Ejector pin mechanism and device for separating chip from mucosa and production line of ejector pin mechanism and device

Abstract

The utility model particularly relates to an ejector pin mechanism and device for separating a chip from a mucosa and a production line of the ejector pin mechanism, and the ejector pin mechanism is used for sequentially jacking through a first jacking surface and a second jacking surface which are respectively arranged on the X-direction central axis and the Y-direction central axis of a to-be-jacked plane of the chip, so that the technical problem that glue residues are easily caused by a non-pinpoint-shaped ejector pin is solved. Therefore, the situation that the adhesive film is punctured or the chip is damaged due to the fact that too large pressure is generated when the ejector pin is jacked up can be avoided, the adhesive can be prevented from remaining on the chip, and the yield of the chip is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, and in particular to an ejector mechanism and device for separating a chip from a mucous membrane, and a production line thereof. Background Art

[0002] In the field of semiconductor packaging and testing, wafers are often attached to a mucus membrane during the dicing process to prevent damage to the chips. After the wafer is diced into chips, ejector pins and a suction mechanism are typically used to peel the chips from the mucus membrane.

[0003] For example, patent application CN118352290A, which describes an ejector pin device capable of automatically detecting ejection force, points out that the small active area of ​​the ejector pin tip during chip ejection can easily damage the adhesive membrane, leaving adhesive residue on the chip and even causing chip damage. To address this technical issue, this patented utility model provides an ejector pin device that detects ejection force and utilizes a cam to control the ejection angle, thereby reducing the probability of chip damage.

[0004] In reality, the chip ejection process faces two major technical challenges. The first is the contact pressure of the ejector pin on the chip. When the needle's contact area is small, according to the pressure formula p = F / S, the ejector pin's pressure increases, which can easily cause mucosal puncture or chip damage. The second is the adhesion between the chip and the mucosa. Increasing the needle's contact area reduces the pressure on the chip, avoiding mucosal puncture or chip damage. However, the increased contact area prevents the mucosa from being pushed away at the contact point between the ejector pin and the chip, making it difficult to push away the mucosa. This can easily lead to adhesive residue on the chip, affecting subsequent chip processing. For example, although the aforementioned patent application improves the flexibility of the ejector pin through measurement and force adjustment, the contact area of ​​the ejector pin remains unchanged. This means that the problem of excessive ejector pin pressure on the chip still exists, which can still lead to mucosal puncture or chip damage. Utility Model Content

[0005] The utility model addresses the technical problem in the prior art that it is difficult to achieve the best of both worlds in terms of pressure and adhesive residue when a chip is lifted by a pin, and provides a pin mechanism, a device and a production line for separating a chip from a mucous membrane, which at least have the advantages of being safe and reliable during the lifting process and having little adhesive residue.

[0006] First aspect

[0007] The utility model provides an ejector mechanism for separating a chip from a mucous membrane, comprising: an ejector module and a drive assembly;

[0008] The ejector module includes a first ejector member and a second ejector member, one end of each of the first ejector member and the second ejector member is connected to the drive assembly, and the other end thereof is respectively provided with a first lifting surface and a second lifting surface parallel to the plane to be lifted of the chip, the first lifting surface is located on the Y-axis of the plane to be lifted, and the second lifting surface is located on the X-axis of the plane to be lifted, and is symmetrically arranged on both sides of the first lifting surface;

[0009] Driven by the driving assembly, the first ejector member and the second ejector member are lifted up in sequence.

[0010] Specifically, one of the main concepts of the present invention is to solve the technical problem that non-needle-pointed ejectors easily cause adhesive residue by sequentially lifting the chip using the first and second lifting surfaces respectively set on the X and Y central axes of the chip's plane to be lifted. This can ensure that the lifting of the ejector pins does not generate excessive pressure that may cause puncture of the mucous membrane or damage to the chip, and can also avoid adhesive residue on the chip, thereby ensuring the chip's yield rate.

[0011] Optionally, the adhesive film includes blue film, UV film and other electronic-grade tapes used for wafer cutting protection.

[0012] Optionally, there is no particular order in which the first ejector pin and the second ejector pin are lifted up.

[0013] Preferably, the first lifting surface is in the shape of an elongated Chinese character "I".

[0014] Preferably, the second lifting surface is two elongated "I" shapes perpendicular to the first lifting surface, forming a "X" shape on the projection plane.

