Planar cathode for magnetron sputtering and magnetron sputtering device

Abstract

The utility model belongs to the technical field of magnetron sputtering, and discloses a planar cathode for magnetron sputtering and a magnetron sputtering device. The planar cathode for magnetron sputtering comprises a cathode body and a cooling assembly, the cooling assembly and the cathode body are detachably connected, the cooling assembly comprises a heat exchange plate, the first surface of the heat exchange plate is attached to the cathode body, and a cooling medium circulates in the cooling assembly in a circulating mode so that the heat exchange plate can exchange heat with the cathode body. According to the planar cathode for magnetron sputtering, the cooling assembly is externally arranged, and the heat exchange plate is attached to the cathode body, so that direct contact between a cooling medium and the planar cathode is avoided while the cooling effect of the planar cathode for magnetron sputtering is guaranteed, the service life of the planar cathode is prolonged, the use effect of the planar cathode is improved, and the reliability of the magnetron sputtering device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering, in particular to a plane cathode for magnetron sputtering and a magnetron sputtering device. Background Art

[0002] Vacuum magnetron sputtering coating features low temperatures and high speeds, enabling long-term mass production and widespread application in a wide range of fields. However, during vacuum magnetron sputtering, the planar cathode structure heats up, which can affect the performance of the planar cathode and, consequently, the effectiveness of the magnetron sputtering process.

[0003] In the prior art, in order to avoid the impact of excessive temperature on the planar cathode, the planar cathode is often cooled by injecting a cooling medium, that is, the cooling medium is in direct contact with the planar cathode for cooling. However, the contact heat exchange structure is prone to corrosion of the planar cathode during long-term use, and demagnetization is likely to occur, affecting the stable progress of the vacuum magnetron sputtering operation.

[0004] Therefore, there is an urgent need for a planar cathode for magnetron sputtering and a magnetron sputtering device to solve the above technical problems. Utility Model Content

[0005] One purpose of the utility model is to provide a planar cathode for magnetron sputtering, which can externalize the cooling component, avoid direct contact between the cooling medium and the planar cathode while ensuring the cooling effect, and increase the service life of the planar cathode.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A planar cathode for magnetron sputtering includes a cathode body and a cooling assembly. The cooling assembly and the cathode body are detachably connected. The cooling assembly includes a heat exchange plate. The first surface of the heat exchange plate is bonded to the cathode body. A cooling medium circulates in the cooling assembly to exchange heat between the heat exchange plate and the cathode body.

[0008] Optionally, the cooling assembly includes:

[0009] a box body connected to the heat exchange plate, wherein at least a portion of the box body contains a cooling medium;

[0010] The heat exchange pipeline is arranged in a side wall of the box body close to the second surface of the heat exchange plate. The inlet and outlet of the heat exchange pipeline are both arranged in the cooling medium so that the cooling medium can circulate in the heat exchange pipeline.

[0011] Optionally, the heat exchange pipeline is arranged in an S-shaped winding manner on a side wall of the box body close to the second surface of the heat exchange plate.

[0012] Optionally, the cooling assembly further includes a water pump, which is connected to the heat exchange pipeline and is used to provide power for the circulation of the cooling medium in the heat exchange pipeline.

[0013] Optionally, one of the heat exchange plate and the cathode body is provided with a connecting groove, and the other is provided with a connecting plate, and the connecting plate and the connecting groove are slidably connected in a one-to-one correspondence.

[0014] Optionally, the cathode body is provided with support plates at both ends along the first direction, the distance between the two support plates is not less than the distance between the heat exchange plates along the first direction, and the heat exchange plates are provided with elastic telescopic parts at both ends along the first direction, and the elastic telescopic parts can be snapped onto the support plates.

[0015] Optionally, the support plate is provided with a snap-in hole, and the elastic telescopic member is telescopic along the first direction to snap in or out of the snap-in hole.

[0016] Optionally, the elastic telescopic part includes a sliding rod, the heat exchange plate is provided with a accommodating groove along the first direction, the sliding rod is slidably connected to the accommodating groove, and a limiting portion is provided at one end of the sliding rod away from the accommodating groove, a step portion is provided in the accommodating groove, and the limiting portion is elastically connected to the step portion.

