Circuit board automatic carrying and punching device

Abstract

The utility model discloses an automatic carrying and punching device for a circuit board, which relates to the technical field of circuit board production and comprises a processing table, a support frame seat, a placing table and a lower die are fixedly mounted at the upper end of the processing table, and the support frame seat, the placing table and the lower die are fixedly mounted at the upper end of the processing table. An automatic carrying mechanism is arranged at one end of the supporting frame base, and an ejection mechanism is arranged at the lower end of the machining table. The automatic carrying mechanism comprises a fixed frame and a movable plate. According to the circuit board feeding device, circuit board raw materials can be fed, so that the circuit board raw materials can be conveyed in a rotating mode, the conveying speed of the circuit board raw materials is increased, the conveying speed can be efficiently matched with the machining speed of the punching device, the waiting time of the punching device cannot be prolonged, and the overall production efficiency is improved; and the circuit board can be moved out from the interior of the lower die, so that the processed circuit board can be moved out from the interior of the lower die.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to an automatic conveying and punching device for circuit boards. Background Art

[0002] Circuit boards, also known as printed circuit boards (PCBs), feature high wiring density, light weight, thin thickness, and good flexibility. Circuit boards are broadly categorized by the number of layers: single-sided, double-sided, and multi-layer. When printing circuit boards, multiple small circuit blocks are typically printed simultaneously on a large board. These blocks are then punched out of the large board using a punch press. In other words, a large piece of raw circuit board material is assembled from multiple small finished circuit boards and scraps.

[0003] However, in the prior art, workers mainly manually place circuit board raw materials on the punching machine processing area, and process the circuit board raw materials through the punching machine to form the required circuit board finished products and scraps. However, the speed of transporting circuit boards in this way is relatively slow, which makes it impossible to efficiently match the processing speed of the punching device, thereby increasing the waiting time of the punching device and reducing the overall production efficiency. Therefore, an automatic circuit board transport and punching device is proposed. Utility Model Content

[0004] The purpose of this utility model is to solve the problem in the prior art that the existing speed of transporting circuit boards is relatively slow, which makes it impossible to efficiently match the processing speed of the punching device, thereby increasing the waiting time of the punching device and reducing the overall production efficiency, and proposes an automatic circuit board transporting and punching device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a circuit board automatic transport and punching device, comprising a processing table, a support frame fixedly mounted on the upper end of the processing table, a placement table fixedly mounted on the upper end of the processing table, a lower mold fixedly mounted on the upper end of the processing table, an automatic transport mechanism provided at one end of the support frame, and an ejection mechanism provided at the lower end of the processing table;

[0006] The automatic transport mechanism includes a fixed frame and a movable plate, a stepping motor is fixedly installed on the upper end of the fixed frame, a small gear is provided in the middle of the fixed frame, a large gear is rotatably installed in the middle and at the top of the fixed frame, a limiting cylinder is fixedly installed on the upper end of the movable plate, a rotating rod is rotatably installed inside the limiting cylinder, telescopic rods are installed through the upper ends of the two protruding parts of the movable plate, and adsorption components are fixedly installed on the protruding ends of the two groups of telescopic rods.

[0007] Preferably, the ejection mechanism includes an elliptical block and a top plate, the upper end of the elliptical block is penetrated by two sets of cylinders, the lower end of the top plate is fixedly mounted with two sets of concave seats, and movable blocks are rotatably mounted inside the two sets of concave seats.

[0008] Preferably, the output end of the stepper motor is fixed to the upper end of the small gear, the small gear is meshed with the large gear, and the upper end of the rotating rod passes through the lower end of the fixed frame and is fixed to the lower end of the large gear.

[0009] Preferably, the lower end of the rotating rod is fixed to the upper end of the movable plate, and the lower ends of the two protruding parts of the fixed frame are fixed to the upper end of the supporting frame.

[0010] Preferably, a power system is installed through the upper end of the support frame, and an upper mold is fixedly installed on the ejection end of the power system, and the upper mold is located directly above the lower mold.

[0011] Preferably, the upper end of the elliptical block is fixed to the inner top end of the processing table, and the protruding ends of the two groups of cylinders are respectively fixed to the lower ends of the two groups of movable blocks.

