Optical path structure with inverted COB (Chip On Board) optical module laser
Through the flip structure of COB optical module laser, the flip package and support design is adopted, which solves the problem of reducing the bandwidth of RF signal in the formal installation method, and achieves the increase in the rate and heat dissipation protection of the optical module.
Patent Information
- Application Number
- CN202422842310.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-11-20
AI Technical Summary
In existing optical communication, the laser chip in the formal mode is connected to the electric chip through the wire bond gold wire, resulting in a reduction in the bandwidth of the radio frequency signal, which becomes a bottleneck in improving the rate.
The COB optical module laser flip structure is adopted, and the flip packaging scheme is used to weld the optical chip to the PCB board through gold ball or copper column. Combined with the L-shaped support and ceramic substrate, the TEC and collimating lens are fixed, the gold wire connection is cancelled, and the RF link bandwidth is increased.
The RF link bandwidth is increased, the speed of the optical module is increased, the optical chip is protected, the adaptability and heat dissipation performance of the optical path are enhanced, and the impact of optical power changes on the optical chip is reduced.
Smart Images
Figure CN223259930U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communications, in particular to an optical path structure of a COB optical module laser flip-up. Background Art
[0002] In the current optical communications field, lasers in optical modules are typically fabricated using a face-mounted method, a process that is highly mature and offers stable performance. However, this method requires wire bonds to connect the electrical and optical chips. The inductance of these gold wires reduces RF signal bandwidth, significantly impacting single-wavelength speeds of 200G and above, and has become a bottleneck for increasing speeds. Utility Model Content
[0003] The purpose of the utility model is to provide a COB optical module laser flip-chip optical path structure, the laser chip adopts a flip-chip packaging solution, which can improve the radio frequency link bandwidth and increase the optical module rate.
[0004] In order to achieve the above objectives, the following technical solutions are adopted:
[0005] A flip-chip optical path structure for a COB optical module laser comprises a PCB, an optical chip mounted on the PCB, and a first support member and a collimating lens; the first support member is L-shaped, with the L-shaped vertical end of the first support member connected to the top of the PCB, and the L-shaped horizontal end of the first support member extending toward the optical chip; a first substrate, a second substrate, and a semiconductor cooler are sequentially arranged on the top of the optical chip from bottom to top, and the semiconductor cooler is arranged at the bottom of the L-shaped horizontal end of the first support member; the collimating lens is arranged near one end of the PCB and is located on the light output path of the optical chip; a converging lens is arranged on the light output path of the collimating lens, and an optical isolator is also arranged on the light output path between the collimating lens and the converging lens; the converging lens is used to converge light and transmit it into an optical fiber.
[0006] Furthermore, the optical chip is soldered to the PCB board via gold balls or copper pillars.
[0007] Furthermore, it also includes a third substrate; the third substrate is arranged at the bottom of the L-shaped horizontal end of the first support member; the collimating lens is fixed on the second substrate by dispensing glue, and the optical isolator and the converging lens are fixed on the third substrate by dispensing glue.
[0008] Furthermore, it also includes a second support member and a third substrate; the second support member is L-shaped, the L-shaped vertical end of the second support member is connected to the bottom of the PCB board, and the L-shaped horizontal end of the second support member extends in the direction of the optical chip; the third substrate is arranged on the L-shaped horizontal end of the second support member; the collimating lens is fixed to the second substrate by dispensing glue, and the optical isolator and the converging lens are fixed to the third substrate by dispensing glue.
[0009] Furthermore, the first substrate, the second substrate and the third substrate are made of ceramic.
[0010] Furthermore, the first support member and the second support member are made of ceramic or tungsten copper.
[0011] By adopting the above solution, the beneficial effects of the utility model are:
[0012] 1) The laser chip adopts a flip-chip packaging solution, which can improve the RF link bandwidth and increase the optical module rate. At the same time, a first support is provided to fix the TEC (semiconductor cooler) and the PCB board, protecting the connection between the optical chip and the PCB board, and also playing a role in heat dissipation;
[0013] 2) In the optical path design, the collimating lens is fixed on the TEC or on the TEC substrate, while the optical isolator, converging lens, and fiber array are fixed on another supporting structure. In this way, no leverage force is generated on the optical chip, thereby protecting the optical chip. In addition, since the optical path is converted into collimated light, it has strong adaptability to the deformation of the PCB board or other components, and the optical power changes very little. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic structural diagram of one embodiment of the present utility model;
[0015] Figure 2 This is a structural diagram of another embodiment of the present utility model;
[0016] The accompanying drawings illustrate:
[0017] 1. PCB board; 2. Optical chip; 3. First support member; 4. Collimating lens; 5. First substrate; 6. Second substrate; 7. Semiconductor cooler; 8. Converging lens; 9. Optical isolator; 10. Third substrate; 11. Second support member. DETAILED DESCRIPTION
[0018] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0019] Reference Figures 1 to 2As shown, the utility model provides a flip-chip optical path structure of a COB optical module laser, comprising a PCB board 1, an optical chip 2 mounted on the PCB board 1, and in one embodiment, a first support member 3 and a collimating lens 4; the first support member 3 is L-shaped, the L-shaped vertical end of the first support member 3 is connected to the top of the PCB board 1, and the L-shaped horizontal end of the first support member 3 extends in the direction of the optical chip 2; the top of the optical chip 2 is provided with a first substrate 5, a second substrate 6 and a semiconductor cooler 7 from bottom to top, and the semiconductor cooler 7 is arranged at the bottom of the L-shaped horizontal end of the first support member 3; the collimating lens 4 is arranged close to one end of the PCB board 1 and is located on the light output path of the optical chip 2; a converging lens 8 is arranged on the light output path of the collimating lens 4, and an optical isolator 9 is also arranged on the light output path between the collimating lens 4 and the converging lens 8; the converging lens 8 is used to converge light and transmit it into the optical fiber.