[0017] Optionally, a heat-conducting layer is further provided on the first surface of the heat exchange plate, and the heat exchange coefficient between the heat-conducting layer and the cathode body is greater than the heat exchange coefficient between the heat exchange plate and the cathode body.

[0018] Another object of the present invention is to provide a magnetron sputtering device, including the above-mentioned planar cathode for magnetron sputtering, which can improve its service life and use effect.

[0019] Beneficial effects of the utility model:

[0020] The utility model provides a planar cathode for magnetron sputtering and a magnetron sputtering device. The cooling assembly and the cathode body are detachably connected, and the cooling assembly is placed outside the cathode body, so that the cooling medium circulating in the cooling assembly and the cathode body do not directly contact each other, thereby avoiding damage such as corrosion of the cathode body by the cooling medium and improving the service life of the cathode body. In addition, the heat exchange plate in the cooling assembly is arranged in close contact with the cathode body, so that the two are in full contact, ensuring the speed and effect of heat exchange between the cooling assembly and the cathode body. This allows the planar cathode for magnetron sputtering to quickly exchange heat with the cathode body without corroding or damaging the cathode body, thereby extending the service life of the cathode body during magnetron sputtering operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1This is an axonometric view of a planar cathode for magnetron sputtering provided in a specific embodiment of the present utility model;

[0022] Figure 2 It is an axonometric cross-sectional view of a cooling assembly provided by a specific embodiment of the present utility model;

[0023] Figure 3 This is an axonometric diagram of the connection between the heat exchange plate and the cathode body provided in a specific embodiment of the present utility model;

[0024] Figure 4 This is an axonometric view of the cathode body provided by a specific embodiment of the present utility model;

[0025] Figure 5 yes Figure 2 A partial enlarged view of point A in the middle.

[0026] In the picture:

[0027] 10. cathode body; 11. connecting plate; 12. supporting plate; 121. snap-fit ​​hole;

[0028] 20. Cooling assembly; 21. Heat exchange plate; 211. Connecting groove; 212. Accommodating groove; 22. Box; 23. Heat exchange pipeline; 231. Inlet pipe; 232. Outlet pipe; 24. Water pump;

[0029] 30. Elastic telescopic member; 31. Sliding rod; 311. Limiting portion; 32. Elastic member. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0031] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; they can refer to direct connection or indirect connection through an intermediate medium; they can refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper," "lower," "left," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0034] Refer to the following Figures 1 to 5 The utility model provides a planar cathode for magnetron sputtering and a magnetron sputtering device.

[0035] It should be noted that the first direction in this embodiment is Figure 1 The X direction in FIG. 1 is also the length direction of the cathode body 10 and the length direction of the heat exchange plate 21 .

[0036] Please refer to Figure 1 Specifically, this embodiment provides a planar cathode for magnetron sputtering, which includes a cathode body 10 and a cooling assembly 20. The cooling assembly 20 and the cathode body 10 are detachably connected. The cooling assembly 20 includes a heat exchange plate 21. The first surface of the heat exchange plate 21 is bonded to the cathode body 10. A cooling medium circulates in the cooling assembly 20 to exchange heat with the heat exchange plate 21 and the cathode body 10.

[0037] The planar cathode for magnetron sputtering is detachably connected to the cathode body 10 via a cooling assembly 20. The cooling assembly 20 is placed outside the cathode body 10, preventing direct contact between the cooling medium circulating within the cooling assembly 20 and the cathode body 10. This prevents corrosion of the cathode body 10 by the cooling medium and other hazards, thereby extending the service life of the cathode body 10. Furthermore, the heat exchange plate 21 in the cooling assembly 20 is fitted to the cathode body 10, ensuring full contact between the two. This ensures the speed and effectiveness of heat exchange between the cooling assembly 20 and the cathode body 10. This allows the planar cathode for magnetron sputtering to rapidly exchange heat with the cathode body 10 without corroding or damaging the cathode body 10, thereby extending the service life of the cathode body 10 during magnetron sputtering operations.

