Carrier plate circulating conveying equipment

Abstract

The utility model belongs to the field of silicon wafer conveying, and particularly relates to a carrier plate circulating conveying device which comprises a carrier plate conveying mechanism, a silicon wafer conveying mechanism, a feeding mechanism and a machining mechanism. By arranging the carrier plate conveying mechanism, the silicon wafers are conveyed in batches, during machining, the carrier plates are conveyed into the machining mechanism, the silicon wafers on the carrier plates are machined in batches, after machining is completed, the carrier plates are taken out of the machining mechanism, and the next carrier plate is conveyed into the machining mechanism, so that the silicon wafer feeding time is shortened, and the machining efficiency is improved. The processing efficiency of the processing mechanism is improved, meanwhile, empty carrier plates are placed in the carrier plate conveying mechanism to complete circulation of the carrier plates, the use number of the carrier plates is reduced, and then the cost of the whole production line is reduced.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer transportation, in particular to a carrier plate circulation transportation device. Background Art

[0002] Silicon wafers are the basic materials for the semiconductor and solar photovoltaic industries, and are mainly used to manufacture electronic devices and solar cells.

[0003] In the related art, when silicon wafers are processed in batches, they are transported to the processing mechanism for processing in a single-wafer conveying manner. After the silicon wafers in the processing mechanism reach a preset number, the conveying is stopped and the next conveying is carried out after the processing mechanism completes the processing. This results in a long loading time and reduces the working efficiency of the processing mechanism.

[0004] How to realize batch transportation of silicon wafers is an urgent problem to be solved. Utility Model Content

[0005] The purpose of the utility model is to provide a plate carrier circulation conveying device.

[0006] In order to solve the above technical problems, the present invention provides a carrier plate circulating conveying device, comprising:

[0007] Carrier conveying mechanism, silicon wafer conveying mechanism, loading mechanism and processing mechanism;

[0008] The carrier plate conveying mechanism is suitable for cyclically conveying the carrier plates;

[0009] The silicon wafer conveying mechanism is arranged at the feed port of the carrier conveying mechanism and is suitable for conveying silicon wafers;

[0010] The loading mechanism is arranged above the carrier conveying mechanism and the silicon wafer conveying mechanism, and is suitable for grabbing the silicon wafer conveyed by the silicon wafer conveying mechanism onto the carrier conveyed by the carrier conveying mechanism;

[0011] The processing mechanism is arranged at the discharge port of the carrier conveying mechanism and is suitable for processing the silicon wafers on the carrier.

[0012] Furthermore, the carrier conveying mechanism includes: a first conveying line, a second conveying line and a lifting assembly;

[0013] The first conveying line and the second conveying line are arranged in a stacked manner;

[0014] The first conveying line is arranged above the second conveying line;

[0015] The first conveying line is configured to convey the silicon wafer from the silicon wafer conveying mechanism to the processing mechanism and is suitable for conveying a carrier plate loaded with silicon wafers;

[0016] The second conveying line is configured to convey the wafers from the processing mechanism to the wafer conveying mechanism and is suitable for conveying empty carriers.

[0017] The lifting assembly is adapted to transport the empty carrier plates transported in the second conveying line to the first conveying line.

[0018] Furthermore, the lifting assembly includes: a lifting frame and a transfer conveyor belt;

[0019] The transfer conveyor belt is arranged on the lifting frame;

[0020] The lifting frame is suitable for driving the transfer conveyor belt to move up and down, thereby transporting the empty carrier plates transported by the second conveyor line to the first conveyor line.

[0021] Furthermore, the lifting frame is arranged below the silicon wafer conveying mechanism.

[0022] Furthermore, the first conveying line includes a first conveying portion and a second conveying portion;

[0023] The first conveying portion and the second conveying portion are spaced apart from each other.

[0024] Furthermore, the second conveying line includes a third conveying portion and a fourth conveying portion;

[0025] The third conveying unit and the fourth conveying unit are spaced apart from each other.

[0026] Furthermore, the carrier plate is provided with a plurality of supporting stations;

[0027] The plurality of supporting stations are distributed at intervals along the length and width directions of the carrier plate.

[0028] Furthermore, the side wall of the supporting station is provided with a limited prism;

[0029] At least one supporting ramp is provided on the top surface of the limiting prism.

[0030] Furthermore, the feeding mechanism includes: a driving component and a grabbing component;

[0031] The driving component is suitable for driving the grabbing component to grab the silicon wafers of the silicon wafer conveying mechanism and place them on the carrier of the carrier conveying mechanism.

