Heat dissipation structure of square heat source flow chip

Abstract

The utility model belongs to the technical field of chip heat dissipation, and particularly relates to a square heat source flow chip heat dissipation structure which comprises a substrate used for bearing a flow chip, a mounting block is fixedly connected right above the substrate, and a heat dissipation mechanism is arranged in the mounting block; the heat dissipation mechanism is arranged, and the heat dissipation plate is directly attached to the heat source flow chip, so that effective transfer and rapid dissipation of heat are guaranteed, air circulation flow in the installation cavity is achieved, continuity of the heat dissipation effect is guaranteed, the heat dissipation area is enlarged, air flow resistance is reduced, the heat can be taken away more rapidly and effectively, and the heat dissipation efficiency is improved. The problem that the chip is damaged or the performance is reduced due to overheating is avoided, the air inlet is connected with the air source, the chip is effectively prevented from being overheated, and the stability and the reliability of equipment are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a square-shaped heat source flow chip heat dissipation structure. Background Art

[0002] Heat source flow chips generally refer to electronic chips that generate heat during operation and need to process certain flow data. These chips are commonly found in various electronic devices such as computers, servers, routers, switches, data centers, etc. They generate high heat when processing large amounts of data or performing complex tasks.

[0003] In actual use, the heat source flow chip dissipates heat naturally through the heat conduction structure. The heat dissipation efficiency of the heat conduction structure alone is low, and it is difficult to quickly remove the heat from the heat source flow chip. This can easily cause the chip to be damaged or its performance to degrade due to overheating, making it difficult to ensure the stability and reliability of the chip performance.

[0004] In view of the above technical defects, a solution is now proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a U-shaped heat source flow chip heat dissipation structure. Through the heat dissipation structure, the heat dissipation area is further expanded, the air flow resistance is reduced, so that heat can be taken away faster and more effectively, avoiding the problem of chip damage or performance degradation due to overheating.

[0006] The purpose of the utility model can be achieved by the following technical solutions: a U-shaped heat source flow chip heat dissipation structure, comprising a base plate for carrying the flow chip, a mounting block fixedly connected just above the base plate, and a heat dissipation mechanism provided in the mounting block;

[0007] The heat dissipation mechanism includes a heat dissipation plate that passes through the mounting block and is attached to the chip on the substrate, two symmetrically arranged connecting strips are fixedly connected to the upper surface of the heat dissipation plate, a plurality of fins 1 are fixedly connected to the opposite sides of the two connecting strips, and a plurality of fins 2 are fixedly connected to the opposite sides of the two connecting strips, a mounting cavity is provided on the upper surface of the mounting block, a cover plate is fixedly connected to the upper surface of the mounting block, an air inlet is provided at one end of the mounting block, and an air outlet is provided at the end of the mounting block away from the air inlet.

[0008] Preferably, the connecting strips are arranged obliquely, a plurality of the fins 1 are arranged at intervals on opposite sides of the two connecting strips along the vertical direction, and a plurality of the fins 2 are arranged at intervals on opposite sides of the two connecting strips along the horizontal direction.

[0009] Preferably, two symmetrically arranged fins three are fixedly connected to the upper surface of the heat dissipation plate, and a gap for air flow is provided between the two fins three.

[0010] Preferably, a frame 1 is connected to the side of the inner wall of the installation cavity close to the air inlet, a filter is embedded in the inner wall of the frame 1, and a frame 2 corresponding to the frame 1 is connected to the end of the base plate away from the air inlet.

[0011] Preferably, the upper surface of the base plate is fixedly connected with connecting posts, four of which are provided and distributed in a matrix, and the outer wall of the mounting block is fixedly connected with connecting pieces corresponding to the connecting posts.

[0012] Preferably, the base plate is provided with two symmetrically arranged air ducts along the direction of the air inlet, the outer wall of the mounting block away from the air inlet is fixedly connected to a connecting bin, the inner wall of the mounting cavity is provided with a through groove connected to the connecting bin, the connecting bin is connected with a connecting pipe, and the end of the connecting pipe away from the connecting bin is connected to the air duct.

[0013] Beneficial effects of the utility model:

[0014] (1) The utility model sets a heat dissipation mechanism, and the heat dissipation plate is directly attached to the heat source flow chip, which ensures the effective transfer and rapid dissipation of heat. The design of the air inlet and outlet, in conjunction with the fan, realizes the air circulation flow in the installation cavity, ensuring the continuity of the heat dissipation effect. The connecting strip, fin 1 and fin 2 further expand the heat dissipation area. At the same time, the arrangement of fin 1 and fin 2 reduces the air flow resistance, so that the heat can be taken away faster and more effectively, avoiding the problem of chip damage or performance degradation due to overheating, and improving the stability and reliability of the equipment;

[0015] (2) By connecting the air inlet to the air source, the air in the installation cavity can move into the air duct through the connecting compartment and the connecting pipe, thereby achieving rapid heat dissipation of the substrate, further improving the heat dissipation effect, achieving efficient heat dissipation, and effectively preventing the chip from overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings;

[0017] Figure 1 The utility model has an overall structure of three-dimensional Figure 1 ;

[0018] Figure 2 This is a side view of the structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the mounting block of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the connecting warehouse of the utility model;

[0021] Figure 5 It is a schematic structural diagram of the heat dissipation plate of the present utility model.

