Impact-resistant chip protection tray assembly

By designing a multi-component combination impact-resistant chip protection pallet, including the pallet body, spring assembly and magnetic stripe, the problem of chip vulnerability during transportation is solved, achieving efficient protection and environmentally friendly production.

CN223267313UActive Publication Date: 2025-08-26WU XI SHEN SHAN KE JI YOU XIAN GONG SI
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Patent Information

Application Number
CN202422677176.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-08-26
Estimated Expiration
2034-11-04

AI Technical Summary

Technical Problem

In the prior art, pallets lack buffering and anti-collision effects during transportation, resulting in the chip being easily damaged, and the traditional methods are costly and have a great environmental impact.

Method used

It adopts a multi-component combination design, including a pallet body, a spring assembly and a magnetic stripe. The pallet body is a rectangular structure. The pallet wall is connected by hinges and snaps. It is filled with foam buffer plates. The spring assembly provides shock absorption and the magnetic stripe enhances stability. The pallet material is injection molded by PP material.

Benefits of technology

It improves the impact resistance and stability of the pallet, reduces the risk of chip damage, reduces production costs, and has a small environmental impact.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an impact-resistant chip protection tray assembly which comprises a tray body, the tray body is a cuboid with an opening in the upper surface, the tray body is divided into a tray bottom and four tray walls, the four tray walls are installed on the tray bottom through hinges respectively, the four tray walls are installed in a locking mode through buckles, and the four tray walls are arranged on the tray bottom through buckles. The four tray walls are all provided with magnetic strips used for adsorbing the chip trays. The spring assembly is fixedly arranged on the tray bottom, and the spring assembly is used for damping the chip; and the chip tray is arranged on the spring assembly. A chip can be buffered when being placed in the tray main body by arranging the spring assembly, and the chip tray can be tightly attached to the bearing plate and the tray wall and adsorbed on the bearing plate and the tray wall by introducing a composite damping structure of the magnetic strip and the spring assembly when being placed in the tray main body, so that the chip tray is placed more stably, and the tray wall and the tray bottom are detachably arranged, so that the chip tray is more convenient to use. Different tray walls and tray bottoms can be freely combined and installed to adapt to different chip trays.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip trays, in particular to an impact-resistant chip protection tray component. Background Art

[0002] IC trays, also known as electronic chip trays, are mostly used in electronic products and electronic components. The trays used in electronic products include stamping-type trays and blister-formed trays. Many trays are used to prevent static electricity from touching the product, which plays a good protective role.

[0003] Traditional chip protection devices typically use a hard casing or foam material to secure and protect the chip, preventing damage from shock and vibration during transportation and handling. However, these traditional methods have some drawbacks. For example, hard casings can still damage the chip under strong impact, while foam materials can lose their protective effectiveness due to compression deformation. Furthermore, they are difficult to reuse, increasing costs and environmental impact.

[0004] To this end, the utility model provides an impact-resistant chip protection tray assembly to solve the above technical problems. Utility Model Content

[0005] Purpose of the utility model: to solve the problem in the prior art that trays usually only use one-piece injection molding to hold chips and do not have the effect of buffering and anti-collision during transportation.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] An impact-resistant chip protection tray assembly comprising:

[0008] The tray body is a rectangular parallelepiped with an open upper surface. The tray body is divided into a tray bottom and four tray walls. The four tray walls are respectively mounted on the tray bottom by hinges and are fastened together by snap locks. The four tray walls are each provided with a magnetic strip for adsorbing the chip tray.

[0009] A spring assembly, the spring assembly being fixedly mounted on the bottom of the tray and used to reduce vibration of the chip;

[0010] A chip tray is provided on the spring assembly.

[0011] Furthermore, the interior of the tray body is hollow and filled with a foam buffer board.

[0012] Furthermore, the spring assembly includes: shock-absorbing springs, which are fixedly arranged on the bottom of the tray in a matrix shape; and a supporting plate, which is fixed on the shock-absorbing springs.

[0013] Furthermore, a chip slot for placing the chip is provided inside the chip tray, and a groove for engaging with the supporting plate is provided at the bottom of the chip tray.

[0014] Furthermore, a magnet adsorbed to the supporting plate is provided in the groove at the bottom of the tray, and a magnetic strip adsorbed to the magnetic strip on the tray wall is provided on the side of the tray.

[0015] Furthermore, the tray bottom, tray wall, support plate and chip tray are all made of PP material by injection molding.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] By setting up a spring assembly, the chip can be cushioned when placed inside the tray body. By introducing a composite shock-absorbing structure of magnetic strips and spring assemblies, the chip tray can be tightly attached to the support plate and tray wall when placed in, and adsorbed on both, making the chip tray more stable. The tray wall and tray bottom are detachably arranged so that different tray walls and tray bottoms can be freely combined and installed to adapt to different chip trays. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional view of the utility model;

[0019] Figure 2 This is a disassembly diagram of the utility model;

[0020] Figure 3 It is a schematic diagram of the overall structure of the utility model.

[0021] In the figure: 101, tray bottom; 102, tray wall; 1021, magnetic strip; 1022, magnet; 103, buckle; 201, shock-absorbing spring; 202, support plate; 3, chip tray. DETAILED DESCRIPTION

[0022] In the following description, numerous specific details are provided to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features known in the art are not described to avoid confusion with the present invention.