[0032] Furthermore, the grabbing assembly includes a connecting frame and a plurality of adsorption plates;

[0033] The plurality of adsorption plates are arranged at intervals on the bottom surface of the connecting frame, and the arrangement positions of the plurality of adsorption plates are adapted to the positions of the corresponding silicon wafers transported on the silicon wafer conveying mechanism.

[0034] The beneficial effect of the present invention is that the present invention provides a carrier circulating conveying device, including: a carrier conveying mechanism, a silicon wafer conveying mechanism, a loading mechanism and a processing mechanism; the carrier conveying mechanism is suitable for circulating the carrier; the silicon wafer conveying mechanism is arranged at the feed port of the carrier conveying mechanism, and is suitable for conveying silicon wafers; the loading mechanism is arranged above the carrier conveying mechanism and the silicon wafer conveying mechanism, and is suitable for grabbing the silicon wafers conveyed by the silicon wafer conveying mechanism to the carrier conveyed by the carrier conveying mechanism; the processing mechanism is arranged at the discharge port of the carrier conveying mechanism, and is suitable for processing the silicon wafers on the carrier. By setting up a carrier conveying mechanism, silicon wafers can be transported in batches. During processing, the carriers are transported to the processing mechanism, and the silicon wafers on the carriers are processed in batches. After the processing is completed, the carriers are taken out of the processing mechanism and the next carrier is transported to the processing mechanism, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism. At the same time, the empty carriers are placed in the carrier conveying mechanism to complete the carrier cycle, reducing the number of carriers used, and thereby reducing the cost of the overall production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] Figure 1 It is a structural diagram of the carrier plate circulating conveying equipment provided in this embodiment.

[0037] Figure 2 It is a side view of the carrier plate circulating conveying equipment provided in this embodiment.

[0038] Figure 3 Schematic diagram of the structure of the carrier board provided in this embodiment.

[0039] Figure 4 It is a structural schematic diagram of the carrier plate circulating conveying equipment provided by this embodiment from another perspective.

[0040] Figure 5 It is a structural diagram of the lifting assembly provided in this embodiment.

[0041] In the figure: 100, carrier conveying mechanism; 110, carrier; 111, supporting station; 112, limiting prism; 113, supporting ramp; 120, first conveyor line; 121, first conveyor section; 122, second conveyor section; 130, second conveyor line; 131, third conveyor section; 132, fourth conveyor section; 140, lifting assembly; 141, lifting frame; 142, transfer conveyor belt; 200, silicon wafer conveying mechanism; 300, loading mechanism; 310, driving assembly; 320, grabbing assembly; 321, connecting frame; 322, adsorption plate; 400, processing mechanism. DETAILED DESCRIPTION

[0042] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0043] For examples, see Figure 1 At least one embodiment provides a carrier circulating conveying device, including: a carrier conveying mechanism 100, a silicon wafer conveying mechanism 200, a loading mechanism 300 and a processing mechanism 400; the carrier conveying mechanism 100 is suitable for circulating the carrier 110; the silicon wafer conveying mechanism 200 is arranged at the feed port of the carrier conveying mechanism 100, and is suitable for conveying silicon wafers; the loading mechanism 300 is arranged above the carrier conveying mechanism 100 and the silicon wafer conveying mechanism 200, and is suitable for grabbing the silicon wafers conveyed by the silicon wafer conveying mechanism 200 and placing them on the carrier 110 conveyed by the carrier conveying mechanism 100; the processing mechanism 400 is arranged at the discharge port of the carrier conveying mechanism 100, and is suitable for processing the silicon wafers on the carrier 110. By setting up a carrier conveying mechanism 100, silicon wafers are conveyed in batches. During processing, the carrier 110 is conveyed to the processing mechanism 400, and the silicon wafers on the carrier 110 are processed in batches. After the processing is completed, the carrier 110 is taken out of the processing mechanism 400, and the next carrier 110 is conveyed to the processing mechanism 400, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism 400. At the same time, the empty carrier 110 is placed in the carrier conveying mechanism 100 to complete the circulation of the carrier 110, reducing the number of carriers 110 used, and thereby reducing the cost of the overall production line.

