Cleaning device

Abstract

The utility model relates to the technical field of semiconductor chip packaging, in particular to a cleaning device. The cleaning device is used for cleaning a to-be-cleaned chip and comprises a body, a mounting seat, an operation mold and an adhesion structure, the mounting seat is arranged on the body and is used for mounting a to-be-cleaned chip; the operation mold is movably arranged on the body, the operation mold is used for pressing the to-be-cleaned chip so that the to-be-cleaned chip can be fixed to the mounting base, the operation mold is provided with an open hole, and the open hole is used for exposing the cleaning part of the to-be-cleaned chip; the adhesion structure is arranged on the body, and the adhesion structure is used for adhering impurities on the chip to be cleaned through the open hole. When the cleaning device is used for cleaning the chip structure, the hidden danger that the chip falls off due to poor fixation of the chip can be solved, meanwhile, impurities can be prevented from falling on other parts of the chip in the cleaning process, and the cleaning effect on the chip can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip packaging technology, and in particular to a cleaning device. Background Art

[0002] As the semiconductor industry develops faster and faster, the process is constantly changing, and there are higher requirements for the cleanliness of the product surface during the semiconductor production process.

[0003] During the current production process, when a product is misprinted, it needs to be deep cleaned to remove the tin powder and flux on the surface so that the product can be put into production again.

[0004] The existing cleaning method involves manually securing the product and removing the tin powder and flux with a clean cloth. This method presents the following issues: 1. The product cannot be effectively secured, making it prone to falling during operation and potentially causing quality problems; 2. Tin powder particles are extremely small and can easily lodge in product gaps, creating blind spots that are difficult to remove. After reflow heating, they adhere to the metal surface of the product, causing functional failure and resulting in scrapping; 3. The diverse product sizes make it difficult to use a uniform jig, hindering yield improvement. Utility Model Content

[0005] The embodiments of the present application aim to solve at least one of the technical problems existing in the prior art and provide a cleaning device that can effectively fix the chip to be cleaned.

[0006] The embodiment of the present application provides a cleaning device for cleaning a chip to be cleaned, the cleaning device comprising: a body, a mounting seat, a working mold and an adhesion structure;

[0007] The mounting seat is provided on the body, and the mounting seat is used to mount the chip to be cleaned;

[0008] The working mold is movably arranged on the body, and is used to press the chip to be cleaned so that it is fixed to the mounting seat. The working mold is provided with an opening, and the opening is used to expose the cleaning part of the chip to be cleaned;

[0009] The adhesion structure is arranged on the main body, and is used for adhering impurities on the chip to be cleaned through the opening.

[0010] In an optional embodiment, the working mold includes a plate-like structure, the plate-like structure is used to press the chip to be cleaned and is provided with the opening, and the thickness of the plate-like structure is not greater than 1 mm.

[0011] In an optional embodiment, the working mold further includes a support ring, which is arranged along a circle of the plate-like structure and is used to support the plate-like structure.

[0012] In an optional embodiment, the working mold is rotatably disposed on the main body and has a first position and a second position that rotate relative to the main body. In the first position, the chip to be cleaned can be installed on the mounting seat. In the second position, the working mold presses the chip to be cleaned so that it is fixed to the mounting seat.

[0013] In an optional embodiment, the mounting seat includes a plurality of side panels, the plurality of side panels enclose a mounting space, and the chip to be cleaned is mounted in the mounting space.

[0014] In an optional embodiment, the cleaning device further comprises: a plurality of adjustment components;

[0015] The multiple adjustment components are respectively connected to the multiple side panels, and the multiple adjustment components are used to control the movement of the multiple side panels relative to the body to adjust the size of the installation space.

[0016] In an optional embodiment, the adjustment assembly includes a lead screw and a nut;

[0017] The lead screw is rotatably arranged on the body;

[0018] The nut is sleeved on the lead screw and connected to the corresponding side plate. The nut can drive the side plate to move along the axial direction of the lead screw when the lead screw rotates circumferentially.

[0019] In an optional embodiment, the number of the nuts is two, the two nuts are respectively connected to the two opposite side plates, and the two nuts have opposite thread directions.

[0020] In an optional embodiment, the cleaning device further comprises: a winch;

[0021] The winch is rotatably disposed on the body, and the winch is used to wind the adhesion structure.

[0022] In an optional embodiment, the cleaning device further comprises: a cutter;

[0023] The cutter is disposed on the main body and is used for cutting the adhesive structure.

[0024] The above technical solution of this application has the following beneficial technical effects:

[0025] The cleaning device of the embodiment of the present application can utilize a mounting base and a working mold to position and secure the chip when cleaning the chip structure. Furthermore, the working mold can expose the chip portion to be cleaned (e.g., a hole or slot in the chip structure) during the securing process. This can eliminate the risk of the chip falling due to poor chip securing and prevent impurities from landing on other parts of the chip during the cleaning process, thereby improving the chip cleaning effect.

