Damping and damage-preventing chip tray

Abstract

The utility model discloses a shock-absorbing and damage-preventing chip tray, which belongs to the technical field of chip trays and comprises a tray body, a chip groove is arranged in the tray body, liquid silica gel bodies are arranged on the peripheral side of the chip groove, limiting grooves are formed between the adjacent liquid silica gel bodies in a surrounding manner, and a plurality of clamping bodies are arranged at the bottom of the tray body. The chip is placed in the chip groove, and when the upper tray body and the lower tray body are connected in a stacked mode, the clamping bodies are clamped in the limiting grooves. According to the utility model, the liquid silica gel body is matched with the clamping body and the hollow abutting pad which are made of the liquid silica gel, and the excellent elasticity of the liquid silica gel can effectively absorb and disperse the stress generated by friction, so that the damage of friction to the chip and the tray and tiny dust generated by friction are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip trays, and in particular relates to a shock-absorbing and damage-resistant chip tray. Background Art

[0002] Chip tray, also known as IC tray or electronic chip tray, is a packaging tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing.

[0003] During semiconductor manufacturing and transportation, the friction between the chip and the tray will generate fine dust. This dust not only has a negative impact on the performance and reliability of the chip, but also poses challenges to the efficiency and product quality of the entire production line. Currently, soft rubber pads are used at the bottom of the chip. Due to their soft material, they are easy to leave marks on the chip surface or tray. These marks not only affect the appearance quality of the chip, but also pose a potential threat to the electrical performance and reliability of the chip. Although the soft rubber pad can reduce friction, its wear resistance is poor. During long-term friction, the soft rubber pad will gradually wear out, causing the friction problem to reappear. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the existing soft rubber pad is used at the bottom of the chip. Due to its soft material, it is easy to leave marks on the chip surface or tray. These marks not only affect the appearance quality of the chip, but also pose a potential threat to the electrical performance and reliability of the chip. Although the soft rubber pad can reduce friction, its wear resistance is poor. During long-term friction, the soft rubber pad will gradually wear out, causing the friction problem to reappear. Therefore, a shock-absorbing and damage-resistant chip tray is proposed.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a shock-absorbing and damage-proof chip tray, comprising a tray body, a chip slot is provided in the tray body, liquid silicone bodies are provided around the chip slot, and the adjacent liquid silicone bodies are surrounded to form a limiting groove, and a plurality of clamping bodies are provided at the bottom of the tray body, and the chip is placed in the chip slot. When the upper and lower tray bodies are stacked, the clamping bodies are clamped in the limiting groove.

[0006] As a further description of the above technical solution:

[0007] A hollow abutment pad is provided between the clamping bodies.

[0008] As a further description of the above technical solution:

[0009] The clamping body and the hollow abutting pad are made of liquid silicone.

[0010] As a further description of the above technical solution:

[0011] A plurality of hollow holes are provided on the inner wall of the chip slot.

[0012] As a further description of the above technical solution:

[0013] The tray body is provided with a clamping edge, and the bottom of the tray body is provided with an abutting plate. When the upper and lower tray bodies are stacked, the abutting plate abuts against the clamping edge.

[0014] As a further description of the above technical solution:

[0015] A clamping groove is provided on the clamping edge, and a clamping block is provided on the inner wall of the abutting plate. When the upper and lower tray bodies are stacked, the clamping block is connected to the clamping groove.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0017] In the utility model, by using liquid silicone body and a clamping body and a hollow abutment pad made of liquid silicone, after the chip is placed in the chip slot, its sides and top are protected by liquid silicone, and the excellent elasticity of liquid silicone can effectively absorb and disperse the stress generated by friction, thereby reducing the damage to the chip and tray caused by friction and the tiny dust generated by friction. At the same time, the wear resistance of liquid silicone is better than that of traditional soft rubber materials, and it can maintain a low wear rate during long-term use, thereby extending the service life. When the liquid silicone contacts the surface of the chip and tray, due to its tight molecular structure and smooth surface, it is not easy to leave marks on the contact surface, which helps to maintain the cleanliness of the chip and tray and reduce poor electrical connection or appearance quality problems caused by marks. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A three-dimensional chip tray that absorbs shock and prevents damage Figure 1 .