[0012] Preferably, the lower end of the top plate contacts the inner bottom end of the lower mold, a long hole is opened through the lower end of the lower mold, and the two groups of concave seats and the two groups of movable blocks are arranged inside the long hole.

[0013] Compared with the prior art, the advantages and positive effects of the present invention are:

[0014] 1. In the present invention, by providing an automatic conveying mechanism, the circuit board raw materials can be loaded, thereby realizing the rotational conveying of the circuit board raw materials and accelerating the conveying speed of the circuit board raw materials, which can efficiently match the processing speed of the punching device, does not increase the waiting time of the punching device, and improves the overall production efficiency. Secondly, the circuit board can be moved out from the interior of the lower mold, thereby the processed circuit board can be moved out from the interior of the lower mold.

[0015] 2. In the present invention, by providing an ejection mechanism, a part of the top plate can be raised while the other part is in its original rest position, and the top plate can be in an inclined state, so that the scraps on the top plate can be guided out, thereby improving the processing efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of a partially cutaway structure of a circuit board automatic transport and punching device proposed by the utility model;

[0017] Figure 2 The utility model provides a schematic structural diagram of an automatic transport mechanism in an automatic transport and punching device for circuit boards;

[0018] Figure 3 This utility model provides a schematic diagram of the structure of the ejection mechanism in the automatic transport and punching device for circuit boards;

[0019] Figure 4 The utility model provides a three-dimensional diagram of a circuit board automatic transport and punching device.

[0020] Legend: 1. Processing table; 11. Support frame; 12. Placement table; 13. Lower mold; 14. Power system; 15. Upper mold; 2. Automatic transport mechanism; 21. Fixed frame; 22. Stepper motor; 23. Small gear; 24. Large gear; 25. Rotating rod; 26. Movable plate; 261. Limiting cylinder; 27. Telescopic rod; 28. Adsorption assembly; 3. Ejection mechanism; 31. Elliptical block; 32. Cylinder; 33. Ejector plate; 34. Movable block; 35. Concave seat. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0023] Example 1: Figure 1 - Figure 4 As shown, the utility model provides an automatic conveying and punching device for circuit boards, comprising a processing table 1, a support frame 11 being fixedly mounted on the upper end of the processing table 1, a placement table 12 being fixedly mounted on the upper end of the processing table 1, a lower mold 13 being fixedly mounted on the upper end of the processing table 1, an automatic conveying mechanism 2 being provided at one end of the support frame 11, and an ejection mechanism 3 being provided at the lower end of the processing table 1;

[0024] The automatic transport mechanism 2 includes a fixed frame 21 and a movable plate 26. A stepper motor 22 is fixedly installed on the upper end of the fixed frame 21. A small gear 23 is provided in the middle of the fixed frame 21. A large gear 24 is rotatably installed in the middle and top of the fixed frame 21. A limit cylinder 261 is fixedly installed on the upper end of the movable plate 26. A rotating rod 25 is rotatably installed inside the limit cylinder 261. Telescopic rods 27 are installed on the upper ends of the two protruding parts of the movable plate 26. Adsorption components 28 are fixedly installed on the protruding ends of the two sets of telescopic rods 27. The output end of the feed motor 22 is fixed to the upper end of the small gear 23, the small gear 23 is meshed with the large gear 24, the upper end of the rotating rod 25 passes through the lower end of the fixed frame 21 and is fixed to the lower end of the large gear 24, the lower end of the rotating rod 25 is fixed to the upper end of the movable plate 26, the lower ends of the two protrusions of the fixed frame 21 are fixed to the upper end of the support frame 11, the upper end of the support frame 11 is penetrated by the power system 14, the ejection end of the power system 14 is fixedly installed with the upper mold 15, and the upper mold 15 is located directly above the lower mold 13.

