Bonding pad shielding jig for spraying UV glue on circuit board

Abstract

The utility model relates to the technical field of electronic manufacturing, in particular to a bonding pad shielding jig for spraying UV glue on a circuit board, which comprises a mounting plate fixed on an operating table of spraying equipment through bolts, electric push rods are fixedly connected to four corners of the top surface of the mounting plate, a supporting block is fixedly connected to the top surface of the mounting plate, and the supporting block is fixedly connected with a supporting rod. The combined plate is fixed to the output ends of the four electric push rods through bolts and used for separating elements on the circuit board, and the combined plate comprises an element receding plate and a covering plate located above the element receding plate. According to the utility model, elements on the circuit board can be divided into two parts under the action of the plurality of barrier strips and the covering plate in the element clearance plate, and the elements needing glue spraying are accurately covered and completely exposed, so that accurate glue spraying on the circuit board is facilitated, the waste of UV glue can be reduced, and the production efficiency is improved. In addition, manual processing in the later period is not needed, the cost support can be reduced, and the production efficiency of the circuit board can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic manufacturing, in particular to a soldering pad protection jig for spraying UV glue on a circuit board. Background Art

[0002] Electronics manufacturing is a broad field that involves the design, development, production, and testing of electronic devices and components. This industry encompasses everything from simple electronic components like resistors, capacitors, and inductors to complex electronic products like smartphones, laptops, televisions, and medical devices. Circuit boards are a common component in these products, and during their production, they require the application of UV adhesive.

[0003] Currently, when spraying UV glue on circuit boards, the electronic components on the circuit boards are usually all exposed, which will cause the entire surface of the circuit board to be sprayed with glue. However, some electronic components may need to be replaced later and do not need to be sprayed with glue, which will increase the waste of UV glue. In addition, in the later stage, the UV glue in the areas that do not need to be sprayed needs to be manually cleaned, which increases the labor intensity of the staff and increases the cost expenditure. Utility Model Content

[0004] The purpose of the utility model is to provide a solder pad protection jig for spraying UV glue on a circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A solder pad protection jig for spraying UV glue on a circuit board, comprising:

[0007] The mounting plate is fixed to the operating table of the spraying equipment by bolts, and the four corners of the top surface of the mounting plate are fixedly connected to the electric push rods, and the top surface of the mounting plate is fixedly connected to the support block;

[0008] A combination plate is fixed to the output ends of the four electric push rods by bolts and is used to separate the components on the circuit board. The combination plate includes a component air avoidance plate and a cover plate located above the component air avoidance plate. The component air avoidance plate is a circular structure. Multiple groups of baffles are fixedly connected between the two long sides of the component air avoidance plate. Each group of baffles consists of two symmetrically distributed baffles. An opening is opened on the top surface of the cover plate corresponding to each group of baffles.

[0009] The correction mechanism is arranged inside the support block and is used to straighten the circuit board.

[0010] Furthermore, a rectangular groove is provided on the top surface of the support block, and the deviation correction mechanism includes:

[0011] Two sets of symmetrical sliding rods slide through the two sides of the support block respectively, and each set of sliding rods consists of two symmetrical sliding rods;

[0012] Two symmetrical abutment plates are located outside the support block and are respectively fixedly connected between the ends of the two sliding rods at corresponding positions;

[0013] Two symmetrical connecting plates are located inside the rectangular slot and are respectively fixedly connected between the ends of the two sliding rods at corresponding positions;

[0014] The control component is arranged inside the rectangular groove and located between the two connecting plates.

[0015] Furthermore, the two connecting plates are fixedly connected to opposite sides with racks, the two racks are staggered with each other, and the control assembly includes:

[0016] A rotating shaft is rotatably connected to the inner bottom surface of the rectangular groove;

[0017] The gear is fixedly connected to the outer wall of the rotating shaft and meshes with the two racks for transmission;

[0018] A worm gear is fixedly connected to the bottom end of the outer wall of the rotating shaft;

[0019] The worm is arranged inside the rectangular groove and meshes with the worm wheel for transmission.

[0020] Furthermore, a connecting rod fixed to two ends of the worm is rotatably connected between two opposite side surfaces inside the rectangular groove.

[0021] Furthermore, one end of one of the connecting rods passes through the supporting block and is fixedly connected to the rotating block.

[0022] Furthermore, two opposite side surfaces of the support block are penetrated and fixed with stabilizing tubes which slide through and slide with the slide rods at corresponding positions.