[0044] See also Figure 2In some embodiments, the carrier conveying mechanism 100 includes: a first conveyor line 120, a second conveyor line 130 and a lifting assembly 140; the first conveyor line 120 and the second conveyor line 130 are stacked; the first conveyor line 120 is arranged above the second conveyor line 130; the conveying direction of the first conveyor line 120 is from the silicon wafer conveying mechanism 200 to the processing mechanism 400, and is suitable for conveying carriers 110 loaded with silicon wafers; the conveying direction of the second conveyor line 130 is from the processing mechanism 400 to the silicon wafer conveying mechanism 200, and is suitable for conveying empty carriers 110; the lifting assembly 140 is suitable for conveying the empty carriers 110 conveyed in the second conveyor line 130 to the first conveyor line 120. By dividing the carrier conveyor mechanism 100 into a first conveyor line 120 and a second conveyor line 130, empty carriers 110 placed on the carrier conveyor mechanism 100 are prevented from interfering with carriers 110 currently being loaded with silicon wafers. Furthermore, stacking the first and second conveyor lines 120, 130 reduces the space occupied by the carrier conveyor mechanism 100, making the carrier conveyor mechanism 100 more compact. A lifting assembly 140 is provided to transport empty carriers 110 from the second conveyor line 130 to the first conveyor line 120, completing the loading of carriers 110 and facilitating subsequent loading of silicon wafers.

[0045] Please continue reading Figure 2 The specific structure of the lifting assembly 140 is described below. In a preferred embodiment, the lifting assembly 140 includes a lifting frame 141 and a transfer conveyor belt 142. The transfer conveyor belt 142 is mounted on the lifting frame 141. The lifting frame 141 is adapted to raise and lower the transfer conveyor belt 142, thereby transporting the empty carriers 110 from the second conveyor line 130 to the first conveyor line 120. Specifically, the lifting frame 141 is positioned below the wafer conveying mechanism 200. By raising and lowering the entire transfer conveyor belt 142 and controlling its conveying direction, the carriers 110 are circulated.

[0046] Please continue reading Figure 2The structures of the first conveyor line 120 and the second conveyor line 130 are described in detail below. In a preferred embodiment, the first conveyor line 120 includes a first conveyor section 121 and a second conveyor section 122; the first conveyor section 121 and the second conveyor section 122 are spaced apart. Empty carriers 110 are loaded with silicon wafers on the first conveyor section 121. After loading, the carriers 110 are transported to the second conveyor section 122 for placement, awaiting processing by the processing mechanism 400. This saves the processing mechanism 400 the time it spends waiting for the carriers 110 to be loaded, thereby improving the overall efficiency of the processing mechanism 400.

[0047] Correspondingly, the second conveyor line 130 includes a third conveyor section 131 and a fourth conveyor section 132; the third conveyor section 131 and the fourth conveyor section 132 are spaced apart. The positions of the third conveyor section 131 and the fourth conveyor section 132 correspond to the first conveyor section 121 and the second conveyor section 122. Empty carriers 110 are loaded on the fourth conveyor section 132 and transported to the third conveyor section 131 for placement, awaiting lifting and transfer by the lifting assembly 140.

[0048] See also Figure 3 In some embodiments, the carrier 110 is provided with a plurality of supporting stations 111 spaced apart along the length and width of the carrier 110. The supporting stations 111 are hollowed out, and the sidewalls of the supporting stations 111 are provided with limiting prisms 112. The top surface of each limiting prism 112 is provided with at least one supporting ramp 113. The supporting ramp 113 supports the sidewalls of the silicon wafer, thereby reducing contact between the bottom surface of the silicon wafer and the carrier 110 and preventing scratches on the wafer.

[0049] See also Figure 4 as well as Figure 5 In some embodiments, the loading mechanism 300 includes a drive assembly 310 and a gripping assembly 320. The drive assembly 310 is adapted to drive the gripping assembly 320 to grip the silicon wafers from the wafer conveying mechanism 200 onto the carrier 110 of the carrier conveying mechanism 100. The gripping assembly 320 includes a connecting frame 321 and a plurality of suction plates 322. The suction plates 322 are spaced apart on the bottom surface of the connecting frame 321, and the arrangement of the suction plates 322 matches the positions of the corresponding silicon wafers being conveyed by the wafer conveying mechanism 200.

[0050] The driving assembly 310 is hoisted on a top slide rail (not shown) for sliding.