[0025] The following is a detailed description of the specific settings and functions of this embodiment. The stepper motor 22 is started, and the output end of the stepper motor 22 drives the small gear 23 to rotate, and the small gear 23 drives the large gear 24 to rotate, so that the large gear 24 rotates inside the fixed frame 21, and the large gear 24 drives the movable plate 26 to rotate through the rotating rod 25, and the movable plate 26 drives the two groups of adsorption components 28 to rotate through two groups of telescopic rods 27. When one group of adsorption components 28 is moved to the top of the lower mold 13, the telescopic rod 27 located just above is started to run, and one group of telescopic rods 27 pushes one group of adsorption components 28 to move downward, so that one group of adsorption components 28 drives the circuit board raw material to move out of the interior of the lower mold 13, and places the circuit board raw material inside the lower mold 13, and then runs the telescopic rod 27. The rod 27 drives one group of adsorption components 28 to move upward, and then one group of adsorption components 28 is removed from directly above the lower mold 13 through the above steps. This is repeated to load the circuit board raw materials, thereby realizing the rotation of the circuit board raw materials and accelerating the transportation speed of the circuit board raw materials. It can efficiently match the processing speed of the punching device without increasing the waiting time of the punching device, thereby improving the overall production efficiency. Secondly, after processing the circuit board raw materials, repeat the above steps, move another group of adsorption components 28 to the inside of the lower mold 13, and adsorb the processed circuit board, and then repeat the above operations to remove the circuit board from the inside of the lower mold 13, thereby removing the processed circuit board from the inside of the lower mold 13.

[0026] Example 2: Figure 1 、 Figure 3 and Figure 4As shown, the ejection mechanism 3 includes an elliptical block 31 and a top plate 33. The upper end of the elliptical block 31 is penetrated by two groups of cylinders 32. The lower end of the top plate 33 is fixedly installed with two groups of concave seats 35. The insides of the two groups of concave seats 35 are rotatably installed with movable blocks 34. The upper end of the elliptical block 31 is fixed to the internal top of the processing table 1, and the protruding ends of the two groups of cylinders 32 are respectively fixed to the lower ends of the two groups of movable blocks 34. The lower end of the top plate 33 contacts the inner bottom end of the lower mold 13. A long hole is opened at the lower end of the lower mold 13, and the two groups of concave seats 35 and the two groups of movable blocks 34 are all arranged inside the long hole.

[0027] The effect achieved by the entire embodiment is that the two groups of cylinders 32 are started, and the two groups of cylinders 32 push the top plate 33 upward through the two groups of movable blocks 34 and the two groups of concave seats 35, so that the top plate 33 moves upward inside the lower mold 13, thereby facilitating the top plate 33 to drive the scrap to be removed from the interior of the lower mold 13. Then, one of the groups of cylinders 32 is stopped, and the other group of cylinders 32 will push the movable block 34 that cooperates with it to move upward, so that the movable block 34 pushes a part of the top plate 33 to move upward through the concave seats 35 that cooperate with it. At this time, the top plate 33 drives the two groups of concave seats 35 to move on the outer walls of the two groups of movable blocks 34, so that a part of the top plate 33 can be raised, and the other part is in its original stop position, so that the top plate 33 can be in an inclined state, thereby being able to guide the scrap on the top plate 33, thereby improving the processing efficiency of the circuit board.

