Screen printing sheet baking multi-layer rack

Abstract

The utility model discloses a screen printing sheet baking multi-layer rack which comprises a sheet baking multi-layer rack body, a sheet placing frame, a cross-shaped supporting cross beam and positioning pins. The board placing frame is arranged on the board baking multi-layer rack; the cross-shaped supporting cross beam is erected on the board placing frame, and the positioning pins are arranged at the four corners of the board placing frame; the board placing frame is a square-frame-shaped board frame, and the board baking multi-layer frame comprises a base and a vertical frame. One plate placing frame is correspondingly provided with one cross-shaped supporting cross beam; and the positioning pins are arranged at four corners of the plate placing frame. By adopting the structural design of the wet film baking plate multi-layer rack, the PCB with the thickness of more than 0.1 mm can be baked after wet film printing, the processing difficulty of processing a thin plate by a vertical insertion frame is solved, the quality risk problems of foreign matters on the edge of the plate, warping of the plate and the like are solved, and the problems that the thin plate cannot be processed or the processing flow is complicated are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a silk-screen thin plate baking plate Thousand Layer Rack. Background Art

[0002] Currently in the circuit board industry, there are two common ways to bake the board after manual wet film printing: rack (vertical) and kilo-layer rack (horizontal).

[0003] 1) Insert the baking sheet:

[0004] After wet film printing, the baking board is carried out using a vertical rack. Although the rack width can be adjusted to match the production board size, since the ink is not fully cured, ink dripping is likely to occur, and oil is collected at the hole edge, resulting in inconsistent ink thickness at the hole edge and the board inside, affecting the board thickness and causing quality abnormalities.

[0005] The frequent removal and placement of boards during the manufacturing process can easily cause wear and tear on the board edges, resulting in foreign matter and copper chips. This is especially true for negative board processes (where the board edges are not copper-wrapped). During the printing process, these foreign matter can fall onto the printing plate surface, forming foreign matter on the board surface and causing abnormal board quality.

[0006] This rack method is more suitable for thick plates, but for thin plates below 0.5mm, the processing operability is extremely poor. Due to the thinness of the plates and weak supporting force, the plates are easily in contact with each other by simply using the vertical rack method, resulting in oil sticking to the plate surface and abnormal quality. Therefore, in order to reduce the risk of the plates shaking during processing and transportation and the contact between the plates and oil sticking, the conventional operation is to adjust the spacing between the plates on the rack (previously inserting one every one, changing to inserting one every three or more), and reducing the size of the rack to provide sufficient support force for the bending of the plates to prevent the plates from shaking and sticking. However, under the action of external forces, the plates usually undergo severe warping and deformation after baking, resulting in abnormal plate quality.

[0007] In addition, peers have also tried to use plug-in frames and add fixing pins on the edge of the frame, with at least one on each side of each board. However, manual operation is cumbersome, seriously affecting efficiency, and the pins are often not effectively fixed to the board, causing the baking plate to fail.

[0008] The rack baking method has a maximum thickness of 0.4mm. Plate thickness below 0.4mm is prone to plate damage, sticking, warping, and ink cracking. Therefore, it cannot be used for thin plates.

[0009] 2) Melaleuca:

[0010] The use of a kirigami baking method is common in the wet film manufacturing process for flexible printed circuits (FPCs). This is because flexible printed circuits (FPCs) are thin, have low support, and are prone to warping and deformation. However, wet film printing for FPCs primarily involves a single-sided ink process: pretreatment → wet film printing → pre-baking → exposure → development → inspection → next step. In contrast, wet film printing for printed circuit boards (PCBs) uses a double-sided process (i.e., ink on both sides): pretreatment → wet film printing on the first side → pre-baking → wet film printing on the second side → pre-baking → exposure → development → inspection → next step. PCBs, compared to FPCs, have an additional second side. If a kirigami baking method is used, during the wet film printing of the second side, the ink on the first side is not fully cured, resulting in a bright print on the board surface after only 10 minutes on a conventional kirigami baking method. This allows the ink on the board to adhere directly during baking. Therefore, this method is not feasible.

