Manual piece pushing equipment

Abstract

The utility model discloses manual wafer pushing equipment, which comprises an equipment bottom plate, a vacuum chuck, a wafer bearing table and a vacuum heating objective table, the vacuum heating objective table is mounted on the equipment bottom plate through a vacuum heating objective table mounting connecting column, and a heating mica sheet and a temperature sensing thermocouple are arranged in the vacuum heating objective table. The temperature is controlled through an external temperature control module; the vacuum heating objective table and the vacuum suction cup are each provided with a vacuum air path, and each vacuum air path is provided with a control switch used for controlling the vacuum air path to be connected or disconnected. The wafer bearing table is connected to the equipment bottom plate through a sliding adjusting device, and the sliding adjusting device is used for completing wafer falling by adjusting the front position, the rear position, the upper position and the lower position of the wafer bearing table. The manual wafer pushing equipment is accurate in temperature adjustment, uniform in heating, firm in adsorption, convenient and fast to operate and beneficial to standardized production and research.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor wafer processing and relates to a manual wafer pushing device. Background Art

[0002] During the processing of semiconductor wafers, the wafers or materials need to be thinned and polished. After grinding and thinning, the substrate material of the wafer or material needs to be removed to facilitate quality inspection and subsequent processing, such as slip, epitaxy, packaging, etc.

[0003] In current small-batch production or engineering sample preparation processes, due to the uncertainty of front-end processes, the diversity of engineering materials, the diverse material properties of bonding waxes, and the diversity of thinning and polishing requirements, the exploration of new processes, new materials, and new technologies mostly adopts the method of placing dewaxing liquid in heated glassware, immersing in high-temperature liquid, and naturally separating. The separation time required using this method ranges from tens of minutes to more than ten hours, and there is considerable uncertainty as to whether the separation can be completed in the end. It is inefficient and easily damages the wafer or material, resulting in poor results and is not conducive to standardized production and research. Utility Model Content

[0004] Purpose of the utility model: The purpose of the utility model is to solve the problem that the existing separation method is low in efficiency and easily causes damage to the wafer or material, and to provide a manual wafer pushing device.

[0005] Technical solution: The utility model is a manual film pushing device, including a device base plate, a vacuum suction cup, a wafer holding table and a vacuum heating stage. The vacuum heating stage is installed on the device base plate through a vacuum heating stage mounting connecting column. A heating mica sheet and a temperature-sensing thermocouple are provided in the vacuum heating stage, and the temperature is controlled by an external temperature control module; the vacuum heating stage and the vacuum suction cup are respectively provided with a vacuum air path, and the vacuum air path is provided with a control switch for controlling the on and off of the vacuum air path; the wafer holding table is connected to the device base plate through a sliding adjustment device, and the sliding adjustment device is used to complete the film dropping by adjusting the front, rear, upper and lower positions of the wafer holding table.

[0006] Furthermore, the sliding adjustment device includes a movable slide and an adjusting slide, the bottom surface of the movable slide is connected to the bottom plate of the equipment, a slide bracket is provided on the slider of the movable slide, the adjusting slide is provided on the slide bracket, and the wafer support table is connected to the adjusting slide through the support table base; the movable slide is used to adjust the front and rear positions of the wafer support table, and the adjusting slide is used to adjust the upper and lower positions of the wafer support table.

[0007] Furthermore, the vacuum air passages of the vacuum heating stage and the vacuum suction cup are both provided with pressure gauges.

[0008] Furthermore, an annular groove is provided on the surface of the vacuum heating stage, and the annular groove is connected to the vacuum air path in the vacuum heating stage.

[0009] Furthermore, a vacuum air pipe quick-connect connector is provided on the bottom plate of the equipment, and the vacuum air pipe quick-connect connector is used to connect the vacuum air path of the vacuum heating stage and the vacuum suction cup.

[0010] Furthermore, the control switch is a fork switch, and the fork switch is arranged on the bottom plate of the equipment.

[0011] Furthermore, adjustable feet are provided below the bottom plate of the equipment.

[0012] Furthermore, protective rings are provided around the vacuum heating stage.

[0013] Furthermore, the wafer stage is made of polytetrafluoroethylene material.

[0014] Beneficial effects: Compared with the prior art, the utility model has the following advantages: 1. The vacuum heating stage and the vacuum suction cup are respectively provided with vacuum air paths, which are individually controlled by a control switch to ensure firm adsorption;

[0015] 2. The heating temperature of the vacuum heating stage is controlled by an external control module to meet the melting point temperature differences of different bonding materials;

[0016] 3. The wafer stage can be adjusted forward, backward, up and down through the sliding adjustment device to complete the wafer placement;

[0017] In summary, the manual sheet pushing equipment of the present invention has precise temperature regulation, uniform heating, firm adsorption, and convenient operation, which is conducive to standardized production and research. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the present utility model. DETAILED DESCRIPTION

[0019] The technical solution of the present utility model will be further described below with reference to the accompanying drawings.

[0020] Combine Figure 1As shown, the manual wafer pushing device in this embodiment includes a device base plate 108, a vacuum suction cup 101, a wafer holding table 102 and a vacuum heating stage 111. The vacuum heating stage 111 is installed on the device base plate 108 through a vacuum heating stage mounting connecting column 114. A heating mica sheet and a temperature-sensing thermocouple are provided in the vacuum heating stage 111, and the temperature is controlled by an external temperature control module. In a specific embodiment, an annular groove is provided on the surface of the vacuum heating stage 111, and the annular groove is connected to the vacuum air path inside the vacuum heating stage 111, so that the adsorption is more firm. A heat insulating sheet is also provided inside the vacuum heating stage 111 to isolate the heat transfer during the heating process of the heated mica. A protective ring 112 is also provided around the vacuum heating stage 111 to prevent burns to personnel during operation.

