Full-automatic film tearing mechanism for wafer film

Abstract

The utility model belongs to the technical field of semiconductor processing, and relates to a full-automatic film tearing mechanism of a wafer film, which comprises a film tearing base, a film supply assembly and a waste film recovery assembly are arranged on the film tearing base, the film supply assembly comprises a film supply roll shaft rotationally connected to the film tearing base, a film supply roll shaft motor is connected to the film tearing base, and the waste film recovery assembly is connected to the film supply roll shaft motor. The movable end of the film supply roll shaft motor is connected with the film supply roll shaft; the film tearing base is rotationally connected with a first film supply driven roller shaft; the waste film recovery assembly comprises a waste film recovery roll shaft arranged on the film tearing base, the film tearing base is rotationally connected with a waste film recovery driven roll shaft, the film tearing base is provided with a film pressing assembly, the film pressing assembly comprises a film pressing base connected to the film tearing base, and the bottom of the film pressing base is connected with a film tearing pressing plate. After the structure is adopted, the full-automatic film tearing machine has the beneficial effects that film tearing can be fully automatically carried out, manual film tearing is not needed, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, and in particular relates to a fully automatic wafer film tearing mechanism. Background Art

[0002] With advancements in semiconductor technology, the demand for product performance is increasing, and new packaging processes are constantly emerging. When wafers leave the wafer fab, they are relatively thick. Due to package size requirements, the wafers are thinned during packaging to accommodate smaller packages. To protect the wafer's circuit layer during wafer thinning, a film is applied to the wafer's circuit layer to protect it from scratches and contamination during thinning and grinding. After wafer thinning, this protective film must be removed without damaging the wafer.

[0003] There are many ways to remove the film. The traditional solution involves attaching the wafer to a platform, manually peeling off one edge with tweezers, and then manually pulling the film to remove the thin film from the wafer. This purely manual method is prone to human error and is difficult to control. Tweezers can easily puncture the wafer, and manual tearing force is difficult to control, which can easily cause the wafer to break. Therefore, improvements are necessary. Utility Model Content

[0004] In order to solve the above problems in the prior art, the utility model provides a fully automatic film tearing mechanism for wafer films.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] As one aspect of the present invention, a fully automatic film tearing mechanism for wafer films is proposed, which comprises: a film tearing base, on which a film supply component and a waste film recovery component are provided,

[0007] The film supply assembly includes a film supply roller rotatably connected to the film tearing base, the film tearing base is connected to a film supply roller motor, and the movable end of the film supply roller motor is connected to the film supply roller; the film tearing base is rotatably connected to a first film supply driven roller;

[0008] The waste film recovery assembly includes a waste film recovery roller arranged on a film tearing base, a waste film recovery roller motor is provided on the film tearing base, the movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller; a waste film recovery driven roller is rotatably connected to the film tearing base,

[0009] A film pressing assembly is provided on the film tearing base, and the film pressing assembly is located between the film supply assembly and the waste film recovery assembly; the film pressing assembly includes a film pressing base connected to the film tearing base, and the film pressing base is connected to the movable end of the film pressing power part provided on the film tearing base, and the bottom of the film pressing base is connected to a film tearing pressure plate.

[0010] Optionally, the film tearing pressing plate is arranged at a preset angle to the horizontal plane.

[0011] Optionally, a first waste film driven roller is provided on the film pressing base, and the first waste film driven roller is located above the film tearing pressure plate; a second waste film driven roller is provided on the film pressing base, and the second waste film driven roller is located behind the first waste film driven roller; a cylindrical film tearing tape is connected to the film supply roller, and the movable end of the film tearing tape passes around the first film supply driven roller, the second waste film driven roller, the film tearing pressure plate and the first waste film driven roller in turn, and is connected to the waste film recovery roller.

[0012] Optionally, the movable end of the film supply roller motor is connected to the film supply roller driving wheel, and one end of the film supply roller is connected to the film supply roller driven wheel; the film supply roller driving wheel and the film supply roller driven wheel are connected by a film supply roller synchronous belt.

[0013] Optionally, the first film-feeding driven roller is located to the lower right of the film-feeding roller.

[0014] Optionally, the waste film recovery driven roller is located below the waste film recovery roller.

[0015] Optionally, a pressure roller assembly is further included, and the pressure roller assembly is located below the waste film recovery assembly.

[0016] Optionally, the pressure roller assembly includes a pressure roller, which is rotatably connected to a pressure roller bracket, and the pressure roller bracket is connected to a movable end of a pressure roller power unit provided on the film tearing base.

[0017] Optionally, a passive limiting roller is rotatably connected to the film tearing base, and a preset interval is provided between the passive limiting roller and the pressure roller.

