Rigid-flex flexible circuit board

Abstract

The utility model relates to the technical field of flexible circuit boards, in particular to a rigid-flex flexible circuit board, which comprises a rigid circuit board, the upper side and the lower side of the rigid circuit board are provided with mounting grooves, the bottom ends of the mounting grooves are provided with through holes, the flexible circuit board is mounted in the mounting grooves, and the flexible circuit board is connected with the rigid circuit board through the through holes. An anti-interference layer is arranged on the outer side of the flexible circuit board. The flexible circuit board has the beneficial effects that the flexible circuit board can provide buffering, compression resistance and collision prevention protection for the outer side of the flexible circuit board, the edge of the flexible circuit board is prevented from being warped, and stable soft and hard combination of the flexible circuit board and the hard circuit board is kept; heat conduction and heat dissipation can be carried out on the rigid-flex combination interior of the rigid circuit board and the flexible circuit board, and the heat dissipation and cooling speed of the rigid-flex combination flexible circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit boards, in particular to a flexible circuit board that combines softness and hardness. Background Art

[0002] With the development of electronic devices, especially mobile phones and digital cameras, the trend toward lighter, thinner, shorter, and smaller devices is being driven. This can only be achieved by reducing the number of components or combining them into modules to reduce the size of the finished product. The characteristics of rigid-flex circuit boards precisely meet these requirements. They can effectively utilize installation space, achieve three-dimensional assembly, reduce installation costs, and can replace plug-in components. They can also ensure reliability in environments such as impact and humidity. Rigid-flex circuit boards have both the support function of rigid printed circuit boards and the characteristics of flexible boards. Therefore, due to their significant advantages, they have an increasingly broad application prospect, especially in the aerospace and military fields.

[0003] A rigid-flex PCB is a circuit board structure that includes both interconnected flexible and rigid circuit boards. It combines the flexibility of a flexible PCB with the hardness of a rigid PCB. Rigid-flex PCBs are typically fabricated by sequentially layering rigid PCB materials on top of the flexible PCB. The flexible and rigid PCBs are connected via through-holes, buried vias, or blind vias.

[0004] For example, the prior art Chinese patent publication number "CN108055773A" provides a soft-hard combined flexible circuit board and its manufacturing method, including a first flexible substrate, a plurality of grooves are opened laterally on the surface of the first flexible substrate, a rigid circuit board is installed in the groove, and one side of the rigid circuit board is provided with adhesive glued to the bottom of the groove, a plurality of conductive circuits are printed on the surface of the first flexible substrate and connected to the rigid circuit board, a mounting groove is laser cut on the surface of the rigid circuit board, a flexible electrode is installed in the mounting groove, a second flexible substrate is hot-pressed on the side of the substrate facing away from the flexible electrode, and a connecting electrode is provided on the second flexible substrate corresponding to the position of the flexible electrode, and the connecting electrode is connected to the flexible electrode.

[0005] The device uses a hard-soft combination board formed by bonding a rigid circuit board and a flexible substrate. The overall manufacturing cost is low and the use effect is good. In addition, a double-layer flexible substrate is used to improve the overall flexibility and tear resistance, and it is more practical.

[0006] The existing soft-hard combined flexible circuit boards have an unsafe adhesive connection between the flexible circuit boards and the rigid circuit boards. The edges of the flexible circuit boards are prone to loosening and warping. Moreover, the outside of the flexible circuit boards lacks good buffering support protection, which can easily cause damage such as squeezing and bumping on the outside of the flexible circuit boards. At the same time, after the flexible circuit boards are combined with the rigid circuit boards, the heat generated inside them cannot be dissipated well, resulting in internal heat collection, which affects the safe use of the soft-hard combined flexible circuit boards. Utility Model Content

