connecting section 25 regardless of its displacement in either direction, thereby improving the reliability and stability of the electrical connection between the pin and the second connecting section 25.

[0042] Specifically, the first film body 14 is provided with a plurality of welding holes 141, each of which is provided for each first connecting section 23, so that the first connecting section 23 is at least partially exposed. The provision of the welding holes 141 facilitates welding and fixing the nickel sheet to the first connecting section 23, thereby improving installation efficiency.

[0043] Furthermore, the first connecting section 23 is arranged in a square shape. By arranging the first connecting section 23 in a square shape, the welding area between the first connecting section 23 and the nickel sheet is increased, thereby facilitating welding between the first connecting section 23 and the nickel sheet, thereby improving the stability and reliability of the electrical connection between the nickel sheet and the first connecting section 23.

[0044] Furthermore, in one embodiment, the welding holes 141 are provided on the first film body 14 of the second insulating film 12 and the third insulating film 13. That is, although the FDC flexible die-cut double-layer circuit board is provided with a first circuit layer 21 and a second circuit layer 22, the first connecting segments 23 on the first circuit layer 21 and the second circuit layer 22 are both exposed through the welding holes 141 on the third film body. In other words, the first connecting segments 23 of the first circuit layer 21 and the second circuit layer 22 are exposed on the same side of the FDC flexible die-cut double-layer circuit board. This avoids the need to solder nickel sheets on both sides of the FDC flexible die-cut double-layer circuit board, thereby reducing the installation space required for the FDC flexible die-cut double-layer circuit board. This allows the FDC flexible die-cut double-layer circuit board to implement more circuit layouts in a smaller space, thereby enabling the product to achieve more functions.

[0045] Understandably, the spacing between the first connecting segment 23, the main segment 24, and the second connecting segment 25 varies in size, with some being larger and some being smaller. If these spacings are too large, they will contain only the insulating film, which is generally flexible and lacks structural strength. Furthermore, if the spacings are too large, the bonding strength between the insulating films corresponding to these spacings will also be weak. Therefore, in one embodiment, each of the first circuit layer 21 and the second circuit layer 22 further includes at least one support segment 26, which is spaced apart from the multiple circuit segments. The provision of support segments 26 increases the structural strength of the FDC flexible die-cut double-layer circuit board and prevents excessive spacing between the circuit segments.

[0046] In one embodiment, the third insulating film 13 is provided with mounting holes 16, which extend through the first insulating film 11, the first circuit layer 21, the second insulating film 12, the second circuit layer 22, and the third insulating film 13. The provision of mounting holes 16 facilitates the installation and fixation of the FDC flexible die-cut double-layer circuit board. Furthermore, corresponding support sections 26 are provided at the mounting holes 16, thereby increasing the structural strength of the mounting holes 16 and, in turn, the mounting strength and stability of the FDC flexible die-cut double-layer circuit board.

[0047] In one embodiment, at least one of the first insulating film 11, the second insulating film 12 and the third insulating film 13 is a PI material. PI film, i.e., polyimide film (Polyimide Film), is one of the best performing thin-film insulating materials in the world. It has good high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance, and can be used for a long time in an extremely wide temperature range (-269°C to 280°C, up to 400°C for a short time). In addition, the PI film also has excellent mechanical properties, chemical stability and moisture and heat resistance, as well as good dielectric properties. This improves the safety, reliability and service life of the FDC flexible die-cut double-layer circuit board. Of course, in other embodiments, the material of the first insulating film 11, the second insulating film 12 and the third insulating film 13 can also be a thermosetting adhesive film, etc.

[0048] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An FDC flexible die-cut double-layer circuit board, characterized in that: include: an insulating film, the insulating film comprising a first insulating film (11), a second insulating film (12), and a third insulating film (13); and A circuit layer, the circuit layer comprising a first circuit layer (21) and a second circuit layer (22), the first circuit layer (21) being arranged between the first insulating film (11) and the second insulating film (12), the second circuit layer (22) being arranged between the second insulating film (12) and the third insulating film (13), and the second insulating film (12) being arranged between the first circuit layer (21) and the second circuit layer (22); The first circuit layer (21) and the second circuit layer (22) each include a plurality of circuit segments, wherein the circuit segments include a first connecting segment (23), a main segment (24) and a second connecting segment (25) connected to each other, the first connecting segment (23) and the second connecting segment (25) being located at two ends of the main segment (24), respectively, the first connecting segment (23) being used to connect to a nickel sheet, the second connecting segment (25) being used to connect to a connector pin, and the widths of the first connecting segment (23) and the second connecting segment (25) being greater than the width of the main segment (24).

2. The FDC flexible die-cut double-layer circuit board according to claim 1, characterized in that: The first insulating film (11), the second insulating film (12) and the third insulating film (13) all include a first film body (14) and a second film body (15); the first connecting segments (23) are all arranged on the first film body (14); the plurality of second connecting segments (25) of the first circuit layer (21) and the plurality of second connecting segments (25) of the second circuit layer (22) are respectively arranged side by side on the second film body (15); and the width of the second film body (15) is greater than the width of the first film body (14).

3. The FDC flexible die-cut double-layer circuit board according to claim 2, characterized in that: The second membrane body (15) is provided with a plurality of insertion holes (151), and one insertion hole (151) is provided corresponding to at least one second connecting section (25) so that the second connecting section (25) is exposed to the outside, and reinforcing ribs (152) are provided between the plurality of insertion holes (151).

4. The FDC flexible die-cut double-layer circuit board according to claim 3, characterized in that: The second connecting section (25) is arranged in a ring shape.

5. The FDC flexible die-cut double-layer circuit board according to claim 2, characterized in that: The first film body (14) is provided with a plurality of welding holes (141), and one welding hole (141) is provided corresponding to one first connecting section (23), so that the first connecting section (23) is at least partially exposed to the outside.

6. The FDC flexible die-cut double-layer circuit board according to claim 5, characterized in that: The first connecting section (23) is arranged in a square shape.

7. The FDC flexible die-cut double-layer circuit board according to claim 5, characterized in that: The welding hole (141) is provided on the first film body (14) of the second insulating film (12) and the third insulating film (13).

8. The FDC flexible die-cut double-layer circuit board according to claim 1, characterized in that: The first circuit layer (21) and the second circuit layer (22) each further comprise at least one supporting segment (26), and the supporting segment (26) is spaced apart from the plurality of circuit segments.

9. The FDC flexible die-cut double-layer circuit board according to claim 1, characterized in that: The third insulating film (13) is provided with a mounting hole (16), and the mounting hole (16) is simultaneously provided through the first insulating film (11), the first circuit layer (21), the second insulating film (12), the second circuit layer (22) and the third insulating film (13).

10. The FDC flexible die-cut double-layer circuit board according to claim 1, characterized in that: At least one of the first insulating film (11), the second insulating film (12) and the third insulating film (13) is made of PI material.

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