Grinding fluid detection equipment and grinding fluid supply system

Abstract

The utility model provides grinding fluid detection equipment and a grinding fluid supply system, and the grinding fluid detection equipment comprises a detection unit, a data processing unit and a connecting pipe, one end of the connecting pipe is connected with the detection unit, and the detection unit is used for detecting grinding particles in the grinding fluid to obtain detection data; and the data processing unit is electrically connected with the detection unit and is used for processing the detection data. According to the grinding fluid detection equipment provided by the utility model, the grinding fluid can be guided into the detection unit to be detected to obtain detection data, and the data processing unit receives the detection data, processes and analyzes the detection data and is used for judging whether the size and the content of particulate matters in the grinding fluid are standard or not; and when the content of large-size particles in the grinding liquid is high, the data processing unit can feed back the content to a worker in time, so that the wafer is prevented from being damaged in the grinding process, the reliability of wafer grinding is improved, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a grinding liquid detection device and a grinding liquid supply system. Background Art

[0002] Chemical Mechanical Polishing (CMP) is a combination of mechanical grinding and chemical etching. It uses ultra-fine ion grinding and chemical etching of slurry to form a smooth surface on the surface of the ground medium.

[0003] Among them, the abrasive particle content in the polishing liquid is strongly correlated with the CMP polishing rate and polishing effect. When the abrasive particles in the polishing liquid are too large or the particles generated in the liquid supply system are mixed into the polishing liquid supply pipeline, the surface of the wafer will be scratched during the polishing process, causing damage to the wires on the surface of the wafer.

[0004] Currently, the abrasive particle size content in polishing slurries requires sampling and sending them to the laboratory for testing. This prevents real-time detection during polishing, which impacts production efficiency. Furthermore, if the concentration of large particles in the polishing slurry goes undetected during the polishing process, it can damage a large number of wafers, affecting product yield and increasing production costs. Utility Model Content

[0005] The purpose of the utility model is to provide a grinding liquid detection device and a grinding liquid supply system, which can detect particles in the grinding liquid in real time, improve the reliability of wafer grinding, increase production efficiency and reduce production costs.

[0006] To achieve the above-mentioned object, in a first aspect, the utility model provides a grinding liquid detection device, comprising a detection unit, a data processing unit and a connecting pipe;

[0007] One end of the connecting tube is connected to the detection unit, and the other end of the connecting tube is used to connect to the liquid supply pipeline of the grinding liquid. The detection unit is used to detect the grinding particles in the grinding liquid and obtain detection data;

[0008] The data processing unit is electrically connected to the detection unit and is used to process the detection data.

[0009] The beneficial effect of the grinding liquid detection equipment provided by the present invention is that: by connecting the other end of the connecting tube to the grinding liquid supply pipe, the grinding liquid can be introduced into the detection unit for detection to obtain detection data. After receiving the detection data, the data processing unit processes and analyzes the data to determine whether the size and content of the particles in the grinding liquid are standard. When the content of large-sized particles in the grinding liquid is relatively high, the data processing unit can provide timely feedback to the staff to avoid damage to the wafer during the grinding process, thereby improving the reliability of wafer grinding, increasing production efficiency and reducing production costs.

[0010] In some embodiments, the detection unit includes a particle detector;

[0011] The connecting pipe includes a main liquid inlet pipe and a first branch liquid inlet pipe, one end of the main liquid inlet pipe is used to connect to the liquid supply pipeline, and the other end of the main liquid inlet pipe is connected to one end of the first branch liquid inlet pipe;

[0012] The other end of the first branch liquid inlet pipe is connected to the particle detector for introducing the grinding liquid into the particle detector;

[0013] The particle detector is used to detect the size of the grinding particles in the grinding liquid.

[0014] In some embodiments, the detection unit further includes a conductivity detector, and the connecting tube further includes a second branch liquid inlet tube;

[0015] One end of the second branch liquid inlet pipe is connected to the main liquid inlet pipe, and the other end of the second branch liquid inlet pipe is connected to the conductivity detector;

[0016] The conductivity detector is used to detect the conductivity in the polishing liquid.

[0017] In some embodiments, the grinding liquid detection device further includes a first liquid outlet pipe and a first valve;

[0018] The first liquid outlet pipe is connected to the particle detector and is used to discharge the liquid in the particle detector;

[0019] The first valve is provided on the first liquid outlet pipe and is used to open or close the first liquid outlet pipe.