[0015] Preferably, the length of the first lifting surface is 135um to 155um; the length of any section of the second lifting surface is 90um to 110um.

[0016] It is worth understanding that, with the continuous development of chip technology, the size of chips is getting smaller and smaller, and the above-mentioned size design is more suitable for lifting rectangular chips.

[0017] Optionally, the end portion of the first ejector member located on the first lifting surface is configured to be in a wedge shape that gradually narrows from wide;

[0018] The end portion of the second ejector pin located on the second lifting surface is configured to be in a wedge shape that gradually narrows from wide.

[0019] Optionally, the driving assembly includes a driving motor, a base body, a main driving rod disposed in the middle of the base body, and slave driving rods disposed on both sides of the main driving rod;

[0020] One end of the main driving rod and the slave driving rod are respectively connected to the driving motor, and the other ends thereof are respectively used to connect to the first ejector part and the second ejector part.

[0021] In some embodiments, when the first lifting surface and the second lifting surface are lifted up respectively in the order of first driving the first lifting surface and then driving the second lifting surface;

[0022] The lifting height of the second lifting surface is greater than the upgrading height of the first lifting surface.

[0023] Specifically, when the second lifting surface and the first lifting surface are lifted up respectively in the order of first driving the second ejector pin and then driving the first ejector pin; the lifting height of the first lifting surface is greater than the lifting height of the second lifting surface, that is, the lifting height of the lifting surface of the ejector pin lifted up later is higher than the lifting height of the lifting surface of the ejector pin lifted up first, so that the lifting surface lifted up later can peel off the adhesive portion between the chip and the mucosa of the lifting surface lifted up first, thereby avoiding the generation of adhesive residue when the long-faced ejector is used in the utility model.

[0024] In a second aspect, the present invention provides a pin device for separating a chip from a mucous membrane, comprising a pin mechanism for separating a chip from a mucous membrane provided by any embodiment of the first aspect. The pin device comprises: a base, a transmission line, an adsorption component, and an electrical control unit;

[0025] The base is used for installing the ejector mechanism, transmission line and adsorption assembly;

[0026] The transmission line is used for transporting chips;

[0027] The electric control unit is used to control the ejector mechanism, transmission line and adsorption component to operate according to a set program;

[0028] The ejector mechanism is arranged at a transmission node of the transmission line, and the ejector module is aligned with the chip transported to the transmission node.

[0029] The adsorption component is used for adsorbing the chip.

[0030] Specifically, the ejector mechanism provided in the first aspect is primarily used for lifting chips. Therefore, the ejector mechanism has a specific application scenario, requiring the chips flowing through the ejector mechanism to be sequentially lifted and adsorbed during sequential chip transport, thereby separating the chips from the mucous membrane and facilitating subsequent chip processing. It is worth noting that the ejector device provided by the present invention includes an ejector mechanism, a base, a transmission line, an adsorption assembly, and an electrical control unit. The coordination and control of these components achieves separation of the chip from the mucous membrane.

[0031] Furthermore, after one of the first ejector pin and the second ejector pin is lifted up, the adsorption assembly adsorbs the chip, and then the other ejector pin is lifted up.

[0032] Specifically, the present invention employs a secondary lifting operation, with the second lifting surface being higher than the first. To prevent the first-separated mucosa from re-adhering to the second-lifted surface, an adsorption component is first used to absorb the lifted chip. This prevents the second-lifted surface from re-adhering to the mucosa and causing adhesive adhesion. Therefore, this embodiment ensures that there is essentially no adhesive residue after the chip and mucosa are separated.

[0033] In a third aspect, the present invention provides a production line for separating a chip from a mucous membrane, comprising a pin device for separating a chip from a mucous membrane as provided in any embodiment of the second aspect.

[0034] Specifically, chip manufacturing involves a lengthy production process, including wafer processing, oxidation, photolithography, etching, thin-film deposition, interconnection, testing, and packaging. Separating the chip from the membrane using a pin is only one step in the testing process. Therefore, the present invention can be applied to the entire chip manufacturing line.

[0035] In summary, the present invention provides a pin mechanism, device, and production line for separating a chip from a mucous membrane, which have at least the following advantages:

[0036] 1. By sequentially lifting the chip along the X and Y axis of the plane to be lifted, the first and second lifting surfaces are respectively set to solve the technical problem of non-needle-pointed ejectors easily causing adhesive residue. This can ensure that the ejection of the ejector pins does not generate excessive pressure that may cause mucous membrane puncture or chip damage, and prevent adhesive residue on the chip, thereby ensuring the chip yield.

