Circuit board for MEMS chip

Abstract

The utility model provides a circuit board for an MEMS (Micro Electro Mechanical System) chip. The circuit board comprises a board body and a metal covered edge, the plurality of MEMS chips are arranged on the plate body; the edge of the plate body is coated with the metal covered edge, the plate body is electrically connected with the metal covered edge, the metal covered edge is provided with at least one first through hole, the at least one first through hole penetrates through the metal covered edge and the plate body, and grounding pins of a plurality of MEMS chips are electrically connected with the metal covered edge. Through the arrangement mode, resonance interference of the MEMS chip and other environmental noise can be effectively reduced, and the performance of the whole system is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of anti-interference and vibration isolation, in particular to a circuit board for a MEMS chip. Background Art

[0002] Microelectromechanical systems (MEMS) are high-tech electromechanical devices that integrate microelectronics and micromachining technologies. They incorporate fabrication techniques such as photolithography, etching, thin film, and silicon micromachining. Common MEMS products include MEMS accelerometers, MEMS gyroscopes, and MEMS inertial measurement units, which are widely used in aerospace, industrial automation, and automotive industries. MEMS products require excellent electromagnetic shielding and vibration resistance. Existing methods include placing a shield around the MEMS chip to reduce electromagnetic interference and wrapping the MEMS chip with vibration-damping materials to isolate it from external vibrations.

[0003] However, the shielding can generate electromagnetic reflections on the internal circuits, thus affecting the electromagnetic compatibility of the MEMS chip with surrounding circuits. The vibration damping material wrapped around the MEMS chip can hinder the chip's heat dissipation to a certain extent. Therefore, how to enhance the MEMS chip's anti-interference and vibration isolation capabilities has become an urgent problem to be solved. Utility Model Content

[0004] In light of this, the present invention aims to provide a circuit board for a MEMS chip that, through metal edging, enhances the strength of the circuit board's main body, reduces stress, and provides anti-oxidation and anti-static protection, thereby improving the circuit board's anti-interference performance. Furthermore, the metal edging effectively shields external electromagnetic interference and isolates mechanical vibration, ensuring stable operation of the MEMS chip in complex environments and enhancing signal integrity and measurement accuracy.

[0005] The utility model provides a circuit board for a MEMS chip, the circuit board comprising: a board body and a metal edging; a plurality of MEMS chips are arranged on the board body;

[0006] The edge of the plate body is covered with the metal edging, the plate body is electrically connected to the metal edging, the metal edging is provided with at least one first through hole, the at least one first through hole passes through the metal edging and the plate body, and the ground pins of multiple MEMS chips are electrically connected to the metal edging.

[0007] Furthermore, the edge of the plate body includes at least one of the following items: at least one side edge of the plate body, at least a portion of the upper surface of the plate body, and at least a portion of the lower surface of the plate body.

[0008] Furthermore, the at least one first through hole passes through the metal edging corresponding to at least a portion of the upper surface of the plate, the metal edging corresponding to at least a portion of the lower surface of the plate, and the plate.

[0009] Furthermore, the ground pins of the plurality of MEMS chips are electrically connected to the metal edging via metal wires;

[0010] The metal connection line is arranged on the upper surface of the plate.

[0011] Furthermore, the metal connection is provided with at least one second through hole.

[0012] Furthermore, the at least one second through hole passes through the metal connection and the board.

[0013] Furthermore, the plurality of MEMS chips are arranged on the upper surface of the board.

[0014] Furthermore, the plurality of MEMS chips are arranged in an area outside the diagonal line of the upper surface of the board.

[0015] Furthermore, the distance between each MEMS chip of the plurality of MEMS chips is within a preset range.

[0016] Furthermore, a micro control unit is provided on the upper surface of the plate;

[0017] The micro control unit is electrically connected to the MEMS chip.

[0018] The utility model provides a circuit board for a MEMS chip. The edge of the board body is coated with a metal edging, the board body is electrically connected to the metal edging, and the metal edging is provided with at least one first through-hole. The at least one first through-hole extends through the metal edging and the board body. The ground pins of multiple MEMS chips are electrically connected to the metal edging. The circuit board provided by the utility model strengthens the main body of the circuit board through the metal edging, reduces stress generation, and provides anti-oxidation and anti-static protection, thereby improving the anti-interference performance of the circuit board. In addition, the metal edging can effectively shield external electromagnetic interference and isolate mechanical vibration, ensuring the stable operation of the MEMS chip in complex environments and improving signal integrity and measurement accuracy.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is a structural schematic diagram of a circuit board for a MEMS chip provided by an embodiment of the present utility model;

[0022] Figure 2 This is a top view of a circuit board for a MEMS chip provided by an embodiment of the present utility model;

[0023] Figure 3 This is a bottom view of a circuit board for a MEMS chip provided by an embodiment of the utility model.

