Monitoring management equipment and ATE test system

Abstract

The utility model provides a monitoring management device and an ATE test system, which are used for monitoring and managing an ATE device, the ATE device comprises a cabinet and a test head which are in communication connection, the monitoring management device comprises a system management unit, a test head management unit and a docking control unit which are in communication connection, the system management unit is arranged in the cabinet of the ATE device, and the docking control unit is arranged in the cabinet of the ATE device. And the test head management unit and the docking control unit are arranged in a test head of the ATE equipment. Through the application, monitoring, control, power management and the like of the ATE equipment can be realized, and interaction between the external equipment and the ATE equipment can be effectively monitored, so that the running state of the ATE equipment is comprehensively and efficiently monitored and managed, and the safety and stability of the test process are ensured.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit testing, and in particular to a monitoring and management device and an ATE testing system. Background Art

[0002] In the semiconductor manufacturing and testing industry, ATE (Automatic Test Equipment) plays a central role in evaluating and verifying the performance of semiconductor devices. The efficiency and reliability of ATE equipment directly impact product quality and production efficiency, making accurate monitoring and management of ATE equipment crucial. Traditional ATE test systems have shortcomings in system monitoring and management. For example, monitoring and management of the power distribution system, test head status, and external device connection status are not detailed or intelligent enough, leading to instability or failures during testing. Currently, some ATE test systems use simple monitoring devices to detect system operating status. However, such monitoring devices are often fragmented and provide only limited monitoring information, failing to comprehensively monitor all aspects of the system. Furthermore, the test head management unit in existing monitoring devices typically only monitors basic test head status, failing to provide comprehensive monitoring information such as the test head's power supply status and posture. Furthermore, the system lacks interactive monitoring and control between the test head and external devices (such as probers or handlers), potentially leading to low test efficiency and increased risk of equipment damage. Utility Model Content

[0003] In view of this, the main purpose of this application is to provide a monitoring and management device and an ATE test system that can monitor, control and power management of ATE equipment, and effectively monitor the interaction between external devices and ATE equipment, so as to comprehensively and efficiently monitor and manage the operating status of ATE equipment and ensure the safety and stability of the test process.

[0004] In a first aspect, the present application provides a monitoring and management device for monitoring and managing ATE equipment, the ATE equipment including a cabinet and a test head connected in communication, the monitoring and management device including a system management unit, a test head management unit, and a docking control unit connected in communication;

[0005] The system management unit is arranged in the cabinet of the ATE equipment, and includes a power management module, a first main control chip, a first sensor interface and a first control interface. The power management module is connected to the power distribution system in the cabinet and monitors and manages the operation of the power distribution system. The first main control chip is connected to at least one of the air path sensor, the temperature sensor and the smoke sensor through the first sensor interface, and monitors at least one of the air pressure, temperature and smoke of the cabinet. The first main control chip is also connected to the safety interlock door switch and the emergency stop button of the cabinet through the first control interface, and is used to perform interlock switch control and emergency stop control on the cabinet;

[0006] The test head management unit is arranged in the test head of the ATE device, and includes a voltage monitoring module, a second main control chip, a second sensor interface and a second control interface. The voltage monitoring module is used to monitor and manage the board voltage and operating voltage of the test head. The second main control chip is connected to at least one temperature sensor through the second sensor interface and monitors the temperature of the test head. The second main control chip is also connected to the safety interlock door switch and emergency stop button of the test head through the second control interface, and is used to control the interlock switch and emergency stop of the test head.

[0007] The docking control unit is arranged in the test head of the ATE device, and includes a third sensor interface and a third control interface. The third sensor interface is connected to the posture sensor and the docking sensor, and is used to monitor the posture parameters of the test head and the docking parameters of the test head and the external device. The third control interface is connected to the external controller, and is used to execute locking or unlocking control of the test head and the external device through the external controller.

