Wafer grinding device

Abstract

The utility model relates to the technical field of electronic chip processing, in particular to a wafer grinding device which comprises a base, a grinding mechanism, a lifting mechanism, a collecting mechanism and a circulating mechanism, the circulating mechanism is fixedly connected with the base, the lifting mechanism is fixedly connected with the base, and the grinding mechanism is fixedly connected with the base. The collecting mechanism comprises a limiting rail, a sliding seat, a motor, a pulley and a collecting barrel, the collecting barrel arranged at present realizes collection treatment of fine particles in grinding fluid under sliding of the sliding seat and the pulley, the design is simple to operate, and the problems that after a filter plate is used for a long time, the accumulated fine particles are inconvenient to clean and need to be manually cleaned by workers, and the working efficiency is high are solved. And more time is consumed.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic chip processing, in particular to a wafer grinding device. Background Art

[0002] IC chips include wafer chips and packaged chips. The corresponding IC chip production line consists of two parts: a wafer production line and a package production line. During wafer processing, after the crystal rod is cut, the cut wafers need to be ground. The existing wafer grinding device for electronic chip processing is prone to waste of grinding fluid when grinding the wafer. The used grinding fluid contains fine particles, which is not easy to recycle and easily leads to waste of resources.

[0003] In the prior art, the patent (CN217914726U) proposes a wafer grinding device for electronic chip processing, including a main body, a recovery chamber is provided on the top surface of the main body, a through hole is provided on the side of the recovery chamber, the through hole passes through the side of the recovery chamber, a filter plate is provided in the recovery chamber, the filter plate is movably connected to the recovery chamber, a support frame is provided on the top surface of the main body, a liquid storage tank is provided on the top surface of the support frame, a circulating pump is provided inside the main body, an infusion tube is provided at the output end of the circulating pump, the infusion tube passes through the main body and the liquid storage tank respectively, the filter plate can filter out fine particles in the grinding liquid, a circulating pump is provided in the main body, and the filtered grinding liquid can be transported to the liquid storage tank for recycling and reuse through the circulating pump, thereby saving resources.

[0004] However, in the above-mentioned prior art, fine particles accumulated on the filter plate after long-term use are difficult to clean and need to be manually cleaned by staff, which consumes a lot of time. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer grinding device, which solves the problem in the prior art that fine particles accumulated on the filter plate after long-term use are difficult to clean and require manual cleaning by staff, which consumes a lot of time.

[0006] To achieve the above-mentioned objectives, the utility model provides a wafer grinding device, including a base, a grinding mechanism, a lifting mechanism, a collecting mechanism and a circulation mechanism, wherein the circulation mechanism is fixedly connected to the base and is located on the inner wall of the base, the lifting mechanism is fixedly connected to the base and is located on the inner bottom of the base, the grinding mechanism is fixedly connected to the base and is located above the base, the collecting mechanism includes a limiting rail, a slide, a motor, a pulley and a collecting barrel, the collecting barrel is detachably connected to the slide and is located on one side of the slide, the pulley is fixedly connected to the output end of the motor, the motor is fixedly connected to the slide and is located below the slide, the slide is movably connected to the limiting rail and is located above the limiting rail, and the limiting rail is fixedly connected to the base and is located above the base.

[0007] Wherein, the base includes a bottom box and a filter cartridge, the filter cartridge is fixedly connected to the bottom box and is located above the bottom box, and the bottom box is fixedly connected to the grinding mechanism and is located below the grinding mechanism.

[0008] Among them, the grinding mechanism includes a gantry, a grinding motor and a grinding disc, the grinding disc is fixedly connected to the output end of the grinding motor, the grinding motor is fixedly connected to the gantry and is located above the gantry, and the gantry is fixedly connected to the bottom box and is located above the bottom box.

[0009] Among them, the lifting mechanism includes a surrounding cylinder, an electric telescopic rod and a supporting plate. The supporting plate is fixedly connected to the electric telescopic rod and is located at the upper end of the electric telescopic rod. The lower end of the electric telescopic rod is fixedly connected to the bottom box and is located at the inner bottom of the bottom box. The surrounding cylinder is fixedly connected to the filter cylinder and is located below the filter cylinder.