[0024] Icon: 1-board; 2-metal edging; 3-MEMS chip; 4-first through hole; 5-metal connection; 6-second through hole; 7-microcontroller unit; 11-upper surface; 12-lower surface; 21-first surface; 22-second surface. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following figures. Therefore, once an item is defined in one figure, it does not require further definition or explanation in subsequent figures. Terms such as "upper," "lower," "inner," "outer," "left," and "right" indicate positions or relationships based on the positions or relationships shown in the figures, or the positions or relationships in which the utility model is typically placed when in use, or the positions or relationships commonly understood by those skilled in the art. These terms are intended solely to facilitate the description of the utility model and to simplify the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the utility model. Terms such as "first," "second," and the like are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "comprise," "include," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Without further constraints, an element defined by the phrase "comprises a..." does not preclude the existence of additional identical elements in the process, method, article or apparatus that includes the element.

[0027] It should also be noted that, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] The specific implementation of the present invention is described in detail below with reference to the accompanying drawings.

[0029] See also Figure 1 , Figure 1 This is a structural schematic diagram of a circuit board for a MEMS chip provided by an embodiment of the utility model.

[0030] like Figure 1 As shown in the figure, the circuit board includes: a board body 1, a metal edging 2; a plurality of MEMS chips 3 are arranged on the board body 1; the edge of the board body 1 is covered with the metal edging 2, the board body 1 is electrically connected to the metal edging 2, the metal edging 2 is provided with at least one first through hole 4, the at least one first through hole 4 passes through the metal edging 2 and the board body 1, and the ground pins of the plurality of MEMS chips 3 are electrically connected to the metal edging 2.

[0031] Furthermore, the edge of the plate body 1 includes at least one of the following items: at least one side of the plate body 1 , at least a portion of the upper surface 11 of the plate body 1 , and at least a portion of the lower surface 12 of the plate body 1 .

[0032] Among them, the board body 1 can be a cube or a rectangular parallelepiped. The metal edging 2 is formed by gold plating or gold immersion on the edge of the board body 1. The electrical connection between the board body 1 and the metal edging 2 means that a grounding network is provided on the board body 1, and the grounding network is electrically connected to the metal edging 2. When external interference is transmitted to the circuit board, the interference is introduced into the earth through the large-scale grounding of the metal edging 2, thereby reducing the impact of the interference on the MEMS chip 3. When unexpected external vibration occurs, the vibration will first be transmitted to the metal edging 2, and then transmitted to the inside of the circuit board. When the vibration is transmitted to the metal edging 2, it will be guided to diffuse around, reducing the intensity transmitted to the inside of the circuit board, thereby achieving the effect of isolating unexpected vibrations.

[0033] In this embodiment, the number of the metal edging 2 is equal to the number of the side edges of the plate body 1, that is, four metal edgings 2. Each metal edging 2 covers one side edge of the plate body 1, at least a portion of the upper surface 11 of the plate body 1, and at least a portion of the lower surface 12 of the plate body 1.

[0034] See also Figure 2 and Figure 3 , Figure 2 This is a top view of a circuit board for a MEMS chip provided by an embodiment of the utility model. Figure 3 This is a bottom view of a circuit board for a MEMS chip provided by an embodiment of the utility model.

[0035] like Figure 2 As shown in FIG, at least a portion of the four metal edgings 2 covers at least a portion of the upper surface 11 of the plate 1, forming a first surface 21 of the metal edging 2. Figure 3 As shown in , at least a portion of the four metal edgings 2 covers at least a portion of the lower surface 12 of the plate body 1 , forming a second surface 22 of the metal edging 2 .

[0036] like Figure 2 As shown in , further, the at least one first through hole 4 passes through the metal edging 2 corresponding to at least a portion of the upper surface 11 of the plate body 1, the metal edging 2 corresponding to at least a portion of the lower surface 12 of the plate body 1, and the plate body 1.

[0037] Wherein, at least one first through hole 4 is provided on each of the metal edgings 2 .

[0038] In this embodiment, the plate body 1 is opened by a window, and at least one first through hole 4 is formed from the first surface 21 of the metal cladding 2 to the second surface 22 of the metal cladding 2. The at least one first through hole 4 can reduce the ground impedance.

[0039] By opening a window in the plate body 1 , at least one first through hole 4 is formed from the first surface 21 of the metal cladding 2 to the second surface 22 of the metal cladding 2 .

[0040] like Figure 2 As shown in , further, the ground pins of the multiple MEMS chips 3 are electrically connected to the metal cladding 2 through metal wires 5; the metal wires 5 are arranged on the upper surface 11 of the plate body 1.