[0008] From the above, the present application provides a monitoring and management device to monitor and manage the cabinet and test head of the ATE equipment, wherein the system management unit of the monitoring and management device can be set in the cabinet of the ATE equipment, and monitor the environmental parameters in the cabinet through multiple sensor interfaces, and connect to external safety interlock door switches and emergency stop buttons through multiple control interfaces, so as to realize emergency stop control of the cabinet and interlock switch control between the cabinet and external equipment. The test head management unit and docking control unit of the monitoring and management device can be set in the test head of the ATE equipment, wherein the test head management unit can realize monitoring and configuration management of the test head through the sensor interface and the control interface, and the docking control unit can realize docking status monitoring and docking lock management of the test head and external equipment (such as probe station, manipulator, etc.) through the sensor interface and the control interface. Through the monitoring and management device provided by this application, comprehensive monitoring, control and power management of the ATE equipment can be realized, and the interaction between the external equipment and the ATE equipment can be effectively monitored, so as to comprehensively and efficiently monitor and manage the operating status of the ATE equipment and ensure the safety and stability of the test process.

[0009] Optionally, it also includes a host computer, which is connected to the system management unit via an Ethernet interface, and is used to receive monitoring data uploaded by the system management unit, the test head management unit and the docking control unit via a communication link, and issue corresponding control instructions via the communication link.

[0010] As described above, by setting up a host computer and using an Ethernet interface to establish a stable communication link with the system management unit of the monitoring and management equipment, it is possible to receive in real time the monitoring data uploaded by the system management unit, the test head management unit, and the docking control unit. These data include but are not limited to the power status of the cabinet, environmental parameters (such as air pressure, temperature, and smoke concentration), the voltage and temperature information of the test head, and the docking status of the test head and external devices. The host computer can analyze the received monitoring data in real time and display it intuitively through a graphical interface. In addition, the host computer can also issue control instructions to the system management unit, the test head management unit, and the docking control unit through the communication link. These instructions can be adjustments to device parameters (such as setting voltage ranges and adjusting temperature thresholds), triggering safety mechanisms (such as emergency shutdowns and interlock switch control), or even automated control of the test process. Through this host computer, the monitoring and management level of ATE equipment can be significantly improved, and real-time data collection, analysis, display, and remote control can be achieved, providing strong support for the stable operation and efficient management of the equipment.

[0011] Optionally, the system management unit further includes a physical layer chip and a plurality of bus communication interfaces, and the physical layer chip is connected to at least one of the liquid cooling unit, the intelligent circuit breaker, and the cooling fan through the bus communication interface.

[0012] As mentioned above, the physical layer chip, as the underlying processing unit in the communication link, can be used to be responsible for physical-level processing such as serial / parallel conversion of data, clock synchronization, and signal shaping. Through the bus communication interface, the system management unit can establish connections with multiple components inside the ATE equipment, such as the liquid cooling unit, intelligent circuit breaker, cooling fan, etc. The system management unit can monitor the working status of the liquid cooling unit (such as coolant temperature, flow, etc.) in real time through the bus communication interface and adjust its working mode as needed. The system management unit can also monitor the current, voltage and other parameters in the circuit in real time through the bus communication interface, and quickly cut off the power supply through the intelligent circuit breaker when an abnormal situation is detected to ensure the safety of the ATE equipment.

[0013] Optionally, the system management unit further includes a status indication interface, and the first main control chip is connected to at least one display module via the status indication interface for status display.

[0014] From the above, by setting up a status indication interface in the system management unit and connecting a display module (LED digital tube), the current status or error code of the equipment can be directly displayed to the operator in a visual manner, which helps the operator to better understand the operating status of the equipment and make corresponding decisions.

[0015] Optionally, the test head management unit also includes a protective cover detection port and a maintenance mode detection port connected to the second main control chip, and the protective cover status of the test head is monitored through the protective cover detection port, and maintenance operations and status monitoring of the test head are performed through the maintenance mode detection port.

[0016] As described above, a protective cover detection port is added to the test head management unit, which can monitor the opening and closing status, locking status, etc. of the protective cover in real time. A maintenance mode detection port is added to the test head management unit, which can perform maintenance operations and status monitoring on the test head.

[0017] Optionally, the test head management unit further includes a physical layer chip and a plurality of bus communication interfaces, and the physical layer chip is connected to at least one of the service board and the cooling fan via the bus communication interface.

[0018] As described above, by setting a physical layer chip and a bus communication interface in the test head management unit, the connection and interactive control between the test head and external devices such as various business boards and cooling fans can be achieved.

[0019] Optionally, the test head management unit further includes a calibration bus interface connected to the second main control chip, for calibrating the test head through the calibration bus interface.