[0011] In addition, if the PCB board also adopts the single-sided process, namely: pre-treatment → wet film printing on the first side → pre-bake → exposure → development → pre-treatment → wet film printing on the second side → pre-bake → exposure → development → inspection → next process, the process is complicated and the number of steps is doubled, which is not suitable for mass production operations.

[0012] Therefore, finding a solution suitable for manual wet film printing thin plate baking can not only improve the thin plate production and processing capabilities, but also enhance the competitiveness of the industry. Summary of the Invention

[0013] In view of the shortcomings of the existing technology and the need for improvement, the utility model proposes a silk-screen thin plate baking plate Thousand Layer Rack, which solves the problem that the baking plate is prone to quality abnormalities after the existing manual wet film printing.

[0014] In order to achieve the above-mentioned object, the utility model provides a silk-screen thin plate baking plate Thousand Layer Rack, comprising a baking plate Thousand Layer Rack, a plate placing frame, a cross supporting beam and positioning pins; the plate placing frame is arranged on the baking plate Thousand Layer Rack; the cross supporting beam is arranged on the plate placing frame, and the positioning pins are arranged on the four corners of the square plate frame;

[0015] The plate placing frame is a square plate frame, and the baking plate lasagna rack includes a base and a vertical frame. One end of the vertical frame is connected to the end of the base. There are multiple plate placing frames, and the multiple plate placing frames are arranged in parallel, and the ends are arranged on the vertical frame; one cross supporting beam is correspondingly arranged for each plate placing frame; the positioning pins are arranged on the four corners of the square plate frame;

[0016] The size of the board frame is set corresponding to the size of the PCB board.

[0017] Preferably, the plate placing frame is provided with an inner folding edge strip, and the inner folding edge strip is arranged inside the plate placing frame.

[0018] Preferably, the plate placing frame is welded to the vertical frame.

[0019] Preferably, the plate placing frame is made of stainless steel.

[0020] Preferably, the baking plate lasagna rack further includes a lasagna rack roller, and the lasagna rack roller is arranged on the base.

[0021] The utility model provides a silk screen thin plate baking plate Thousand Layer Rack which has the following beneficial effects:

[0022] The utility model provides a silk-screen thin plate baking plate Thousand Layer Rack, which is convenient for the production operation of baking plates on both sides after wet-film printing of PCB boards, and is not prone to the generation of foreign matter on the board edges and board warping; it can solve the problem of non-stick oil on the double-sided wet-film printing baking plates of PCB thin boards, avoid the generation of foreign matter and abnormal board warping; it can match the conventional board production process and is conducive to batch PCB board production operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a front view of a preferred embodiment of a silk-screened thin-plate baking sheet Thousand Layer Rack of the present invention;

[0024] Figure 2 for Figure 1 A side view of a silk-screened sheet baking sheet lasagna rack is shown;

[0025] Figure 3 for Figure 1 A three-dimensional diagram of a plate placing frame of a silk-screened thin plate baking sheet lasagna rack is shown;

[0026] Figure 4 for Figure 3 A front view of a plate placing frame of a silk-screened thin plate baking sheet lasagna rack is shown;

[0027] Figure 5 for Figure 3 A side view of a plate placing frame of a silk-screened thin-plate baking sheet lasagna rack is shown;

[0028] Figure 6 for Figure 3 A top view of a plate placing frame of a silk-screened thin plate baking sheet lasagna rack is shown;

[0029] in

[0030] 1. Baking sheet lasagna rack; 2. Sheet frame; 3. Cross support beam; 4. Positioning pins. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0032] The utility model aims to solve the existing problems and provides a silk-screened thin plate baking plate lasagna rack.