[0023] Furthermore, the top surface of the support block is fixedly connected to a limiting block at a side away from the rotating block, and the bottom surfaces of the two abutment plates are flush with the top surface of the limiting block.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. The components on the circuit board can be divided into two parts by the multiple baffles and cover plates in the component avoidance plate, and the components that need to be sprayed with glue are accurately covered, while the components that need to be sprayed with glue are completely exposed, so as to facilitate accurate spraying of glue on the circuit board, reduce the waste of UV glue, and do not require later manual processing, which can reduce cost support and improve the efficiency of circuit board production;

[0026] 2. The tilted circuit board can be straightened by bringing the two abutment plates closer to each other, so that the component avoidance plate and the cover plate can accurately separate the circuit board into two parts according to actual requirements, so that the spraying equipment can accurately spray glue on the exposed part. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0028] Figure 2 This is a schematic diagram of the positions of the mounting plate and the deviation-correcting mechanism in the utility model;

[0029] Figure 3 It is a schematic diagram of the mounting plate in the utility model;

[0030] Figure 4 This is a schematic diagram of the component air-avoiding plate in the utility model;

[0031] Figure 5 This is a schematic diagram of the cover plate in the present utility model;

[0032] Figure 6 It is a structural diagram of the correction mechanism in the utility model.

[0033] In the figure: 1. Mounting plate; 11. Electric push rod; 12. Support block; 13. Limit block; 14. Rectangular groove; 15. Stabilizing tube; 2. Component avoidance plate; 21. Baffle; 3. Covering plate; 31. Opening; 4. Correction mechanism; 41. Sliding rod; 42. Abutment plate; 43. Connecting plate; 44. Rack; 45. Gear; 46. Worm wheel; 47. Worm; 48. Connecting rod. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] See also Figures 1 to 6In an embodiment of the present invention, a pad protection jig for spraying UV glue on a circuit board is provided, comprising a mounting plate 1 fixed to an operating table of the spraying equipment by bolts, and electric push rods 11 are fixedly connected to the four corners of the top surface of the mounting plate 1, and a support block 12 is fixedly connected to the top surface of the mounting plate 1. A combination plate is fixed to the output ends of the four electric push rods 11 by bolts, and is used to separate the components on the circuit board. The combination plate comprises a component air avoidance plate 2 and a covering plate 3 located above the component air avoidance plate 2. The component air avoidance plate 2 is a circular structure, and a plurality of groups of baffles 21 are fixedly connected between the two long side surfaces inside the component air avoidance plate 2, and each group of baffles 21 is composed of two baffles 21 symmetrically distributed. An opening 31 is penetrated through the top surface of the covering plate 3 corresponding to each group of baffles 21, and a correction mechanism 4 is arranged inside the support block 12, and is used to straighten the circuit board.

[0036] Specifically, when in use, first fix the mounting plate 1 on the operating table of the spraying equipment by bolts, then put the component air-avoiding plate 2 and the covering plate 3 together, and the component air-avoiding plate 2 is located below the covering plate 3, and fix the component air-avoiding plate 2 and the covering plate 3 to the output ends of the four electric push rods 11 by bolts, and then the component air-avoiding plate 2 and the covering plate 3 can be raised by driving the four electric push rods 11. At this time, the circuit board that needs to be sprayed with glue can be placed on the support block 12, and then the component air-avoiding plate 2 and the covering plate 3 are moved down and cover the circuit board by driving the four electric push rods 11. At this time, the multiple baffles 21 on the component air-avoiding plate 2 can separate some components on the circuit board, so that the components that need to be sprayed with glue are located in the openings 31 on the covering plate 3, and then the UV glue can be sprayed into the openings 31 by the spraying equipment. Since the components that need to be sprayed with glue are located in the opening 31, the sprayed UV glue is directly applied to the circuit board in the opening 31. When the spraying is completed, the circuit board is taken out by the action of the four electric push rods 11, and a new circuit board is placed. If it is necessary to spray glue on other types of circuit boards, the matching component air avoidance plate 2 and the cover plate 3 can be replaced and fixed to the four electric push rods 11 by bolts. The device can separate the components on the circuit board into two parts through the action of multiple baffles 21 in the component air avoidance plate 2 and the cover plate 3, accurately cover the components that need to be sprayed with glue, and completely expose the components that need to be sprayed with glue, thereby facilitating accurate spraying of glue on the circuit board, reducing the waste of UV glue, and requiring no subsequent manual processing, which can reduce cost support and improve the efficiency of circuit board production.

[0037] Example 1

[0038] like Figure 6As shown, in this embodiment, a rectangular groove 14 is provided on the top surface of the support block 12, and the correction mechanism 4 includes two groups of symmetrical sliding rods 41 that respectively penetrate and slide on the two side surfaces of the support block 12, and each group of sliding rods 41 is composed of two symmetrical sliding rods 41, two symmetrical abutment plates 42 are located on the outside of the support block 12, and are respectively fixedly connected between the ends of the two sliding rods 41 at corresponding positions, two symmetrical connecting plates 43 are located inside the rectangular groove 14, and are respectively fixedly connected between the ends of the two sliding rods 41 at corresponding positions, and the control component is arranged inside the rectangular groove 14 and between the two connecting plates 43.

[0039] In this embodiment, the circuit board is placed on the support block 12, and the two abutment plates 42 are brought closer to each other to straighten the tilted circuit board, thereby facilitating the component avoidance plate 2 and the masking plate 3 to accurately separate the circuit board into two parts according to actual requirements, so that the spraying equipment can accurately spray glue on the exposed part.

