Control circuit of backflow digestion instrument and backflow digestion instrument

Abstract

The utility model relates to a control circuit of a backflow digestion instrument and the backflow digestion instrument, the control circuit comprises a temperature control module, a multiplexing module, a wiring terminal module, a central processing unit, a touch screen driving module and a storage module, the temperature control module is respectively connected with the wiring terminal module, the multiplexing module and the central processing unit; the central processing unit is connected with the touch screen driving module and the storage module respectively; the temperature control module and the touch screen driving module are respectively connected with a liquid crystal touch screen of the backflow digestion instrument, and the wiring terminal module is respectively connected with a heating plate of the backflow digestion instrument. The temperature control module can accurately control the temperature of the heating plate of the reflux digestion instrument, so that a sample can reach an ideal digestion temperature in the heating process, and the decomposition efficiency and the decomposition effect are improved; meanwhile, through the touch screen driving module and the storage module, temperature information can be displayed in real time, resolution data can be stored, and operation and data processing by a user are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of analytical instruments, and in particular to a control circuit of a reflux digestion instrument and a reflux digestion instrument. Background Art

[0002] A digester is a commonly used sample pretreatment device. The electric digester includes a heating body, which is connected to an AC power supply through a heating main circuit to form a heating circuit. A number of digestion holes are opened on the heating body. The prefabricated reagent containing the sample is placed in the digestion groove and heated and digested by the heating body.

[0003] The circuit loop temperature of the existing electrothermal digestion instrument is high, and the decomposition efficiency and effect are poor. Utility Model Content

[0004] The purpose of the present application is to provide a control circuit of a reflux digester and a reflux digester, so as to solve the problems of high circuit loop temperature, poor decomposition efficiency and effect of existing electrothermal digesters.

[0005] In order to solve the above problems, this application adopts the following technical solutions:

[0006] The first aspect of the present application provides a control circuit of a reflux digestion instrument, which includes: a temperature control module, a multiplexing module, a wiring terminal module, a central processing unit, a touch screen driver module and a storage module, wherein the temperature control module is respectively connected to the wiring terminal module, the multiplexing module and the central processing unit, and the central processing unit is respectively connected to the touch screen driver module and the storage module; wherein the temperature control module and the touch screen driver module are respectively connected to the liquid crystal touch screen of the reflux digestion instrument, and the wiring terminal modules are respectively connected to the heating plate of the reflux digestion instrument.

[0007] The temperature control module can accurately control the temperature of the heating plate of the reflux digester, so that the sample can reach the ideal digestion temperature during the heating process, thereby improving the decomposition efficiency and decomposition effect; at the same time, through the touch screen driver module and storage module, it can display temperature information in real time and save digestion data, making it convenient for users to operate and process data.

[0008] Furthermore, the storage module includes a storage chip and a first capacitive reactance circuit, one end of the first capacitive reactance circuit is connected to the storage chip, the other end of the first capacitive reactance circuit is grounded, and the storage chip is connected to the central processing unit.

[0009] One end of the first capacitive reactance circuit is connected to the memory chip, and the other end is grounded, which effectively reduces the possibility of the memory chip being affected by electromagnetic interference and improves the stability of data storage.

[0010] Furthermore, the first capacitive reactance circuit is provided with a plurality of first capacitors, and the plurality of first capacitors are arranged in parallel.

[0011] By arranging multiple first capacitors in parallel, the current is filtered more effectively, and the noise and interference in the circuit are reduced, thereby improving the stability of the entire circuit and improving the load adaptability of the circuit.

[0012] Furthermore, the touch screen driver module includes a power buck chip and a transceiver chip, the transceiver chip is connected to the central processing unit, two pins of the transceiver chip are respectively connected to power and ground, and the power buck chip is connected to the terminal module.