[0010] In which, the circulation mechanism includes a circulation pump, a circulation pipe, a liquid storage tank and a liquid spray pipe. The liquid spray pipe is fixedly connected to the liquid storage tank and is located below the liquid storage tank. The liquid storage tank is fixedly connected to the gantry and is located above the gantry. One end of the circulation pipe is fixedly connected to the liquid storage tank and is located on one side of the liquid storage tank. The other end of the circulation pipe is fixedly connected to the circulation pump and is located on one side of the circulation pump. The circulation pump is fixedly connected to the bottom box and is located on the inner wall of the bottom box.

[0011] The utility model provides a wafer grinding device, in which the collecting cylinder is arranged to collect and process the fine particles in the grinding liquid under the sliding of the slide seat and the pulley. The design is simple to operate and solves the problem that the fine particles accumulated on the filter plate after long-term use are difficult to clean and require manual cleaning by the staff, which consumes a lot of time. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0013] Figure 1 It is a schematic diagram of the overall structure of a wafer grinding device of the present invention.

[0014] Figure 2 This is a front view of a wafer grinding device of the present invention.

[0015] Figure 3 This is a left view of a wafer grinding device of the present invention.

[0016] Figure 4 This utility model Figure 3 AA line section view.

[0017] Figure 5 This utility model Figure 4 A magnified view of the local structure at point B.

[0018] 101-base, 102-grinding mechanism, 103-lifting mechanism, 104-collecting mechanism, 105-circulation mechanism, 106-limiting track, 107-slide, 108-motor, 109-pulley, 110-collecting cylinder, 111-bottom box, 112-filter cylinder, 113-gantry, 114-grinding motor, 115-grinding disc, 116-surrounding cylinder, 117-electric telescopic rod, 118-carrying plate, 119-circulating pump, 120-circulating pipe, 121-liquid storage tank, 122-spray pipe. DETAILED DESCRIPTION

[0019] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0020] See also Figure 1-Figure 5 ,in Figure 1 This is a schematic diagram of the overall structure of a wafer grinding device of the present invention. Figure 2 This is a front view of a wafer grinding device of the present invention. Figure 3 This is a left view of a wafer grinding device of the present invention. Figure 4 This utility model Figure 3 AA line section view, Figure 5 This utility model Figure 4 A magnified view of the local structure at point B.

[0021] The utility model provides a wafer grinding device, including a base 101, a grinding mechanism 102, a lifting mechanism 103, a collecting mechanism 104 and a circulation mechanism 105, wherein the collecting mechanism 104 includes a limiting rail 106, a slide 107, a motor 108, a pulley 109 and a collecting cylinder 110, the base 101 includes a bottom box 111 and a filter cylinder 112, the grinding mechanism 102 includes a gantry 113, a grinding motor 114 and a grinding disc 115, the lifting mechanism 103 includes a surrounding cylinder 116, an electric telescopic rod 117 and a carrying plate 118, and the circulation mechanism 105 includes a circulation pump 119, a circulation pipe 120, a liquid storage tank 121 and a liquid spray pipe 122.

[0022] According to this specific embodiment, the circulation mechanism 105 is fixedly connected to the base 101, the lifting mechanism 103 is fixedly connected to the base 101, the grinding mechanism 102 is fixedly connected to the base 101, the collecting cylinder 110 is detachably connected to the slide 107, the pulley 109 is fixedly connected to the output end of the motor 108, the motor 108 is fixedly connected to the slide 107, the slide 107 is movably connected to the limiting rail 106, the limiting rail 106 is fixedly connected to the base 101, the filter cartridge 112 is fixedly connected to the bottom box 111, the bottom box 111 is fixedly connected to the grinding mechanism 102, the grinding disc 115 is fixedly connected to the output end of the grinding motor 114, the grinding motor 114 is fixedly connected to the gantry 113, and the gantry 113 is movably connected to the bottom box 11 1 is fixedly connected, the carrying plate 118 is fixedly connected to the electric telescopic rod 117, the lower end of the electric telescopic rod 117 is fixedly connected to the bottom box 111, the surrounding cylinder 116 is fixedly connected to the filter cylinder 112, the spray pipe 122 is fixedly connected to the liquid storage tank 121, the liquid storage tank 121 is fixedly connected to the gantry 113, one end of the circulation pipe 120 is fixedly connected to the liquid storage tank 121, the other end of the circulation pipe 120 is fixedly connected to the circulation pump 119, and the circulation pump 119 is fixedly connected to the bottom box 111. The collecting cylinder 110 currently provided is used to collect and process fine particles in the grinding liquid under the sliding of the slide 107 and the pulley 109. This design is simple to operate and solves the problem that fine particles accumulated on the filter plate after long-term use are inconvenient to clean, and manual cleaning by staff is required, which takes a lot of time.