[0038] Please refer to Figure 2 In this embodiment, the cooling assembly 20 includes a housing 22 and a heat exchange pipe 23. The housing 22 is connected to the heat exchange plate 21, and at least a portion of the housing 22 contains a cooling medium. The heat exchange pipe 23 is disposed within the housing 22 on a side near the second surface of the heat exchange plate 21, thereby increasing the contact area between the heat exchange pipe 23 and the heat exchange plate 21. The inlet and outlet of the heat exchange pipe 23 are both disposed within the cooling medium, allowing the cooling medium to circulate within the heat exchange pipe 23. The cooling assembly 20 cools and exchanges heat with the cathode body 10 by circulating the cooling medium through the housing 22 and the heat exchange pipe 23 and transferring heat from the heat exchange pipe 23 to the cathode body 10 through the heat exchange plate 21 for heat exchange.

[0039] It should be noted that the first surface and the second surface of the heat exchange plate 21 in this embodiment are two large surfaces arranged opposite to each other, so that the heat exchange plate 21 contacts the cathode body 10 and the heat exchange pipeline 23 over a large area.

[0040] Specifically, the box body 22 and the heat exchange plate 21 are fixedly connected by welding, threaded connection, bonding, or other fixing methods to achieve connection between the two.

[0041] Specifically, the heat exchange medium is a liquid coolant, which is disposed at the bottom of the housing 22. The inlet and outlet of the heat exchange pipe 23 are both inserted into the liquid coolant, thereby ensuring that both the inlet and outlet of the heat exchange pipe 23 are disposed within the coolant. Of course, in other embodiments, the housing 22 is further connected to an external coolant supply device, the inlet of the heat exchange pipe 23 is connected to the outlet of the external coolant supply device, and the outlet of the heat exchange pipe 23 is connected to the inlet of the external coolant supply device, thereby ensuring a continuous supply of coolant within the heat exchange pipe 23.

[0042] Specifically, the heat exchange pipe 23 is arranged in an S-shaped winding manner in the box body 22 near the second surface of the heat exchange plate 21. This arrangement increases the heat exchange area between the heat exchange pipe 23 and the heat exchange plate 21, thereby improving the heat exchange effect and efficiency between the two.

[0043] Optionally, the heat exchange pipe 23 is disposed on a side of the housing 22 near the second surface of the heat exchange plate 21 by bonding, welding, or other fixing methods to secure the heat exchange pipe 23. Preferably, when the heat exchange pipe 23 and the side of the housing 22 near the second surface of the heat exchange plate 21 are bonded together, the adhesive used can be a heat-conducting adhesive, thereby further improving the heat conduction effect between the two.

[0044] More specifically, an inlet pipe 231 is provided at the inlet of the heat exchange pipeline 23 , and an outlet pipe 232 is provided at the outlet of the heat exchange pipeline 23 . The inlet pipe 231 and the outlet pipe 232 are arranged in the cooling medium to realize the circulation of the cooling medium in the heat exchange pipeline 23 .

[0045] Optionally, the inlet pipe 231 and the outlet pipe 232 are connected to the heat exchange pipeline 23 by welding, two-way valve connection or integral molding, so that the inlet pipe 231 and the outlet pipe 232 are respectively provided at the inlet and outlet of the heat exchange pipeline 23.

[0046] In this embodiment, the cooling assembly 20 further includes a water pump 24 . The water pump 24 is connected to the heat exchange pipeline 23 . The water pump 24 is used to provide power for the circulation of the cooling medium in the heat exchange pipeline 23 .

[0047] Specifically, the water pump 24 is connected to the inlet pipe 231, so that the cooling medium can flow from the inlet pipe 231 into the heat exchange pipeline 23 through the drive of the water pump 24, and then flow out from the outlet pipe 232, thereby realizing the circulation of the cooling medium.

[0048] Optionally, the water pump 24 is connected to the inlet pipe 231 by welding at both ends of its own water channel, connecting with a two-way valve or quickly plugging it in, so that the water pump 24 is connected to the inlet pipe 231 of the heat exchange pipeline 23.

[0049] In this embodiment, the heat exchange plate 21 is made of metal. Metal has good thermal conductivity and can better exchange heat with the cathode body 10 and the heat exchange pipeline 23 respectively.

[0050] Furthermore, a heat-conducting layer is provided on the first surface of the heat exchange plate 21. The heat transfer coefficient between the heat-conducting layer and the cathode body 10 is greater than the heat transfer coefficient between the heat exchange plate 21 and the cathode body 10. This arrangement further increases the heat transfer efficiency between the two. Specifically, the heat-conducting layer is provided on the heat exchange plate 21 by coating, bonding, or other methods.