[0013] By integrating the power supply step-down chip and the transceiver chip into the touch screen driver module, the circuit structure can be simplified and the signal transmission efficiency can be improved. At the same time, the two pins of the transceiver chip are connected to power and ground respectively, which can effectively reduce the risk of failure and improve the stability and reliability of the system.

[0014] Furthermore, the touch screen driving module includes a second capacitive reactance circuit, one end of the second capacitive reactance circuit is grounded, and the other end of the second capacitive reactance circuit is connected to the power step-down chip.

[0015] By providing the second capacitive reactance circuit, the power supply voltage can be filtered and stabilized, electromagnetic interference can be reduced, and the impact of power supply noise and fluctuations on the touch screen driver module can be reduced, thereby improving the stability of the power supply.

[0016] Furthermore, the temperature control module includes a temperature control chip and a first switch, the temperature control chip is respectively connected to one end of the first switch, the terminal module, the multiplexing module and the central processing unit, and the other end of the first switch is grounded.

[0017] By integrating the temperature control chip and the first switch, the temperature control module can monitor and adjust the temperature more accurately, prevent overheating or overcooling, and ensure that the system operates within an appropriate temperature range, thereby improving the stability and performance of the system.

[0018] Furthermore, the temperature control module includes a light emitting diode, one end of the light emitting diode is grounded, and the other end of the light emitting diode is connected to the temperature control chip.

[0019] One end of the LED is grounded, and the other end is connected to the temperature control chip. When the temperature is abnormal, the brightness or flashing of the LED can sound an alarm, reminding the user to take measures to prevent potential overheating risks.

[0020] Furthermore, the temperature control module includes a plurality of second capacitors, one ends of the plurality of second capacitors are respectively connected to different pins of the temperature control chip, and the other ends of the plurality of second capacitors are all grounded.

[0021] By connecting multiple second capacitors to different pins of the temperature control chip, power supply noise and interference are filtered out, ensuring the stability of the signal received by the temperature control chip, thereby improving the accuracy of temperature monitoring and enhancing the system's anti-interference ability.

[0022] Furthermore, the temperature control module includes a temperature sensor, and the temperature sensor is connected to the temperature control chip.

[0023] By integrating a temperature sensor, the temperature control module can accurately monitor the ambient temperature, ensure accurate temperature readings, and enhance the system's adaptability.

[0024] The present application also provides a reflux digestion instrument, comprising: a shell with a receiving cavity formed therein, and a control circuit of any of the above-mentioned reflux digestion instruments, which is arranged in the shell.

[0025] Compared with the existing technology, the beneficial effects of the present application are: the temperature control module can accurately control the temperature of the heating plate of the reflux digester, so that the sample can reach the ideal digestion temperature during the heating process, thereby improving the decomposition efficiency; the multiplexing module can realize unified control of multiple heating plates, improving the flexibility and applicability of the equipment; the central processing unit can obtain the temperature information of the heating plate in real time, and through the touch screen drive module and storage module, it can display the temperature information in real time and save the digestion data, which is convenient for users to operate and process data. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a temperature control module provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of a multiplexing module provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of a wiring terminal module provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a central processing unit provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a touch screen driver module provided in an embodiment of the present application; and

[0031] Figure 6 A schematic diagram of a storage module provided in an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 100, temperature control module; 110, temperature control chip; 120, first switch; 130, light-emitting diode; 140, second capacitor; 150, temperature sensor; 200, multiplexing module; 300, terminal module; 400, central processing unit; 500, touch screen driver module; 510, power step-down chip; 520, transceiver chip; 530, second capacitive reactance circuit; 600, storage module; 610, storage chip; 620, first capacitive reactance circuit; 621, first capacitor. DETAILED DESCRIPTION

[0034] The specific implementation methods of this application are described in detail below with reference to the accompanying drawings.

[0035] It should be noted that, unless there is a conflict, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of this application and should not be regarded as an improper restriction on this application.

[0036] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only used to facilitate the description of this application and simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting this application.