[0020] In this embodiment, the optical chip 2 is soldered to the PCB board 1 through gold balls or copper pillars, which eliminates the gold wirebond soldering, can reduce parasitic parameters, and improve the RF signal bandwidth. At the same time, the optical chip 2 can conduct heat to the TEC (semiconductor cooler 7) through the back of the chip for heat dissipation, and a first support member 3 is also provided. The TEC connection is arranged at the bottom of the L-shaped horizontal end of the first support member 3. On the one hand, the heat of the TEC can be transferred to the optical module housing for heat dissipation, and on the other hand, the optical chip 2 can be protected (the optical chip 2 is small, the material is brittle, the adhesion of the welding area is small, and the TEC is large and heavy, so it needs protection).
[0021] In addition, this embodiment further includes a second support member 11 and a third substrate 10; the second support member 11 is L-shaped, the L-shaped vertical end of the second support member 11 is connected to the bottom of the PCB board 1, and the L-shaped horizontal end of the second support member 11 extends in the direction of the optical chip 2; the third substrate 10 is arranged on the L-shaped horizontal end of the second support member 11; the collimating lens 4 is fixed to the second substrate 6 by dispensing glue, and the optical isolator 9 and the converging lens 8 are fixed to the third substrate 10 by dispensing glue.
[0022] The second support member 11 supports other parts of the optical path. The collimating lens 4 and the optical chip 2 refer to the second substrate 6, and their expansion due to heat is consistent, which can ensure that the divergent light from the optical chip 2 can be normally converted into parallel light; and when converting from parallel light to convergent light, the tolerance for position tolerance is large, and a change of a few microns has little effect on the optical power, thereby solving the deformation difference problem caused by the optical chip 2 and the third substrate 10 not sharing a common reference surface. At the same time, it should be noted that the optical chip 2 has a small mode spot and needs to be precisely aligned with the collimating lens 4, and it cannot be affected by thermal expansion, with an accuracy of less than 1um.
[0023] Another embodiment is also provided, in which the third substrate 10 is positioned at the bottom of the L-shaped horizontal end of the first support member 3; the collimating lens 4 is fixed to the second substrate 6 by dispensing glue, and the optical isolator 9 and converging lens 8 are also fixed to the third substrate 10 by dispensing glue. In this embodiment, the second support member 11 is eliminated, and the corresponding materials are placed on the first support member 3. This also meets the functional and performance requirements, but the fixation between the support structure and the PCB board 1 must be very secure to prevent deformation under external forces and damage to the optical chip 2 and optical path components.
[0024] In summary of the above embodiments, the first substrate 5, the second substrate 6 and the third substrate 10 are made of ceramic (aluminum nitride AlN), and the first support member 3 and the second support member 11 are made of ceramic or tungsten copper. At the same time, the parts of the first support member 3 and the second support member 11 that are in contact with the PCB board 1 can be in contact and connected with the surface of the PCB board 1, or can be inserted into the hole of the PCB board 1 and then fixed with glue with a low thermal expansion coefficient.
[0025] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A COB optical module laser flip-chip optical path structure, including a PCB board and an optical chip mounted on the PCB board, characterized in that: It also includes a first support member and a collimating lens; the first support member is L-shaped, the L-shaped vertical end of the first support member is connected to the top of the PCB board, and the L-shaped horizontal end of the first support member extends in the direction of the optical chip; the top of the optical chip is provided with a first substrate, a second substrate and a semiconductor cooler from bottom to top, and the semiconductor cooler is arranged at the bottom of the L-shaped horizontal end of the first support member; the collimating lens is arranged close to one end of the PCB board and is located on the light output path of the optical chip; a converging lens is arranged on the light output path of the collimating lens, and an optical isolator is also arranged on the light path between the collimating lens and the converging lens; the converging lens is used to converge light and transmit it into the optical fiber.
2. The optical path structure of the COB optical module laser flip-chip according to claim 1 is characterized in that: The optical chip is soldered to the PCB board via gold balls or copper pillars.
3. The optical path structure of the COB optical module laser flip-chip according to claim 1, characterized in that: It also includes a third substrate; the third substrate is arranged at the bottom of the L-shaped horizontal end of the first support member; the collimating lens is fixed on the second substrate by dispensing glue, and the optical isolator and the converging lens are fixed on the third substrate by dispensing glue.
4. The optical path structure of the COB optical module laser flip-chip according to claim 1, characterized in that: It also includes a second support member and a third substrate; the second support member is L-shaped, the L-shaped vertical end of the second support member is connected to the bottom of the PCB board, and the L-shaped horizontal end of the second support member extends in the direction of the optical chip; the third substrate is arranged on the L-shaped horizontal end of the second support member; the collimating lens is fixed to the second substrate by dispensing glue, and the optical isolator and the converging lens are fixed to the third substrate by dispensing glue.
5. The optical path structure of the COB optical module laser flip-chip according to claim 3 or 4, characterized in that: The first substrate, the second substrate and the third substrate are made of ceramic.
6. The optical path structure of the COB optical module laser flip-chip according to claim 4, characterized in that: The first support member and the second support member are made of ceramic or tungsten copper.