Circuit board and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board and electronic equipment, and the circuit board comprises a substrate, the target surface of which is provided with at least one chip; the substrate is provided with a target surface, the fixing piece is arranged on the substrate, the fixing piece and the target surface form a target area, at least one chip is located in the target area, and the filling agent is arranged in the target area and at least wraps the chip located in the target area.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a circuit board and an electronic device including the circuit board. Background Art

[0002] As the layout of devices in electronic devices becomes more compact, the thickness of electronic devices is getting thinner and thinner. Correspondingly, the thickness of circuit boards in electronic devices is also getting thinner. As a result, when the electronic device is accidentally dropped, the housing of the electronic device is easily deformed, which may cause the pad to fall off or the circuit to break in the high stress area of ​​the circuit board, affecting the performance of the electronic device. Utility Model Content

[0003] In view of this, the present application provides a circuit board and an electronic device including the circuit board, and the scheme is as follows:

[0004] In a first aspect, the present application provides a circuit board, comprising:

[0005] a substrate, wherein a target surface of the substrate is provided with at least one chip;

[0006] A fixing member is provided on the substrate to form a target area with the target surface, and at least one chip is located in the target area.

[0007] A filler is disposed in the target area and at least covers the chip located in the target area.

[0008] Optionally, the fixing member has at least one first positioning hole, and the substrate has at least one first positioning member. The first positioning hole and the first positioning member correspond one to one and are used for positioning between the fixing member and the substrate.

[0009] Optionally, the fixing member is a silicone ring, and the connection between the silicone ring and the substrate is sealed.

[0010] Optionally, the fixing member includes a top cover and a side wall, the side wall of the fixing member is fixedly connected to the substrate, and the top cover of the fixing member has an injection hole and an exhaust hole.

[0011] Optionally, the side wall of the fixing member includes a first side wall and a second side wall fixedly connected, wherein the first side wall is fixedly connected to the top cover, the second side wall is fixedly connected to the substrate, and the second side wall is at least partially parallel to the target surface.

[0012] Optionally, the top cover of the fixing member includes a first portion, a second portion, and a third portion, wherein the distance between the second portion and the substrate is greater than the distance between the first portion and the substrate, and the distance between the third portion and the substrate is greater than the distance between the first portion and the substrate;

[0013] The second portion is provided with the injection hole, and the third portion is provided with the exhaust hole;

[0014] Optionally, the second portion is a concave structure, and the injection hole is located in the concave surface of the second portion;

[0015] A distance between the injection hole and the substrate is greater than a distance between the first portion and the substrate.

[0016] Optionally, the third part is provided with a waterproof breathable membrane corresponding to the exhaust hole, and the waterproof breathable membrane is connected to the third part via adhesive.

[0017] Optionally, the filler is filled into the target area through the injection hole so that the air in the target area is discharged through the exhaust hole. When the filler fills the target area, the filler covers the surface of the chip away from the substrate. The filler is a thermally conductive gel.

[0018] In a second aspect, the present application provides an electronic device, including a circuit board, wherein the circuit board includes:

[0019] a substrate, wherein a target surface of the substrate is provided with at least one chip;

[0020] A fixing member is provided on the substrate to form a target area with the target surface, and at least one chip is located in the target area.

[0021] A filler is disposed in the target area and at least covers the chip located in the target area. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0023] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0024] Figure 1 A schematic structural diagram of a circuit board provided in one embodiment of the present application as viewed from the side of the filler away from the substrate;

[0025] Figure 2 A schematic diagram of the reverse structure of a circuit board provided by one embodiment of the present application, viewed from the side of the substrate away from the filler;

[0026] Figure 3 A schematic structural diagram of a circuit board after a fixing member is assembled onto a target surface of a substrate during the manufacturing process of the circuit board provided in one embodiment of the present application;

[0027] Figure 4 A schematic structural diagram of a substrate assembled with fixings after being assembled onto a jig base during the manufacturing process of a circuit board provided in one embodiment of the present application;

[0028] Figure 5 A schematic diagram of the structure of the substrate, fixture base, and fixture upper cover assembled with the fixing parts during the manufacturing process of the circuit board provided in one embodiment of the present application;

[0029] Figure 6 A schematic diagram of the structure of the circuit board manufacturing process provided by one embodiment of the present application, wherein a dispensing head is used to dispense glue on the assembled structure of the substrate, the fixture base, and the fixture upper cover plate assembled with the fixing parts;