[0020] As described above, the calibration bus interface can be used for relevant calibration and maintenance of the test head, thereby ensuring the reliability of the test data.

[0021] Optionally, the first main control chip of the system management unit is further connected to a control panel of the cabinet through the first control interface, so as to perform status monitoring and configuration management on the cabinet through the control panel; and / or,

[0022] The second main control chip of the test head management unit is further connected to the control panel of the test head through the second control interface, and is used for monitoring the status and managing the configuration of the test head through the control panel.

[0023] As described above, the control panel can provide an operation interface, allowing the operator to view real-time data during the test process, such as test parameters and equipment status, through the control panel. The operator can also use the control panel to implement configuration management of the system management unit or the test head management unit.

[0024] Optionally, the docking control unit further includes a power distribution and monitoring module for performing voltage monitoring and power supply management on each module in the docking control unit.

[0025] From the above, the power distribution and monitoring module can manage the power supply for each module in the docking control unit and monitor the health status of the power supply, such as voltage and current.

[0026] Optionally, the docking control unit is further connected to the bracket of the test head through a third control interface, and performs status monitoring and movement management on the bracket of the test head.

[0027] As described above, by connecting the bracket for fixing and moving the test head to the docking control unit, the rotation and movement of the test head can be controlled by controlling the bracket, so that it can be applied to different working scenarios.

[0028] Optionally, the communication link between the system management unit, the test head management unit and the docking control unit is formed via a 485 bus and / or a CAN bus.

[0029] As described above, communication interfaces are respectively set in the system management unit, the test head management unit and the docking control unit, and the 485 bus, CAN bus and other methods can be used to realize the interaction of data and control instructions. Among them, the 485 bus and CAN bus can be used to realize dual-bus communication between the system management unit, the test head management unit and the docking control unit to ensure that in the event of failure of a single bus, it can switch to another bus to ensure connection stability.

[0030] Optionally, the bus communication interface includes at least one of a MODBUS interface, a 485 interface, a CAN interface and an IO interface.

[0031] As mentioned above, the system management unit and the test head management unit can be configured with multiple bus communication interfaces to realize the integration of multiple communication protocols, such as 485 bus, CAN bus, MODBUS protocol, TCP / RTU protocol, etc., so as to exchange data with external devices such as test heads, intelligent circuit breakers, liquid cooling units, fans, etc., adapt to different communication protocols, and improve the compatibility and flexibility of the system.

[0032] In a second aspect, the present application provides an ATE test system, including an ATE device and the above-mentioned monitoring and management device;

[0033] The ATE equipment includes a cabinet and a test head connected in communication;

[0034] The monitoring and management device includes a system management unit arranged in the cabinet, a test head management unit and a docking control unit arranged in the test head.

[0035] Based on the above, the present application also provides an ATE test system, including ATE equipment and a monitoring and management device. Through the monitoring and management device, comprehensive monitoring, control and power management of the ATE equipment can be achieved, and the interaction between external devices and the ATE equipment can be effectively monitored, thereby comprehensively and efficiently monitoring and managing the operating status of the ATE equipment to ensure the safety and stability of the test process.

[0036] These and other aspects of the present application will become more apparent from the following description of the embodiment(s). BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A structural diagram of a monitoring and management device provided in an embodiment of the present application;

[0038] Figure 2 A structural diagram of an ATE test system provided in an embodiment of the present application;

[0039] Figure 3 A structural diagram of a system management unit provided in an embodiment of the present application;

[0040] Figure 4 A structural diagram of a test head management unit provided in an embodiment of the present application;

[0041] Figure 5 This is a structural diagram of a docking control unit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0043] The embodiments of the present application provide a monitoring and management device and an ATE test system, which can monitor, control, and manage power supply of ATE equipment, and effectively monitor the interaction between external devices and ATE equipment, thereby comprehensively and efficiently monitoring and managing the operating status of ATE equipment and ensuring the safety and stability of the test process.

[0044] like Figure 1 As shown, an embodiment of the present application provides a monitoring and management device for monitoring and managing ATE equipment, wherein the ATE equipment includes a cabinet and a test head connected in communication, and the monitoring and management device includes a system management unit 210, a test head management unit 310 and a docking control unit 320 connected in communication.

