Wafer etching and cleaning structure

Abstract

The utility model discloses a wafer etching and cleaning structure which comprises a shell and a shell inner bottom face, the shell is fixedly connected with the shell inner bottom face, a top plate is installed at the top end of the shell, a conveying device is fixedly connected and installed at the top end of the shell inner bottom face, two opposite through openings are formed in the shell, and a backboard inlet and a backboard outlet are rotationally connected to the through openings of the shell. A wafer is placed in the wafer basket, the conveying device moves the wafer basket from the backboard inlet position to the backboard outlet position, a cleaning bin is installed in the middle of the conveying device, an exhaust pipe is fixedly connected to the upper end of the side wall of the shell, a through opening of the shell is designed to be an opening in the lower middle position of the shell, and the backboard inlet and the backboard outlet are installed at the opening. The waste gas pipe is installed at the top end, harmful gas volatilized by the cleaning solution is discharged from the waste gas pipe at the upper end, and pollution of the solution to the working environment is reduced.

Description

Technical Field

[0001] The utility model relates to the field of wafer cleaning, and more particularly to a wafer cleaning device. Background Art

[0002] After the wafer is manufactured, it needs to be cut into discs. Before the circular wafer is cut into small squares, the circular wafer needs to be cleaned. Conventional cleaning of wafers generally uses etching methods. Therefore, the etching and cleaning wafer device is one of the indispensable key equipment in the semiconductor manufacturing process.

[0003] Conventional wafer etching and cleaning devices require that a wafer basket be placed in the cleaning device, and the cleaning liquid in the basket be sprayed onto the surface of the wafer through a water gun for cleaning. The cleaning solution is flushed on the surface of the wafer to make its surface smooth. The solution that needs to be etched and cleaned generally contains a large amount of organic components. When using an organic solution to clean the wafer, the easily volatile substances in the organic solution in the cleaning chamber will evaporate into gas. When taking out the cleaned wafer, the opening of the cleaning chamber needs to be opened and the wafer taken out. At this time, organic waste gas will overflow, thereby polluting the workers' working environment.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present invention aims to provide a wafer etching and cleaning structure.

[0006] The above technical purpose of the present utility model is achieved through the following technical solutions: it includes a shell, a conveying device is fixedly connected to the top of the bottom surface of the shell, and a through opening is opened on the two opposite side walls of the shell. The two shell through openings are hingedly connected to an inlet backboard and an outlet backboard respectively. The top of the conveying device is slidably connected to a wafer basket, and a plurality of wafers are placed in the wafer basket. The conveying device moves the wafer basket from the inlet backboard position to the outlet backboard. A cleaning chamber is installed in the middle position of the conveying device, and an exhaust pipe is fixedly connected to the upper end of the side wall of the shell. An air suction pump is installed in the exhaust pipe. The gas extraction speed of the air suction pump in the exhaust pipe is greater than the overflow rate of the solution organic waste gas.

[0007] By adopting the above technical solution, the device is installed between the bottom surface of the shell, the shell and the top plate of the surgical top to form a closed space. The conveying device installed in the shell transports a wafer basket containing several wafers from the input basket position to the cleaning chamber, and sprays a cleaning solution on the wafers. The cleaning solution is mostly an organic solvent. This solvent is volatile. During the spraying process, the substances therein are easily released into the air, causing damage to the working environment. When general organic substances evaporate into the air, their molar mass and density are lower than those of air. Therefore, they will exist above the shell under the same environment. Therefore, the exhaust pipe is installed above the shell, and the suction pump installed in the exhaust pipe absorbs the organic waste gas generated in the shell. Then the wafers in the wafer basket are etched and cleaned. After cleaning, they are transported to the output basket via the conveying device, and the cleaned wafer basket can be obtained from the output basket.

[0008] The utility model is further configured as follows: the conveying device includes a plurality of conveying platforms and conveying toothed belts, the side walls of the conveying platforms are fixedly connected to a plurality of platform rods, the conveying toothed belts are slidably connected to the platform rods, and the platform rods are installed on the side walls of the conveying platforms near the cleaning chamber.