[0030] Figure 7 A schematic diagram of the structure of a circuit board provided in one embodiment of the present application;

[0031] Figure 8 A schematic structural diagram of a circuit board provided in another embodiment of the present application;

[0032] Figure 9 A schematic structural diagram of a fixing member in a circuit board provided in yet another embodiment of the present application;

[0033] Figure 10 A schematic diagram of a structure in which a fixing member is fixed to a substrate in a circuit board provided in yet another embodiment of the present application;

[0034] Figure 11A schematic structural diagram of a fixing member in a circuit board provided in yet another embodiment of the present application;

[0035] Figure 12 A schematic diagram of a partial structure of a fixing member in a circuit board provided in yet another embodiment of the present application;

[0036] Figure 13 A schematic diagram of a partial structure of a fixing member in a circuit board provided in yet another embodiment of the present application;

[0037] Figure 14 A schematic structural diagram of a fixing member in a circuit board provided in yet another embodiment of the present application;

[0038] Figure 15 A cross-sectional view of a circuit board provided in another embodiment of the present application showing a location of a fixing member;

[0039] Figure 16 This is a schematic diagram of pressing a thermally conductive gel filling tube onto a concave, perforated boss on a top cover of a fixing member when the filler is formed in a circuit board provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0043] As described in the background technology section, when an electronic device accidentally falls, the housing of the electronic device is prone to deformation, which may cause pads to fall off or circuits to break in high-stress areas of the circuit board, affecting the performance of the electronic device.

[0044] The applicant's research has discovered that by strengthening the circuit board's external housing structure to avoid or support stress, stress in high-stress areas on the circuit board can be reduced, thereby reducing the probability of excessive stress in these high-stress areas causing pad detachment or circuit breakage of electronic components in these areas of the circuit board. However, this approach does not completely resolve the problem. For example, if stress in high-stress areas of the circuit board is reduced by removing the housing support ribs, the stress in the support ribs in low-stress areas will increase, causing the low-stress areas on the circuit board to become high-stress areas.

[0045] The applicant also discovered that the desoldering of the solder balls at the bottom of the chip can be reduced by applying a filler glue at the bottom of the chip. However, the filler glue at the bottom of the chip can only protect the solder balls at the bottom of the chip from desoldering, and cannot ensure that the chip itself will not break or damage due to stress problems.

[0046] The applicant has also discovered that sealant can be applied to local stress areas of the circuit board to reduce stress in high stress areas of the circuit board. However, in this method, the area and thickness of the sealant application area cannot be precisely controlled.

[0047] In view of this, an embodiment of the present application provides a circuit board, such as Figure 1 As shown, the circuit board includes:

[0048] A substrate 10, wherein a target surface 11 of the substrate 10 is provided with at least one chip;

[0049] a fixing member 20 , the fixing member 20 being disposed on the substrate 10 and forming a target area with the target surface 11 , wherein at least one chip is located in the target area;

[0050] The filler 30 is disposed in the target area and at least covers the chip located in the target area.

[0051] The circuit board provided in the embodiment of the present application includes not only a substrate and a chip located on the substrate, but also a fixing member located on the substrate and a filler located in a target area defined by the fixing member and the target surface of the substrate. The filler at least covers the chip located in the target area, thereby protecting the chip located in the target area through the filler. When the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the probability of the chip falling off the substrate and the circuit breakage in the chip, thereby improving the performance of the circuit board and the electronic device to which it is applied.

[0052] Moreover, the circuit board provided in the embodiment of the present application protects the chip located in the target area through the filler, so that when the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the hardness requirement of the shell of the electronic device when the circuit board is applied to the electronic device, which is conducive to making the thickness of the electronic device thinner and is suitable for the development of lighter and thinner electronic devices.

[0053] In addition, in the circuit board provided in the embodiment of the present application, the surface of the substrate on which the chip is provided is the target surface of the substrate, and the fixing part is provided on the surface of the side of the substrate on which the chip is provided, so that the fixing part can form a target area with the target surface of the substrate, and then the filler can be provided in the target area formed by the fixing part and the target surface of the substrate. The formation area and thickness of the filler are precisely controlled by using the fixing part and the substrate, thereby improving the consistency of stress improvement at different positions in the circuit board.