[0028] The method of using and working principle of this device: First, place the circuit board on the placement table 12 in advance, start the stepper motor 22, the output end of the stepper motor 22 drives the small gear 23 to rotate, the small gear 23 drives the large gear 24 to rotate, so that the large gear 24 rotates inside the fixed frame 21, and the large gear 24 drives the movable plate 26 to rotate through the rotating rod 25, and the movable plate 26 drives the two groups of adsorption components 28 to rotate through the two groups of telescopic rods 27. When one group of adsorption components 28 is moved to the top of the lower mold 13, the telescopic rod located above is started. 27 is operated, one set of telescopic rods 27 pushes one set of adsorption components 28 to move downward, so that one set of adsorption components 28 drives the circuit board raw material to move out of the interior of the lower mold 13, and the circuit board raw material is placed inside the lower mold 13, and then the telescopic rod 27 is operated again, so that one set of adsorption components 28 is driven to move upward, and then one set of adsorption components 28 is removed from the top of the lower mold 13 through the above steps, and this is repeated, so that the circuit board raw material can be loaded, and the rotation of the circuit board raw material can be realized, and the circuit board raw material can be transported faster. The conveying speed of the circuit board raw material is increased. Then, after processing the circuit board raw material, the above steps are repeated to move another set of adsorption components 28 to the inside of the lower mold 13 and adsorb the processed circuit board. Then, the above operation is repeated to remove the circuit board from the inside of the lower mold 13. Finally, the two sets of cylinders 32 are started. The two sets of cylinders 32 push the top plate 33 upward through the two sets of movable blocks 34 and the two sets of concave seats 35, so that the top plate 33 moves upward inside the lower mold 13, and then In order to facilitate the top plate 33 to move the scraps out from the inside of the lower mold 13, one of the groups of cylinders 32 is stopped, and the other group of cylinders 32 will push the movable block 34 that cooperates with it to move upward, so that the movable block 34 pushes a part of the top plate 33 to move upward through the concave seat 35 that cooperates with it. At this time, the top plate 33 drives the two groups of concave seats 35 to move on the outer walls of the two groups of movable blocks 34, so that a part of the top plate 33 can rise and the other part remains in its original stop position. The top plate 33 can be in an inclined state, and the scraps on the top plate 33 can be guided out.

[0029] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A circuit board automatic transport and punching device, comprising a processing table (1), characterized in that: A support frame (11) is fixedly mounted on the upper end of the processing table (1), a placement table (12) is fixedly mounted on the upper end of the processing table (1), a lower mold (13) is fixedly mounted on the upper end of the processing table (1), an automatic transport mechanism (2) is provided at one end of the support frame (11), and an ejection mechanism (3) is provided at the lower end of the processing table (1); The automatic transport mechanism (2) includes a fixed frame (21) and a movable plate (26), wherein a stepping motor (22) is fixedly mounted on the upper end of the fixed frame (21), a small gear (23) is provided in the middle of the fixed frame (21), a large gear (24) is rotatably mounted in the middle and at the top of the fixed frame (21), a limiting cylinder (261) is fixedly mounted on the upper end of the movable plate (26), a rotating rod (25) is rotatably mounted inside the limiting cylinder (261), and telescopic rods (27) are installed through the upper ends of the two protruding parts of the movable plate (26), and adsorption components (28) are fixedly mounted on the protruding ends of the two groups of telescopic rods (27).

2. The circuit board automatic transport and punching device according to claim 1, characterized in that: The ejection mechanism (3) comprises an elliptical block (31) and a top plate (33). The upper end of the elliptical block (31) is penetrated by two sets of cylinders (32). The lower end of the top plate (33) is fixedly mounted with two sets of concave seats (35). The insides of the two sets of concave seats (35) are both rotatably mounted with movable blocks (34).

3. The circuit board automatic transport and punching device according to claim 1, characterized in that: The output end of the stepping motor (22) is fixed to the upper end of the small gear (23), the small gear (23) is meshed with the large gear (24), and the upper end of the rotating rod (25) passes through the lower end of the fixed frame (21) and is fixed to the lower end of the large gear (24).

4. The circuit board automatic transport and punching device according to claim 3, characterized in that: The lower end of the rotating rod (25) is fixed to the upper end of the movable plate (26), and the lower ends of the two protruding parts of the fixed frame (21) are fixed to the upper end of the support frame (11).

5. The circuit board automatic transport and punching device according to claim 1, characterized in that: A power system (14) is installed through the upper end of the support frame (11), and an upper mold (15) is fixedly installed at the ejection end of the power system (14). The upper mold (15) is located directly above the lower mold (13).

6. The circuit board automatic transport and punching device according to claim 2, characterized in that: The upper end of the elliptical block (31) is fixed to the inner top of the processing table (1), and the protruding ends of the two groups of cylinders (32) are respectively fixed to the lower ends of the two groups of movable blocks (34).

7. The automatic circuit board transport and punching device according to claim 6, characterized in that: The lower end of the top plate (33) contacts the inner bottom end of the lower mold (13), and a long hole is opened through the lower end of the lower mold (13). The two groups of concave seats (35) and the two groups of movable blocks (34) are both arranged inside the long hole.

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