[0020] In some embodiments, the grinding liquid detection device further includes a second liquid outlet pipe and a second valve;

[0021] The second liquid outlet pipe is connected to the conductivity detector and is used to discharge the liquid in the conductivity detector;

[0022] The second valve is provided on the second liquid outlet pipe and is used to open or close the second liquid outlet pipe.

[0023] In some embodiments, the conductivity detector includes a detection sensor and a receiving cavity;

[0024] The accommodating chamber is in communication with both the second branch liquid inlet pipe and the second liquid outlet pipe;

[0025] The detection sensor is arranged in the accommodating cavity and is electrically connected to the data processing unit. The detection sensor is used to detect the conductivity in the grinding liquid.

[0026] In some embodiments, the grinding liquid detection apparatus further includes a cleaning pipe and a third valve;

[0027] One end of the cleaning tube is connected to the connecting tube, and the cleaning tube is used to introduce cleaning liquid into the connecting tube and the detection unit;

[0028] The third valve is provided on the cleaning pipe and is used to open or close the cleaning pipe. Its beneficial effect is that by connecting the cleaning pipe to the connecting pipe, the connecting pipe and the detection unit can be cleaned with a cleaning fluid, thereby ensuring the cleanliness of the connecting pipe and the detection unit, thereby improving the accuracy of the detection of the grinding fluid.

[0029] In some embodiments, the grinding liquid detection device further includes a purge tube;

[0030] One end of the purge pipe is connected to the connecting pipe, and the purge pipe is used to guide the purge gas to the connecting pipe and the detection unit. This advantageously allows the connecting pipe and the detection unit to be purged by connecting the purge pipe to the connecting pipe, thereby ensuring the cleanliness of the connecting pipe and the detection unit, thereby improving the accuracy of the detection of the grinding fluid.

[0031] In some embodiments, the grinding liquid detection device further includes a fourth valve, a fifth valve, and a sixth valve;

[0032] The fourth valve is provided on the main liquid inlet pipe and is used to open or close the main liquid inlet pipe;

[0033] The fifth valve is provided on the first branch liquid inlet pipe, and is used to open or close the first branch liquid inlet pipe;

[0034] The sixth valve is provided on the second branch liquid inlet pipe and is used to open or close the second branch liquid inlet pipe.

[0035] In a second aspect, an embodiment of the present utility model provides a grinding liquid supply system, comprising a liquid supply device, a liquid supply pipeline, a valve control box, a nozzle and the grinding liquid detection device;

[0036] The liquid supply device is connected to the nozzle through the liquid supply pipe, and the liquid supply device is used to provide grinding liquid;

[0037] The grinding liquid detection device is connected to the liquid supply pipeline;

[0038] The valve control box is arranged on the liquid supply pipeline.

[0039] The beneficial effect of the grinding liquid supply system provided by the present invention is that: by connecting the other end of the connecting tube to the grinding liquid supply pipeline, part of the grinding liquid can be introduced into the grinding liquid detection equipment for detection and analysis during the process of conveying the wafer grinding, so as to determine whether the particle content in the grinding liquid is standard. When the content of large-sized particles in the grinding liquid is relatively high, the grinding liquid detection equipment can promptly feedback to the staff so that the staff can process the grinding liquid to avoid damage to the wafer during the wafer grinding process, thereby improving the reliability of wafer grinding, increasing production efficiency and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic structural diagram of a grinding liquid detection device according to a first embodiment of the present invention;

[0041] Figure 2 A schematic structural diagram of a second embodiment of a grinding liquid detection device provided by the present utility model;

[0042] Figure 3 This is a schematic structural diagram of the grinding liquid supply system provided in an embodiment of the present invention.

