Cutter for semiconductor component

By designing tools for semiconductor components with connection sections and reinforcement sections, the problem of interference between the tool and the side wall of the workpiece is solved, and the processing quality and the service life of the tool are improved.

CN223250596UActive Publication Date: 2025-08-22LISHUI RUISHENG SEMICON TECH CO LTD
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Patent Information

Application Number
CN202422370624.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-08-22
Estimated Expiration
2034-09-27

AI Technical Summary

Technical Problem

When existing tools process the annular groove of semiconductor components, they are prone to interfere with the side wall of the workpiece, resulting in poor roughness and deformation of the parts, resulting in product scrapping.

Method used

A tool for semiconductor components is designed, including a tool holder, a connecting section and a cutting head. The connecting section consists of a connecting part and a reinforcement part, and is arranged in sequence along the preset axial direction. The peripheral wall of the connecting section forms a barrier surface to avoid affecting the side wall of the workpiece. The connecting section increases the torque bearing capacity through the reinforcement part.

Benefits of technology

It effectively avoids the roughness problem of the side wall of the workpiece, prevents parts from deforming, and improves the processing quality and tool service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of cutters, in particular to a cutter for semiconductor parts, which comprises a cutter handle, a connecting section and a cutter head which are sequentially arranged along a preset axial direction. The connecting section comprises a connecting part and a reinforcing part, one end of the connecting part is fixedly connected with the cutter handle, the other end of the connecting part is connected with the cutter head, and in the preset axial direction, one projection of the connecting part covers part of the end face, connected with the connecting part, of the corresponding cutter head, and the other projection covers part of the end face, connected with the connecting part, of the corresponding cutter handle. The reinforcing part is fixedly connected with the connecting part and the cutter handle at the same time, and the reinforcing part and the cutter head are arranged at intervals in the preset axial direction. According to the arrangement, the maximum diameter formed by rotation of the tool bit is larger than the maximum diameter formed by rotation of the connecting section, so that the peripheral wall of the connecting section forms an avoiding face to avoid the side wall of a workpiece machined by the tool bit, the roughness of the side wall of the workpiece is prevented from being affected, and the problems that parts deform and products are scrapped are solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of cutting tools, in particular to a cutting tool for semiconductor components. Background Art

[0002] In the semiconductor industry, parts with annular grooves are frequently used. These grooves are primarily used to install sealing rings and provide a seal. However, the deep end faces of these grooves are difficult to machine with standard cutting tools. During machining, the tool and the part are prone to interference, resulting in poor groove roughness and deformation of the part, leading to product failure.

[0003] Therefore, there is an urgent need for cutting tools for semiconductor components to solve the above problems. Utility Model Content

[0004] The purpose of the present utility model is to provide a cutting tool for semiconductor components to solve the problem in the related art that when processing the side wall of the workpiece, the existing cutting tool and the side wall of the workpiece are prone to interference, which not only easily causes the roughness of the side wall of the workpiece to be poor, but also easily causes the part to deform, resulting in product scrapping.

[0005] On the one hand, the utility model provides a cutting tool for semiconductor components, which includes a tool handle, a connecting section and a tool head. Along the preset axial direction, the tool handle, the connecting section and the tool head are arranged in sequence; the connecting section includes a connecting portion and a reinforcing portion, one end of the connecting portion is fixedly connected to the tool handle, and the other end of the connecting portion is connected to the tool head. Along the preset axial direction, one projection of the connecting portion covers the corresponding part of the end face where the tool head is connected to the connecting portion, and the other projection covers the corresponding part of the end face where the tool handle is connected to the connecting portion. The reinforcing portion is fixedly connected to the connecting portion and the tool handle at the same time, and the reinforcing portion is spaced apart from the tool head along the preset axial direction.

[0006] As a preferred technical solution for the cutting tool for semiconductor components, the projection of the reinforcing portion along the preset axial direction covers a portion of the end surface where the tool handle is connected to the connecting portion.

[0007] As a preferred technical solution for the cutting tool for semiconductor components, the end of the reinforcement portion away from the tool handle is configured as a stepped structure.

[0008] As a preferred technical solution for the cutting tool for semiconductor components, the distance between the end of the reinforcing portion away from the tool handle and the tool head is a, 5mm≤a≤20mm.