[0018] Optionally, the passive limiting roller and the pressure roller are on the same plane.

[0019] The beneficial effects of the fully automatic wafer film tearing mechanism of the present invention are specifically embodied in that: the film can be fully automatically torn without manual tearing, thereby improving work efficiency; the film is torn evenly without causing damage to the wafer surface or leaving residual adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0021] Figure 1 This is a schematic structural diagram of the fully automatic wafer film tearing mechanism of the present invention;

[0022] Figure 2 This is a front view of the structure of the fully automatic wafer film tearing mechanism of the present invention;

[0023] Figure 3 This is a bottom view of the structure of the fully automatic wafer film tearing mechanism of the present invention;

[0024] Figure 4 This is a schematic structural diagram of the first cleaning member of the present invention;

[0025] Figure 5 This is a schematic structural diagram of the first cleaning component of the present invention. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0027] An embodiment of the present application is a fully automatic film tearing mechanism for a wafer film, such as Figure 1-Figure 3 The film supply roller 521 is connected to the film supply roller motor 522, and the movable end of the film supply roller motor 522 is connected to the film supply roller shaft 521, so as to drive the film supply roller 521 to rotate relative to the film supply base 51; the movable end of the film supply roller motor 522 is connected to the film supply roller shaft driving wheel, and one end of the film supply roller shaft 521 is connected to the film supply roller shaft driven wheel; the film supply roller shaft driving wheel and the film supply roller shaft driven wheel are connected by a film supply roller shaft synchronous belt; the film tearing base 51 is rotatably connected to the first film supply driven roller 57, and the first film supply driven roller 57 is located at the lower right of the film supply roller 521;

[0028] The waste film recovery assembly 53 includes a waste film recovery roller 531 provided on the film tearing base 51, a waste film recovery roller motor is provided on the film tearing base 51, the movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller 531, driving the waste film recovery roller 531 to wind the waste film; a waste film recovery driven roller 532 is rotatably connected to the film tearing base 51, and the waste film recovery driven roller 532 is located below the waste film recovery roller 531;

[0029] The film-tearing base 51 is provided with a film pressing assembly 54, which is located between the film supply assembly 52 and the waste film recovery assembly 53; the film pressing assembly 54 includes a film pressing base 541 connected to the film-tearing base 51, and the film pressing base 541 is connected to the movable end of a film pressing power unit 545 provided on the film-tearing base 51, and the film pressing power unit 545 is a cylinder or a motor; the bottom of the film-tearing base 541 is connected to a film-tearing pressing plate 542, and the film-tearing pressing plate 542 is arranged at a preset angle to the horizontal plane, so that one end of the film-tearing pressing plate 542 can cooperate with the wafer film of the wafer on the wafer adsorption chuck 4; it should be noted that the wafer adsorption chuck 4 is used to adsorb the wafer, and its structure is prior art and will not be described here;

[0030] The film pressing base 541 is provided with a first waste film driven roller 543, and the first waste film driven roller 543 is located above the film tearing pressure plate 542; the film pressing base 541 is provided with a second waste film driven roller 544, and the second waste film driven roller 544 is located behind the first waste film driven roller 543; the film supply roller 521 is connected with a cylindrical film tearing tape 55, and the movable end of the film tearing tape 55 passes around the first film supply driven roller 57, the second waste film driven roller 544, the film tearing pressure plate 542 and the first waste film driven roller 543 in turn, and is connected to the waste film recovery roller 531, so as to realize film supply and film collection at the same time.

[0031] The wafer adsorption chuck 4 drives the wafer to move to the bottom of the film tearing pressure plate 542, and the wafer film of the wafer on the wafer adsorption chuck 4 hits the film tearing tape 55 at the bottom of the film tearing pressure plate 542. The pressure formed between the film tearing pressure plate 542 and the wafer adsorption chuck 4 makes the film tearing tape 55 adhere to the wafer film of the wafer; then the wafer adsorption chuck 4 moves to the right, and at the same time, the film supply roller 521 rotates to supply the film tearing tape 55, and the waste film recovery roller 531 rotates to recover the waste film. The film tearing tape 55 tears up the wafer film and tears the entire wafer film at a uniform speed. Then the wafer adsorption chuck 4 moves to the bottom of the first cleaning part to clean the surface of the wafer. After the surface of the wafer is cleaned, the wafer adsorption chuck 4 transports the wafer to the next process.