[0026] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without inventive effort.

[0028] Figure 1 A schematic structural diagram of a cleaning device provided in an embodiment of the present application is shown;

[0029] Figure 2 Shown Figure 1 Side view of

[0030] Figure 3 Shown Figure 1 A top view of

[0031] Reference numerals:

[0032] 1. Main body; 11. Slide groove; 12. Support frame; 13. Rotating shaft; 14. Mounting groove; 2. Mounting seat; 21. Side panel; 21a. First side panel; 21b. Second side panel; 21c. Third side panel; 21d. Fourth side panel; 22. Slide plate; 3. Working mold; 31. Plate-like structure; 311. Opening; 32. Support ring; 33. Hinge; 4. Adjustment assembly; 4a. First adjustment assembly; 4b. Second adjustment assembly; 41. Screw; 42. Knob; 5. Adhesion structure; 6. Capstan; 7. Cutter. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0034] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0038] An embodiment of the present application provides a cleaning device for cleaning a chip to be cleaned.

[0039] In some embodiments, as Figures 1 to 3As shown, the cleaning device includes: a main body 1, a mounting seat 2 and a working mold 3. The mounting seat 2 is arranged on the main body 1, and the mounting seat 2 is used to install the chip to be cleaned. The working mold 3 is movably arranged on the main body 1, and the working mold 3 is used to press the chip to be cleaned so that it is fixed on the mounting seat 2. The working mold 3 is provided with an opening 311, and the opening 311 is used to expose the part to be cleaned of the chip to be cleaned. When using the above-mentioned cleaning device to clean the chip structure, the mounting seat 2 and the working mold 3 can be used to position and fix the chip, and the working mold 3 can expose the part to be cleaned of the chip (such as the hole or groove of the chip structure) when fixed. In this way, the hidden danger of the chip falling due to poor fixation can be solved. At the same time, it can also prevent impurities from falling on other parts of the chip during the cleaning process, which is beneficial to improving the cleaning effect of the chip.

[0040] In some embodiments, as Figure 1 As shown, the working mold 3 includes a plate-like structure 31, which is used to compress the chip to be cleaned and secure it to the mounting base 2. The plate-like structure 31 is provided with an opening 311. The thickness of the plate-like structure 31 is no greater than 1 mm. For example, the thickness of the plate-like structure 31 can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm. It should be understood that the operator needs to clean the chip through the opening 311 in the plate-like structure 31. Therefore, the depth of the opening 311 should be minimized to prevent the opening 311 from being too deep, preventing the cleaning cloth from reaching impurities on the chip surface.

[0041] In some embodiments, as Figure 1 As shown, the working mold 3 includes a support ring 32, which is arranged along a circle of the plate-like structure 31 and is used to support the plate-like structure 31. It should be understood that as the thickness of the plate-like structure 31 decreases, the plate-like structure 31 becomes more susceptible to deformation (such as bending), which inevitably affects the operation of the plate-like structure 31. This embodiment uses the support ring 32 to support the plate-like structure 31, which can solve the problem of easy deformation of the plate-like structure 31 and make it easier for operators to operate the working mold 3.

[0042] In some embodiments, the working mold 3 is rotatably disposed on the body 1 and has a first position and a second position that rotate relative to the body 1. In the first position, the chip to be cleaned can be mounted on the mounting seat 2. In the second position, the working mold 3 presses the chip to be cleaned to fix it on the mounting seat 2. Figure 1 As shown, this embodiment shows that the support ring 32 of the working mold 3 is connected to the body 1 through a hinge 33, so that the working mold 3 can rotate relative to the body 1. During use, the working mold 3 can be rotated clockwise to the first position, or counterclockwise to the second position.

[0043] In some embodiments, the mounting base 2 includes a plurality of side panels 21, which enclose a mounting space, and the chip to be cleaned is mounted in the mounting space. Figure 1 As shown, this embodiment shows that the side panels 21 are L-shaped panels, and four L-shaped panels enclose the installation space. This allows the chip to be positioned and circumferentially fixed, facilitating alignment of the chip's cleaning area with the opening 311 of the working mold 3, and preventing the chip from shifting during the cleaning process and becoming misaligned with the opening 311.

[0044] In some embodiments, a plurality of side panels 21 are movably disposed on the body 1. Figure 1 As shown, this embodiment shows that the mounting base 2 also includes a plurality of slides 22 , and the plurality of side panels 21 are respectively arranged on the plurality of slides 22 , and the plurality of slides 22 can slide on the surface of the body 1 to enable the plurality of side panels 21 to move relative to the body 1 .