[0043] Reference numerals:

[0044] Detection unit 1, particle detector 11, conductivity detector 12, data processing unit 2, connecting pipe 3, main liquid inlet pipe 31, first branch liquid inlet pipe 32, second branch liquid inlet pipe 33, fourth valve 34, fifth valve 35, sixth valve 36, first liquid outlet pipe 41, first valve 42, second liquid outlet pipe 43, second valve 44, cleaning pipe 51, third valve 52, purge pipe 53, cleaning liquid supply device 54, purge device 55,

[0045] Grinding liquid detection equipment 100, liquid supply device 101, raw liquid supply box 1011, liquid mixing box 1012, liquid supply box 1013, liquid supply pipeline 102, valve control box 103, nozzle 104. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0047] In view of the problems existing in the prior art, the embodiment of the present utility model provides a grinding liquid detection device, referring to Figure 1 As shown, the grinding liquid detection equipment includes a detection unit 1, a data processing unit 2 and a connecting tube 3, one end of the connecting tube 3 is connected to the detection unit 1, and the other end of the connecting tube 3 is used to connect to the liquid supply pipeline of the grinding liquid. The detection unit 1 is used to detect the grinding particles in the grinding liquid to obtain detection data, and the data processing unit 2 is electrically connected to the detection unit 1 for processing the detection data.

[0048] In this embodiment, by connecting the other end of the connecting tube 3 to the liquid supply pipe of the grinding liquid, part of the grinding liquid can be introduced into the detection unit 1 for detection during the wafer grinding process, and the detection data can be obtained. After receiving the detection data, the data processing unit 2 processes and analyzes it to determine whether the size and content of the particles in the grinding liquid are standard. When the size and content of the particles in the grinding liquid are standard, the wafer grinding can continue. When the content of large-sized particles in the grinding liquid is high, the data processing unit 2 can promptly feedback to the staff so that the staff can control the equipment to stop the wafer grinding and process the grinding liquid to avoid damage to a large number of wafers, thereby improving the reliability of wafer grinding, increasing production efficiency, and reducing production costs.

[0049] It should be noted that the data processing unit 2 may be a fault detection and classification (FDC) system in a semiconductor factory.

[0050] refer to Figure 1As shown, in some embodiments, the detection unit 1 includes a particle detector 11, which is electrically connected to the data processing unit 2. The connecting pipe 3 includes a main liquid inlet pipe 31 and a first branch liquid inlet pipe 32. One end of the main liquid inlet pipe 31 is used to connect to the liquid supply pipeline, and the other end of the main liquid inlet pipe 31 is connected to one end of the first branch liquid inlet pipe 32. The other end of the first branch liquid inlet pipe 32 is connected to the particle detector 11 to introduce the polishing liquid into the particle detector 11. When the polishing liquid is injected into the particle detector 11, the particle detector 11 is used to detect the size of the polishing particles in the polishing liquid to avoid the situation where large-sized particles are present in the polishing liquid without being noticed, thereby improving the reliability of wafer polishing.

[0051] In this embodiment, the particle detector 11 may be a nano-laser particle size analyzer.

[0052] Furthermore, the grinding liquid detection device also includes a first liquid outlet pipe 41 and a first valve 42. The first liquid outlet pipe 41 is connected to the particle detector 11 and is used to discharge the liquid in the particle detector 11 to achieve continuous detection of the grinding liquid. The first valve 42 is provided on the first liquid outlet pipe 41 and is used to open or close the first liquid outlet pipe 41.

[0053] Continue to refer Figure 1 As shown, in some embodiments, the detection unit 1 also includes a conductivity detector 12, and the connecting tube 3 also includes a second branch liquid inlet pipe 33, one end of the second branch liquid inlet pipe 33 is connected to the main liquid inlet pipe 31, and the other end of the second branch liquid inlet pipe 33 is connected to the conductivity detector 12, which is used to introduce part of the grinding liquid into the conductivity detector 12, and the conductivity detector 12 is used to detect the conductivity in the grinding liquid.

[0054] It can be understood that the content of abrasive particles in the polishing liquid is proportional to the conductivity, that is, the more abrasive particles there are, the greater the conductivity of the polishing liquid. It can be seen that the present application can determine the content of abrasive particles in the polishing liquid by using the conductivity detector 12 to detect the conductivity of the polishing liquid, thereby avoiding too much abrasive particles in the polishing liquid, which may cause damage to the wafer during the polishing process.

[0055] Furthermore, the grinding liquid detection device also includes a second liquid outlet pipe 43 and a second valve 44. The second liquid outlet pipe 43 is connected to the conductivity detector 12 and is used to discharge the liquid in the conductivity detector 12 so that the conductivity detector 12 can continuously detect the conductivity of the grinding liquid. The second valve 44 is provided on the second liquid outlet pipe 43 and is used to open or close the second liquid outlet pipe 43.