[0032] Furthermore, if Figure 4 and Figure 5As shown, the first cleaning member 5029 includes a cleaning member body 50291, which is connected to the frame; an adsorption chamber 50292 is provided at the bottom of the cleaning member body 50291, and the cavity opening of the adsorption chamber 50292 cooperates with the surface of the wafer; an air inlet channel 50293 and an exhaust channel 50294 are provided on the cleaning member body 50291, and the exhaust channel 50294 is connected to the inner bottom of the adsorption chamber 50292; the air inlet channel 50293 runs through the cleaning member body 50291, and the air outlet of the air inlet channel 50293 forms a preset angle with the horizontal plane. When in use, the air inlet channel 50293 blows air to blow up the dust on the surface of the wafer; the exhaust channel 50294 sucks air to suck the blown dust out of the adsorption chamber 50292, thereby cleaning the surface of the wafer.

[0033] In one embodiment, if Figure 1-Figure 3 As shown, it also includes a pressure roller assembly 56, which is located below the waste film recovery assembly 53; the pressure roller assembly 56 applies a preset pressure to the film tearing tape 55, so that the film tearing tape 55 has a preset tension, which facilitates the film tearing of the film tearing tape 55; the pressure roller assembly 56 includes a pressure roller 561, which is rotatably connected to a pressure roller bracket 562, and the pressure roller bracket 562 is connected to the movable end of a pressure roller power unit 563 provided on the film tearing base 51, and the pressure roller power unit 563 is a motor or a cylinder, which drives the pressure roller 561 to move laterally to form a preset pressure on the film tearing tape 55; a passive limiting roller 564 is rotatably connected to the film tearing base 51, and the passive limiting roller 564 and the pressure roller 561 are on the same plane. There is a preset gap between the passive limiting roller 564 and the pressure roller 561, and the film tearing tape 55 passes through this preset gap.

[0034] As described above, the fully automatic wafer film tearing mechanism of the present application has the following beneficial effects: it can fully automatically tear the film, eliminating the need for manual tearing, thereby improving work efficiency. The film is evenly torn without damaging the wafer surface or leaving residual adhesive. After tearing the film, a cleaning device cleans the wafer surface to prevent dust residue on the wafer surface.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0037] In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0038] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0039] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0040] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model in specific circumstances.

[0041] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A fully automatic wafer film tearing mechanism, characterized in that: It includes: The film tearing base is provided with a film supply component and a waste film recovery component. The film supply assembly includes a film supply roller rotatably connected to the film tearing base, the film tearing base is connected to a film supply roller motor, and the movable end of the film supply roller motor is connected to the film supply roller; the film tearing base is rotatably connected to a first film supply driven roller; The waste film recovery assembly includes a waste film recovery roller arranged on a film tearing base, a waste film recovery roller motor is provided on the film tearing base, the movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller; a waste film recovery driven roller is rotatably connected to the film tearing base, A film pressing assembly is provided on the film tearing base, and the film pressing assembly is located between the film supply assembly and the waste film recovery assembly; the film pressing assembly includes a film pressing base connected to the film tearing base, and the film pressing base is connected to the movable end of the film pressing power part provided on the film tearing base, and the bottom of the film pressing base is connected to a film tearing pressure plate.

2. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The film tearing pressing plate is arranged at a preset angle to the horizontal plane.

3. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The film pressing base is provided with a first waste film driven roller, which is located above the film tearing pressure plate; the film pressing base is provided with a second waste film driven roller, which is located behind the first waste film driven roller; the film supply roller is connected to a cylindrical film tearing tape, and the movable end of the film tearing tape passes around the first film supply driven roller, the second waste film driven roller, the film tearing pressure plate and the first waste film driven roller in sequence, and is connected to the waste film recovery roller.

4. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The movable end of the film supply roller motor is connected to the film supply roller driving wheel, and one end of the film supply roller is connected to the film supply roller driven wheel; the film supply roller driving wheel and the film supply roller driven wheel are connected through a film supply roller synchronous belt.

5. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The first film-feeding driven roller is located to the lower right of the film-feeding roller.

6. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The waste film recovery driven roller is located below the waste film recovery roller.

7. The fully automatic wafer film tearing mechanism according to claim 1, characterized in that: The utility model also comprises a pressure roller assembly, which is located below the waste film recovery assembly.

8. The fully automatic wafer film tearing mechanism according to claim 7, characterized in that: The pressure roller assembly includes a pressure roller, which is rotatably connected to a pressure roller bracket, and the pressure roller bracket is connected to a movable end of a pressure roller power unit arranged on a film tearing base.

9. The fully automatic wafer film tearing mechanism according to claim 8, characterized in that: A passive limiting roller is rotatably connected to the film tearing base, and a preset interval is provided between the passive limiting roller and the pressure roller.

10. The fully automatic wafer film tearing mechanism according to claim 9, characterized in that: The passive limiting roller shaft and the pressure roller shaft are on the same plane.

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