[0045] In some embodiments, the body 1 is provided with a plurality of slide grooves 11, and the plurality of slide plates 22 are respectively slidably matched with the plurality of slide grooves 11 to guide the side plates 21. Figure 1 As shown, this embodiment shows that the sliding groove 11 is arranged along the diagonal direction of the side plate 21.

[0046] In some embodiments, the cleaning device further includes multiple adjustment assemblies 4, each of which is connected to the multiple side panels 21. The multiple adjustment assemblies 4 are used to control the movement of the multiple side panels 21 relative to the body 1 to adjust the size of the installation space. In this way, the adjustment assemblies 4 can be used to control the position of the side panels 21, thereby adjusting the size of the installation space, allowing the mounting base 2 to accommodate chips of different sizes. It should be understood that in a specific configuration, the multiple adjustment assemblies 4 can be indirectly connected to the side panels 21 via the slide 22.

[0047] In some embodiments, the adjustment assembly 4 can be a ball screw 41 mechanism. Specifically, the adjustment assembly 4 includes a screw 41 and a nut. The screw 41 is rotatably mounted on the body 1. The nut is mounted on the screw 41 and connected to the corresponding side plate 21. The nut drives the side plate 21 axially as the screw 41 rotates circumferentially. This allows the nut mounted on the screw 41 to move the side plate 21, thereby adjusting the size of the installation space.

[0048] In some embodiments, as Figures 1 to 3 As shown, one end of the lead screw 41 is passed through the body 1, and a nut is sleeved on the portion of the lead screw 41 passing through the body 1. In this way, the cleaning device as a whole can be made neater and more beautiful.

[0049] In some embodiments, as Figures 1 to 3 As shown, a knob 42 is provided at one end of the lead screw 41 for transmitting torque to the lead screw 41. Figure 1As shown, this embodiment shows that the knob 42 is arranged at the end of the screw 41 exposed outside the body 1.

[0050] In some embodiments, the installation heights of the screws 41 of different adjustment assemblies 4 are different. Figure 3 As shown, this embodiment shows that the lead screws 41 of the two adjustment components 4 are arranged in an upper and lower staggered manner. In this way, interference between the adjustment components 4 can be avoided, thereby affecting the adjustment function of the installation space.

[0051] In some embodiments, the adjustment assembly 4 is connected to two opposing side panels 21, and the adjustment assembly 4 drives the two opposing side panels 21 to move synchronously. For example, the adjustment assembly 4 includes two nuts, each connected to one of the opposing side panels 21, and having opposite thread directions. This reduces the number of parts in the adjustment assembly 4, which helps reduce the manufacturing cost of the cleaning device. Furthermore, since the adjustment assembly 4 can drive the two opposing side panels 21 to move synchronously, the operation of the cleaning device is more convenient, which helps improve the user's operating experience.

[0052] Exemplarily, the number of side panels 21 is 4, and the number of adjustment assemblies 4 is 2. The four side panels 21 are respectively the first side panel 21a, the second side panel 21b, the third side panel 21c, and the fourth side panel 21d. The first side panel 21a and the second side panel 21b are arranged opposite to each other, and the third side panel 21c and the fourth side panel 21d are arranged opposite to each other. The two adjustment assemblies 4 are respectively the first adjustment assembly 4a and the second adjustment assembly 4b. The screw 41 of the first adjustment assembly 4a is provided with two nuts, and the two nuts of the first adjustment assembly 4a have opposite thread directions. The screw 41 of the second adjustment assembly 4b is provided with two nuts, and the two nuts of the second adjustment assembly 4b have opposite thread directions. During specific installation, the two nuts of the first adjustment assembly 4a are connected to the first side panel 21a and the second side panel 21b, respectively, and the two nuts of the second adjustment assembly 4b are connected to the third side panel 21c and the fourth side panel 21d, respectively. During use, when the screw 41 of the first adjusting component 4a is rotated circumferentially, the two nuts thereon can be moved closer to or farther away from each other, thereby making the first side plate 21a and the second side plate 21b closer to or farther away from each other; when the screw 41 of the second adjusting component 4b is rotated circumferentially, the two nuts thereon can be moved closer to or farther away from each other, thereby making the third side plate 21c and the fourth side plate 21d closer to or farther away from each other.

[0053] In some embodiments, as Figure 1As shown, the cleaning device also includes an adhesion structure 5, which can be an adhesive tape. The adhesion structure 5 is arranged on the main body 1, and the adhesion structure 5 is used to adhere impurities (such as tin powder and flux, etc.) on the chip to be cleaned through the opening 311. In other words, this embodiment uses an adhesion cleaning method to clean the chip. It should be noted that adhesion cleaning is a cleaning method that uses a sticky substance to remove impurities on the surface of the chip. This cleaning method will not damage the structure of the chip surface, and the adhesion cleaning tool is usually easy to use and does not require special skills or tools. In addition, this cleaning method can avoid the use of chemical detergents, thereby reducing the impact on the environment and human health.