[0023] Among them, the circulation mechanism 105 is located on the inner wall of the base 101, the lifting mechanism 103 is located at the inner bottom of the base 101, the grinding mechanism 102 is located above the base 101, the collecting cylinder 110 is located on one side of the slide 107, the motor 108 is located below the slide 107, the slide 107 is located above the limiting track 106, and the limiting track 106 is located above the base 101. After the motor 108 is started, the pulley 109 and the slide 107 slide around the limiting track 106, thereby driving the collecting cylinder 110 to fit the inner wall of the filter cylinder 112. Activated carbon is provided in the collecting cylinder 110, which can adsorb fine particles to ensure that the grinding liquid filtered by the filter cylinder 112 can be used again.

[0024] Secondly, the filter cartridge 112 is located above the bottom box 111, and the bottom box 111 is located below the grinding mechanism 102. The grinding motor 114 is located above the gantry 113, and the gantry 113 is located above the bottom box 111. A control panel is installed on one side of the gantry 113 to control the start of the grinding motor 114 and the electric telescopic rod 117. After the material is placed on the carrying plate 118, the electric telescopic rod 117 raises the height of the carrying plate 118, and the grinding motor 114 drives the grinding disc 115 to rotate. At the same time, the spray pipe 122 sprays grinding fluid for lubrication. At this time, the staff starts Start the motor 108, place the slide 107 above the limit track 106, and fit the pulley 109 with the limit track 106. Since the pulley 109 fits the limit track 106 perfectly, the pulley 109 and the slide 107 will not separate from the limit track 106 when moving, ensuring that the slide 107 makes a circular motion above the bottom box 111. The collecting cylinder 110 can also fit the inner wall of the filter cylinder 112 to adsorb and collect fine particles in the grinding liquid. The setting of the surrounding cylinder 116 can isolate the grinding liquid from contact with the electric telescopic rod 117, and also support the filter cylinder 112.

[0025] At the same time, the carrying plate 118 is located at the upper end of the electric telescopic rod 117, the lower end of the electric telescopic rod 117 is located at the inner bottom of the bottom box 111, the surrounding cylinder 116 is located below the filter cylinder 112, the spray pipe 122 is located below the liquid storage tank 121, the liquid storage tank 121 is located above the gantry 113, one end of the circulation pipe 120 is located on one side of the liquid storage tank 121, the other end of the circulation pipe 120 is located on one side of the circulation pump 119, the circulation pump 119 is located on the inner side wall of the bottom box 111, and the peripheral side of the carrying plate 118 has a plurality of through holes for discharging The grinding liquid sprayed from the spray pipe 122 flows from the supporting plate 118 into the filter cylinder 112, and the filter cylinder 112 filters the fine particles. The grinding liquid returns to the inside of the bottom box 111, and is then circulated to the liquid storage tank 121 by the circulation pump 119 to realize the recycling of the grinding liquid. The fine particles filtered out by the filter cylinder 112 are collected by the collecting cylinder 110. After the staff completes the collection of fine particles by the collecting cylinder 110, they can directly remove the collecting cylinder 110 from the slide 107 and quickly clean the fine particles in the collecting cylinder 110.