[0037] Figure 1 This is a schematic diagram of a temperature control module provided in an embodiment of the present application. Figure 2 A schematic diagram of a multiplexing module provided in an embodiment of the present application is shown. Figure 3 A schematic diagram of a wiring terminal module provided in an embodiment of the present application is shown. Figure 4 A schematic diagram of a central processing unit provided in an embodiment of the present application is provided. Figure 5 A schematic diagram of a touch screen driver module provided in an embodiment of the present application is shown. Figure 6 This is a schematic diagram of a storage module provided in an embodiment of the present application. Figures 1 to 6 As shown, an embodiment of the present application provides a control circuit of a reflux digestion instrument, and the control circuit includes: a temperature control module 100, a multiplexing module 200, a terminal module 300, a central processing unit 400, a touch screen driver module 500 and a storage module 600. The temperature control module 100 is respectively connected to the terminal module 300, the multiplexing module 200 and the central processing unit 400, and the central processing unit 400 is respectively connected to the touch screen driver module 500 and the storage module 600; wherein, the temperature control module 100 and the touch screen driver module 500 are respectively connected to the liquid crystal touch screen of the reflux digestion instrument, and the terminal module 300 is respectively connected to the heating plate of the reflux digestion instrument.

[0038] Specifically, the temperature control module 100 may include one or more temperature sensors 150 for monitoring the temperature of the heating body in real time. In addition, the temperature control module 100 may also include a PID controller for adjusting according to the set digestion temperature and the real-time heating body temperature to ensure the accuracy and stability of temperature control. The multiplexing module 200 may include a plurality of switches for controlling the switching of the heating power supplies of different digestion holes on the heating body, which can realize independent control of multiple digestion holes and improve digestion efficiency and flexibility. The terminal module 300 may include a plurality of terminal blocks for connecting to the heating plate of the reflux digester. The central processing unit 400 is responsible for the control and management of the entire control circuit, processes signals from the temperature control module 100, the multiplexing module 200 and other modules, and controls the digestion process according to preset programs and algorithms.

[0039] The touchscreen driver module 500 is responsible for driving the reflux digester's LCD touchscreen, displaying real-time data and a user interface for the digestion process. It also receives user-entered parameters and instructions and passes them to the central processor 400 for processing. The storage module 600 is used to store digestion programs, parameter settings, and historical data. Users can preset appropriate digestion programs based on different sample characteristics and digestion requirements, and adjust parameters at any time.

[0040] Since the temperature control module 100 can accurately control the temperature of the heating plate of the reflux digester, the sample can reach the ideal digestion temperature during the heating process, thereby improving the decomposition efficiency and decomposition effect; at the same time, through the touch screen drive module 500 and the storage module 600, the temperature information can be displayed in real time and the digestion data can be saved, which is convenient for users to operate and process data.

[0041] In some embodiments, the storage module 600 includes a storage chip 610 and a first capacitive reactance circuit 620 , one end of the first capacitive reactance circuit 620 is connected to the storage chip, the other end of the first capacitive reactance circuit 620 is grounded, and the storage chip 610 is connected to the central processing unit 400 .

[0042] Specifically, the memory chip 610 can utilize flash memory storage technology to store large amounts of data, including digestion programs, parameter settings, historical data, and the like. The memory chip 610 has sufficient storage capacity to meet user needs and has relatively fast read and write speeds to ensure efficient data processing. The first capacitive reactance circuit 620 can include one or more capacitors to reduce high-frequency noise and electromagnetic interference between the memory chip 610 and the ground. The memory chip 610 can be connected to the central processing unit 400 via a circuit.

[0043] Since one end of the first capacitive reactance circuit 620 is connected to the memory chip 610 and the other end is grounded, the possibility of the memory chip 610 being affected by electromagnetic interference is effectively reduced, thereby improving the stability of data storage.

[0044] In some embodiments, the first capacitive reactance circuit 620 includes a plurality of first capacitors 621 , and the plurality of first capacitors 621 are connected in parallel.