[0021] The wafer stage 102 is connected to the equipment base plate 108 through a sliding adjustment device, and the sliding adjustment device is used to complete the wafer drop by adjusting the front, rear, upper and lower positions of the wafer stage 102. In a specific embodiment, the sliding adjustment device includes a movable slide 105 and an adjustment slide 103. The bottom surface of the movable slide 105 is connected to the equipment base plate 108. A slide bracket 104 is provided on the slider of the movable slide 105. The adjustment slide 103 is provided on the slide bracket 104. The wafer stage 102 is connected to the adjustment slide 103 through the stage base 110. Among them, the movable slide 105 is used to adjust the front and rear positions of the wafer stage 102, and the adjustment slide 103 is used to adjust the upper and lower positions of the wafer stage 102. In a specific embodiment, the wafer stage 102 is made of polytetrafluoroethylene.

[0022] The vacuum heating stage 111 and the vacuum chuck 101 are each provided with an independent vacuum air path, and are provided with an independent control switch to control the opening and closing of the vacuum air path and adjust the vacuum value separately. Furthermore, the vacuum air paths of the vacuum heating stage 111 and the vacuum chuck 101 are each provided with a pressure gauge for reading the pressure value. In a specific embodiment, a vacuum air pipe quick connector 113, a vacuum pressure gauge 107, and a fork switch 106 are respectively provided on the left and right sides of the device base plate 108. The left vacuum air pipe quick connector 113 is connected to the vacuum heating stage 111 with a heat-resistant air pipe, and the right vacuum air pipe quick connector 113 is connected to the vacuum chuck 101; the left vacuum pressure gauge 107 displays the pressure value of the vacuum heating stage 111, and the right vacuum pressure gauge 107 displays the pressure value of the vacuum chuck 101; the left fork switch 106 controls the vacuum air path of the vacuum heating stage 111, and the right fork switch 106 controls the vacuum air path of the vacuum chuck 101.

[0023] During operation, place the wafer / material on the heated vacuum stage 111, turn on the left fork switch 106, and allow the heated vacuum stage 111 to firmly adsorb the substrate material on the wafer / material through vacuum adsorption. According to the melting point of different bonding materials, the temperature of the vacuum heating stage 111 is controlled by the external temperature control module to melt the bonding material. Then, adjust the movable slide 105 to achieve the forward and backward movement of the wafer carrier 102, and adjust the slide 103 to achieve the up and down movement of the wafer carrier 102, so that the wafer carrier 102 moves to the appropriate position, turn on the right fork switch 106, hold the vacuum suction cup 101 close to the wafer / material, and when the vacuum pressure gauge 107 shows that the pressure value meets the standard, manually push the wafer / material to move it to the wafer carrier 102, close the right fork switch, drop the wafer, and complete the operation.

[0024] In a specific embodiment, an adjustment foot 109 is provided below the equipment base plate 108 for adjusting the overall stability of the equipment.

Claims

1. A manual film pushing device, characterized in that: It includes an equipment base plate, a vacuum suction cup, a wafer holding table and a vacuum heating carrier. The vacuum heating carrier is installed on the equipment base plate through a vacuum heating carrier mounting connecting column. A heating mica sheet and a temperature-sensing thermocouple are provided in the vacuum heating carrier, and the temperature is controlled by an external temperature control module; the vacuum heating carrier and the vacuum suction cup are respectively provided with a vacuum air path, and the vacuum air path is provided with a control switch for controlling the on and off of the vacuum air path; the wafer holding table is connected to the equipment base plate through a sliding adjustment device, and the sliding adjustment device is used to complete the wafer dropping by adjusting the front, rear, upper and lower positions of the wafer holding table.

2. The manual film pushing device according to claim 1, characterized in that: The sliding adjustment device includes a movable slide and an adjusting slide. The bottom surface of the movable slide is connected to the bottom plate of the equipment. A slide bracket is provided on the slider of the movable slide. The adjusting slide is provided on the slide bracket. The wafer support table is connected to the adjusting slide through the support table base. The movable slide is used to adjust the front and rear positions of the wafer support table, and the adjusting slide is used to adjust the upper and lower positions of the wafer support table.

3. The manual film pushing device according to claim 1, characterized in that: The vacuum air passages of the vacuum heating stage and the vacuum suction cup are both provided with pressure gauges.

4. The manual film pushing device according to claim 1, characterized in that: An annular groove is provided on the surface of the vacuum heating stage, and the annular groove is connected to the vacuum air path in the vacuum heating stage.

5. The manual film pushing device according to claim 1, characterized in that: A vacuum air pipe quick-connect connector is provided on the bottom plate of the equipment, and the vacuum air pipe quick-connect connector is used to connect the vacuum air path of the vacuum heating stage and the vacuum suction cup.

6. The manual film pushing device according to claim 1, characterized in that: The control switch is a fork switch, and the fork switch is arranged on the equipment bottom plate.

7. The manual film pushing device according to claim 1, characterized in that: Adjustable feet are provided below the equipment bottom plate.

8. The manual film pushing device according to claim 1, characterized in that: The vacuum heating stage is surrounded by protective rings.

9. The manual film pushing device according to claim 1, characterized in that: The wafer stage is made of polytetrafluoroethylene.

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