[0037] 2. By setting the lifting height of the lifting surface of the ejector pin that is lifted later to be higher than that of the lifting surface of the ejector pin that is lifted earlier, the lifting surface that is lifted later can peel off the adhesive between the chip and the mucous membrane on the lifting surface that is lifted earlier, thereby avoiding the generation of adhesive residue when the long-surface ejector pin is used in the utility model;

[0038] 3. It also provides an application scenario suitable for the ejector mechanism, which makes the utility model have broad application prospects and has practical significance for improving the yield rate of chips and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention will be described in further detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will appreciate that these drawings are drawn only for the purpose of explaining the preferred embodiments and should not be construed as limiting the scope of the present invention. Furthermore, unless otherwise specified, the drawings are merely schematic representations of the composition or structure of the depicted objects and may contain exaggerated representations. Furthermore, the drawings are not necessarily drawn to scale.

[0040] Figure 1 A schematic structural diagram of a pin mechanism for separating a chip from a mucous membrane provided by an embodiment of the present utility model;

[0041] Figure 2 A schematic diagram of the lifting surface of the ejector module provided by an embodiment of the present utility model;

[0042] Figure 3 A schematic diagram of the working of the ejector module provided by an embodiment of the present utility model;

[0043] 1. Chip; 2. Mucous membrane; 3. Ejector module; 4. Drive assembly; 31. First ejector component; 32. Second ejector component; 41. Drive motor; 42. Base; 43. Main drive rod; 44. Slave drive rod; 311. First lifting surface; 321. Second lifting surface. DETAILED DESCRIPTION

[0044] The following is combined with Figures 1 to 3 , the utility model is described in detail.

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0046] It is worth noting that the embodiments of the present invention use ordinal numbers such as "first" and "second" to distinguish between multiple objects, and are not used to limit the order, timing, priority or importance of multiple objects. For example, the "first ejector part 31" and the "second ejector part 32" are only for the convenience of description, and do not indicate the difference in order, importance, etc. between the "first ejector part 31" and the "second ejector part 32". In addition, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection; wherein, "connection" can also be a direct connection or an indirect connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0047] The main idea of ​​the present invention is to separately lift the chip 1 in sequence by providing a first lifting surface 311 and a second lifting surface 321 on the X-axis and Y-axis of the surface to be lifted, thereby solving the technical problems that a needle-shaped ejector easily punctures the mucosa 2, damages the chip 1, and causes adhesive adhesion after the chip 1 is separated from the mucosa 2.

[0048] In order to further explain the technical solution provided by this utility model, please refer to Figure 1 The figure shows a schematic structural diagram of a pin mechanism for separating a chip 1 from a mucous membrane 2 provided by an embodiment of the present invention.