[0054] Optionally, based on the above embodiment, in one embodiment of the present application, as Figure 2 As shown, the fixing member has at least one first positioning member 201, and the substrate 10 has at least one first positioning hole 101. The first positioning hole and the first positioning member correspond one-to-one and are used to position the fixing member and the substrate, thereby facilitating precise control of the filler formation area. Optionally, the first positioning member is a positioning post, but this application is not limited to this and the specific configuration depends on the specific situation.

[0055] Specifically, in one embodiment of the present application, the fixing member has two first positioning members, and the substrate has two first positioning holes, and the two first positioning holes are located on different sides of the target area. Accordingly, the two first positioning members are also located on different sides of the target area, thereby improving the positioning accuracy between the fixing member and the substrate, but the present application is not limited to this. In other embodiments of the present application, the fixing member may also have at least three first positioning members, and accordingly, the substrate has at least three first positioning holes, thereby further improving the positioning accuracy between the fixing member and the substrate, depending on the specific circumstances.

[0056] Based on any of the above embodiments, in one embodiment of the present application, the fixing part is a silicone ring, the connection between the silicone ring and the substrate is sealed, and the connection between the silicone ring and the substrate forms a target area with the target surface, but the present application does not limit this, and it depends on the specific situation.

[0057] Optionally, in one embodiment of the present application, the filler completely covers the chip located in the target area, so as to protect the chip located in the target area to the greatest extent through the filler. When the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the hardness requirement of the shell of the electronic device when the circuit board is applied to the electronic device, which is conducive to making the thickness of the electronic device thinner and suitable for the lightweight development of the electronic device.

[0058] Based on the above embodiment, in one embodiment of the present application, the substrate further has at least one second positioning hole, and the second positioning hole is used to fix the substrate on the jig assembly so as to achieve a fixed connection between the fixing member and the substrate through the jig assembly.

[0059] Specifically, in one embodiment of the present application, the fixture assembly includes:

[0060] A fixture base, wherein the fixture base has at least one second positioning member and at least one third positioning member, wherein the second positioning member corresponds to the second positioning hole in a one-to-one manner, and is used to realize assembly positioning of the fixture base and the substrate;

[0061] The jig upper cover plate has at least one third positioning hole, and the third positioning hole corresponds one-to-one with the third positioning piece, so as to realize the assembly positioning of the jig upper cover plate and the jig base.

[0062] Specifically, in this embodiment, the method for fixing the silicone ring and the substrate includes:

[0063] like Figure 3 As shown, the fixing member 20 is assembled to the substrate 10 through the first positioning member on the fixing member 20 and the first positioning hole on the substrate 10, specifically: the first positioning member of the fixing member 20 is inserted into the first positioning hole on the substrate 10;

[0064] like Figure 4 The substrate 10 assembled with the fixing member 20 is assembled onto the jig base 40 through the second positioning hole and the second positioning member 41 , specifically: the second positioning hole on the substrate 10 is inserted into the second positioning member 41 on the jig base 40 ;

[0065] like Figure 5As shown, the jig upper cover plate 43 is assembled to the jig base 40 through the third positioning hole and the third positioning member. The assembly structure of the fixing member 20 and the substrate 10 is located between the jig upper cover plate 43 and the jig base 40. Optionally, the jig base 40 has an electromagnet assembly 42, and the jig upper cover plate 43 is an iron jig upper cover plate.

[0066] Continue as Figure 5 As shown, the electromagnet assembly 42 in the jig base 40 is energized, and the magnetic field force generated by the energized electromagnet assembly 42 is used to attract the jig upper cover 43, thereby pressing and sealing the fixing member 20 and the substrate 10 through the jig upper cover 43 and the jig base 40, so that when a filler is subsequently formed in a target area formed by the target surface of the fixing member 20 and the substrate 10, the filler will not leak out of the fixing member;

[0067] The filler 30 is formed in the target fixed area formed by the target surface of the fixing member 20 and the substrate 10, such as by dispensing glue on the target fixed area formed by the target surface of the fixing member 10 and the substrate 10. Specifically, Figure 6 As shown, the dispensing head 50 uses the inner side wall of the fixing member 20 as the boundary and dispenses glue according to the set path and flow rate of the dispensing machine;

[0068] After the filler in the target area formed by the fixing member and the target surface of the substrate is automatically flattened, heating or ultraviolet irradiation is applied according to the solidification requirements of the filler to fix the filler;

[0069] After the filler is solidified, the electromagnet assembly in the jig base is de-energized, the jig cover is removed, and then the combined structure of the substrate and the fixing member is removed from the jig base to obtain the circuit board provided in the embodiment of the present application. Figure 7 shown.