[0051] Optionally, the heat-conducting layer is made of a material with high thermal conductivity, such as thermally conductive silica gel or phase change material, to further improve the heat exchange effect between the heat exchange plate 21 and the cathode body 10 .

[0052] Please refer to Figure 3 and Figure 4 In this embodiment, the cathode body 10 and the heat exchange plate 21 can be detachably connected by means of a snap connection, a bolt connection, or the like.

[0053] Specifically, the cathode body 10 and the heat exchange plate 21 in this embodiment are connected by snap-fitting to achieve quick disassembly and assembly, thereby facilitating maintenance.

[0054] Optionally, support plates 12 are provided at both ends of the cathode body 10 along the first direction, and the distance between the two support plates 12 is no less than the distance between the heat exchange plates 21 along the first direction. Elastic expansion members 30 are provided at both ends of the heat exchange plates 21 along the first direction, and the elastic expansion members 30 can be snapped onto the support plates 12. When the two are installed, the elastic expansion members 30 retract inward. After the two are installed, the elastic expansion members 30 snap onto the support plates 12, thereby achieving a snap connection between the cathode body 10 and the heat exchange plates 21.

[0055] Optionally, the cathode body 10 and the support plate 12 are connected by welding to achieve fixation therebetween.

[0056] Specifically, the support plate 12 defines a snap-fitting hole 121, and the elastic member 30 is extendable along a first direction to engage with or disengage from the snap-fitting hole 121. That is, after the two are installed, the elastic member 30 extends and engages with the snap-fitting member, thereby achieving snap-fitting of the elastic member 30 to the support plate 12, thereby achieving snap-fitting connection between the cathode body 10 and the heat exchange plate 21.

[0057] Please refer to Figure 5 More specifically, the elastic telescopic member 30 includes a sliding rod 31, and the heat exchange plate 21 is provided with a accommodating groove 212 along the first direction. The sliding rod 31 is slidably connected to the accommodating groove 212, and a limiting portion 311 is provided at the end of the sliding rod 31 away from the accommodating groove 212, and a step portion is provided in the accommodating groove 212. The limiting portion 311 is elastically connected to the step portion to achieve the elastic telescopic effect of the sliding rod 31, so that the sliding rod 31 can be reset after being pressed, which makes it easier to disassemble and assemble the heat exchange plate 21 and the cathode body 10, thereby improving portability.

[0058] Optionally, the elastic telescopic member 30 further includes an elastic member 32 , which is disposed between the limiting portion 311 and the step portion so as to elastically connect the two, thereby achieving an elastic telescopic effect of the sliding rod 31 .

[0059] Please refer to Figure 2 and Figure 4To achieve a removable connection between the heat exchange plate 21 and the cathode body 10, in this embodiment, one of the heat exchange plate 21 and the cathode body 10 is provided with a connecting groove 211, and the other is provided with a connecting plate 11. The connecting plate 11 and the connecting groove 211 are slidably connected in a one-to-one correspondence. Specifically, in this embodiment, the heat exchange plate 21 is provided with a connecting groove 211, and the cathode body 10 is provided with a connecting plate 11. This arrangement allows the two to slide relative to each other for assembly and disassembly, thereby guiding and positioning them for installation, facilitating quick assembly and disassembly. It also increases the contact area between the heat exchange plate 21 and the cathode body 10, improving heat exchange efficiency.

[0060] Specifically, when the two are installed, the heat exchange plate 21 and the cathode body 10 are first slidably connected through the connecting groove 211 and the connecting plate 11. At this time, the support plate 12 can slide on both ends of the heat exchange plate 21 along the first direction. During the sliding process, the elastic telescopic member 30 is compressed between the support plate 12 and the heat exchange plate 21 until the elastic telescopic member 30 is engaged with the engaging hole 121, and the installation of the two is completed. Of course, when the two are disassembled, it is only necessary to press the elastic telescopic member 30 to separate the engaging hole 121 from the elastic telescopic member 30, and then slide the cathode body 10 and the heat exchange plate 21 to achieve the disassembly of the two.