[0020] Figure 2 A three-dimensional chip tray that absorbs shock and prevents damage Figure 2 .

[0021] Figure 3 A three-dimensional chip tray that absorbs shock and prevents damage Figure 3 .

[0022] Legend:

[0023] 1-tray body; 2-chip slot; 3-liquid silicone body; 4-limiting slot; 5-clamping body; 6-hollow abutment pad; 7-hollow hole; 8-clamping edge; 9-abutment plate; 10-clamping slot; 11-clamping block. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0028] In the description of the embodiments of the present invention, it should be noted that the terms "upper" and "inner" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0029] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0030] See also Figure 1-3 The utility model provides a technical solution: a shock-absorbing and damage-proof chip tray, comprising a tray body 1, a chip slot 2 is provided in the tray body 1, liquid silicone bodies 3 are provided on the sides of the chip slot 2, and limiting grooves 4 are formed by barriers between adjacent liquid silicone bodies 3. A plurality of clamping bodies 5 are provided at the bottom of the tray body 1, and the chip is placed in the chip slot 2. When the upper and lower tray bodies 1 are stacked, the clamping bodies 5 are clamped in the limiting grooves 4.

[0031] A hollow abutment pad 6 is provided between the clamping bodies 5 .

[0032] The clamping body 5 and the hollow abutting pad 6 are made of liquid silicone.

[0033] The inner wall of the chip slot 2 is provided with a plurality of hollow holes 7. This reduces material usage, saves energy, and ensures the appearance of the chip tray.

[0034] The tray body 1 is provided with a snap-on edge 8 , and the bottom of the tray body 1 is provided with an abutment plate 9 . When the upper and lower tray bodies 1 are stacked, the abutment plate 9 abuts against the snap-on edge 8 .

[0035] The clamping edge 8 is provided with a clamping groove 10, and the inner wall of the abutting plate 9 is provided with a clamping block 11. When the upper and lower tray bodies 1 are stacked, the clamping block 11 is connected to the clamping groove 10, so as to facilitate the stacking and transportation of chip trays.

[0036] Working principle: By using liquid silicone body and the clamping body and hollow abutment pad made of liquid silicone, after the chip is placed in the chip slot, its sides and top are protected by liquid silicone, and the excellent elasticity of liquid silicone can effectively absorb and disperse the stress generated by friction, thereby reducing the damage to the chip and tray caused by friction and the tiny dust generated by friction. At the same time, the wear resistance of liquid silicone is better than that of traditional soft rubber materials. It can maintain a low wear rate during long-term use and extend its service life. When liquid silicone contacts the surface of the chip and tray, due to its tight molecular structure and smooth surface, it is not easy to leave marks on the contact surface, which helps to maintain the cleanliness of the chip and tray and reduce poor electrical connection or appearance quality problems caused by marks.

[0037] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip tray with shock absorption and damage prevention, characterized in that: It includes a tray body, a chip slot is provided in the tray body, liquid silicone bodies are provided around the chip slot, and limiting slots are formed by barriers between adjacent liquid silicone bodies. A plurality of clamping bodies are provided at the bottom of the tray body, and the chip is placed in the chip slot. When the upper and lower tray bodies are stacked, the clamping bodies are clamped in the limiting slots.

2. The shock-absorbing and damage-resistant chip tray according to claim 1, characterized in that: A hollow abutment pad is provided between the clamping bodies.

3. The shock-absorbing and damage-resistant chip tray according to claim 2, characterized in that: The clamping body and the hollow abutting pad are made of liquid silicone.

4. The shock-absorbing and damage-resistant chip tray according to claim 1, characterized in that: A plurality of hollow holes are provided on the inner wall of the chip slot.

5. The shock-absorbing and damage-resistant chip tray according to claim 4, characterized in that: The tray body is provided with a clamping edge, and the bottom of the tray body is provided with an abutting plate. When the upper and lower tray bodies are stacked, the abutting plate abuts against the clamping edge.

6. The shock-absorbing and damage-resistant chip tray according to claim 5, characterized in that: A clamping groove is provided on the clamping edge, and a clamping block is provided on the inner wall of the abutting plate. When the upper and lower tray bodies are stacked, the clamping block is connected to the clamping groove.

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