[0033] In one embodiment, referring to Figure 1 As shown, it includes a baking plate lasagna rack 1, a plate placing frame 2, a cross supporting beam 3 and a positioning pin 4; the plate placing frame 2 is arranged on the baking plate lasagna rack 1; the cross supporting beam 3 is mounted on the plate placing frame 2, and the positioning pin 4 is arranged on the four corners of the plate placing frame 2;

[0034] This device features a rectangular baking frame designed to the dimensions of the PCB cutouts. In addition to the frame's frame frame, a cross-shaped support beam is designed in the center to support the thin boards and prevent them from sagging, which could affect baking quality. This cross also prevents grease from sticking to the boards due to improper placement during operation.

[0035] The cross supporting beam is movable and can be adjusted to suit different panel structures so that it is distributed in the panel milling area / invalid secondary edge.

[0036] The plate placing frame 2 is a square frame. The lasagna baking rack 1 includes a base and a vertical frame. One end of the vertical frame is connected to the end of the base. There are multiple plate placing frames 2, and the multiple plate placing frames 2 are arranged in parallel, with the ends arranged on the vertical frame. Each plate placing frame 2 is correspondingly provided with one cross supporting beam 3. The positioning pins 4 are arranged at the four corners of the plate placing frame 2.

[0037] The size of the board frame 2 is set corresponding to the size of the PCB board.

[0038] The board frame 2 is designed based on the dimensions of the PCB board being cut, with compensation based on the theoretical dimensions (length +10mm, width +6mm). For example, if the actual dimensions are 520mm*414mm, the final dimensions will be 530mm*420mm. This size facilitates board processing, allowing printed boards to be placed flat within the frame 2 without compromising the quality of the finished boards.

[0039] The number of the positioning pins 4 is four.

[0040] This device features a rectangular frame 2 with four positioning pins 4 designed into the frame. These pins are located in the four corner holes of the PCB board. These holes are fixed in position and are used to hold the thin PCB board in place, preventing it from sagging. Furthermore, these pins position the board to prevent it from shifting due to the airflow in the oven, or shifting during transport, which could cause the cross beam to enter the active board and affect the baking quality.

[0041] The plate placing frame 2 is provided with an inner folding edge strip, and the inner folding edge strip is arranged inside the plate placing frame.

[0042] The panel frame 2 has a 10*10mm stainless steel right-angled hem with a 1mm thick inner hem. This hem is securely welded within the rectangular frame and serves as an effective panel edge support beam. This serves two purposes: first, to limit the range of panel hanging holes, facilitating operation; second, to increase effective panel edge support, reducing the concentration of panel weight on the corner hanging holes and reducing the risk of hole breakage and panel damage. The inner hem effectively supports the panels, acting as a barrier and preventing contact between panels. The principle behind this is that the panels are 520mm*414mm in size, while the rectangular outer frame is 530mm*420mm, making it sufficiently large for the panels. In order to solve the problem of effective support of the panel in the panel frame 2, 10*10mm stainless steel right-angle folded edges are provided on the four sides of the rectangular frame as supporting beams (opening facing upwards), forming a rectangular inner frame with a minimum bottom size of 500mm*400mm. The bottom inner frame is smaller than the panel, which can effectively support the panel edge and prevent the panel from moving significantly in the frame, thereby limiting the panel hanging hole to a smaller range for convenient operation.

[0043] The plate placing frame 2 is welded on the vertical frame 12 .

[0044] The plate frame 2 is welded to the interior of the crossbeam-free lasagna rack 1. This welding method solves the stacking problem of the lasagna rack 1, facilitates production operations, and eliminates the problem of oily surface caused by contact between ink on the plate surface and the crossbeam. The stacking principle of the lasagna rack is as follows: the right-angled edges within the plate frame 2 can independently support the plate edges, and the plate positioning pins 4 are used to pull and fix the plate. The plate frame 2 is then welded to the interior of the crossbeam-free lasagna rack, and the stacking function is achieved by adjusting the parallelism and distance between the layers of the lasagna rack.

[0045] The plate placing frame is made of stainless steel.