[0009] By adopting the above technical solution, the conveying device includes a conveyor toothed belt and a conveyor platform. The conveyor platform is installed at both ends of the conveyor toothed belt and the position of the cleaning chamber, driving the conveyor toothed belt to rotate. The rotation of the conveyor toothed belt drives the wafer basket to move from the input basket to the output basket. The conveyor toothed belt rotates through the table rods installed on the opposite surfaces of the two conveyor platforms, thereby driving the wafer basket to move.

[0010] The utility model is further configured as follows: a support platform is fixedly connected to the center position of the inner bottom surface of the shell, and a passage groove is opened at the center position of the support platform.

[0011] By adopting the above technical solution, a strip-shaped support is installed in the center of the bottom surface of the shell. There is a passage groove in the center of the support. The passage groove is a circular surface. When the wafer basket moves on the conveyor belt, it slides between the bottom end and the support, and the support shares the pressure exerted by the wafer basket on the conveyor belt.

[0012] The utility model is further configured as follows: a plurality of wafer baffles are installed in the wafer basket, a sliding bar is fixedly connected to the center position of the bottom end of the wafer basket, a plurality of connecting teeth are fixedly connected to the two ends of the bottom end of the wafer basket, and a plurality of through grooves are penetrated through the bottom wall of the wafer basket.

[0013] By adopting the above technical solution, the wafer basket is used to place wafers, and the gaps between the wafer baffles in the wafer basket are used to place wafers. The wafers are arranged and placed between the wafer baffles. The slide bar installed at the bottom end of the wafer basket is embedded in the passage groove and slides. The slide bar reduces the wear on the bottom surface of the wafer basket. The border teeth are rotatably connected to the conveyor belt. The through groove is opened on the bottom wall of the wafer basket. When the wafer basket passes through the cleaning chamber and the cleaning solution used for cleaning is sprayed, the solution flows to the bottom of the wafer basket and flows out from the through groove.

[0014] The utility model is further configured as follows: a plurality of nozzles are fixedly connected to the inner wall of the cleaning chamber, one end of the nozzle is provided with an opening, and the opening end of the nozzle faces the inner cavity of the cleaning chamber.

[0015] By adopting the above technical solution, the nozzle can spray cleaning liquid or gas evenly and efficiently, thereby effectively removing various impurities on the surface of the wafer, such as particles, metals, organic matter and natural oxide film.

[0016] The utility model is further configured as follows: an exhaust flare is fixedly connected to the top end of the exhaust pipe, and an upper opening of the exhaust flare is in a flared shape.

[0017] By adopting the above technical solution, the flared design can increase the cross-sectional area of ​​the exhaust outlet, allowing the exhaust gas to be discharged more smoothly, reducing the resistance of the airflow at the outlet, and thus improving the exhaust efficiency.

[0018] The utility model is further configured as follows: a water outlet is opened at one end of the inner bottom surface of the shell.

[0019] By adopting the above technical solution, after the round wafer is cleaned, the solution flowing to the inner bottom surface of the shell flows out from the water outlet so as to be recycled and reused.

[0020] The utility model is further configured such that a height distance greater than fifty centimeters is left between the through opening of the shell and the inner bottom surface of the shell.

[0021] By adopting the above technical solution, the opening of the shell is at a certain height distance from the inner bottom surface of the shell. When the solution accumulates on the inner bottom surface of the shell, it will not flow to the outside through the opening.

[0022] In summary, the utility model has the following beneficial effects: the opening of the shell is designed to open at the middle and lower position of the shell, the inlet and outlet backboards are installed at the opening, and the exhaust pipe is installed at the top position, so that the harmful gases volatilized by the cleaning solution are discharged from the upper end exhaust pipe, reducing the pollution caused by the solution to the working environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of the utility model;

[0024] Figure 2It is a schematic diagram of the interior of the housing of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the transfer platform of the utility model;

[0026] Figure 4 For this utility model Figure 3 A magnified schematic diagram of point A in the middle;

[0027] Figure 5 This is a schematic structural diagram of the wafer basket of the present invention;

[0028] Figure 6 This is a bottom view of the bottom end of the wafer basket of the present invention.