[0009] As an optimal technical solution for cutting tools for semiconductor components, the tool head includes a fixing part and a cutting part fixedly connected to the fixing part, the fixing part is fixedly connected to the other end of the connecting part, and the cutting part and the reinforcing part are respectively located on both sides of the connecting part.

[0010] As a preferred technical solution for the cutting tool for semiconductor components, a micro texture is provided on the cutting edge of the cutting portion.

[0011] As a preferred technical solution for the tool for semiconductor components, a chamfer is provided at the connection between the connecting portion and the tool handle, and a chamfer is provided at the connection between the reinforcing portion and the tool handle.

[0012] As an optimal technical solution for the cutting tool for semiconductor components, the cutting head is detachably connected to the other end of the connecting portion.

[0013] As a preferred technical solution for the cutting tool for semiconductor components, the other end of the connecting portion is provided with a slot, and the cutting head is provided with an inserting portion, and the inserting portion is inserted into the slot;

[0014] It also includes a bolt and a nut, wherein the bolt passes through the connecting portion and the plug-in portion and is threadedly connected with the nut.

[0015] As a preferred technical solution for semiconductor component cutting tools, the semiconductor component cutting tools are integrally formed parts.

[0016] The beneficial effects of the utility model are:

[0017] The utility model provides a tool for semiconductor components, which includes a tool handle, a connecting section, and a tool head. The tool handle, the connecting section, and the tool head are arranged in sequence along a preset axial direction. The connecting section includes a connecting portion and a reinforcing portion. One end of the connecting portion is fixedly connected to the tool handle, and the other end of the connecting portion is connected to the tool head. Along the preset axial direction, one projection of the connecting portion covers the corresponding portion of the end face where the tool head and the connecting portion are connected, and the other projection covers the corresponding portion of the end face where the tool handle and the connecting portion are connected. The reinforcing portion is fixedly connected to both the connecting portion and the tool handle, and the reinforcing portion is spaced apart from the tool head along the preset axial direction. The above arrangement makes the maximum diameter formed by the rotation of the tool head larger than the maximum diameter formed by the rotation of the connecting section, thereby forming an avoidance surface on the peripheral wall of the connecting section to avoid the side wall of the workpiece processed by the tool head, thereby avoiding affecting the roughness of the side wall of the workpiece, and avoiding deformation of the parts, which leads to product scrapping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the tool for semiconductor components in the first embodiment of the present invention. Figure 1 ;

[0019] Figure 2This is a schematic diagram of the structure of the tool for semiconductor components in the first embodiment of the present invention. Figure 2 ;

[0020] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0021] Figure 4 This is a schematic structural diagram of a cutting tool for semiconductor components in the second embodiment of the present utility model.

[0022] In the picture:

[0023] X, preset axis;

[0024] 1. Handle;

[0025] 2. Connecting section; 21. Connecting portion; 22. Reinforcement portion; 221. Step structure;

[0026] 3. Cutting head; 31. Fixing part; 32. Cutting part; 321. Micro texture;

[0027] 4. Bolts. DETAILED DESCRIPTION

[0028] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a specific position, be constructed and operated in a specific position, and therefore should not be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0030] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0032] Example 1

[0033] like Figures 1 to 3 As shown, this embodiment provides a tool for semiconductor components, comprising a tool holder 1, a connecting section 2, and a cutting head 3. The tool holder 1, the connecting section 2, and the cutting head 3 are sequentially arranged along a predetermined axial direction X. The connecting section 2 includes a connecting portion 21 and a reinforcing portion 22. One end of the connecting portion 21 is fixedly connected to the tool holder 1, and the other end of the connecting portion 21 is connected to the cutting head 3. Along the predetermined axial direction X, one projection of the connecting portion 21 covers the corresponding portion of the end face where the cutting head 3 and the connecting portion 21 are connected, while the other projection covers the corresponding portion of the end face where the tool holder 1 and the connecting portion 21 are connected. The reinforcing portion 22 is fixedly connected to both the connecting portion 21 and the tool holder 1, and is spaced apart from the cutting head 3 along the predetermined axial direction X. This arrangement ensures that the maximum diameter formed by the rotating cutting head 3 is greater than the maximum diameter formed by the rotating connecting section 2. This, in turn, creates a clearance surface on the peripheral wall of the connecting section 2 to avoid the side wall of the workpiece being machined by the tool holder 3, thereby avoiding affecting the roughness of the workpiece side wall, preventing deformation of the part, and thus preventing product scrapping.