[0049] Specifically, the ejector mechanism provided by the present invention is used in the test link of chip 1 production. After the wafer is cut into chips 1, the chip 1 is circulated on the transportation line. In order to separate the chip 1 from the protective mucous film 2 before the chip 1 is cut, an ejector mechanism is usually used in conjunction with an adsorption component to separate the chip 1 from the mucous film 2. The ejector mechanism is arranged below the transmission line of the chip 1. When the chip 1 flows through the ejector mechanism, the ejector mechanism starts to work. Based on the figure, the ejector mechanism provided by the present invention includes an ejector module 3 and a drive component 4. The drive component 4 is used to drive the ejector module 3 to achieve the lifting operation. The ejector module 3 includes a first ejector part 31 and a second ejector part 32. One end of the first ejector part 31 is connected to the drive component 4, and the other end is set to a first lifting surface 311 parallel to the surface to be lifted of the chip 1. Similarly, one end of the second ejector part 32 is connected to the drive component 4, and the other end is set to a second lifting surface 321 parallel to the surface to be lifted of the chip 1. Please refer to Figure 2 As shown ( Figure 2 This is a schematic diagram of the lifting surface of the ejector module 3 provided in the embodiment of the present utility model. Figure 1 Since it is a front view, it is not possible to represent the lifting surface, so it is supplemented Figure 2 Based on the top view of the Figure 2As shown, the first lifting surface 311 is disposed on the Y-axis of the surface to be lifted of the chip 1 (the dotted line indicated by the letter Y); while the second lifting surface 321 is disposed on the X-axis and symmetrically distributed on both sides of the first lifting surface 311. It is worth noting that, compared to traditional needle-shaped ejectors, the provision of the first and second lifting surfaces 311, 321 can effectively increase the lifting area of ​​the first and second ejector components 31, 32. Therefore, according to the pressure formula P = F / S, it can be seen that the pressure applied by the first and second ejector components 31, 32 when lifting the chip 1 is greatly reduced, thereby effectively avoiding the problem of the first and second ejector components 31, 32 applying excessive pressure to the chip 1 during lifting, which may cause damage to the chip 1. However, when the lifting area of ​​the ejector pin increases, another problem will arise: the chip 1 at the lifting surface is still adhered to the mucosa 2, which makes it difficult for the adsorption component (not shown) to absorb the chip 1 or the adhesive on the lifting surface is likely to remain. Therefore, the ejector pin module 3 of the present invention adopts a step-by-step lifting method. First, the chip 1 is lifted by the first lifting surface 311 of the Y-axis, so that the adhesion between the chip 1 and the mucosa 2 is only the chip 1 area corresponding to the first lifting surface 311, and the adhesion between the chip 1 and the mucosa 2 in other areas is pushed open. Then, the chip 1 is lifted by the second lifting surface 321 of the X-axis, so that the adhesion between the chip 1 area corresponding to the first lifting surface 311 is pushed open, so that there is no adhesion area between the chip 1 and the mucosa 2, thereby avoiding the problem of adhesive residue on the chip 1 after the adsorption component absorbs the chip 1.

[0050] Optionally, the lifting order of the first lifting surface 311 and the second lifting surface 321 is not followed in any order, that is, the chip 1 is first lifted by the second lifting surface 321, and then the adhesion point between the chip 1 and the mucosa 2 at the second lifting surface 321 is lifted by the first lifting surface 311, which can achieve the same technical effect as provided in the above embodiment.

[0051] Optionally, the first lifting surface 311 is in the shape of an elongated "I". It is worth noting that the narrow "I"-shaped first lifting surface 311 has achieved the purpose of reducing the pressure when the first ejector tip lifts the chip 1. Other lifting surface forms such as diamond shapes can also be used to achieve the purpose of reducing pressure, but the change in area will cause the adhesion area between the mucous membrane 2 and the UV film in the chip 1 area corresponding to the first lifting surface 311 to increase. Although the adhesion area of ​​the first lifting surface 311 can be lifted and separated by the second lifting surface 321, the probability of adhesive residue increases as the adhesion area increases. Therefore, the narrow "I"-shaped first lifting surface 311 can achieve the purpose of reducing pressure and reducing the lifting adhesion area.

[0052] Optionally, the second lifting surface 321 is two slender "I" shapes perpendicular to the first lifting surface 311, forming a "X" shape on the projection plane, for the reasons mentioned above. It is worth understanding that the second lifting surfaces 321 are symmetrically distributed on both sides of the first lifting surface 311, and can be diamond-shaped, triangular-shaped or other various shapes, but the narrow "I" shape is the optimal structural design. In addition, both the first lifting surface 311 and the second lifting surface 321 are arranged at the central axis of the surface to be lifted of the chip 1 to enhance the stability of the first lifting surface 311 and the second lifting surface 321 when lifting the chip 1.

[0053] Optionally, the length of the first lifting surface 311 is 135um to 155um; the length of any section of the second lifting surface 321 is 90um to 110um. It is worth noting that with the continuous advancement of chip 1 technology, the size of chips 1 is becoming smaller and smaller, and the above-mentioned dimensional design is more suitable for lifting rectangular chips 1. Therefore, the dimensions here are suitable for lifting chips 1 of the current size. However, if the size of the chip 1 changes, the lengths of the first lifting surface 311 and the second lifting surface 321 can be adaptively adjusted.

[0054] Optionally, the end of the first ejector pin 31 located on the first lifting surface 311 is set to a wedge shape that gradually narrows from wide; the end of the second ejector pin 32 located on the second lifting surface 321 is set to a wedge shape that gradually narrows from wide, so that the lifting surface can better apply pressure to the chip 1 when it is raised.