[0040] Example 2

[0041] like Figure 3 and Figure 6 As shown, in this embodiment, the two opposite sides of the connecting plates 43 are fixedly connected to racks 44, and the two racks 44 are staggered with each other. The control component includes a rotating shaft rotatably connected to the inner bottom surface of the rectangular groove 14, a gear 45 fixedly connected to the outer wall of the rotating shaft, and meshing with the two racks 44 for transmission, a worm gear 46 fixedly connected to the bottom end of the outer wall of the rotating shaft, and a worm 47 arranged inside the rectangular groove 14 and meshing with the worm gear 46 for transmission. A connecting rod 48 fixed to both ends of the worm 47 is rotatably connected between the two opposite side surfaces inside the rectangular groove 14, one end of one of the connecting rods 48 passes through the support block 12 and is fixedly connected to the rotating block, and the two opposite side surfaces of the support block 12 are penetrated and fixed with a stabilizing tube 15 that slides through the sliding rod 41 at the corresponding position, and the top surface of the support block 12 is fixedly connected to the limiting block 13 on the side away from the rotating block, and the bottom surfaces of the two abutment plates 42 are flush with the top surface of the limiting block 13.

[0042] In this embodiment, the circuit board is placed on the support block 12 so that one side of the circuit board contacts the limit block 13, and then the worm 47 drives the worm gear 46 to rotate by rotating the rotating block. The rotating worm gear 46 can rotate the gear 45. Since the gear 45 is located between the two racks 44 and the gear 45 is engaged with the two racks 44, the rotating gear 45 can make the two racks 44 move in opposite directions, so that the two abutment plates 42 can be brought close to each other. If the circuit board is placed at an angle, the two abutment plates 42 close to each other can straighten the circuit board, so that the component avoidance plate 2 and the cover plate 3 can accurately separate the circuit board into two parts according to actual requirements, so that the spraying equipment can accurately spray glue on the exposed part.

[0043] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0044] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A solder pad protection jig for spraying UV glue on circuit boards, characterized in that: include: The mounting plate (1) is fixed to the operating table of the spraying equipment by bolts, the four corners of the top surface of the mounting plate (1) are fixedly connected to the electric push rods (11), and the top surface of the mounting plate (1) is fixedly connected to the support block (12); A combination plate is fixed to the output ends of the four electric push rods (11) by bolts and is used to separate the components on the circuit board. The combination plate includes a component air-avoiding plate (2) and a cover plate (3) located above the component air-avoiding plate (2). The component air-avoiding plate (2) is a circular structure. A plurality of groups of baffles (21) are fixedly connected between the two long side surfaces inside the component air-avoiding plate (2). Each group of baffles (21) is composed of two baffles (21) symmetrically distributed. An opening (31) is formed through the top surface of the cover plate (3) corresponding to each group of baffles (21). The deviation correction mechanism (4) is arranged inside the support block (12) and is used to straighten the circuit board.

2. The solder pad protection jig for spraying UV glue on circuit boards according to claim 1 is characterized in that: A rectangular groove (14) is provided on the top surface of the support block (12), and the deviation correction mechanism (4) includes: Two groups of symmetrical slide bars (41) respectively penetrate and slide on the two side surfaces of the support block (12), and each group of slide bars (41) is composed of two symmetrical slide bars (41); Two symmetrical abutment plates (42) are located outside the support block (12) and are respectively fixedly connected between the ends of the two slide bars (41) at corresponding positions; Two symmetrical connecting plates (43) are located inside the rectangular groove (14) and are respectively fixedly connected between the ends of the two sliding rods (41) at corresponding positions; The control assembly is arranged inside the rectangular groove (14) and located between the two connecting plates (43).

3. The solder pad protection jig for spraying UV glue on circuit boards according to claim 2, characterized in that: The two connecting plates (43) are fixedly connected to opposite sides with racks (44), and the two racks (44) are staggered with each other. The control component includes: A rotating shaft rotatably connected to the inner bottom surface of the rectangular groove (14); A gear (45) is fixedly connected to the outer wall of the rotating shaft and meshes with the two racks (44) for transmission; A worm gear (46) is fixedly connected to the bottom end of the outer wall of the rotating shaft; The worm (47) is arranged inside the rectangular groove (14) and meshes with the worm wheel (46) for transmission.

4. The solder pad protection jig for spraying UV glue on circuit boards according to claim 3, characterized in that: A connecting rod (48) fixed to both ends of the worm (47) is rotatably connected between two opposite side surfaces inside the rectangular groove (14).

5. The solder pad protection jig for spraying UV glue on circuit boards according to claim 4, characterized in that: One end of one of the connecting rods (48) passes through the support block (12) and is fixedly connected to the rotating block.

6. The solder pad protection jig for spraying UV glue on circuit boards according to claim 5, characterized in that: Stabilizing tubes (15) that slide through and penetrate the slide bars (41) at corresponding positions are fixed on both opposite side surfaces of the support block (12).

7. The solder pad protection jig for spraying UV glue on circuit boards according to claim 6, characterized in that: The top surface of the support block (12) is fixedly connected to the limiting block (13) on a side away from the rotating block, and the bottom surfaces of the two abutment plates (42) are flush with the top surface of the limiting block (13).

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