[0022] Legend: 1. Base plate; 2. Mounting block; 3. Cover plate; 4. Connecting column; 5. Connecting piece; 6. Air inlet; 7. Connecting compartment; 8. Connecting pipe; 9. Air duct; 10. Mounting cavity; 11. Heat sink; 12. Connecting strip; 13. Fin three; 14. Fin one; 15. Fin two; 16. Frame two; 17. Frame one. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Example 1:

[0025] This embodiment is used to solve the problem that the heat dissipation efficiency of the heat-conducting structure is low, which makes it difficult to quickly remove the heat from the heat source flow chip, easily causing the chip to be damaged or the performance to degrade due to overheating, and it is difficult to ensure the stability and reliability of the chip performance.

[0026] See also Figure 1 - Figure 5 As shown, this embodiment is a U-shaped heat source flow chip heat dissipation structure, comprising a substrate 1 for carrying the flow chip, a U-shaped groove for chip installation is provided on the substrate, a mounting block 2 is fixedly connected directly above the substrate 1, and a heat dissipation mechanism is provided in the mounting block 2;

[0027] The heat dissipation mechanism includes a heat sink 11 that passes through the mounting block 2 and is bonded to the chip on the substrate 1. Heat is dissipated through the heat sink 11 bonded to the heat source flow chip. Two symmetrically arranged connecting bars 12 are fixedly connected to the upper surface of the heat sink 11. A plurality of fins 14 are fixedly connected to the opposite sides of the two connecting bars 12. A plurality of fins 15 are fixedly connected to the opposite sides of the two connecting bars 12. The connection bars 12, fins 14, and fins 15 increase the heat dissipation area, thereby improving the heat dissipation efficiency.

[0028] An installation cavity 10 is provided on the upper surface of the installation block 2, a cover plate 3 is fixedly connected to the upper surface of the installation block 2, an air inlet 6 is provided at one end of the installation block 2, and an air outlet is provided at the end of the installation block 2 away from the air inlet 6. When the air inlet 6 is connected to the air source, the air source includes a fan, which can move air into the installation cavity 10 and quickly flow out from the end of the installation cavity 10 away from the air inlet 6, so that the air can quickly take away the heat on the connecting strip 12, and can effectively realize the heat dissipation of the U-shaped heat source flow chip to prevent the chip from overheating.

[0029] The connecting strips 12 are arranged at an angle, and a plurality of fins 14 are arranged at intervals along the vertical direction on opposite sides of the two connecting strips 12, and a plurality of fins 2 15 are arranged at intervals along the horizontal direction on the opposite sides of the two connecting strips 12, further expanding the heat dissipation area. The fins 14 and fins 2 15 extend along the direction of air flow in the installation cavity 10, which can reduce air resistance and make the air flow quickly between multiple adjacent fins 1 14 and multiple adjacent fins 2 15, thereby quickly taking away the heat on the fins 14 and fins 2 15.

[0030] Two symmetrically arranged fins 13 are fixedly connected to the upper surface of the heat sink 11, and a gap for air flow is provided between the two fins 13. The gap between the two fins 13 facilitates the flow of air between the two fins 13, further ensuring the rapid flow of air in the installation cavity 10.

[0031] A frame 1 is connected to the side of the inner wall of the installation cavity 10 close to the air inlet 6, and a filter is embedded in the inner wall of the frame 1. By setting the filter, dust can be prevented from entering the installation cavity 10 and being adsorbed on the heat sink 11, fin 14 and fin 2 15, thereby affecting its heat dissipation function. A frame 2 16 corresponding to the frame 1 is connected to the end of the substrate 1 away from the air inlet 6. By setting the corresponding frame 2 16 and the filter, dust can be prevented from entering the installation cavity 10 from the air outlet at the end away from the air inlet 6.

[0032] A connecting column 4 is fixedly connected to the upper surface of the substrate 1. Four connecting columns 4 are provided and distributed in a matrix. A connecting piece 5 corresponding to the connecting column 4 is fixedly connected to the outer wall of the mounting block 2. The end of the connecting column 4 is a threaded structure. The connecting column 4 passes through the through hole on the connecting piece 5, which is convenient for fixing the mounting block 2 by fitting with a nut.

[0033] Example 2:

[0034] This embodiment is used to solve the problem of preventing the chip from transferring heat to the substrate 1 and causing it to overheat.

[0035] See also Figure 1 、 Figure 5As shown, a U-shaped heat source flow chip heat dissipation structure of the present embodiment includes a substrate 1 with two symmetrically arranged air ducts 9 arranged along the direction of the air inlet 6, the outer wall of the mounting block 2 away from the air inlet 6 is fixedly connected to the connecting bin 7, the inner wall of the mounting cavity 10 is provided with a through groove connected to the connecting bin 7, the connecting bin 7 is connected with a connecting pipe 8, and the end of the connecting pipe 8 away from the connecting bin 7 is connected to the air duct 9. When one end of the air inlet 6 is connected to the wind source, the air in the mounting cavity 10 can move into the air duct 9 through the connecting bin 7 and the connecting pipe 8, thereby realizing rapid heat dissipation of the substrate 1 and further improving the heat dissipation effect.