[0051] In summary, the utility model provides a carrier circulating conveying equipment, including: a carrier conveying mechanism 100, a silicon wafer conveying mechanism 200, a loading mechanism 300 and a processing mechanism 400; the carrier conveying mechanism 100 is suitable for circulating the carrier 110; the silicon wafer conveying mechanism 200 is arranged at the feed port of the carrier conveying mechanism 100, and is suitable for conveying silicon wafers; the loading mechanism 300 is arranged above the carrier conveying mechanism 100 and the silicon wafer conveying mechanism 200, and is suitable for grabbing the silicon wafers conveyed by the silicon wafer conveying mechanism 200 to the carrier 110 conveyed by the carrier conveying mechanism 100; the processing mechanism 400 is arranged at the discharge port of the carrier conveying mechanism 100, and is suitable for processing the silicon wafers on the carrier 110. By setting up a carrier conveying mechanism 100, silicon wafers are conveyed in batches. During processing, the carrier 110 is conveyed to the processing mechanism 400, and the silicon wafers on the carrier 110 are processed in batches. After the processing is completed, the carrier 110 is taken out of the processing mechanism 400, and the next carrier 110 is conveyed to the processing mechanism 400, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism 400. At the same time, the empty carrier 110 is placed in the carrier conveying mechanism 100 to complete the circulation of the carrier 110, reducing the number of carriers 110 used, and thereby reducing the cost of the overall production line.

[0052] In the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0053] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A carrier plate circulation conveying device, characterized in that: include: Carrier conveying mechanism, silicon wafer conveying mechanism, loading mechanism and processing mechanism; The carrier plate conveying mechanism is suitable for cyclically conveying the carrier plates; The silicon wafer conveying mechanism is arranged at the feed port of the carrier conveying mechanism and is suitable for conveying silicon wafers; The loading mechanism is arranged above the carrier conveying mechanism and the silicon wafer conveying mechanism, and is suitable for grabbing the silicon wafer conveyed by the silicon wafer conveying mechanism onto the carrier conveyed by the carrier conveying mechanism; The processing mechanism is arranged at the discharge port of the carrier conveying mechanism and is suitable for processing the silicon wafers on the carrier.

2. The carrier plate circulating conveying device according to claim 1, characterized in that: The carrier conveying mechanism includes: a first conveying line, a second conveying line and a lifting assembly; The first conveying line and the second conveying line are arranged in a stacked manner; The first conveying line is arranged above the second conveying line; The first conveying line is configured to convey the silicon wafer from the silicon wafer conveying mechanism to the processing mechanism and is suitable for conveying a carrier plate loaded with silicon wafers; The second conveying line is configured to convey the wafers from the processing mechanism to the wafer conveying mechanism and is suitable for conveying empty carriers. The lifting assembly is adapted to transport the empty carrier plates transported in the second conveying line to the first conveying line.

3. The carrier plate circulating conveying device according to claim 2, characterized in that: The lifting assembly includes: a lifting frame and a transfer conveyor belt; The transfer conveyor belt is arranged on the lifting frame; The lifting frame is suitable for driving the transfer conveyor belt to move up and down, thereby transporting the empty carrier plates transported by the second conveyor line to the first conveyor line.

4. The carrier plate circulating conveying device according to claim 3, characterized in that: The lifting frame is arranged below the silicon wafer conveying mechanism.

5. The carrier plate circulating conveying equipment according to claim 2, characterized in that: The first conveying line includes a first conveying portion and a second conveying portion; The first conveying portion and the second conveying portion are spaced apart from each other.

6. The carrier plate circulating conveying device according to claim 2, characterized in that: The second conveying line includes a third conveying portion and a fourth conveying portion; The third conveying unit and the fourth conveying unit are spaced apart from each other.

7. The carrier plate circulating conveying device according to claim 1, characterized in that: The carrier plate is provided with a plurality of supporting stations; The plurality of supporting stations are distributed at intervals along the length and width directions of the carrier plate.

8. The carrier plate circulating conveying device according to claim 7, characterized in that: The side wall of the supporting station is provided with a limited prism; At least one supporting ramp is provided on the top surface of the limiting prism.

9. The carrier plate circulating conveying device according to claim 1, characterized in that: The feeding mechanism includes: a driving component and a grabbing component; The driving component is suitable for driving the grabbing component to grab the silicon wafers of the silicon wafer conveying mechanism and place them on the carrier of the carrier conveying mechanism.

10. The carrier plate circulating conveying device according to claim 9, characterized in that: The grabbing assembly includes a connecting frame and a plurality of adsorption plates; The plurality of adsorption plates are arranged at intervals on the bottom surface of the connecting frame, and the arrangement positions of the plurality of adsorption plates are adapted to the positions of the corresponding silicon wafers transported on the silicon wafer conveying mechanism.

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