[0061] Optionally, the connecting plate 11 and the connecting groove 211 both extend in a vertical direction, which is perpendicular to the first direction and corresponds to the width of the planar cathode for magnetron sputtering, to facilitate the sliding connection between the heat exchange plate 21 and the cathode body 10. That is, when the heat exchange plate 21 and the cathode body 10 are engaged via the connecting plate 11 and the connecting groove 211, they are already in close contact. They only need to be moved to a large-area engagement position, where they can be engaged via the elastic member 30 and the engaging hole 121. Disassembly can be performed in reverse, which facilitates operation.

[0062] It is understandable that, in other embodiments, the detachable connection between the heat exchange plate 21 and the cathode body 10 may also be achieved through other detachable connection methods such as threaded connection, which is not specifically limited here.

[0063] This embodiment further provides a magnetron sputtering device comprising the planar cathode for magnetron sputtering described in any of the above-described embodiments. By providing the planar cathode for magnetron sputtering, the cathode body 10 is cooled effectively and is not corroded or damaged by the cooling medium, thereby extending the service life of the cathode body 10 and thereby improving the service life and performance of the magnetron sputtering device.

[0064] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A planar cathode for magnetron sputtering, characterized in that: The invention comprises a cathode body (10) and a cooling assembly (20), wherein the cooling assembly (20) and the cathode body (10) are detachably connected, the cooling assembly (20) comprises a heat exchange plate (21), the first surface of the heat exchange plate (21) is arranged in contact with the cathode body (10), and a cooling medium circulates in the cooling assembly (20) to enable the heat exchange plate (21) and the cathode body (10) to exchange heat.

2. The planar cathode for magnetron sputtering according to claim 1, characterized in that: The cooling assembly (20) comprises: a box (22), the box (22) being connected to the heat exchange plate (21), and at least a portion of the box (22) containing a cooling medium; A heat exchange pipeline (23) is provided on a side wall of the box body (22) close to the second surface of the heat exchange plate (21), and an inlet of the heat exchange pipeline (23) and an outlet of the heat exchange pipeline (23) are both provided in the cooling medium so that the cooling medium can circulate in the heat exchange pipeline (23).

3. The planar cathode for magnetron sputtering according to claim 2, characterized in that: The heat exchange pipeline (23) is arranged in an S-shaped winding manner on a side wall of the box body (22) close to the second surface of the heat exchange plate (21).

4. The planar cathode for magnetron sputtering according to claim 2, characterized in that: The cooling assembly (20) further includes a water pump (24), which is connected to the heat exchange pipeline (23) and is used to provide power for the circulation of the cooling medium in the heat exchange pipeline (23).

5. The planar cathode for magnetron sputtering according to claim 1, characterized in that: One of the heat exchange plate (21) and the cathode body (10) is provided with a connection groove (211), and the other is provided with a connection plate (11), and the connection plate (11) and the connection groove (211) are slidably connected in a one-to-one correspondence.

6. The planar cathode for magnetron sputtering according to claim 1, characterized in that: Support plates (12) are provided at both ends of the cathode body (10) along the first direction, the distance between the two support plates (12) is not less than the distance between the heat exchange plates (21) along the first direction, and elastic telescopic parts (30) are provided at both ends of the heat exchange plates (21) along the first direction, and the elastic telescopic parts (30) can be snapped onto the support plates (12).

7. The planar cathode for magnetron sputtering according to claim 6, characterized in that: The support plate (12) is provided with a clamping hole (121), and the elastic telescopic member (30) is telescopic along the first direction to be clamped with or separated from the clamping hole (121).

8. The planar cathode for magnetron sputtering according to claim 7, characterized in that: The elastic telescopic member (30) includes a sliding rod (31), the heat exchange plate (21) is provided with a receiving groove (212) along the first direction, the sliding rod (31) is slidably connected to the receiving groove (212), and a limiting portion (311) is provided at one end of the sliding rod (31) away from the receiving groove (212), a step portion is provided in the receiving groove (212), and the limiting portion (311) is elastically connected to the step portion.

9. The planar cathode for magnetron sputtering according to any one of claims 1 to 8, characterized in that: The first surface of the heat exchange plate (21) is further provided with a heat conducting layer, and the heat exchange coefficient between the heat conducting layer and the cathode body (10) is greater than the heat exchange coefficient between the heat exchange plate (21) and the cathode body (10).

10. Magnetron sputtering device, characterized in that, The invention comprises the planar cathode for magnetron sputtering according to any one of claims 1 to 9.

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