[0055] Optionally, the drive assembly 4 includes a drive motor 41, a base, a main drive rod 43 disposed in the middle of the base, and slave drive rods 44 disposed on both sides of the main drive rod 43; one end of the main drive rod 43 and the slave drive rod 44 are respectively connected to the drive motor 41, and the other ends thereof are respectively used to connect the first ejector member 31 and the second ejector member 32. Specifically, when it is necessary to lift the first ejector member 31, the main drive rod 43 pushes up the first ejector member 31 connected thereto, so that the first ejection surface 311 lifts the chip 1; when it is necessary to lift the second ejector member 32, the slave drive rods 44 on both sides push up the second ejector member 32 connected thereto, so that the second ejection surface 321 lifts the chip 1.

[0056] In some embodiments, when the first lifting surface 311 and the second lifting surface 321 are lifted up in the order of first driving the first lifting surface 311 and then driving the second lifting surface 321 , the lifting height of the second lifting surface 321 is greater than the lifting height of the first lifting surface 311 .

[0057] In order to explain the working process of this utility model in detail, please refer to Figure 3 FIG. 1 is a schematic diagram showing the operation of the ejector module 3 provided in an embodiment of the present utility model.

[0058] Specifically, Figure 3 (a) is the state before the chip 1 is lifted. At this time, the first ejector 31 and the second ejector 32 are both in the non-elevated state, and the chip 1 is also adhered to the mucosa 2. When the chip 1 flows to the top of the lifting mechanism, the first ejector 31 starts to work. Figure 3 As shown in (b), the driving component 4 drives the main driving rod 43 upward, thereby lifting the first ejector part 31, and then the first lifting surface 311 at the end of the first ejector part 31 pushes the mucosa 2 upward. Since the first lifting surface 311 is set on the Y-axis, the chip 1 is lifted up and separated from the adhesion of the mucosa 2, and only the chip 1 corresponding to the area lifted by the first lifting surface 311 remains adhered to the mucosa 2. At this time, the adsorption component intervenes to adsorb the chip 1, but does not directly peel the chip 1 from the mucosa 2, to avoid the generation of glue residue in the area corresponding to the first lifting surface 311. After the adsorption component adsorbs the chip 1, the driving component 4 drives the slave driving rods 44 on both sides to lift up, as shown. Figure 3 As shown in (c) of the figure, the second lifting surface 321 of the second ejector 32 further lifts the mucosa 2. As a result, the suction assembly retains the chip 1, disengaging the chip 1 from the mucosa 2 in the area corresponding to the first lifting surface 311. This completely separates the chip 1 from the mucosa 2, and the suction assembly finally removes the chip 1. Since there is no longer any adhesion between the chip 1 and the mucosa 2, no adhesive residue remains on the chip 1 after the suction assembly has completely absorbed the chip 1.

[0059] In some embodiments, the present invention provides a pin device for separating a chip 1 from a mucous membrane 2, comprising: a base 42, a transmission line, an adsorption assembly and an electrical control unit; the base 42 is used for installing the pin mechanism, the transmission line and the adsorption assembly; the transmission line is used for conveying the chip 1; the electrical control unit is used to control the pin mechanism, the transmission line and the adsorption assembly to operate according to a set program; the pin mechanism is arranged at a transmission node of the transmission line, and the pin module 3 is aligned with the chip 1 conveyed to the transmission node; the adsorption assembly is used to adsorb the chip 1.

[0060] Specifically, the ejector mechanism provided in the first aspect is primarily used to lift chips 1. Therefore, the ejector mechanism has a specific application scenario, requiring the chips 1 to be sequentially lifted and adsorbed as they pass through the ejector mechanism during sequential transmission, thereby separating the chips 1 from the mucous membrane 2 and facilitating subsequent processing of the chips 1. It is worth noting that the ejector device provided by the present invention includes an ejector mechanism, a base 42, a transmission line, an adsorption assembly, and an electrical control unit. The separation of the chip 1 from the mucous membrane 2 is achieved through the coordination and control of these components.

[0061] Furthermore, after one of the first ejector pin 31 and the second ejector pin 32 is lifted up, the adsorption assembly adsorbs the chip 1 , and then the other ejector pin is lifted up.