[0056] In some specific embodiments, the conductivity detector 12 includes a detection sensor and a accommodating cavity, wherein the accommodating cavity is connected to both the second branch liquid inlet pipe 33 and the second liquid outlet pipe 43, the detection sensor is arranged in the accommodating cavity and is electrically connected to the data processing unit 2, and the detection sensor is used to detect the conductivity in the grinding liquid.

[0057] In this embodiment, the detection sensor may be a detection probe of the conductivity detector 12 , and the detection probe is disposed at the bottom of the accommodating cavity.

[0058] refer to Figure 2 As shown, in some embodiments, the grinding liquid detection device further includes a cleaning pipe 51 and a third valve 52. One end of the cleaning pipe 51 is connected to the connecting pipe 3, and the other end of the cleaning pipe 51 is connected to an external cleaning liquid supply device 54. The cleaning liquid supply device 54 is used to provide cleaning liquid. The cleaning pipe 51 is used to introduce the cleaning liquid into the connecting pipe 3 and the detection unit 1. The third valve 52 is provided on the cleaning pipe 51 and is used to open or close the cleaning pipe 51.

[0059] In this embodiment, when cleaning fluid is required to clean the connecting tube 3 and the detection unit 1, the third valve 52 can be opened. When cleaning fluid is no longer required to clean the connecting tube 3 and the detection unit 1, the third valve 52 is closed to block the cleaning tube 51. By cleaning the connecting tube 3 and the detection unit 1 with cleaning fluid, the cleanliness of the connecting tube 3 and the detection unit 1 is ensured, thereby improving the accuracy of the detection of the grinding fluid.

[0060] Furthermore, the grinding liquid detection equipment also includes a purge tube 53, one end of the purge tube 53 is connected to the connecting tube 3, and the other end of the purge tube 53 is connected to an external purge device 55, and the purge device 55 is used to provide purge gas and guide the purge gas to the connecting tube 3 and the detection unit 1 through the purge tube 53, so as to purge the connecting tube 3 and the detection unit 1 to further improve the detection accuracy of the grinding liquid.

[0061] refer to Figure 2 As shown, in some embodiments, the grinding liquid detection equipment also includes a fourth valve 34, a fifth valve 35 and a sixth valve 36, the fourth valve 34 is arranged on the main liquid inlet pipe 31, and is used to open or close the main liquid inlet pipe 31, the fifth valve 35 is arranged on the first branch liquid inlet pipe 32, and is used to open or close the first branch liquid inlet pipe 32, and the sixth valve 36 is arranged on the second branch liquid inlet pipe 33, and is used to open or close the second branch liquid inlet pipe 33.

[0062] In this embodiment, the fourth valve 34 , the fifth valve 35 and the sixth valve 36 are provided on the connecting pipe 3 to realize the control of the connecting pipe 3 .

[0063] In another embodiment of the present invention, a grinding liquid supply system is disclosed, referring to Figure 3 As shown, the polishing liquid supply system includes a liquid supply device 101, a liquid supply pipeline 102, a valve control box 103, a nozzle 104, and the polishing liquid detection device 100 disclosed in the above embodiment. The liquid supply device 101 is connected to the nozzle 104 via the liquid supply pipeline 102, and is used to provide polishing liquid. The polishing liquid detection device 100 is connected to the liquid supply pipeline 102 and is used to detect abrasive particles in the polishing liquid. The valve control box 103 is provided in the liquid supply pipeline 102 and is used to control the valve on the liquid supply pipeline 102.

[0064] In this embodiment, by connecting the other end of the connecting tube 3 to the liquid supply pipe 102 of the grinding liquid, a portion of the grinding liquid can be introduced into the grinding liquid detection equipment 100 for detection and analysis during the process of conveying the wafer grinding, so as to determine whether the content of particulate matter in the grinding liquid is standard. When the content of large-sized particles in the grinding liquid is relatively high, the grinding liquid detection equipment 100 can provide timely feedback to the staff so that the staff can process the grinding liquid to avoid damage to the wafer during the wafer grinding process, thereby improving the reliability of wafer grinding, increasing production efficiency and reducing production costs.

