Attaching structure of electronic product

Abstract

The utility model discloses an attaching structure of an electronic product, which comprises a flexible attaching object, the flexible attaching object is used for being attached to the surface of the electronic product, the attaching surface of the flexible attaching object is provided with air stagnation holes, and the air stagnation holes are used for absorbing air; the attaching structure of the electronic product can effectively solve the problem of swelling caused by gas retention when the flexible attaching object is used for large-area attaching, gas generated during attaching can be effectively absorbed by arranging the gas retention holes in the attaching face of the flexible attaching object, retention of the gas under the attaching face is reduced, and the attaching effect of the electronic product is improved. Bulging caused by gas pressure is avoided, and it is ensured that the attached surface is smoother, so that the bonding stability of an attached object and the surface of an electronic product is improved, and the service life of the product is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, in particular to an attachment structure of an electronic product. Background Art

[0002] With the rapid development of electronic products, their designs are becoming increasingly thinner and more integrated. This trend necessitates the use of various flexible attachments during the manufacturing process to achieve vibration reduction, sound insulation, and heat dissipation. These flexible attachments include, but are not limited to, adhesive strips, cushioning pads, sound insulation pads, and thermal grease blocks, and they play a crucial role in the assembly of electronic products.

[0003] However, existing technologies often encounter a common problem when these flexible adhesives are used for large-area bonding: bulging is easily caused by air trapped between the product and the adhesive during the bonding process. This phenomenon not only affects the appearance and quality of electronic products but can also negatively impact their performance. For example, bulging can lead to uneven heat dissipation, affecting the stability and lifespan of electronic components. Alternatively, in a vibrating environment, bulging can cause an unstable connection between the adhesive and the electronic product, compromising overall shock resistance.

[0004] Furthermore, bulging increases the cost and time of subsequent repairs. During the production of some precision electronic products, once bulging is discovered, it may be necessary to reattach or replace the adhesive, which not only increases production costs but also reduces production efficiency.

[0005] Although there are some solutions on the market that attempt to solve this problem, such as improving the bonding process and using special adhesives, these methods are often costly and have limited effects, and cannot fundamentally solve the bulging problem caused by gas retention. Utility Model Content

[0006] The main purpose of the utility model is to provide an attachment structure for electronic products to solve the problem of bulging caused by gas retention when a flexible attachment is used for large-area attachment.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is: an attachment structure of an electronic product, comprising

[0008] Flexible stickers, used to adhere to the surface of electronic products;

[0009] The air retardation holes are provided on the contact surface of the flexible adhesive and are used for absorbing air.

[0010] Furthermore, there are multiple air-trapping holes.

[0011] Furthermore, a through groove is provided on the fitting surface of the flexible attachment, and two adjacent air-trapping holes are connected through the through groove.

[0012] Furthermore, the flexible attachment is further provided with an exhaust hole communicating with the external space and at least one of the air retardation holes.

[0013] Furthermore, the exhaust hole is provided on a side of the flexible attachment facing away from the bonding surface.

[0014] Furthermore, the number of the air-trapping holes is greater than or equal to three, and the distances between two adjacent air-trapping holes are equal.

[0015] Furthermore, it also includes a dustproof film, which is attached to the bonding surface of the flexible attachment and covers the air stagnant holes.

[0016] Furthermore, a tearing strip is provided on the side of the dustproof film that is away from the bonding surface of the flexible attachment.

[0017] Furthermore, the shape of the air retardation hole is circular, elliptical or regular polygonal.

[0018] The beneficial effect of the present invention is that the attachment structure of electronic products provided by the present invention can effectively solve the problem of bulging caused by gas retention when the flexible attachment is used for large-area bonding. By providing air retention holes on the bonding surface of the flexible attachment, the gas generated during bonding can be effectively absorbed, thereby reducing the retention of gas under the bonding surface, avoiding bulging caused by gas pressure, ensuring that the surface after bonding is smoother, thereby improving the bonding stability between the attachment and the surface of the electronic product, and extending the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 This is a schematic structural diagram of the attachment structure of an electronic product according to the first embodiment of the present utility model;

[0021] Figure 2 This is an exploded view of the attachment structure of the electronic product according to the first embodiment of the present invention.

[0022] Description of labels:

[0023] 1. Flexible attachment; 11. Fitting surface; 12. Air retardation hole; 2. Dust-proof film; 21. Tear-off strip. DETAILED DESCRIPTION

[0024] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments.

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indications will also change accordingly.

[0027] In addition, if the embodiments of the present invention include descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of such features.