[0070] It should be noted that, in the above embodiment, the filler may only cover the gap area between adjacent chips, and does not cover the surface of the chip away from the substrate. Figure 8 As shown, it is also possible to cover not only the gap area between adjacent chips, but also the surface of the chip away from the substrate, as shown in FIG. Figure 7 As shown, this application does not limit this and the specific circumstances will depend on the specific situation.

[0071] In another embodiment of the present application, Figure 9 As shown, the fixing member 20 includes a top cover 21 and a side wall 22, wherein Figure 10As shown, the side wall 22 of the fixing member 20 is fixedly connected to the substrate 10, and the top cover 21 of the fixing member 20 has an injection hole 211 and an exhaust hole 212, so that the filler can be injected into the target area formed by the fixing member 20 and the target surface of the substrate 10 through the injection hole 211 of the fixing member 20. During the process of injecting the filler into the target area, the air in the target area is discharged through the exhaust hole 212 at the same time, so that the filler can be smoothly injected into the target area.

[0072] Optionally, in one embodiment of the present application, the fixing member is a shielding cover, but the present application does not limit this and it depends on the specific situation.

[0073] Specifically, in one embodiment of the present application, Figure 11 As shown, the side wall 22 of the fixing member 20 is welded to the substrate through a flange wall structure 23 to achieve fixed sealing between the fixing member 20 and the substrate, but the present application is not limited to this. In other embodiments of the present application, the side wall of the fixing member can also be fixed and sealed with the substrate through other methods, depending on the specific situation.

[0074] Optionally, based on the above embodiment, in one embodiment of the present application, as Figure 12 As shown, the side wall 22 of the fixing member 20 includes a first side wall 221 and a second side wall 222 that are fixedly connected, wherein the first side wall 221 is fixedly connected to the top cover, and the second side wall 222 is fixedly connected to the substrate, and the second side wall 222 is at least partially parallel to the target surface, so as to increase the contact area between the second side wall and the substrate, improve the firmness of the fixed connection between the fixing member and the substrate, and improve the sealing of the target area formed by the fixing member and the substrate in the contact area between the fixing member and the substrate. However, this application does not limit this, and the specific situation will depend on the situation.

[0075] Specifically, in one embodiment of the present application, Figure 12 and Figure 13 As shown, the top cover of the fixing member includes a first portion 213, a second portion 214 and a third portion 215, wherein the second portion 214 is provided with the injection hole 211, and the third portion 215 is provided with the exhaust hole 212. It should be noted that, in this embodiment, Figure 13As shown, the distance between the second part 214 and the substrate is greater than the distance between the first part 213 and the substrate, so that the height of the end face of the injection hole 211 away from the side of the substrate is greater than the height of the surface of the first part 213 toward the side of the substrate, thereby facilitating the injection of filler into the target area formed by the fixing part and the target surface of the substrate through the injection hole 211, thereby ensuring that the filler can completely fill the space where the target area formed by the fixing part and the target surface of the substrate is located.

[0076] It should also be noted that, in this embodiment, Figure 12 As shown, the distance between the third part 215 and the substrate is greater than the distance between the first part 213 and the substrate, so that the height of the end face of the exhaust hole 212 away from the substrate is greater than the height of the surface of the first part 213 toward the substrate, so that when the filler is injected into the target area formed by the fixing part and the target surface of the substrate through the injection hole, it can be ensured that the exhaust hole exhausts outwards without overflowing from the exhaust hole before the filler can completely fill the space where the target area formed by the fixing part and the target surface of the substrate is located.

[0077] Optionally, based on the above embodiment, in one embodiment of the present application, continue as follows Figure 13 As shown, the second portion 214 is a concave structure, the injection hole 211 is located in the concave surface of the second portion 214, and the distance between the injection hole 211 and the substrate is greater than the distance between the first portion 213 and the substrate, so that when the filler is filled into the space of the target area formed by the fixing member and the substrate through the injection hole 211, the concave surface of the second portion 214 can accommodate a certain filler redundancy 25, as shown in FIG. Figure 14 As shown, the injection hole is sealed on the basis of ensuring that the filler can completely fill the space where the target area formed by the fixing member and the target surface of the substrate is located, and will not overflow to other areas of the fixing member top cover.