[0029] In the figure: 1. Shell; 11. Inlet backboard; 12. Outlet backboard; 13. Exhaust pipe; 131. Exhaust flare; 2. Conveyor platform; 21. Conveyor toothed belt; 22. Platform rod; 3. Support platform; 31. Passageway; 4. Cleaning chamber; 41. Nozzle; 5. Wafer basket; 51. Wafer baffle; 52. Slide bar; 53. Border teeth; 54. Passageway. DETAILED DESCRIPTION

[0030] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0031] Example:

[0032] A wafer etching cleaning structure such as Figure 1 As shown, it includes an outer shell 1, a conveying device is fixedly connected to the top of the inner bottom surface of the outer shell, and a through opening is opened on the two opposite side walls of the outer shell 1. The two through openings of the outer shell 1 are respectively hingedly connected to an inlet backboard 11 and an outlet backboard 12. A wafer basket 5 is slidably connected to the top of the conveying device. A number of wafers are placed in the wafer basket 5. The conveying device moves the wafer basket 5 from the inlet backboard 11 to the outlet backboard 12. A cleaning chamber 4 is installed in the middle position of the conveying device. An exhaust pipe 13 is fixedly connected to the upper end of the side wall of the outer shell 1, and an air pump is installed in the exhaust pipe 13. The exhaust gas extraction speed of the air pump in the exhaust pipe 13 is greater than the overflow rate of the solution organic waste gas. An exhaust flare 131 is fixedly connected to the top of the exhaust pipe 13, and the upper opening of the exhaust flare 131 is flared. There is a height distance of more than fifty centimeters between the through opening of the outer shell 1 and the inner bottom surface of the outer shell.

[0033] like Figure 2 As shown, the conveying device includes several conveying platforms 2 and conveying toothed belts 21. Several platform rods 22 are fixedly connected to the side walls of the conveying platforms 2. The conveying toothed belts 21 are slidably connected to the platform rods 22. The platform rods 22 are installed on the side walls of the conveying platforms 2 near the cleaning chamber 4. A water outlet is provided at one end of the inner bottom surface of the outer shell 1.

[0034] like Figure 3As shown, a support platform 3 is fixedly connected to the center of the inner bottom surface of the shell, and a passage groove 31 is opened at the center of the support platform 3.

[0035] like Figure 4 As shown, a plurality of nozzles 41 are fixedly connected to the inner wall of the cleaning chamber 4 , and an opening is formed at one end of the nozzle 41 , and the open end of the nozzle 41 faces the inner cavity of the cleaning chamber 4 .

[0036] like Figure 5 , Figure 6 As shown, a plurality of wafer baffles 51 are installed in the wafer basket 5, a slide bar 52 is fixedly connected to the center of the bottom end of the wafer basket 5, a plurality of connecting teeth 53 are fixedly connected to the two ends of the bottom end of the wafer basket 5, and a plurality of through slots 54 are passed through the bottom wall of the wafer basket 5.

[0037] The device is installed between the bottom surface of the shell 1 and the top plate of the surgical top to form a closed space. The conveying device is installed in the shell 1. The conveying device includes a conveying toothed belt 21 and a conveying table 2. The conveying table 2 is installed at both ends of the conveying toothed belt 21 and the position of the cleaning chamber 4, driving the conveying toothed belt 21 to rotate. The rotation of the conveying toothed belt 21 drives the wafer basket 5 to move from the inlet backboard 11 to the outlet backboard 12. The conveying toothed belt 21 rotates through the table rods 22 installed on the opposite surfaces of the two conveying tables 2, thereby driving the wafer basket 5 to move. The wafer basket 5 is used to place wafers, and the gap between the wafer baffles 51 in the wafer basket 5 is used The wafers are placed and arranged between the wafer baffles 51. The conveyor belt 21 rotates to drive the wafer basket 5 from the inlet backboard 11 to the outlet backboard 12. A nozzle 41 is set in the cleaning chamber 4 to clean the wafers. The nozzle 41 can spray cleaning liquid or gas evenly and efficiently, thereby effectively removing various impurities on the surface of the wafer, such as particles, metals, organic matter and natural oxide films. When the wafer basket 5 passes through the cleaning chamber 4, the cleaning solution used for cleaning is sprayed. When the solution flows to the bottom of the wafer basket 5, it flows out from the through groove 54. The support table 3 is installed between the two conveyor belts 21. The groove in the support table 3 shares the pressure of the wafer basket 5 on the conveyor belt 21. The force causes the passage slot 31 opened inside to slide with the slide bar 52 of the wafer basket 5, which also reduces the wear of the wafer basket 5. The bordering teeth 53 installed on the bottom wall of the wafer basket 5 are engaged and rotated with the conveyor belt 21 to move the wafer basket 5, and the wafer basket 5 containing several wafers is transported from the inlet backboard 11 to the cleaning chamber 4, and the cleaning solution is sprayed on the wafers. Then, the wafers in the wafer basket 5 are etched and cleaned. After the cleaning is completed, it is transported to the outlet backboard 12 by the conveyor device, and the cleaned wafer basket 5 can be obtained from the outlet backboard 12. The cleaning solution is mostly an organic solvent. This solvent is volatile. During the spraying process, the substances in it are easily emitted into the air, causing To avoid damage to the working environment, when general organic matter evaporates into the air, its molar mass and density are lower than those of the air. Therefore, in the same environment, it will exist above the shell 1. Therefore, the exhaust pipe 13 is installed above the shell 1, and the exhaust expansion port 131 fixedly connected to the top of the exhaust pipe 13 allows the exhaust gas to be discharged more smoothly, reducing the resistance of the airflow at the outlet, thereby improving the exhaust efficiency. After cleaning the wafer, the solution flowing to the inner bottom surface of the shell 1 flows out from the water outlet for recycling and reuse. The through port of the shell 1 has a certain height distance from the inner bottom surface of the shell 1. When the solution accumulates on the inner bottom surface of the shell 1, it will not flow to the outside from the through port.