[0062] Specifically, the present invention employs a secondary lifting operation, with the second lifting surface being higher than the first. To prevent the first-separated mucosa 2 from re-adhering to the second-lifted surface, an adsorption component is first used to absorb the lifted chip. This prevents the second-lifted surface from re-adhering to the mucosa 2 and causing adhesive adhesion. Therefore, this embodiment ensures that after the chip 1 and mucosa 2 are separated, there is essentially no adhesive residue.

[0063] In some embodiments, the present invention provides a production line for separating chip 1 from mucous membrane 2. Specifically, chip 1 manufacturing involves a lengthy production process, including wafer processing, oxidation, photolithography, etching, thin film deposition, interconnection, testing, and packaging. Using a pin device to separate chip 1 from mucous membrane 2 is merely one step in the testing process. Therefore, the present invention can be applied to the entire chip 1 manufacturing line.

[0064] The present invention has been described in detail above. Specific examples have been used in the present invention to illustrate the principles and implementation methods of the present invention. The description of the above examples is only intended to help understand the present invention and its core concept. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A ejector mechanism for separating a chip from a mucous membrane, characterized in that: include: Ejector module (3) and drive assembly (4); The ejector module (3) includes a first ejector member (31) and a second ejector member (32), one end of each of the first ejector member (31) and the second ejector member (32) is connected to the driving assembly (4), and the other ends thereof are respectively provided with a first ejection surface and a second ejection surface parallel to the plane to be ejected of the chip, the first ejection surface is located on the Y-axis of the plane to be ejected, and the second ejection surface is located on the X-axis of the plane to be ejected, and is symmetrically arranged on both sides of the first ejection surface; Driven by the driving assembly (4), the first ejector member (31) and the second ejector member (32) are lifted up in sequence.

2. The ejector mechanism for separating a chip from a mucous membrane according to claim 1, characterized in that: The first lifting surface is in the shape of an elongated letter "I".

3. The ejector mechanism for separating a chip from a mucous membrane according to claim 2, characterized in that: The second lifting surface is two elongated "I" shapes perpendicular to the first lifting surface, and forms a "X" shape with the first lifting surface on the projection plane.

4. The ejector mechanism for separating a chip from a mucous membrane according to claim 3, characterized in that: The length of the first lifting surface is 135um to 155um; the length of any section of the second lifting surface is 90um to 110um.

5. The ejector mechanism for separating a chip from a mucous membrane according to claim 3, characterized in that: The end portion of the first ejector pin (31) located on the first lifting surface is configured to be in a wedge shape that gradually narrows from wide; The end portion of the second ejector needle (32) located on the second lifting surface is configured to be in a wedge shape that becomes narrower from wide.

6. The ejector mechanism for separating a chip from a mucous membrane according to claim 3, characterized in that: The driving assembly (4) comprises a driving motor (41), a seat, a main driving rod (43) arranged in the middle of the seat, and slave driving rods (44) arranged on both sides of the main driving rod (43); One end of the main driving rod (43) and the slave driving rod (44) are respectively connected to the driving motor (41), and the other ends thereof are respectively used to connect the first ejector pin (31) and the second ejector pin (32).

7. The ejector mechanism for separating a chip from a mucous membrane according to claim 1, characterized in that: When the first ejection needle member (31) is driven first and the second ejection needle member (32) is driven later to respectively eject the first ejection surface and the second ejection surface; The lifting height of the second lifting surface is greater than the lifting height of the first lifting surface.

8. A chip and mucous membrane separation ejector device, comprising a chip and mucous membrane separation ejector device according to any one of claims 1 to 7, characterized in that: include: A base (42), a transmission line, an adsorption assembly, and an electrical control component; The base (42) is used for installing the ejector mechanism, transmission line and adsorption assembly; The transmission line is used for transporting chips; The electric control unit is used to control the ejector mechanism, transmission line and adsorption component to operate according to a set program; The ejector mechanism is arranged at a transmission node of the transmission line, and the ejector module (3) is aligned with the chip transported to the transmission node; The adsorption component is used for adsorbing the chip.

9. The ejector pin device for separating a chip from a mucous membrane according to claim 8, characterized in that: After one of the first ejector pin (31) and the second ejector pin (32) is lifted up, the adsorption assembly adsorbs the chip, and then the other ejector pin is lifted up.

10. A chip and mucosa separation production line, characterized in that: It comprises a ejector pin device for separating a chip from a mucous membrane as described in claim 8 or 9.

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