[0054] For example, during use, the adhesive structure 5 can be placed above the opening 311 of the working mold 3. Applying downward force can cause the adhesive structure 5 to adhere to impurities (such as tin powder and flux, etc.) on the part of the chip to be cleaned exposed by the opening 311, thereby completing the cleaning of the chip.

[0055] In some embodiments, as Figure 1 As shown, the cleaning device further comprises a winch 6, which is rotatably arranged on the body 1 and is used to wind the adhesive structure 5. Figure 1 As shown, this embodiment shows that the body 1 is provided with a support frame 12 and a rotating shaft 13 disposed on the support frame 12. The capstan 6 is mounted on the rotating shaft 13, so that the capstan 6 can be rotatably mounted on the body 1. During use, when the capstan 6 rotates counterclockwise about the rotating shaft 13, the adhesive structure 5 wrapped around the capstan 6 can be pulled out, thereby releasing the adhesive structure 5 in the longitudinal direction. This facilitates the removal of the adhesive structure 5 and improves the convenience of operation.

[0056] In some embodiments, as Figure 1 As shown, the cleaning device further includes a cutter 7, which is disposed on the body 1 and is used to cut the adhesive structure 5. This facilitates the use of the adhesive structure 5 after it is cut and disposed of. It should be understood that the cutter 7 has a blade, and the cutter 7 can use its blade to cut the adhesive structure 5.

[0057] In some embodiments, as Figure 1 As shown, the body 1 is provided with a mounting groove 14, and the cutter 7 is arranged in the mounting groove 14. Figure 3 As shown, from the side, the cutter 7 is not exposed outside the body 1, that is, the cutter 7 is hidden in the mounting groove 14. In this way, the cutter 7 can be prevented from protruding outside the body 1, thereby preventing the cutter 7 from scratching the user during use, which is conducive to improving the safety of the device.

[0058] The one or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification shall be included within the scope of protection of this application.

[0059] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A cleaning device for cleaning a chip to be cleaned, characterized in that: The cleaning device comprises: a body, a mounting seat, a working mold and an adhesion structure; The mounting seat is provided on the body, and the mounting seat is used to mount the chip to be cleaned; The working mold is movably arranged on the body, and is used to press the chip to be cleaned so that it is fixed to the mounting seat. The working mold is provided with an opening, and the opening is used to expose the cleaning part of the chip to be cleaned; The adhesion structure is arranged on the main body, and is used for adhering impurities on the chip to be cleaned through the opening.

2. The cleaning device according to claim 1, characterized in that The working mold includes a plate-like structure, which is used to press the chip to be cleaned and is provided with the opening. The thickness of the plate-like structure is not greater than 1 mm.

3. The cleaning device according to claim 2, characterized in that The working mold further includes a support ring, which is arranged along a circle of the plate-like structure and is used to support the plate-like structure.

4. The cleaning device according to claim 1, characterized in that The working mold is rotatably arranged on the main body and has a first position and a second position that rotate relative to the main body. In the first position, the chip to be cleaned can be installed on the mounting seat. In the second position, the working mold presses the chip to be cleaned so that it is fixed on the mounting seat.

5. The cleaning device according to claim 1, characterized in that The mounting seat includes a plurality of side panels, which enclose a mounting space, and the chip to be cleaned is mounted in the mounting space.

6. The cleaning device according to claim 5, characterized in that The cleaning device further comprises: a plurality of adjustment components; The multiple adjustment components are respectively connected to the multiple side panels, and the multiple adjustment components are used to control the movement of the multiple side panels relative to the body to adjust the size of the installation space.

7. The cleaning device according to claim 6, characterized in that The adjustment assembly includes a lead screw and a nut; The lead screw is rotatably arranged on the body; The nut is sleeved on the lead screw and connected to the corresponding side plate. The nut can drive the side plate to move along the axial direction of the lead screw when the lead screw rotates circumferentially.

8. The cleaning device according to claim 7, characterized in that There are two nuts, which are respectively connected to the two opposite side plates, and have opposite thread directions.

9. The cleaning device according to claim 1, characterized in that The cleaning device further comprises: a winch; The winch is rotatably disposed on the body, and the winch is used to wind the adhesion structure.

10. The cleaning device according to claim 1, characterized in that The cleaning device further comprises: a cutter; The cutter is disposed on the main body and is used for cutting the adhesive structure.

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