[0041] In this embodiment, the ground pins of the multiple MEMS chips 3 are electrically connected to the oppositely disposed metal cladding 2. This not only facilitates electrical connection between the ground pins of the multiple MEMS chips 3, the metal wires 5, and the metal cladding strip, but also facilitates the construction of a shorter ground loop.

[0042] like Figure 2 As shown in , further, the metal connection line 5 is provided with at least one second through hole 6. The at least one second through hole 6 can reduce the ground impedance.

[0043] Furthermore, the at least one second through hole 6 passes through from the upper surface 11 of the plate body 1 to the lower surface 12 of the plate body 1 .

[0044] In this embodiment, the second through hole 6 penetrates from the upper surface 11 of the plate body 1 to the lower surface 12 of the plate body 1 .

[0045] Furthermore, the plurality of MEMS chips 3 are disposed on the upper surface 11 of the board 1 .

[0046] Furthermore, the plurality of MEMS chips 3 are disposed in an area outside the diagonal line of the upper surface 11 of the plate 1 .

[0047] In this embodiment, the MEMS chip 3 is arranged in an area outside the diagonal line, which can reduce the influence of stress generated during the production process of the board body 1 on the MEMS chip 3 .

[0048] Furthermore, the distance between each MEMS chip 3 of the plurality of MEMS chips 3 is within a preset range.

[0049] In this embodiment, the distance between the centers of two adjacent MEMS chips 3 is greater than 10 mm to prevent the MEMS chips 3 from interfering with each other.

[0050] like Figure 2 As shown in , further, a micro control unit 7 is provided on the upper surface 11 of the board 1 ; the micro control unit 7 is electrically connected to the MEMS chip 3 .

[0051] In this embodiment, the microcontroller unit 7 is electrically connected to the board 1 via surface mount technology. The multiple MEMS chips 3 are capable of sensing external physical quantities, such as acceleration, pressure, and temperature, and generating corresponding analog signals. These analog signals are then transmitted to the microcontroller unit 7, which performs a series of processing operations, such as conversion and correction, on the received analog signals to generate digital signals.

[0052] This utility model provides a circuit board for MEMS chips. Metal edging enhances the strength of the circuit board's main body, reduces stress, and provides anti-oxidation and anti-static protection, thereby improving the circuit board's anti-interference performance. Furthermore, the metal edging effectively shields external electromagnetic interference and isolates mechanical vibration, ensuring stable operation of the MEMS chip in complex environments and enhancing signal integrity and measurement accuracy.

[0053] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will appreciate that the technical solutions described in the aforementioned embodiments may be modified or some or all of the technical features therein may be replaced with equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the various embodiments of the present invention. Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features but not other features included in other embodiments, the combination of features from different embodiments is intended to be within the scope of the present invention and to form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is intended solely to enhance understanding of the overall background technology of the present invention and should not be construed as an admission or any form of implication that such information constitutes prior art already known to those skilled in the art.

Claims

1. A circuit board for a MEMS chip, characterized in that: The circuit board includes: a board body and a metal edging; a plurality of MEMS chips are arranged on the board body; The edge of the plate body is covered with the metal edging, the plate body is electrically connected to the metal edging, the metal edging is provided with at least one first through hole, the at least one first through hole passes through the metal edging and the plate body, and the ground pins of multiple MEMS chips are electrically connected to the metal edging.

2. The circuit board according to claim 1, wherein: The edge of the plate body includes at least one of the following items: at least one side of the plate body, at least a portion of the upper surface of the plate body, and at least a portion of the lower surface of the plate body.

3. The circuit board according to claim 2, wherein: The at least one first through hole passes through the metal cladding corresponding to at least a portion of the upper surface of the plate body, the metal cladding corresponding to at least a portion of the lower surface of the plate body, and the plate body.

4. The circuit board according to claim 1, wherein: The ground pins of the multiple MEMS chips are electrically connected to the metal edging via metal wires; The metal connection line is arranged on the upper surface of the plate.

5. The circuit board according to claim 4, characterized in that The metal connection line is provided with at least one second through hole.

6. The circuit board according to claim 5, characterized in that The at least one second through hole passes through the metal connection line and the board body.

7. The circuit board according to claim 1, wherein: The plurality of MEMS chips are arranged on the upper surface of the board.

8. The circuit board according to claim 1, wherein: The plurality of MEMS chips are disposed in an area other than a diagonal line of the upper surface of the plate.

9. The circuit board according to claim 1, wherein: The distance between each MEMS chip of the plurality of MEMS chips is within a preset range.

10. The circuit board according to claim 1, wherein: The micro control unit is arranged on the upper surface of the plate; The micro control unit is electrically connected to the MEMS chip.

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