[0045] Specifically, the first capacitor 621 can be a variety of capacitors, such as ceramic capacitors, tantalum capacitors, aluminum electrolytic capacitors, etc. It should be noted that the first capacitor 621 should have an appropriate capacitance value to meet the system's requirements for capacitive reactance. Connecting multiple first capacitors 621 in parallel can provide a greater capacitive reactance, thereby improving the circuit's ability to suppress high-frequency noise and electromagnetic interference. The number of parallel capacitors can be designed according to actual needs to achieve the best capacitive reactance effect. One end of the first capacitive reactance circuit 620 is connected to the memory chip 610 and can be implemented using a wire or printed circuit board (PCB) wiring.

[0046] By providing a plurality of first capacitors 621 in parallel, the current is filtered more effectively, and the noise and interference in the circuit are reduced, thereby improving the stability of the entire circuit and improving the load adaptability of the circuit.

[0047] In some embodiments, the touch screen driver module 500 includes a power buck chip 510 and a transceiver chip 520. The transceiver chip 520 is connected to the central processing unit 400. The two pins of the transceiver chip 520 are connected to power and ground respectively. The power buck chip 510 is connected to the terminal module 300.

[0048] Specifically, the power step-down chip 510 can employ circuits such as linear regulators or switching regulators to reduce the input high voltage to a voltage level suitable for touchscreen operation. For example, if the touchscreen's operating voltage is 5V and the input voltage is 12V or higher, the power step-down chip 510 will be responsible for reducing the input voltage to 5V. The transceiver chip 520 can employ a single-chip RF transceiver or an integrated USB transceiver, etc., to handle data transmission between the touchscreen and the central processing unit 400. The transceiver chip 520 should be able to support the required communication protocols and data rates to ensure efficient data exchange. The transceiver chip 520 can connect to the central processing unit 400 via data lines and control lines to transmit instructions and data. The connection method can adopt a standard digital interface such as I2C, SPI, UART, etc., or a high-speed interface. The two pins of the transceiver chip 520 are used for power and ground, respectively. The power step-down chip 510 can be connected to the terminal block 300 via wires or printed circuit board (PCB) wiring.

[0049] By integrating the power buck chip 510 and the transceiver chip 520 into the touch screen driver module 500, the circuit structure can be simplified and the signal transmission efficiency can be improved. At the same time, the two pins of the transceiver chip 520 are connected to power and ground respectively, which can effectively reduce the risk of failure and improve the stability and reliability of the system.

[0050] In some embodiments, the touch screen driving module 500 includes a second capacitive reactance circuit 530 , one end of the second capacitive reactance circuit 530 is grounded, and the other end of the second capacitive reactance circuit 530 is connected to the power step-down chip 510 .

[0051] Specifically, the second capacitive circuit 530 may include one or more capacitors for reducing high-frequency noise and electromagnetic interference between the power buck chip 510 and the ground. One end of the second capacitive circuit 530 can be grounded to ensure the safety and stability of the circuit, and the other end can be connected to the power buck chip 510 to provide a stable low-voltage output. The connection method can adopt printed circuit board wiring, and the power buck chip 510 can be connected to the second capacitive circuit 530 through printed circuit board wiring.

[0052] By providing the second capacitive reactance circuit 530 , the power supply voltage can be filtered and stabilized, thereby reducing electromagnetic interference, and reducing the impact of power supply noise and fluctuations on the touch screen driver module, thereby improving the stability of the power supply.

[0053] In some embodiments, the temperature control module 100 includes a temperature control chip 110 and a first switch 120. The temperature control chip 110 is respectively connected to one end of the first switch 120, the terminal module 300, the multiplexing module 200 and the central processing unit 400, and the other end of the first switch 120 is grounded.