[0078] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 11 and Figure 12 As shown, the third part 215 is provided with a waterproof breathable membrane 24 corresponding to the exhaust hole 212, so as to ensure that the air in the space of the target area formed by the fixing part and the target surface of the substrate can be discharged through the exhaust hole, while ensuring that the filler injected into the space of the target area formed by the fixing part and the target surface of the substrate will not overflow from the exhaust hole.

[0079] Optionally, in one embodiment of the present application, the waterproof breathable membrane is fixedly connected to the third part by adhesive backing, but the present application is not limited to this. In other embodiments of the present application, the waterproof breathable membrane can also be fixedly connected to the third part by other means, depending on the specific circumstances.

[0080] Specifically, in one embodiment of the present application, continue as follows Figure 12 As shown, the waterproof breathable membrane 24 is located on the side of the third portion 215 facing the target surface of the substrate, so that the exhaust hole 212 is used to protect the waterproof breathable membrane 24 to prevent the waterproof breathable membrane 24 from falling off or being damaged due to external force during the use of the circuit board. However, the present application is not limited to this. In other embodiments of the present application, the waterproof breathable membrane may also be located on the side of the third portion away from the target surface of the substrate, depending on the specific situation.

[0081] It should be noted that with the improvement of the performance of electronic devices, the charging speed of electronic devices is getting faster and faster, and the chips on the circuit board, such as the main chip, charging management chip and various power amplifiers, are generating more and more heat, so that the heat dissipation capacity of the circuit board directly affects the performance of the electronic device.

[0082] Optionally, in one embodiment of the present application, the filler is a thermally conductive gel, so that the contact area between the heat dissipation elements of the chip (such as the housing of the circuit board, the housing of the electronic device to which the circuit board is applied, and / or the heat dissipation component provided in the electronic device) is increased through the filler, thereby increasing the heat dissipation channel between the chip and the outside world, thereby improving the heat dissipation efficiency of the chip.

[0083] Specifically, in one embodiment of the present application, Figure 15 As shown, the filler 30 is filled into the target area through the injection hole 211 so that the air in the target area is discharged through the exhaust hole 212. When the filler 30 fills the target area, the filler 30 covers the surface of the chip 101 away from the substrate 10, so as to three-dimensionally wrap the chip 101 in all aspects through the filler 30, thereby increasing the contact area between the filler 30 and the chip 101, so that the heat-dissipating components in the circuit board that are in contact with the filler can absorb the heat generated by the chip through the filler, thereby increasing the heat dissipation channel between the chip and the outside world and improving the heat dissipation efficiency of the chip.

[0084] Optionally, in one embodiment of the present application, the process of filling the target area with a filler through the injection hole includes:

[0085] Take the filler as thermal conductive gel as an example, Figure 16As shown, a thermally conductive gel injection tube 26 is pressed against the concave, perforated boss (i.e., second portion 214) of the fixture's top cover 21, creating a leak-proof seal. The thermally conductive gel injection tube 26 is connected to a pressure dispenser, allowing the thermally conductive gel to flow under pressure through the injection hole in the fixture's second portion 214 into the fixture's inner cavity (i.e., the space formed between the fixture and the target surface of the substrate). The flange wall structure at the bottom of the fixture forms a seal with the target surface of the substrate through a full circle of solder. As the gas in the fixture's inner cavity is discharged through the vent hole 212 in the fixture's third portion 215, the thermally conductive gel will completely fill the fixture's inner cavity.

[0086] It should be noted that, in the above embodiment, the glue dispensing amount can be determined by calculating the inner cavity volume of the fixing member and controlling the glue injection time and speed of the glue dispensing machine.

[0087] Specifically, in one embodiment of the present application, the filler is a non-fluid that is thermally conductive but electrically non-conductive. This allows the filler to increase the heat dissipation path between the chip and the outside world while preventing short circuits between different electrical components within the chip. In another embodiment of the present application, the filler can also be a fluid that is thermally conductive but electrically non-conductive. This application does not limit this, and the specific use case depends on the circumstances.