[0034] Specifically, since the connecting section 2 is subjected to a large torque when the semiconductor component is working with a tool, if only the connecting portion 21 is provided, the connecting portion 21 is thinner than the tool head 3 or the tool handle 1 and can withstand a smaller torque. In order to increase the maximum torque that the connecting section 2 can withstand, a reinforcement portion 22 is provided on the connecting portion 21 to increase the maximum torque that the connecting section 2 can withstand.

[0035] In order to avoid the avoidance effect of the reinforcing portion 22 on the lead connecting portion 21 , the reinforcing portion 22 is spaced apart from the cutter head 3 along the preset axial direction X.

[0036] Optionally, the projection of the reinforcement portion 22 along the predetermined axial direction X covers a portion of the end surface where the tool handle 1 is connected to the connecting portion 21. In this embodiment, this arrangement further limits the maximum diameter of the reinforcement portion 22 during rotation to be smaller than the diameter of the tool handle 1. This arrangement can prevent the reinforcement portion 22 from interfering with other components when the tool is used to cut semiconductor components.

[0037] Optionally, the outer peripheral wall of the reinforcement portion 22 is coplanar with the outer peripheral wall of the tool handle 1. This arrangement facilitates the workers to manufacture semiconductor components and can also increase the rotational torque that the connecting section 2 can withstand.

[0038] Optionally, the end of the reinforcement portion 22 away from the handle 1 is configured as a stepped structure 221. In this embodiment, this configuration prevents the torsional strength of the connecting portion 21 from being significantly reduced at the junction of the connecting portion 21 and the reinforcement portion 22, thereby preventing the connecting portion 21 from twisting or breaking at this location. In other embodiments, the end of the reinforcement portion 22 away from the handle 1 is configured as an inclined surface.

[0039] Optionally, the distance a between the end of the reinforcing portion 22 away from the tool handle 1 and the cutter head 3 is 5 mm ≤ a ≤ 20 mm. In this embodiment, the side wall thickness of the workpiece is generally 5 mm to 20 mm. Therefore, the distance a between the end of the reinforcing portion 22 away from the tool handle 1 and the cutter head 3 is 5 mm to 20 mm.

[0040] Optionally, the cutter head 3 includes a fixing portion 31 and a cutting portion 32 fixedly connected to the fixing portion 31, the fixing portion 31 is fixedly connected to the other end of the connecting portion 21, and the cutting portion 32 and the reinforcing portion 22 are respectively located on both sides of the connecting portion 21. In this embodiment, when the cutter head 3 is working, the force acts on the connecting portion 21, and the fixing portion 31 is arranged on the side of the connecting portion 21 away from the cutting portion 32, so that the fixing portion 31 can play a supporting role for the connecting portion 21. This arrangement can improve the overall strength of the cutter head for semiconductor components. In addition, compared with arranging the cutting portion 32 and the reinforcing portion 22 on one side of the connecting portion 21, the cutting portion 32 and the reinforcing portion 22 are respectively located on both sides of the connecting portion 21. This arrangement is more evenly distributed and can alleviate the vibration of the cutter head for semiconductor components during rotation.

[0041] Optionally, a micro texture 321 is provided on the cutting edge of the cutting portion 32. In this embodiment, the micro texture 321 is formed on the surface of the tool to improve the lubrication performance and wear resistance of the tool and increase the service life of the tool. Specifically, the micro texture 321 on the cutting edge is formed by a laser cutting process.

[0042] Optionally, a chamfer is provided at the connection between the connecting portion 21 and the handle 1, and a chamfer is provided at the connection between the reinforcing portion 22 and the handle 1. In this embodiment, the above arrangement can further enhance the connection strength between the connecting portion 2 and the handle 1, thereby preventing breakage between the connecting portion 2 and the handle 1.