[0045] Among them, the system management unit 210 is set in the cabinet of the ATE equipment, including a power management module 211, a main control chip 212 (the above-mentioned first main control chip), a sensor interface 213 (the above-mentioned first sensor interface) and a control interface 214 (the above-mentioned first control interface). The power management module 211 is connected to the power distribution system in the cabinet and monitors and manages the operation of the power distribution system. The main control chip 212 is connected to at least one of the air path sensor, temperature sensor and smoke sensor through the sensor interface 213, and monitors at least one of the air pressure, temperature and smoke of the cabinet. The main control chip 212 is also connected to the safety interlock door switch and emergency stop button of the cabinet through the control interface 214, which is used to control the interlock switch and emergency stop of the cabinet.

[0046] The test head management unit 310 is provided in the test head of the ATE equipment and includes a voltage monitoring module 311, a main control chip 312 (the above-mentioned second main control chip), a sensor interface 313 (the above-mentioned second sensor interface) and a control interface 314 (the above-mentioned second control interface). The voltage monitoring module 311 is used to monitor and manage the board voltage and operating voltage of the test head. The main control chip 312 is connected to at least one temperature sensor through the sensor interface 313 and monitors the temperature of the test head. The main control chip 312 is also connected to the safety interlock door switch and emergency stop button of the test head through the control interface 314 for interlock switch control and emergency stop control of the test head.

[0047] The docking control unit 320 is arranged in the test head of the ATE device, including a sensor interface 321 (the above-mentioned third sensor interface) and a control interface 322 (the above-mentioned third control interface). The sensor interface 321 is connected to the posture sensor and the docking sensor, and is used to monitor the posture parameters of the test head and the docking parameters of the test head and the external device. The control interface 322 is connected to the external controller, and is used to execute locking or unlocking control of the test head and the external device through the external controller.

[0048] like Figure 2As shown, an embodiment of the present application provides an ATE test system, including ATE equipment and a monitoring and management device, wherein the ATE equipment includes a cabinet 200 and a test head 300, and the monitoring and management device includes a host computer 110, a system management unit 210, a test head management unit 310, and a docking control unit 320. The ATE equipment can be used to perform performance testing of the device under test, and the monitoring and management device can be used to perform comprehensive monitoring, control, and power management of the ATE equipment, and effectively monitor the interaction between external devices and the ATE equipment, thereby comprehensively and efficiently monitoring and managing the operating status of the ATE equipment, ensuring the safety and stability of the test process. The host computer (industrial control computer) 110 can receive monitoring data uploaded from the system management unit 210, the test head management unit 310, and the docking control unit 320 in real time. The host computer 110 can perform real-time analysis on the received monitoring data and issue control instructions to the system management unit 210, the test head management unit 310, and the docking control unit 320 via a communication link, thereby achieving real-time data collection, analysis, display, and remote control, providing strong support for the stable operation and efficient management of the equipment.

[0049] Reference Figure 2 As shown, the system management unit 210 is provided in the cabinet 200 of the ATE device, and the system management unit 210 includes a power management module ( Figure 2 (not shown), the power management module includes Figure 2The voltage monitoring module and power monitoring module in the cabinet 200 are connected to the power distribution system in the cabinet 200 and are responsible for monitoring the operation of the power distribution system in the cabinet; the system management unit 210 is also connected to multiple temperature sensors, smoke sensors, and gas path sensors, which are respectively used to read and record the temperature, smoke, and air pressure inside and outside the system, and are connected to the emergency stop button or safety interlock door switch of the cabinet 200 through multiple control interfaces (the above-mentioned first control interface) to realize the power on and off control of the cabinet 200, as well as the interlock switch control with external equipment (probe station, manipulator, bracket, etc.); the test head management unit 310 is arranged in the test head 300 of the above-mentioned ATE equipment and communicates with the system management unit 210 through the bus. The test head management unit 310 can monitor and manage the board voltage and working voltage of the test head 300 through the voltage monitoring module, A temperature sensor is also connected to read and record the temperature of the test head 300, and the safety interlock door switch and emergency stop button of the test head 300 are respectively connected through multiple control interfaces (the above-mentioned second control interface) to realize the power on and off control of the test head 300, as well as the interlock switch control with external equipment (probe station, manipulator, bracket, etc.); the docking control unit 320 is also arranged in the test head 300 of the above-mentioned ATE equipment. The docking control unit 320 communicates with the test head management unit 310 through the bus and is responsible for controlling the locking and unlocking of the test head 300 and the external probe station or manipulator. The docking control unit 320 is used to monitor the posture parameters of the test head and the docking parameters of the test head and the external equipment by connecting the posture sensor and the docking sensor, and also controls the locking or unlocking of the test head and the external equipment by connecting the external remote control (the above-mentioned external controller).