[0088] It should be noted that if the filler is a fluid that is heat-conductive but not electrically conductive, the fixing member further includes a sealing member for sealing the injection hole when the filler completely fills the space formed by the fixing member and the target surface of the substrate, but this application does not limit this and it depends on the specific situation.

[0089] In addition, an embodiment of the present application further provides an electronic device. Optionally, the electronic device may be a device having a circuit board, such as a mobile phone or a tablet computer. Specifically, in this embodiment, the electronic device includes a circuit board, and the circuit board includes:

[0090] a substrate, wherein a target surface of the substrate is provided with at least one chip;

[0091] A fixing member is provided on the substrate to form a target area with the target surface, and at least one chip is located in the target area.

[0092] A filler is disposed in the target area and at least covers the chip located in the target area.

[0093] In the electronic device provided in the embodiment of the present application, the circuit board not only includes a substrate and a chip located on the substrate, but also includes a fixing member located on the substrate and a filler located in a target area defined by the fixing member and the target surface of the substrate. The filler at least covers the chip located in the target area, thereby protecting the chip located in the target area through the filler. When the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the probability of the chip falling off from the substrate and the circuit breakage in the chip, thereby improving the performance of the circuit board and the electronic device to which it is applied.

[0094] Moreover, in the electronic device provided in the embodiment of the present application, the circuit board protects the chip located in the target area through the filler, so that when the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the hardness requirement of the shell of the electronic device when the circuit board is applied to the electronic device, which is conducive to making the thickness of the electronic device thinner and is suitable for the lightweight development of the electronic device.

[0095] In addition, in the electronic device provided in the embodiment of the present application, the filler inside the circuit board is located within the target area formed by the fixing member and the target surface of the substrate, so that the formation area and thickness of the filler can be precisely controlled using the fixing member and the substrate, thereby improving the consistency of stress improvement at different positions in the circuit board.

[0096] Optionally, based on the above embodiment, in one embodiment of the present application, the fixing member has at least one first positioning member, and the substrate has at least one first positioning hole. The first positioning hole and the first positioning member correspond one-to-one and are used for positioning between the fixing member and the substrate, thereby facilitating precise control of the filler formation area. Optionally, the first positioning member is a positioning post, but this application does not limit this, and the specific configuration depends on the specific situation.

[0097] Based on any of the above embodiments, in one embodiment of the present application, the fixing member is a silicone ring, and the connection between the silicone ring and the substrate is sealed, but the present application does not limit this, and the specific situation depends on the circumstances.

[0098] Optionally, in one embodiment of the present application, the filler completely covers the chip located in the target area, so as to protect the chip located in the target area to the greatest extent through the filler. When the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the hardness requirement of the shell of the electronic device when the circuit board is applied to the electronic device, which is conducive to making the thickness of the electronic device thinner and suitable for the lightweight development of the electronic device.

[0099] It should be noted that, in the above embodiment, the filler may cover the surface of the chip away from the substrate, or may not cover the surface of the chip away from the substrate. This application does not limit this, and it depends on the specific situation.

[0100] In another embodiment of the present application, the fixing member includes a top cover and side walls, wherein the side walls of the fixing member are fixedly connected to the substrate, and the top cover of the fixing member has an injection hole and an exhaust hole, so as to facilitate the injection of filler into the target area formed by the fixing member and the target surface of the substrate through the injection hole of the fixing member, and in the process of injecting the filler into the target area, the air in the target area is simultaneously discharged through the exhaust hole, so that the filler can be smoothly injected into the target area.

[0101] Optionally, in one embodiment of the present application, the fixing member is a shielding cover, but the present application does not limit this and it depends on the specific circumstances.

[0102] Based on the above embodiment, in one embodiment of the present application, the sidewalls of the fixing member include a first sidewall and a second sidewall that are fixedly connected, wherein the first sidewall is fixedly connected to the top cover, the second sidewall is fixedly connected to the substrate, and the second sidewall is at least partially parallel to the target surface, so as to increase the contact area between the second sidewall and the substrate, improve the firmness of the fixed connection between the fixing member and the substrate, and improve the sealing performance of the target area formed by the fixing member and the substrate in the contact area between the fixing member and the substrate. However, this application does not limit this, and the specific situation will depend on the circumstances.