[0026] In this embodiment, after the motor 108 is started, the pulley 109 and the slide 107 slide around the limit track 106, thereby driving the collecting cylinder 110 to fit the inner wall of the filter cylinder 112. The collecting cylinder 110 is provided with activated carbon, which can adsorb fine particles and ensure that the grinding liquid filtered by the filter cylinder 112 can be used again. A control panel is installed on one side of the gantry 113 to control the start of the grinding motor 114 and the electric telescopic rod 117. The material is placed in the After the carrier plate 118 is placed on the carrier plate 118, the electric telescopic rod 117 raises the height of the carrier plate 118, the grinding motor 114 drives the grinding disc 115 to rotate, and the spray pipe 122 sprays the grinding liquid for lubrication. At this time, the staff starts the motor 108 and places the slide 107 above the limit track 106, and fits the pulley 109 with the limit track 106. Since the pulley 109 fits the limit track 106 perfectly, there is no Disengage from the limiting track 106 to ensure that the slide 107 moves in a circular motion above the bottom box 111. The collecting cylinder 110 can also fit the inner wall of the filter cylinder 112 to absorb and collect fine particles in the grinding liquid. The setting of the surrounding cylinder 116 can isolate the grinding liquid from contact with the electric telescopic rod 117, and also support the filter cylinder 112. The peripheral side of the supporting plate 118 has a plurality of through holes for discharging the grinding liquid sprayed by the spray pipe 122. The grinding liquid flows from the supporting plate 118 to the inner wall of the filter cylinder 112. The grinding liquid is returned to the bottom box 111 and then circulated to the liquid storage tank 121 by the circulation pump 119 to realize the recycling of the grinding liquid. The fine particles filtered out by the filter cylinder 112 are collected by the collection cylinder 110. After the collection cylinder 110 has collected the fine particles, the staff can directly remove the collection cylinder 110 from the slide 107 and quickly clean the fine particles in the collection cylinder 110.

[0027] The above disclosure is merely one or more preferred embodiments of the present application and is not intended to limit the scope of the present application. A person skilled in the art will understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present application are still within the scope of the present application.

Claims

1. A wafer grinding device, comprising a base, a grinding mechanism, a lifting mechanism, and a circulation mechanism, wherein the circulation mechanism is fixedly connected to the base and located on the inner wall of the base, the lifting mechanism is fixedly connected to the base and located on the inner bottom of the base, and the grinding mechanism is fixedly connected to the base and located above the base, characterized in that: It also includes a collecting mechanism, which includes a limiting rail, a slide, a motor, a pulley and a collecting cylinder. The collecting cylinder is detachably connected to the slide and is located on one side of the slide. The pulley is fixedly connected to the output end of the motor. The motor is fixedly connected to the slide and is located below the slide. The slide is movably connected to the limiting rail and is located above the limiting rail. The limiting rail is fixedly connected to the base and is located above the base.

2. The wafer grinding apparatus according to claim 1, wherein: The base includes a bottom box and a filter cartridge. The filter cartridge is fixedly connected to the bottom box and is located above the bottom box. The bottom box is fixedly connected to the grinding mechanism and is located below the grinding mechanism.

3. The wafer grinding apparatus according to claim 2, wherein: The grinding mechanism includes a gantry, a grinding motor and a grinding disc, the grinding disc is fixedly connected to the output end of the grinding motor, the grinding motor is fixedly connected to the gantry and is located above the gantry, and the gantry is fixedly connected to the bottom box and is located above the bottom box.

4. The wafer grinding apparatus according to claim 3, wherein: The lifting mechanism includes a surrounding cylinder, an electric telescopic rod and a supporting plate. The supporting plate is fixedly connected to the electric telescopic rod and is located at the upper end of the electric telescopic rod. The lower end of the electric telescopic rod is fixedly connected to the bottom box and is located at the inner bottom of the bottom box. The surrounding cylinder is fixedly connected to the filter cylinder and is located below the filter cylinder.

5. The wafer grinding apparatus according to claim 4, wherein: The circulation mechanism includes a circulation pump, a circulation pipe, a liquid storage tank and a liquid spray pipe. The liquid spray pipe is fixedly connected to the liquid storage tank and is located below the liquid storage tank. The liquid storage tank is fixedly connected to the gantry and is located above the gantry. One end of the circulation pipe is fixedly connected to the liquid storage tank and is located on one side of the liquid storage tank. The other end of the circulation pipe is fixedly connected to the circulation pump and is located on one side of the circulation pump. The circulation pump is fixedly connected to the bottom box and is located on the inner wall of the bottom box.

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