[0007] The purpose of the utility model is to solve the shortcomings in the prior art that the adhesive connection between the flexible circuit board and the rigid circuit board is not safe enough, the edges of the flexible circuit board are prone to loosening and warping, and the outside of the flexible circuit board lacks good buffer support protection, which easily leads to damage such as squeezing and bumping on the outside of the flexible circuit board. A flexible circuit board that combines soft and hard is proposed.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] A flexible circuit board that combines soft and hard is designed, including a rigid circuit board, wherein mounting grooves are provided on the upper and lower sides of the rigid circuit board, a through hole is provided at the bottom end of the mounting groove, a flexible circuit board is installed inside the mounting groove, an anti-interference layer is provided on the outer side of the flexible circuit board, a buffer layer is bonded to the outer side of the anti-interference layer, positioning grooves are provided on the upper and lower edges of the rigid circuit board, a silicone layer is bonded on the upper and lower sides of the rigid circuit board, a positioning column is fixed on the inner edge of the silicone layer, the positioning column is inserted into the interior of the positioning groove, a buffer column is fixed in the middle of the inner side of the silicone layer, a reinforcing layer is bonded to the outer side of the silicone layer, and a protective layer is connected to the outer side of the reinforcing layer.

[0010] Furthermore, heat dissipation holes are opened on the side of the rigid circuit board, and the heat dissipation holes are connected to the mounting grooves and are evenly distributed around the rigid circuit board.

[0011] Furthermore, the rigid circuit board and the mounting groove are both rectangular structures, the two mounting grooves have the same depth, and the sum of their depths is less than the thickness of the rigid circuit board.

[0012] Furthermore, the length and width of the mounting groove are both smaller than the length and width of the rigid circuit board, and the two mounting grooves are connected through the through hole.

[0013] Furthermore, the buffer layer is made of thermally conductive silicone material, and the silicone layer is a rectangular structure, and its length and width are equal to those of the rigid circuit board.

[0014] Furthermore, the positioning column and the buffer column are both made of heat-conducting silicone material, and the inner end of the buffer column abuts against the outer side of the buffer layer.

[0015] Furthermore, the reinforcement layer is made of glass fiber material and has a rectangular structure.

[0016] Furthermore, the protective layer is made of polyurethane and has a rectangular structure.

[0017] The utility model proposes a flexible circuit board that combines softness and hardness, which has the following beneficial effects:

[0018] 1. The present invention provides mounting grooves on both sides of the rigid circuit board, recesses the two flexible circuit boards into the mounting grooves on both sides of the rigid circuit board, and provides a buffer layer, buffer columns, a silicone layer, a reinforcement layer, and a protective layer on the outside of the rigid circuit board. This provides buffering, pressure resistance, and anti-collision protection for the outside of the flexible circuit board, prevents the edges of the flexible circuit board from warping, and maintains a stable soft-hard combination of the flexible circuit board and the rigid circuit board.

[0019] 2. The utility model provides through holes in the mounting grooves on both sides of the rigid circuit board, and evenly provides heat dissipation holes around the rigid circuit board. Therefore, the internal part of the rigid circuit board and the flexible circuit board can be heat-dissipated and the heat dissipation and cooling speed of the flexible circuit board can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 For this utility model Figure 1 Schematic diagram of the rigid circuit board structure;

[0022] Figure 3 For this utility model Figure 1 sectional view of

[0023] Figure 4 For this utility model Figure 3 Enlarged view of point A.

[0024] In the figure: 1. Rigid circuit board; 2. Flexible circuit board; 3. Protective layer; 4. Through hole; 5. Heat dissipation hole; 6. Positioning column; 7. Positioning groove; 8. Silicone layer; 9. Reinforcement layer; 10. Anti-interference layer; 11. Buffer layer; 12. Buffer column; 13. Mounting groove. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0026] Example 1

[0027] See also Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , a flexible circuit board that combines soft and hard in the figure includes a rigid circuit board 1, and mounting grooves 13 are provided on the upper and lower sides of the rigid circuit board 1, and a through hole 4 is provided at the bottom end of the mounting groove 13. A flexible circuit board 2 is installed inside the mounting groove 13, and an anti-interference layer 10 is provided on the outside of the flexible circuit board 2. A buffer layer 11 is bonded to the outside of the anti-interference layer 10, and positioning grooves 7 are provided on the upper and lower edges of the rigid circuit board 1. A silicone layer 8 is bonded on the upper and lower sides of the rigid circuit board 1, and a positioning column 6 is fixed to the inner edge of the silicone layer 8. The positioning column 6 is inserted into the interior of the positioning groove 7, and a buffer column 12 is fixed in the middle of the interior of the silicone layer 8. A reinforcing layer 9 is bonded to the outside of the silicone layer 8, and a protective layer 3 is connected to the outside of the reinforcing layer 9.