[0050] The monitoring and management device provided in the embodiment of the present application integrates the control system, sensors, etc. in the cabinet and test head of the ATE equipment to monitor various parameters of the cabinet and the test head, and transmits each monitoring data to a host computer for centralized display and processing. After analyzing the monitoring data, the host computer issues control instructions to the system management unit, the test head management unit, and the docking control unit through a communication link to achieve comprehensive monitoring, control, and power management of the ATE equipment, etc., thereby solving the problems of decentralized monitoring functions and lack of unified management and coordination of existing ATE equipment. In addition, remote monitoring and control of the ATE equipment can be achieved through the host computer, providing flexibility and security in system management.

[0051] Refer to the following Figure 3-Figure 5 , the system management unit, test head management unit and docking control unit in the embodiments of the present application are described in detail.

[0052] like Figure 3 The structure diagram of a system management unit provided in an embodiment of the present application is shown. Figure 3 As shown in the figure, the system management unit is set in the cabinet of the ATE equipment, adopts a modular design, and is equipped with multiple interfaces (MODBUS interface, 485 interface, Ethernet interface, voltage input interface, voltage output interface, sensor interface, EMO emergency stop interface, distribution box door switch interface, error code indication interface, control panel interface) and multiple chips (main control chip, physical layer chip, ADC, power supply chip) to achieve multi-interface integration and multi-function integration, thereby realizing power management of the entire system, sensor monitoring and communication with external devices.

[0053] The system management unit connects to different voltage input interfaces (12V / 24V / 48V) via an ADC. After voltage conversion via the power supply chip, it connects to different voltage output interfaces (12V / 24V / 48V). This supports input monitoring and output management of multiple voltages, realizes intelligent distribution and management, and monitors voltage, current, and power status in real time to ensure the stable operation of the cabinet power distribution system. In addition, the system management unit can also use a time-sequential power-on method to control the startup of ATE equipment. The main control method is to add a solid-state relay in the front stage of the switch and control it through the IO port of the power supply chip to achieve the purpose of time-sequential startup.

[0054] The system management unit's main control chip (the aforementioned first main control chip) can be implemented using an MCU or FPGA. This main control chip can be connected to a gas path sensor, temperature sensor, and smoke sensor via a sensor interface (the aforementioned first sensor interface) to read and record parameters such as the cabinet's air pressure, temperature, and smoke. Regarding the control interface, the main control chip can be connected to the distribution box door switch interface via a door switch status monitoring circuit, thereby connecting to an external safety interlock door switch. This door switch status monitoring circuit monitors the distribution box door switch status, and this safety interlock door switch interlocks the cabinet's main circuit breaker. When the cabinet door is opened while powered on, the main circuit breaker trips due to pressure loss, and the control circuit detects this fault and issues an alarm. The main control chip is also connected to the EMO emergency stop interface through an emergency stop status monitoring circuit to connect to an external emergency stop button. The emergency stop status monitoring circuit can use diodes and transistors to implement the circuit structure, and can use the small voltage drop generated by the diode to cooperate with the transistor to complete the current amplification, thereby realizing the status monitoring of the safety circuit in the input contact circuit of the safety module that does not support a large voltage drop. In addition, the status monitoring of the safety circuit can be realized by setting a reverse diode. In the embodiment of the present application, the emergency stop button and the safety interlock door switch are set, so that when an abnormality or emergency occurs in the cabinet, the emergency stop button is used to ensure that the system can stop running quickly, and the external device is safety interlocked and controlled by the safety interlock door switch to ensure the safety of the entire system. The main control chip can be connected to a display device (such as an LED digital tube) through an error code indication interface to realize the current status or error code of the equipment directly to the operator in a visual manner without a host computer, which helps the operator to better understand the operating status of the equipment and make corresponding decisions. The main control chip can also be connected to the operation buttons of an external control panel through a control panel interface. The control panel can provide an operation interface, allowing operators to view real-time data during the test process through the control panel. Operators can also use the control panel to manage the configuration of the system management unit.