[0038] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, certain improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A wafer etching and cleaning structure, comprising a housing (1), characterized in that: A conveying device is fixedly connected to the top of the inner bottom surface of the shell, and a through opening is respectively opened on the two opposite side walls of the shell (1). The two through openings of the shell (1) are hingedly connected to an inlet backboard (11) and an outlet backboard (12). A wafer basket (5) is slidably connected to the top of the conveying device, and a plurality of wafers are placed in the wafer basket (5). The conveying device moves the wafer basket (5) from the inlet backboard (11) to the outlet backboard (12). A cleaning chamber (4) is installed in the middle position of the conveying device. An exhaust pipe (13) is fixedly connected to the upper end of the side wall of the shell (1), and an air pump is installed in the exhaust pipe (13). The exhaust speed of the air pump in the exhaust pipe (13) is greater than the overflow rate of the organic waste gas from the solution.

2. The wafer etching and cleaning structure according to claim 1, wherein: The conveying device includes a plurality of conveying platforms (2) and a conveying toothed belt (21), wherein the side wall of the conveying platform (2) is fixedly connected with a plurality of platform rods (22), the conveying toothed belt (21) is slidably connected to the platform rod (22), and the platform rod (22) is installed on the side wall of the conveying platform (2) near the cleaning chamber (4).

3. The wafer etching and cleaning structure according to claim 1, wherein: A support platform (3) is fixedly connected to the center of the inner bottom surface of the shell, and a passage groove (31) is provided at the center of the support platform (3).

4. The wafer etching and cleaning structure according to claim 1, wherein: A plurality of wafer baffles (51) are installed in the wafer basket (5), a sliding bar (52) is fixedly connected to the center position of the bottom end of the wafer basket (5), a plurality of connecting teeth (53) are fixedly connected to the two ends of the bottom end of the wafer basket (5), and a plurality of through slots (54) are passed through the bottom wall of the wafer basket (5).

5. The wafer etching and cleaning structure according to claim 1, wherein: A plurality of nozzles (41) are fixedly connected to the inner wall of the cleaning chamber (4), one end of the nozzles (41) is provided with an opening, and the open end of the nozzles (41) faces the inner cavity of the cleaning chamber (4).

6. The wafer etching and cleaning structure according to claim 1, wherein: The top end of the exhaust pipe (13) is fixedly connected to an exhaust expansion port (131), and the upper opening of the exhaust expansion port (131) is in an expansion shape.

7. The wafer etching and cleaning structure according to claim 1, wherein: A water outlet is provided at one end of the inner bottom surface of the shell (1).

8. The wafer etching and cleaning structure according to claim 1, wherein: The opening of the shell (1) and the inner bottom surface of the shell have a height distance greater than fifty centimeters.

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