[0028] Mounting grooves 13 are provided on both sides of the rigid circuit board 1, and the two flexible circuit boards 2 are recessed and installed in the mounting grooves 13 on both sides of the rigid circuit board 1. A buffer layer 11, a buffer column 12, a silicone layer 8, a reinforcement layer 9 and a protective layer 3 are provided on the outside thereof. Thus, the outside of the flexible circuit board 2 can be provided with buffering pressure resistance and anti-collision protection, and the edge of the flexible circuit board 2 can be prevented from warping, thereby maintaining a stable soft-hard combination between the flexible circuit board 2 and the rigid circuit board 1.

[0029] The rigid circuit board 1 and the mounting groove 13 are both rectangular structures. The two mounting grooves 13 have the same depth, and the sum of their depths is less than the thickness of the rigid circuit board 1 .

[0030] The length and width of the mounting groove 13 are both smaller than those of the rigid circuit board 1 , and the two mounting grooves 13 are connected through the through hole 4 ; the buffer layer 11 is made of thermally conductive silicone material, and the silicone layer 8 is a rectangular structure, and its length and width are equal to those of the rigid circuit board 1 .

[0031] The positioning column 6 and the buffer column 12 are both made of thermally conductive silicone material, and the inner end of the buffer column 12 abuts against the outer side of the buffer layer 11; the reinforcement layer 9 is made of glass fiber material and has a rectangular structure; the protective layer 3 is made of polyurethane material and has a rectangular structure.

[0032] Example 2

[0033] See also Figure 1 、 Figure 2 、 Figure 3 and Figure 4, a flexible circuit board that combines soft and hard in the figure includes a rigid circuit board 1, and mounting grooves 13 are provided on the upper and lower sides of the rigid circuit board 1, and a through hole 4 is provided at the bottom end of the mounting groove 13. A flexible circuit board 2 is installed inside the mounting groove 13, and an anti-interference layer 10 is provided on the outside of the flexible circuit board 2. A buffer layer 11 is bonded to the outside of the anti-interference layer 10, and positioning grooves 7 are provided on the upper and lower edges of the rigid circuit board 1. A silicone layer 8 is bonded on the upper and lower sides of the rigid circuit board 1, and a positioning column 6 is fixed to the inner edge of the silicone layer 8. The positioning column 6 is inserted into the interior of the positioning groove 7, and a buffer column 12 is fixed in the middle of the interior of the silicone layer 8. A reinforcing layer 9 is bonded to the outside of the silicone layer 8, and a protective layer 3 is connected to the outside of the reinforcing layer 9.

[0034] Mounting grooves 13 are provided on both sides of the rigid circuit board 1, and the two flexible circuit boards 2 are recessed and installed in the mounting grooves 13 on both sides of the rigid circuit board 1. A buffer layer 11, a buffer column 12, a silicone layer 8, a reinforcement layer 9 and a protective layer 3 are provided on the outside thereof. Thus, the outside of the flexible circuit board 2 can be provided with buffering pressure resistance and anti-collision protection, and the edge of the flexible circuit board 2 can be prevented from warping, thereby maintaining a stable soft-hard combination between the flexible circuit board 2 and the rigid circuit board 1.

[0035] Heat dissipation holes 5 are formed on the side of the rigid circuit board 1 . The heat dissipation holes 5 are connected to the mounting grooves 13 and are evenly distributed around the rigid circuit board 1 .