[0046] This device is modified appropriately to meet the needs of internal production processes based on actual production practices. For example, if a tunnel oven is used, the number of lasagna racks should be designed based on the tunnel oven's dimensions to maximize the use of baking sheet resources and improve production efficiency. If a vertical oven is used for baking, integrated push-pull wheels and the maximum number of lasagna racks should be designed based on the actual oven dimensions to reduce the use of pallet carts, improve production efficiency, and facilitate on-site 5S management.

[0047] In another preferred embodiment, the baking sheet lasagna rack further includes a lasagna rack roller, and the lasagna rack roller is arranged on the base.

[0048] In other embodiments, the plate frame 2 needs to be designed with fixed dimensions according to the plate size, and the position of the plate corner positioning pins 4, the size of the kiosks and the layer height can be appropriately adjusted according to the actual plate thickness;

[0049] The size of the lasagna rack can be designed according to the size of the tunnel oven or the vertical oven;

[0050] If you design a vertical oven baking sheet Thousand Layer rack, you can make integrated push-pull wheels at the bottom to reduce the need for tray carts.

[0051] The middle cross supporting beam 3 can be fixed or movable, depending on the panel layout design.

[0052] The utility model provides a silk screen thin plate baking plate Thousand Layer Rack which has the following beneficial effects:

[0053] The utility model provides a silk-screen thin plate baking plate Thousand Layer Rack, which bakes PCB boards flatly by the supporting force of the four sides of the board frame 2, thereby reducing the contact between the uncured first side of the PCB board and the beams when the second side is wet-film printed and baked, which may cause ink imprinting or even oil sticking problems; in addition, it avoids the effect of external force that may cause the board to warp and deform during baking.

[0054] It is convenient for the production operation of double-sided baking plates after wet film printing of PCB boards, and is not easy to produce foreign matter on the board edge and board warping; it can solve the problem of non-stick oil on the baking plates for double-sided wet film printing of PCB thin boards, avoid the generation of foreign matter and abnormal board warping; it can match the conventional board production process and is conducive to batch PCB board production operations.

[0055] The baking board is placed flat by the support force of the four sides of the board and the cross support beam 3, and is positioned by the board corner positioning pins 4, which reduces the contact between the effective board surface that is not fully cured on the first side and the beams when the second side of the PCB is wet-film printed and baked, resulting in oil sticking problems and scrapping; in addition, external forces are avoided to prevent the board from warping and deformation during baking.

[0056] According to the above design, this device can effectively expand the thin plate processing capacity and can also process 0.1-0.2mm plates normally (the thickness range currently recognized by the industry as the most difficult for thin plate processing).

[0057] This device is manufactured and welded firmly as described above. After assembly, burrs and burrs are removed before it is dispatched for on-site use.

[0058] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0059] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A silk-screen thin plate baking sheet Thousand Layer Rack, characterized by: It includes a baking plate lasagna rack, a plate placing frame, a cross supporting beam and positioning pins; the plate placing frame is arranged on the baking plate lasagna rack; the cross supporting beam is arranged on the plate placing frame, and the positioning pins are arranged on the four corners of the plate placing frame; The plate placing frame is a square frame, and the baking plate lasagna rack includes a base and a vertical frame. One end of the vertical frame is connected to the end of the base. There are multiple plate placing frames, and the multiple plate placing frames are arranged in parallel, and the ends are arranged on the vertical frame; one cross supporting beam is correspondingly arranged for each plate placing frame; the positioning pins are arranged on the four corners of the plate placing frame; The size of the board frame is set corresponding to the size of the PCB board.

2. The silk-screen thin plate baking sheet lasagna rack according to claim 1, characterized in that: The plate placing frame is provided with an inner folding edge strip, and the inner folding edge strip is arranged in the plate placing frame.

3. The silk-screen thin plate baking sheet lasagna rack according to claim 1, characterized in that: The plate placing frame is welded on the vertical frame.

4. The silk-screened sheet baking sheet lasagna rack according to claim 1, characterized in that: The plate placing frame is made of stainless steel.

5. The silk-screened sheet baking sheet lasagna rack according to claim 1, characterized in that: The baking plate lasagna rack further comprises a lasagna rack roller, and the lasagna rack roller is arranged on the base.

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