[0054] Specifically, the temperature control chip 110 can adopt a microcontroller with a PID control algorithm or a dedicated temperature control chip to monitor the temperature of the heating body and adjust the heating power to achieve precise temperature control. The temperature control chip 110 should have sufficient processing speed and accuracy to meet the temperature control requirements during the digestion process. The first switch 120 can adopt a switching element such as a transistor, a relay or a solid-state relay to control the power switch of the heating body. The temperature control chip 110 can be connected to one end of the first switch 120 through a control line to send a control signal. The temperature control chip 110 can also be connected to the terminal module 300, the multiplexing module 200 and the central processing unit 400 through a data line. The other end of the first switch 120 can be connected to the ground wire to ensure the safety and stability of the circuit.

[0055] By integrating the temperature control chip 110 and the first switch 120, the temperature control module 100 can monitor and adjust the temperature more accurately, prevent overheating or overcooling, and ensure that the system operates within a suitable temperature range, thereby improving the stability and performance of the system.

[0056] In some embodiments, the temperature control module 100 includes a light emitting diode 130 , one end of the light emitting diode 130 is grounded, and the other end of the light emitting diode 130 is connected to the temperature control chip 110 .

[0057] Specifically, the light-emitting diode 130 can be a common photoelectric device, such as an LED (light-emitting diode), which is used to indicate the working status or fault information of the temperature control module 100. The selection of the LED should take into account its brightness, life and compatibility to ensure clear display under different environmental conditions. One end of the light-emitting diode 130 can be grounded through the printed circuit board wiring to ensure the safety and stability of the circuit, and the other end can be connected to the temperature control chip 110 to receive the control signal from the temperature control chip 110. The temperature control chip 110 is used to monitor the temperature of the heating body and adjust the heating power. The temperature control chip 110 can be connected to one end of the light-emitting diode 130 through a control line to send a control signal; the temperature control chip 110 can also be connected to other components (such as the terminal module 300, the multiplexing module 200 and the central processing unit 400) through a data line to transmit temperature data and receive control instructions.

[0058] One end of the light-emitting diode 130 is grounded, and the other end is connected to the temperature control chip 110. When the temperature is abnormal, the brightness or flashing of the light-emitting diode 130 can be used to issue an alarm, reminding the user to take measures to prevent potential overheating risks.

[0059] In some embodiments, the temperature control module 100 includes a plurality of second capacitors 140 , one end of each of the plurality of second capacitors 140 is connected to different pins of the temperature control chip 110 , and the other end of each of the plurality of second capacitors 140 is grounded.

[0060] Specifically, the second capacitor 140 can adopt various types of capacitors, such as ceramic capacitors, tantalum capacitors, aluminum electrolytic capacitors, etc. One end of the multiple second capacitors 140 is respectively connected to different pins of the temperature control chip 110, and the other ends are all grounded, so as to reduce the mutual interference between the pins of the temperature control chip 110 and improve the stability and anti-interference ability of the circuit. The connection method can adopt wire or printed circuit board (PCB) wiring. The temperature control chip 110 can be connected to one end of the second capacitor 140 through a pin to receive the capacitive filtering effect from the second capacitor 140. The temperature control chip 110 can also be connected to the input / output component through other pins to transmit temperature data and receive control instructions.

[0061] By connecting multiple second capacitors 140 to different pins of the temperature control chip 110, power supply noise and interference are filtered out, ensuring that the signal received by the temperature control chip 110 is stable, thereby improving the accuracy of temperature monitoring and enhancing the system's anti-interference ability.

[0062] In some embodiments, the temperature control module 100 includes a temperature sensor 150 , which is connected to the temperature control chip 110 .