[0103] Specifically, in one embodiment of the present application, the top cover of the fixing member includes a first portion, a second portion, and a third portion, wherein the second portion is provided with the injection hole, and the third portion is provided with the exhaust hole. It should be noted that, in this embodiment, the distance between the second portion and the substrate is greater than the distance between the first portion and the substrate, so that the height of the end face of the injection hole away from the substrate is greater than the height of the surface of the first portion facing the substrate, thereby facilitating the injection of filler into the target area formed by the fixing member and the target surface of the substrate through the injection hole, thereby ensuring that the filler can completely fill the space where the target area formed by the fixing member and the target surface of the substrate is located.

[0104] It should also be noted that, in this embodiment, the distance between the third part and the substrate is greater than the distance between the first part and the substrate, so that the height of the end face of the exhaust hole away from the substrate is greater than the height of the surface of the first part facing the substrate, thereby facilitating the injection of filler into the target area formed by the fixing part and the target surface of the substrate through the injection hole, while ensuring that the exhaust hole exhausts outwards without the filler overflowing from the exhaust hole before the space where the target area formed by the fixing part and the target surface of the substrate is located is located.

[0105] Optionally, based on the above embodiments, in one embodiment of the present application, the second part is a concave structure, the injection hole is located in the concave surface of the second part, and the distance between the injection hole and the substrate is greater than the distance between the first part and the substrate, so that when the filler is filled into the space of the target area formed by the fixing part and the substrate through the injection hole, the concave surface of the second part can accommodate a certain filler redundancy, thereby ensuring that the filler can completely fill the space where the target area formed by the target surface of the fixing part and the substrate is located, and the injection hole is sealed and will not overflow into other areas of the top cover of the fixing part.

[0106] Based on any of the above embodiments, in one embodiment of the present application, the third part is provided with a waterproof and breathable membrane corresponding to the exhaust hole to ensure that the air in the space of the target area formed by the fixing part and the target surface of the substrate can be discharged through the exhaust hole while ensuring that the filler injected into the space of the target area formed by the fixing part and the target surface of the substrate will not overflow from the exhaust hole.

[0107] Optionally, in one embodiment of the present application, the waterproof breathable membrane is fixedly connected to the third part by adhesive backing, but the present application is not limited to this. In other embodiments of the present application, the waterproof breathable membrane can also be fixedly connected to the third part by other means, depending on the specific circumstances.

[0108] Specifically, in one embodiment of the present application, the waterproof breathable membrane is located on the side of the third part facing the target surface of the substrate, so that the exhaust hole is used to protect the waterproof breathable membrane to prevent the waterproof breathable membrane from falling off or being damaged due to external force during use of the circuit board. However, the present application is not limited to this. In other embodiments of the present application, the waterproof breathable membrane may also be located on the side of the third part away from the target surface of the substrate, depending on the specific circumstances.

[0109] It should be noted that with the improvement of the performance of electronic devices, the charging speed of electronic devices is getting faster and faster, and the chips on the circuit board, such as the main chip, charging management chip and various power amplifiers, are generating more and more heat, so that the heat dissipation capacity of the circuit board directly affects the performance of the electronic device.

[0110] Optionally, in one embodiment of the present application, the filler is a thermally conductive gel, so that the contact area between the heat dissipation elements of the chip (such as the housing of the circuit board, the housing of the electronic device to which the circuit board is applied, and / or the heat dissipation component provided in the electronic device) is increased through the filler, thereby increasing the heat dissipation channel between the chip and the outside world, thereby improving the heat dissipation efficiency of the chip.

[0111] Specifically, in one embodiment of the present application, the filler is filled into the target area through the injection hole so that the air in the target area is discharged through the exhaust hole. When the filler fills the target area, the filler covers the surface of the chip away from the substrate, so as to three-dimensionally wrap the chip in all aspects through the filler, thereby increasing the contact area between the filler and the chip, so that the heat-dissipating components in the circuit board that are in contact with the filler can absorb the heat generated by the chip through the filler, thereby increasing the heat dissipation channel between the chip and the outside world and improving the heat dissipation efficiency of the chip.

[0112] Specifically, in one embodiment of the present application, the filler is a non-fluid that is thermally conductive but electrically non-conductive. This allows the filler to increase the heat dissipation path between the chip and the outside world while preventing short circuits between different electrical components within the chip. In another embodiment of the present application, the filler can also be a fluid that is thermally conductive but electrically non-conductive. This application does not limit this, and the specific use case depends on the circumstances.