[0055] In terms of communication interfaces, the system management unit can be implemented using a physical layer chip and multiple bus communication interfaces. The physical layer chip, as the underlying processing unit in the communication link, can be used to perform physical-level processing such as serial / parallel data conversion, clock synchronization, and signal shaping. Through the bus communication interface, the system management unit can establish connections with multiple components within the ATE device. For example, the physical layer chip can connect to the MODBUS interface via the 485 bus and connect to an external intelligent circuit breaker and liquid cooling unit via the TCP / RTU protocol. The physical layer chip can also connect to the 485 interface via the 485 bus and connect to an external fan via the 485 bus. Based on this, the system management unit can monitor the operating status of the liquid cooling unit (such as coolant temperature and flow rate) in real time and adjust its operating mode as needed. The system management unit can also monitor various information in the circuit in real time, such as current, voltage, and fuse status. When an abnormal situation is detected, the system management unit can quickly cut off the power supply through the intelligent circuit breaker to ensure the safety of the ATE equipment. The control board can also control the cooling fan to achieve heat dissipation of the cabinet. The physical layer chip of the system management unit is also connected to the host computer through the Ethernet interface, and is connected to the test head management unit through the 485 or CAN interface. Based on this communication link, the system management unit can upload the monitoring data of each unit to the host computer, and monitor the entire ATE equipment through the host computer. The monitoring data of the test head management unit can be transmitted back to the system management unit through communication with the system management unit, thereby realizing a data communication link from the test head management unit to the system management unit to the host computer.

[0056] like Figure 4 The structure diagram of a test head management unit provided by an embodiment of the present application is shown in FIG. Figure 4 As shown, the test head management unit is installed in the test head of the ATE equipment and communicates with the system management unit via the 485 bus and the CAN bus. This allows the use of another bus in the event of a single bus failure to ensure communication stability. The test head management unit can be used to monitor the operating status of the test head, and the monitoring data includes but is not limited to the power supply voltage, current, and test head temperature. The test head management unit allows the test head to be equipped with an independent control unit. An external remote control connected to the control interface provided by the test head management unit can be used to calibrate the test head and control power on and off. The test head management unit supports switching to maintenance mode, which can be activated by turning the key knob to limit the use of the test head. Under normal operating conditions, the test head management unit can protect the operator's safety through the safety interlock of the test head protective cover and the test head board installation door. The test head management unit can also monitor the emergency stop button to ensure stable power failure of the system and to ensure that data is not stored. Through real-time monitoring, the test head management unit can predict and prevent potential failures and optimize the performance of the test head.

[0057] The test head management unit connects to the board power supply voltage monitoring interface and the operating power supply voltage monitoring interface via an ADC. This monitors the board power supply voltage and the operating power supply voltage. By continuously monitoring the power supply voltage, any deviation from the normal range triggers an alarm, and the control logic makes necessary adjustments or cuts off the power supply. A DC power supply is also connected to the power supply interface to convert the power and then power the various modules of the test head through this power supply interface, ensuring stable operation of the test head.

[0058] The main control chip of the test head management unit (the above-mentioned second main control chip) can be implemented using an MCU or FPGA. The main control chip can be connected to at least one temperature sensor through a sensor interface (the above-mentioned second sensor interface) to read and record the temperature parameters of the test head. In terms of the control interface, the main control chip can be connected to the safety interlock door switch interface through a door switch status monitoring circuit to connect to an external limit switch or photoelectric sensor. The limit switch or photoelectric sensor is used to monitor the door status of the test head to ensure that the door remains closed during the test process, prevent external interference, and avoid personal injury caused by dangerous voltages that the user may be exposed to. The main control chip is also connected to the emergency stop interface through an emergency stop status monitoring circuit to connect to an external emergency stop button, ensuring a rapid response in any abnormal situation and immediately interrupting the test process to protect the safety of users and equipment. The main control chip also connects to a protective cover inspection port and a maintenance mode inspection port via an I / O bus. The protective cover inspection port monitors the status of the test head's protective cover, and performs maintenance operations and monitors the test head's status. Through these ports, the test head management unit can switch the test head's operating mode based on operational requirements or safety protocols, such as from normal operation mode to maintenance mode, or activate the protective cover shielding function to prevent accidental operation during maintenance. Both maintenance and protective cover shielding modes are switched via a key knob, preventing accidental activation by others and further enhancing system security. The main control chip also connects to the operation buttons of an external control panel via a control panel interface. The control panel provides an operational interface, allowing operators to view real-time data during the test process and manage the test head management unit's configuration. Furthermore, the main control chip can connect to external calibration equipment via a calibration bus interface to perform relevant calibration and maintenance of the test head, thereby ensuring the reliability of test data.