[0023] The applicant believes that in the prior art, trays are usually only made of one-piece injection molding to hold chips, and do not have the effect of buffering and preventing impact during transportation.

[0024] like Figure 1-3As shown, the impact-resistant chip protection tray assembly of this embodiment includes: a tray body, which is a rectangular parallelepiped with an open top surface. The tray body is divided into a tray base 101 and four tray walls 102. The four tray walls 102 are hinged to the tray base 101 and locked together by snaps 103. Each of the four tray walls 102 is equipped with a magnetic strip for attracting the chip tray 3; a spring assembly, which is fixed to the tray base 101 and used to reduce vibration for the chip; and a chip tray 3, which is mounted on the spring assembly. The tray body design of this utility model comprises a rectangular parallelepiped structure with an open top surface. The tray base and four tray walls are hinged and locked together by snaps, making the overall structure more secure and effectively improving the strength and impact resistance of the tray assembly. Furthermore, each of the four tray walls is equipped with a magnetic strip for attracting the chip tray, further enhancing the stability of the assembly and ensuring the safety of the chip during transportation and handling. The introduction of the spring assembly to reduce vibration for the chip significantly reduces the risk of chip damage in vibrating environments. In particular, the shock-absorbing springs in the spring assembly are fixed on the bottom of the tray in a matrix shape, and the supporting plate is fixed on the shock-absorbing springs. This design not only improves the shock-absorbing effect, but also ensures the stable placement of the chip tray.

[0025] The impact-resistant chip protection tray assembly of this embodiment has a hollow interior and is filled with foam cushioning panels. This design reduces the overall weight while providing a good cushioning effect, effectively protecting the chip from external impacts.

[0026] The impact-resistant chip protection tray assembly of this embodiment includes a spring assembly comprising: shock-absorbing springs 201 , which are fixedly arranged in a matrix on the tray bottom 101 ; and a supporting plate 202 , which is fixed on the shock-absorbing springs 201 .

[0027] The impact-resistant chip protection tray assembly of this embodiment has a chip tray 3 with a chip slot for placing the chip, and a groove at the bottom of the chip tray 3 that engages with the support plate 202. The chip tray of the present invention has a chip slot for placing the chip and a groove at the bottom that engages with the support plate, allowing the chip to be more stably fixed in the tray.

[0028] The impact-resistant chip protection tray assembly of this embodiment is further optional. A magnet that is attracted to the support plate 202 is provided in the groove at the bottom of the tray 3, and a magnetic strip that is attracted to the magnetic strip on the tray wall 102 is provided on the side of the tray 3, further improving the fixation of the chip in the tray.

[0029] In this embodiment, the impact-resistant chip protection tray assembly, including tray base 101, tray walls 102, support plate 202, and chip tray 3, is injection molded from PP. This material has excellent mechanical properties and chemical stability, ensuring component durability while reducing production costs.

[0030] Working principle: The product of this application is used in the transportation scenario of the pallet. The operator first selects a pallet bottom 101 and a pallet wall 102 of appropriate size for installation, places the chip tray 3 on the spring assembly, and engages the groove at the bottom of the chip tray 3 with the support plate 202 of the spring assembly and fixes it by adsorption through the magnet 1023. Then, the pallet wall 102 is erected and clamped and installed through the buckle 103, and the magnetic strip 1021 on the pallet wall 102 is adsorbed correspondingly with the magnetic strip 1023 on the chip tray 3. After installation, the chip tray 3 is in a stable state and can be buffered and protected by the pallet wall 102 and the spring assembly when it is hit.

[0031] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An impact-resistant chip protection tray assembly, characterized in that: include: A tray body, the body being a rectangular parallelepiped with an open upper surface, the tray body being divided into a tray bottom (101) and four tray walls (102), the four tray walls (102) being respectively mounted on the tray bottom (101) via hinges, the four tray walls (102) being locked and mounted via snaps (103), and the four tray walls (102) being provided with magnetic strips for adsorbing the chip tray (3); A spring assembly, the spring assembly being fixedly arranged on the bottom (101) of the tray and being used for damping the chip; A chip tray (3) is provided on the spring assembly.

2. The impact-resistant chip protection tray assembly according to claim 1, characterized in that: The interior of the tray body is hollow and filled with foam buffer panels.

3. The impact-resistant chip protection tray assembly according to claim 1, characterized in that: The spring assembly comprises: a shock-absorbing spring (201), the shock-absorbing spring (201) being fixedly arranged on the tray bottom (101) in a matrix shape; and a supporting plate (202), the supporting plate (202) being fixed on the shock-absorbing spring (201).

4. The impact-resistant chip protection tray assembly according to claim 1, characterized in that: The chip tray (3) is provided with a chip slot for placing the chip inside, and the bottom of the chip tray (3) is provided with a groove for engaging with the supporting plate (202).

5. The impact-resistant chip protection tray assembly according to claim 4, characterized in that: A magnet adsorbed to the supporting plate (202) is provided in the groove at the bottom of the tray (3), and a magnetic strip adsorbed to the magnetic strip on the tray wall (102) is provided on the side of the tray (3).

6. The impact-resistant chip protection tray assembly according to claim 4, characterized in that: The tray bottom (101), tray wall (102), support plate (202) and chip tray (3) are all made of PP material by injection molding.