[0113] It should be noted that if the filler is a fluid that is heat-conductive but not electrically conductive, the fixing member further includes a sealing member for sealing the injection hole when the filler completely fills the space formed by the fixing member and the target surface of the substrate, but this application does not limit this and it depends on the specific situation.

[0114] In summary, in the circuit board and electronic device provided by the implementation of the present application, the circuit board not only includes a substrate and a chip located on the substrate, but also includes a fixing member located on the substrate and a filler located in a target area defined by the fixing member and the target surface of the substrate. The filler at least covers the chip located in the target area, so that the chip located in the target area is protected by the filler. When the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the probability of the chip falling off from the substrate and the circuit breakage in the chip, thereby improving the performance of the circuit board and the electronic device to which it is applied.

[0115] Moreover, in the circuit board and electronic device provided in the embodiments of the present application, the circuit board protects the chip located in the target area through the filler, so that when the shell of the electronic device to which the circuit board is applied is deformed, the circuit board will not be deformed, thereby reducing the hardness requirement of the shell of the electronic device when the circuit board is applied to the electronic device, which is conducive to making the thickness of the electronic device thinner and is suitable for the lightweight development of the electronic device.

[0116] In addition, in the circuit board and electronic device provided in the embodiments of the present application, the filler inside the circuit board is located within the target area formed by the fixing member and the target surface of the substrate, so that the formation area and thickness of the filler can be precisely controlled using the fixing member and the substrate, thereby improving the consistency of stress improvement at different positions in the circuit board.

[0117] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on the differences from other embodiments, and reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple. For relevant parts, refer to the description of the methods.

[0118] It should be noted that in the description of this application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same figure numbers throughout the embodiments of the specification identify the same structure. In addition, for the purpose of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It should also be noted that, in this article, relational terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the article or device comprising the above elements.

[0119] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board, characterized in that: include: a substrate, wherein a target surface of the substrate is provided with at least one chip; A fixing member is provided on the substrate to form a target area with the target surface, and at least one chip is located in the target area. A filler is disposed in the target area and at least covers the chip located in the target area.

2. The circuit board according to claim 1, wherein: The fixing member has at least one first positioning hole, and the substrate has at least one first positioning member. The first positioning hole and the first positioning member correspond to each other one by one and are used for positioning between the fixing member and the substrate.

3. The circuit board according to claim 1, wherein: The fixing member is a silicone ring, and the connection between the silicone ring and the substrate is sealed.

4. The circuit board according to claim 1, wherein: The fixing member includes a top cover and a side wall. The side wall of the fixing member is fixedly connected to the base plate. The top cover of the fixing member has an injection hole and an exhaust hole.

5. The circuit board according to claim 4, characterized in that The side wall of the fixing member includes a first side wall and a second side wall that are fixedly connected, wherein the first side wall is fixedly connected to the top cover, the second side wall is fixedly connected to the base plate, and the second side wall is at least partially parallel to the target surface.

6. The circuit board according to claim 4, wherein: The top cover of the fixing member includes a first portion, a second portion and a third portion, wherein the distance between the second portion and the substrate is greater than the distance between the first portion and the substrate, and the distance between the third portion and the substrate is greater than the distance between the first portion and the substrate; The second portion is provided with the injection hole, and the third portion is provided with the exhaust hole.

7. The circuit board according to claim 6, wherein: The second portion is a concave structure, and the injection hole is located in the concave surface of the second portion; A distance between the injection hole and the substrate is greater than a distance between the first portion and the substrate.

8. The circuit board according to claim 6, wherein: The third part is provided with a waterproof breathable membrane corresponding to the exhaust hole, and the waterproof breathable membrane is connected to the third part through adhesive.

9. The circuit board according to claim 4, wherein: The filler is filled into the target area through the injection hole so that the air in the target area is discharged through the exhaust hole. When the filler fills the target area, the filler covers the surface of the chip away from the substrate. The filler is a thermally conductive gel.

10. An electronic device, characterized in that: A circuit board is included, the circuit board comprising: a substrate, wherein a target surface of the substrate is provided with at least one chip; A fixing member is provided on the substrate to form a target area with the target surface, and at least one chip is located in the target area. A filler is disposed in the target area and at least covers the chip located in the target area.

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