[0036] Through holes 4 are provided in the mounting grooves 13 on both sides of the rigid circuit board 1, and heat dissipation holes 5 are evenly provided around the rigid circuit board 1. Thus, heat can be conducted and dissipated from the interior of the rigid-soft combination of the rigid circuit board 1 and the flexible circuit board 2, thereby improving the heat dissipation and cooling speed of the rigid-soft combination of the flexible circuit board 2.

[0037] Working method: Mounting grooves 13 are set on both sides of the rigid circuit board 1, and two flexible circuit boards 2 are recessed and installed in the mounting grooves 13 on both sides of the rigid circuit board 1, and a buffer layer 11, a buffer column 12, a silicone layer 8, a reinforcement layer 9 and a protective layer 3 are set on the outside thereof. Therefore, the outer side of the flexible circuit board 2 can be provided with buffering pressure resistance and anti-collision protection, and the edge of the flexible circuit board 2 can be prevented from warping, thereby maintaining a stable soft-hard combination of the flexible circuit board 2 and the rigid circuit board 1.

[0038] Through holes 4 are provided in the mounting grooves 13 on both sides of the rigid circuit board 1, and heat dissipation holes 5 are evenly provided around the rigid circuit board 1. Thus, heat can be conducted and dissipated from the interior of the rigid-soft combination of the rigid circuit board 1 and the flexible circuit board 2, thereby improving the heat dissipation and cooling speed of the rigid-soft combination of the flexible circuit board 2.

[0039] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A flexible circuit board combining soft and hard components, comprising a rigid circuit board (1), characterized in that: The rigid circuit board (1) is provided with mounting grooves (13) on the upper and lower sides, a through hole (4) is provided at the bottom end of the mounting groove (13), a flexible circuit board (2) is installed inside the mounting groove (13), an anti-interference layer (10) is provided on the outer side of the flexible circuit board (2), a buffer layer (11) is bonded to the outer side of the anti-interference layer (10), positioning grooves (7) are provided on the upper and lower edges of the rigid circuit board (1), a silicone layer (8) is bonded on the upper and lower sides of the rigid circuit board (1), a positioning column (6) is fixed to the inner edge of the silicone layer (8), the positioning column (6) is inserted into the interior of the positioning groove (7), a buffer column (12) is fixed in the middle of the interior of the silicone layer (8), a reinforcement layer (9) is bonded to the outer side of the silicone layer (8), and a protective layer (3) is connected to the outer side of the reinforcement layer (9).

2. The rigid-soft flexible circuit board according to claim 1, characterized in that: The side of the rigid circuit board (1) is provided with heat dissipation holes (5), the heat dissipation holes (5) are connected to the mounting grooves (13), and are evenly distributed around the rigid circuit board (1).

3. The rigid-soft flexible circuit board according to claim 1, characterized in that: The rigid circuit board (1) and the mounting groove (13) are both rectangular structures, the two mounting grooves (13) have the same depth, and the sum of their depths is less than the thickness of the rigid circuit board (1).

4. The rigid-soft flexible circuit board according to claim 1, characterized in that: The length and width of the mounting groove (13) are both smaller than the length and width of the rigid circuit board (1), and the two mounting grooves (13) are connected via the through hole (4).

5. The rigid-soft flexible circuit board according to claim 1, characterized in that: The buffer layer (11) is made of heat-conducting silica gel, and the silica gel layer (8) is a rectangular structure, with a length and width equal to those of the rigid circuit board (1).

6. The rigid-soft flexible circuit board according to claim 1, characterized in that: The positioning column (6) and the buffer column (12) are both made of heat-conducting silica gel, and the inner end of the buffer column (12) abuts against the outer side of the buffer layer (11).

7. The rigid-soft flexible circuit board according to claim 1, characterized in that: The reinforcement layer (9) is made of glass fiber material and has a rectangular structure.

8. The rigid-soft flexible circuit board according to claim 1, characterized in that: The protective layer (3) is made of polyurethane and has a rectangular structure.

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