[0028] In addition, if the word "and / or" appears throughout the text, it means that three parallel solutions are included. For example, "and / or" includes solutions, or solutions, or solutions that meet all of the requirements simultaneously. In addition, the technical solutions of various embodiments may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. If the combination of technical solutions is mutually contradictory or cannot be implemented, it shall be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0029] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0030] Please refer to Figure 1and Figure 2 , an attachment structure for electronic products, comprising

[0031] Flexible attachment 1, used for attaching to the surface of electronic products;

[0032] The air retardation holes 12 are provided on the contact surface 11 of the flexible adhesive patch 1 and are used for absorbing air.

[0033] As can be seen from the above description, the beneficial effect of the present invention is that by providing air retention holes 12 on the bonding surface 11 of the flexible attachment 1, the gas generated during bonding can be effectively absorbed, thereby reducing the retention of gas under the bonding surface 11, avoiding bulging caused by gas pressure, ensuring that the surface after bonding is smoother, thereby improving the bonding stability between the attachment and the surface of the electronic product, and extending the service life of the product.

[0034] Furthermore, there are multiple air-trapping holes 12 .

[0035] As can be seen from the above description, providing a plurality of gas retention holes 12 is beneficial to improving the gas absorption efficiency and further reducing the risk of gas retention on the bonding surface 11 .

[0036] Furthermore, a through groove is provided on the fitting surface 11 of the flexible patch 1 , and two adjacent air-trapping holes 12 are connected through the through groove.

[0037] As can be seen from the above description, the provision of the through grooves allows adjacent gas-trapping holes 12 to communicate with each other, forming a gas flow network, thereby enhancing the fluidity of the gas and facilitating more uniform gas absorption.

[0038] Furthermore, the flexible patch 1 is further provided with an exhaust hole communicating with the external space and at least one of the air retardation holes 12 .

[0039] As can be seen from the above description, the provision of the exhaust holes provides a direct passage to the outside space, allowing the gas to be discharged quickly, thereby reducing the time the gas is retained during the bonding process.

[0040] Furthermore, the exhaust hole is provided on a side of the flexible adhesive patch 1 that is away from the bonding surface 11 .

[0041] As can be seen from the above description, the vent holes are arranged on the opposite side of the bonding surface 11, that is, on the side away from the bonding surface 11, so as to avoid direct pressure during the bonding process and keep the vent holes unobstructed.

[0042] Furthermore, the number of the air retardation holes 12 is greater than or equal to three, and the distances between two adjacent air retardation holes 12 are equal.

[0043] As can be seen from the above description, setting the number of air-trapping holes 12 and equalizing the spacing between them helps to achieve uniform gas discharge and avoid uneven lamination caused by uneven gas discharge.

[0044] Furthermore, a dustproof film 2 is included, which is attached to the fitting surface 11 of the flexible attachment 1 and covers the air retardation holes 12 .

[0045] As can be seen from the above description, the use of the dustproof film 2 can protect the air retardation holes 12 from being blocked by dust or other impurities before lamination, ensuring that the gas can be smoothly and effectively absorbed by the air retardation holes 12 during lamination.

[0046] Furthermore, a tearing strip 21 is provided on the side of the dustproof film 2 facing away from the bonding surface 11 of the flexible attachment 1 .

[0047] From the above description, it can be seen that the design of the tear strip 21 facilitates the quick removal of the dustproof film 2 before lamination, providing convenience for the lamination process. At the same time, the presence of the tear strip 21 also helps to maintain the integrity of the dustproof film 2 until the last moment before lamination.

[0048] Furthermore, the shape of the air retardation hole 12 is circular, elliptical or regular polygonal.

[0049] As can be seen from the above description, the diversity of the shapes of the air pores 12 (circular, elliptical or regular polygonal) provides different gas flow characteristics. The most suitable shape of the air pores 12 can be selected according to the specific fitting requirements and the material properties of the flexible adhesive 1 to optimize the gas absorption effect.

[0050] Example 1

[0051] Please refer to Figures 1 to 2 , embodiment 1 of the present utility model is: an attachment structure of an electronic product, comprising a flexible attachment 1, wherein the flexible attachment 1 is used to adhere to the surface of the electronic product, and the flexible attachment 1 includes but is not limited to adhesive strips, buffer cotton, sound insulation cotton, heat dissipation silicone grease blocks, etc.; air retardation holes 12 are provided on the bonding surface 11 of the flexible attachment 1, and the air retardation holes 12 are used to absorb gas; by providing the air retardation holes 12 on the bonding surface 11 of the flexible attachment 1, the gas generated during bonding can be effectively absorbed, thereby reducing the retention of gas under the bonding surface 11, avoiding bulging caused by gas pressure, ensuring that the surface after bonding is smoother, thereby improving the bonding stability between the attachment and the surface of the electronic product, and extending the service life of the product.