[0036] Combining Example 1 and Example 2

[0037] By setting up a heat dissipation mechanism, the heat sink 11 is directly attached to the heat source flow chip, ensuring the effective transfer and rapid dissipation of heat. The connecting strip 12, fin 14 and fin 2 15 further expand the heat dissipation area. At the same time, their arrangement reduces the air flow resistance, so that heat can be taken away faster and more effectively, avoiding the problem of chip damage or performance degradation due to overheating. At the same time, the end of the connecting pipe 8 away from the connecting chamber 7 is connected to the air duct 9. When one end of the air inlet 6 is connected to the air source, the air in the installation cavity 10 can move into the air duct 9 through the connecting chamber 7 and the connecting pipe 8, thereby realizing rapid heat dissipation of the substrate 1, further improving the heat dissipation effect, achieving efficient heat dissipation effect, effectively preventing chip overheating, and improving the stability and reliability of the equipment.

[0038] like Figure 1 - Figure 5 As shown, the working process and principle of the utility model are as follows:

[0039] Step 1: Connect the air inlet 6 to the air source. Air enters from one end of the air inlet 6 on the mounting block 2 and flows out from the air outlet at the other end of the mounting block 2. When the air flows rapidly between the plurality of adjacent fins 14 and the plurality of adjacent fins 2 15, the heat on the fins 14 and fins 2 15 is quickly removed, thereby quickly cooling the heat transferred from the chip of the heat sink 11.

[0040] Step two, when one end of the air inlet 6 is connected to the air source, the air in the installation cavity 10 can flow into the connecting chamber 7 through the through groove connected to the connecting chamber 7, and move into the air duct 9 through the connecting chamber 7 and the connecting pipe 8, thereby realizing rapid heat dissipation of the substrate 1 and further improving the heat dissipation effect.

[0041] The above content is merely an example and explanation of the structure of the present invention. Those skilled in the art may make various modifications or additions to the described specific embodiments or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the scope of protection of the present invention.

[0042] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0043] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A U-shaped heat source flow chip heat dissipation structure, comprising a substrate (1) for carrying the flow chip, characterized in that: A mounting block (2) is fixedly connected directly above the substrate (1), and a heat dissipation mechanism is provided in the mounting block (2); The heat dissipation mechanism includes a heat dissipation plate (11) that passes through the mounting block (2) and is bonded to the chip on the substrate (1); two symmetrically arranged connecting bars (12) are fixedly connected to the upper surface of the heat dissipation plate (11); a plurality of fins (14) are fixedly connected to the opposite sides of the two connecting bars (12); a plurality of fins (15) are fixedly connected to the opposite sides of the two connecting bars (12); a mounting cavity (10) is provided on the upper surface of the mounting block (2); a cover plate (3) is fixedly connected to the upper surface of the mounting block (2); an air inlet (6) is provided at one end of the mounting block (2); and an air outlet is provided at the end of the mounting block (2) away from the air inlet (6).

2. The U-shaped heat source flow chip heat dissipation structure according to claim 1 is characterized in that: The connecting strips (12) are arranged obliquely, a plurality of the fins 1 (14) are arranged at intervals on opposite sides of the two connecting strips (12) along the vertical direction, and a plurality of the fins 2 (15) are arranged at intervals on opposite sides of the two connecting strips (12) along the horizontal direction.

3. The U-shaped heat source flow chip heat dissipation structure according to claim 1 is characterized in that: Two symmetrically arranged fins three (13) are fixedly connected to the upper surface of the heat dissipation plate (11), and a gap for air flow is provided between the two fins three (13).

4. The U-shaped heat source flow chip heat dissipation structure according to claim 1 is characterized in that: A frame 1 (17) is plugged into the side of the inner wall of the installation cavity (10) close to the air inlet (6), and a filter screen is embedded in the inner wall of the frame 1 (17). A frame 2 (16) corresponding to the frame 1 (17) is plugged into the end of the base plate (1) away from the air inlet (6).

5. The U-shaped heat source flow chip heat dissipation structure according to claim 1 is characterized in that: The upper surface of the base plate (1) is fixedly connected to a connecting column (4), four connecting columns (4) are provided and distributed in a matrix, and the outer wall of the mounting block (2) is fixedly connected to a connecting piece (5) corresponding to the connecting column (4).

6. The U-shaped heat source flow chip heat dissipation structure according to claim 1, characterized in that: The base plate (1) is provided with two symmetrically arranged air ducts (9) along the direction of the air inlet (6); the outer wall of the mounting block (2) at one end away from the air inlet (6) is fixedly connected to a connecting bin (7); the inner wall of the mounting cavity (10) is provided with a through groove communicating with the connecting bin (7); the connecting bin (7) is connected through a connecting pipe (8); and the end of the connecting pipe (8) away from the connecting bin (7) is communicated with the air duct (9).

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