[0063] Specifically, the temperature sensor 150 can adopt various types of temperature sensors, such as thermocouples, thermistors (NTC, PTC), infrared temperature sensors, etc. When selecting a temperature sensor, factors such as its measurement range, accuracy, response time and stability should be considered to ensure that it can meet the temperature monitoring requirements during the digestion process. The temperature sensor 150 can be connected to the temperature control chip 110 through wires or printed circuit board (PCB) wiring. The connection method can adopt analog signal connection (such as voltage or current signal) or digital signal connection (such as I2C, SPI and other interfaces). In particular, according to the interface type of the temperature control chip 110 and the temperature sensor 150, a suitable connection method is selected. The temperature control chip 110 receives the temperature signal of the temperature sensor 150 and adjusts the heating power accordingly. When the temperature control chip 110 receives the temperature signal of the temperature sensor 150, it adjusts the power of the heater according to the preset temperature control algorithm to maintain the target temperature. At the same time, the temperature control chip 110 can also display the current temperature and target temperature through the touch screen so that the user can understand the working status of the temperature control module 100 in real time.

[0064] By integrating the temperature sensor 150 , the temperature control module 100 can accurately monitor the ambient temperature, ensure accurate temperature readings, and enhance the system's adaptability.

[0065] An embodiment of the present application further provides a reflux digestion instrument, comprising: a shell with a receiving cavity formed therein, and a control circuit of any of the above-mentioned reflux digestion instruments, disposed in the shell.

[0066] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the above embodiments, or to replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present application.

Claims

1. A control circuit of a reflux digestion instrument, characterized in that: The control circuit includes: a temperature control module, a multiplexing module, a wiring terminal module, a central processing unit, a touch screen driver module and a storage module. The temperature control module is respectively connected to the wiring terminal module, the multiplexing module and the central processing unit, and the central processing unit is respectively connected to the touch screen driver module and the storage module; wherein, the temperature control module and the touch screen driver module are respectively connected to the liquid crystal touch screen of the reflux digestion instrument, and the wiring terminal modules are respectively connected to the heating plate of the reflux digestion instrument.

2. The control circuit of a reflux digestion instrument according to claim 1, characterized in that: The storage module includes a storage chip and a first capacitive reactance circuit, one end of the first capacitive reactance circuit is connected to the storage chip, the other end of the first capacitive reactance circuit is grounded, and the storage chip is connected to the central processing unit.

3. The control circuit of a reflux digestion instrument according to claim 2, characterized in that: The first capacitive reactance circuit is provided with a plurality of first capacitors, and the plurality of first capacitors are arranged in parallel.

4. The control circuit of a reflux digestion instrument according to claim 1, characterized in that: The touch screen driving module includes a power buck chip and a transceiver chip. The transceiver chip is connected to the central processing unit. Two pins of the transceiver chip are respectively connected to power and ground. The power buck chip is connected to the terminal module.

5. The control circuit of a reflux digestion instrument according to claim 4, characterized in that: The touch screen driving module includes a second capacitive reactance circuit, one end of the second capacitive reactance circuit is grounded, and the other end of the second capacitive reactance circuit is connected to the power step-down chip.

6. The control circuit of a reflux digestion instrument according to claim 1, characterized in that: The temperature control module includes a temperature control chip and a first switch. The temperature control chip is respectively connected to one end of the first switch, the terminal module, the multiplexing module and the central processing unit. The other end of the first switch is grounded.

7. The control circuit of a reflux digestion instrument according to claim 6, characterized in that: The temperature control module includes a light emitting diode, one end of the light emitting diode is grounded, and the other end of the light emitting diode is connected to the temperature control chip.

8. The control circuit of a reflux digestion instrument according to claim 6, characterized in that: The temperature control module includes a plurality of second capacitors, one end of each of the second capacitors is connected to different pins of the temperature control chip, and the other end of each of the second capacitors is grounded.

9. The control circuit of a reflux digestion instrument according to claim 6, characterized in that: The temperature control module includes a temperature sensor, and the temperature sensor is connected to the temperature control chip.

10. A reflux digestion apparatus, characterized in that: include: A shell having an accommodating cavity formed therein and a control circuit of the reflux digestion instrument according to any one of claims 1 to 9 are arranged in the shell.

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