[0052] In this embodiment, there are multiple air retardation holes 12, which is beneficial to improving the gas absorption efficiency and further reducing the risk of gas retention on the fitting surface 11; as an option, a through groove (not shown) can be provided on the fitting surface 11 of the flexible attachment 1, and two adjacent air retardation holes 12 are connected through the through groove. The provision of the through groove allows adjacent air retardation holes 12 to be connected to form a gas circulation network, thereby enhancing the fluidity of the gas and facilitating more uniform absorption of the gas; further optionally, the flexible attachment 1 is further provided with an exhaust hole (not shown) connected to the external space and at least one of the air retardation holes 12, and the provision of the exhaust hole provides It provides a channel directly leading to the external space, so that the gas can be discharged quickly, reducing the time of gas retention during the bonding process; further, the exhaust hole is arranged on the side of the flexible attachment 1 away from the bonding surface 11, and the exhaust hole is arranged on the opposite side of the bonding surface 11, that is, the side away from the bonding surface 11, which can avoid direct pressure during the bonding process and keep the exhaust hole unobstructed; in detail, the number of the air stagnant holes 12 is greater than or equal to three, and the spacing between two adjacent air stagnant holes 12 is equal; it is easy to understand that the setting of the number of air stagnant holes 12 and the equalization of the spacing help to achieve uniform gas discharge and avoid uneven bonding due to uneven gas discharge.

[0053] Preferably, the attachment structure of the electronic product also includes a dust-proof film 2, which is attached to the bonding surface 11 of the flexible attachment 1 and covers the air retardation holes 12. The use of the dust-proof film 2 can protect the air retardation holes 12 from being blocked by dust or other impurities before bonding, ensuring that the gas can be smoothly and effectively absorbed by the air retardation holes 12 during bonding; specifically, the side of the dust-proof film 2 facing away from the bonding surface 11 of the flexible attachment 1 is provided with a tearing strip 21. The design of the tearing strip 21 facilitates the quick removal of the dust-proof film 2 before bonding, thereby facilitating the bonding process. At the same time, the presence of the tearing strip 21 also helps to maintain the integrity of the dust-proof film 2 until the last moment before bonding.

[0054] Optionally, the shape of the air pores 12 is circular, elliptical or regular polygonal; the diversity of the shapes of the air pores 12 (circular, elliptical or regular polygonal) provides different gas flow characteristics, and the most suitable shape of the air pores 12 can be selected according to the specific fitting requirements and the material properties of the flexible attachment 1 to optimize the gas absorption effect.

[0055] To sum up, the attachment structure of electronic products provided by the present invention can effectively solve the problem of bulging caused by gas retention when flexible attachments are used for large-area bonding. By setting air retention holes on the bonding surface of the flexible attachment, the gas generated during bonding can be effectively absorbed, thereby reducing the retention of gas under the bonding surface, avoiding bulging caused by gas pressure, and ensuring that the surface after bonding is smoother, thereby improving the bonding stability between the attachment and the surface of the electronic product and extending the service life of the product.

[0056] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the practical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An attachment structure for an electronic product, characterized in that: include Flexible stickers, used to adhere to the surface of electronic products; The air retardation holes are provided on the contact surface of the flexible adhesive and are used for absorbing air.

2. The attachment structure of electronic products according to claim 1, characterized in that: There are multiple air retardation holes.

3. The attachment structure of electronic products according to claim 2, characterized in that: A through groove is further provided on the fitting surface of the flexible attachment, and two adjacent air-trapping holes are connected through the through groove.

4. The attachment structure of electronic products according to claim 3, characterized in that: The flexible attachment is further provided with an exhaust hole communicating with the external space and at least one of the air-trapping holes.

5. The attachment structure of electronic products according to claim 4, characterized in that: The exhaust hole is arranged on a side of the flexible attachment away from the bonding surface.

6. The attachment structure of electronic products according to claim 2, characterized in that: The number of the air retardation holes is greater than or equal to three, and the distances between two adjacent air retardation holes are equal.

7. The attachment structure of an electronic product according to claim 1, characterized in that: The invention also includes a dustproof film, which is attached to the attachment surface of the flexible attachment and covers the air stagnant holes.

8. The attachment structure of electronic products according to claim 7, characterized in that: A tearing strip is provided on the side of the dustproof film that is away from the bonding surface of the flexible attachment.

9. The attachment structure of an electronic product according to claim 1, characterized in that: The shape of the air retardation hole is circular, elliptical or regular polygonal.

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