[0065] Specifically, the liquid supply device 101 includes a stock liquid supply tank 1011, a liquid mixing tank 1012, and a liquid supply tank 1013. The stock liquid supply tank 1011, the liquid mixing tank 1012, and the liquid supply tank 1013 are sequentially connected via the liquid supply pipe 102. The stock liquid supply tank 1011 is used to provide the stock solution of the polishing liquid and can transport the stock solution of the polishing liquid to the liquid mixing tank 1012. When the concentration of the stock solution of the polishing liquid is high, water or hydrogen peroxide needs to be added to the liquid mixing tank 1012 to dilute the stock solution of the polishing liquid, and then the diluted polishing liquid is transported to the liquid supply tank 1013. The liquid supply tank 1013 is used to transport the diluted polishing liquid to the nozzle 104.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A grinding liquid detection device, characterized in that: It includes a detection unit, a data processing unit and a connecting pipe; One end of the connecting tube is connected to the detection unit, and the other end of the connecting tube is used to connect to the liquid supply pipeline of the grinding liquid. The detection unit is used to detect the grinding particles in the grinding liquid and obtain detection data; The data processing unit is electrically connected to the detection unit and is used to process the detection data.

2. The grinding liquid detection device according to claim 1, characterized in that: The detection unit includes a particle detector; The connecting pipe includes a main liquid inlet pipe and a first branch liquid inlet pipe, one end of the main liquid inlet pipe is used to connect to the liquid supply pipeline, and the other end of the main liquid inlet pipe is connected to one end of the first branch liquid inlet pipe; The other end of the first branch liquid inlet pipe is connected to the particle detector for introducing the grinding liquid into the particle detector; The particle detector is used to detect the size of the grinding particles in the grinding liquid.

3. The grinding liquid detection device according to claim 2, characterized in that: The detection unit further includes a conductivity detector, and the connecting pipe further includes a second branch liquid inlet pipe; One end of the second branch liquid inlet pipe is connected to the main liquid inlet pipe, and the other end of the second branch liquid inlet pipe is connected to the conductivity detector; The conductivity detector is used to detect the conductivity in the polishing liquid.

4. The grinding liquid detection device according to claim 2, characterized in that: It also includes a first liquid outlet pipe and a first valve; The first liquid outlet pipe is connected to the particle detector and is used to discharge the liquid in the particle detector; The first valve is provided on the first liquid outlet pipe and is used to open or close the first liquid outlet pipe.

5. The grinding liquid detection device according to claim 3, characterized in that: Also includes a second liquid outlet pipe and a second valve; The second liquid outlet pipe is connected to the conductivity detector and is used to discharge the liquid in the conductivity detector; The second valve is provided on the second liquid outlet pipe and is used to open or close the second liquid outlet pipe.

6. The grinding liquid detection device according to claim 5, characterized in that: The conductivity detector includes a detection sensor and a receiving cavity; The accommodating chamber is in communication with both the second branch liquid inlet pipe and the second liquid outlet pipe; The detection sensor is arranged in the accommodating cavity and is electrically connected to the data processing unit. The detection sensor is used to detect the conductivity in the grinding liquid.

7. The grinding liquid detection device according to claim 1, characterized in that: Also includes a cleaning pipe and a third valve; One end of the cleaning tube is connected to the connecting tube, and the cleaning tube is used to introduce cleaning liquid into the connecting tube and the detection unit; The third valve is provided on the cleaning pipe and is used to open or close the cleaning pipe.

8. The grinding liquid detection device according to claim 1, characterized in that: Also includes a purge tube; One end of the purge pipe is connected to the connecting pipe, and the purge pipe is used to guide the purge gas to the connecting pipe and the detection unit.

9. The grinding liquid detection device according to claim 3, characterized in that: Also included are a fourth valve, a fifth valve, and a sixth valve; The fourth valve is provided on the main liquid inlet pipe and is used to open or close the main liquid inlet pipe; The fifth valve is provided on the first branch liquid inlet pipe, and is used to open or close the first branch liquid inlet pipe; The sixth valve is provided on the second branch liquid inlet pipe and is used to open or close the second branch liquid inlet pipe.

10. A grinding liquid supply system, characterized in that: It comprises a liquid supply device, a liquid supply pipeline, a valve control box, a nozzle and the grinding liquid detection equipment according to any one of claims 1 to 9; The liquid supply device is connected to the nozzle through the liquid supply pipe, and the liquid supply device is used to provide grinding liquid; The grinding liquid detection device is connected to the liquid supply pipeline; The valve control box is arranged on the liquid supply pipeline.

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