[0043] Optionally, the semiconductor component cutting tool is a one-piece molded part. In this embodiment, this configuration can improve the manufacturing efficiency of the semiconductor component cutting tool and improve the precision and strength of the semiconductor component cutting tool. Specifically, the semiconductor component cutting tool is machined.

[0044] Example 2

[0045] like Figure 4 As shown, this embodiment is essentially the same as the first embodiment, the only difference being that the cutter head 3 is detachably connected to the other end of the connecting portion 21. In this embodiment, the cutter head 3 is a consumable component and will wear out over time. To improve the cost of using cutting tools for semiconductor components, the cutter head 3 is detachably connected to the other end of the connecting portion 21. Specifically, the cutter head 3 is connected to the other end of the connecting portion 21 by a clamping connection or bolt 4.

[0046] Optionally, the other end of the connecting portion 21 is provided with a slot, and the blade head 3 is provided with a plug-in portion that is inserted into the slot. A bolt 4 and a nut are also included, and the bolt 4 passes through the connecting portion 21 and the plug-in portion and is threadedly engaged with the nut. In this embodiment, the slot has a rectangular cross-section, and the plug-in portion is rectangular. After the plug-in portion is inserted into the slot, the blade head 3 and the connecting portion 21 are relatively fixed about the axial direction of the shank 1. Passing the bolt 4 through the connecting portion 21 and the plug-in portion and threading it into the nut prevents the plug-in portion from being dislodged from the slot.

[0047] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A cutting tool for semiconductor components, comprising a tool handle (1), a connecting section (2) and a tool head (3), wherein the tool handle (1), the connecting section (2) and the tool head (3) are arranged in sequence along a preset axial direction (X); It is characterized in that The connecting section (2) comprises a connecting portion (21) and a reinforcing portion (22), one end of the connecting portion (21) is fixedly connected to the tool handle (1), and the other end of the connecting portion (21) is connected to the cutter head (3). Along the preset axial direction (X), one projection of the connecting portion (21) covers a portion of the end face where the corresponding cutter head (3) is connected to the connecting portion (21), and the other projection covers a portion of the end face where the corresponding tool handle (1) is connected to the connecting portion (21). The reinforcing portion (22) is fixedly connected to both the connecting portion (21) and the tool handle (1), and the reinforcing portion (22) is spaced apart from the cutter head (3) along the preset axial direction (X).

2. The semiconductor component cutting tool according to claim 1, wherein: The projection of the reinforcement portion (22) along the preset axial direction (X) covers a portion of the end surface where the shank (1) is connected to the connecting portion (21).

3. The semiconductor component cutting tool according to claim 1, wherein: An end of the reinforcement portion (22) away from the knife handle (1) is configured as a stepped structure (221).

4. The semiconductor component cutting tool according to claim 1, wherein: The distance between the end of the reinforcement portion (22) away from the knife handle (1) and the knife head (3) is a, 5mm≤a≤20mm.

5. The semiconductor component cutting tool according to claim 1, wherein: The cutter head (3) comprises a fixing portion (31) and a cutting portion (32) fixedly connected to the fixing portion (31); the fixing portion (31) is fixedly connected to the other end of the connecting portion (21); and the cutting portion (32) and the reinforcing portion (22) are respectively located on both sides of the connecting portion (21).

6. The semiconductor component cutting tool according to claim 5, wherein: A micro texture (321) is provided on the cutting edge of the cutting portion (32).

7. The semiconductor component cutting tool according to claim 1, wherein: A chamfer is provided at the connection between the connecting portion (21) and the knife handle (1), and a chamfer is provided at the connection between the reinforcing portion (22) and the knife handle (1).

8. The semiconductor component cutting tool according to any one of claims 1 to 7, wherein: The cutter head (3) is detachably connected to the other end of the connecting portion (21).

9. The semiconductor component cutting tool according to claim 8, wherein: The other end of the connecting portion (21) is provided with a slot, and the cutter head (3) is provided with an inserting portion, and the inserting portion is inserted into the slot; It also includes a bolt (4) and a nut, wherein the bolt (4) passes through the connecting portion (21) and the plug-in portion and is threadedly connected to the nut.

10. The semiconductor component cutting tool according to any one of claims 1 to 7, characterized in that: The semiconductor component cutter is an integrally formed part.