[0059] Regarding the communication interface, the test head management unit can be implemented using a physical layer chip and multiple bus communication interfaces. The physical layer chip, as the underlying processing unit in the communication link, is responsible for physical-layer processing such as serial / parallel data conversion, clock synchronization, and signal shaping. Through the bus communication interfaces, the test head management unit can establish connections with multiple components within the ATE device. For example, the physical layer chip can connect to the board communication interface via the 485 bus or CAN bus, and also connect to the service board via the 485 bus or CAN bus to obtain real-time information from the service board and perform fault diagnosis and alarms. The physical layer chip can also connect to the fan control interface and external fan board via the 485 bus to control the cooling fan, dissipate heat from the test head, and ensure that the test head operates at an appropriate temperature. The physical layer chip of the test head management unit is also connected to the host computer or system management unit through the 485 bus or CAN bus, and is connected to the docking control unit through the 485 or CAN interface, uploading the acquired monitoring data of the docking control unit and its own monitoring data to the system management unit or the host computer, and realizing the monitoring and management of the test head and test board status on the host computer.

[0060] like Figure 5 The figure shows a structure diagram of a docking control unit provided in an embodiment of the present application, referring to Figure 5 As shown, the docking control unit, located in the test head of the ATE equipment, is responsible for controlling the locking and unlocking of the test head with an external probe station or manipulator. It communicates with the test head management unit or host computer via the 485 bus and the CAN bus. This allows for communication stability by activating another bus in the event of a single bus failure. The docking control unit adjusts the locking mechanism based on different modes and docking device settings, ensuring a stable connection between the test head and external devices. It also monitors the interlocking status to prevent damage to the tester platform or external docking devices due to operational errors.

[0061] The docking control unit is equipped with a power distribution and monitoring module for supplying power to other modules within the docking control unit and monitoring the health status of the power supply, such as voltage and current. The docking control unit is also equipped with a sensor interface (the aforementioned third sensor interface), through which a posture sensor, a docking sensor, a temperature sensor, and a user interface sensor can be connected. The posture sensor and docking sensor are used to detect the docking status of the test head and the external device, the temperature sensor is used to monitor the temperature parameters of the test head, and the user interface sensor is used to monitor the placement of the user interface, thereby ensuring the normal operation of the system terminal.

[0062] In terms of the control interface (the third control interface mentioned above), the docking control unit is equipped with a handheld operator interface and a bracket control interface. The handheld operator interface allows the docking control unit to connect to an external handheld operator. The operator can use the handheld operator to conveniently control the motion of the test head to ensure a smooth docking process. The operator also uses the detection functions of the posture sensor and docking sensor to complete the locking or unlocking control of the test head and external device, thereby improving the interactivity of the test head and external device. The docking control unit can connect to the test head bracket through the bracket control interface and monitor the status and manage the movement of the test head bracket for application in different work scenarios.

[0063] In summary, the embodiments of the present application provide an ATE test system, which includes an ATE device and a monitoring and management device. By setting the system management unit, test head management unit, and docking control unit in the monitoring and management device in the cabinet and test head of the ATE device, and by setting a variety of sensors for monitoring various parameters of the cabinet and the test head, the monitoring data of each parameter is transmitted to a connected host computer, and each parameter is displayed on the operation interface of the host computer, thereby jointly realizing system control and monitoring management. At the same time, each sensor and controller is uniformly coordinated and managed by the host computer, solving the problem of decentralized monitoring functions and lack of unified management and coordination of ATE equipment. Through the embodiments of the present application, it is possible to realize monitoring, control, and power management of ATE equipment, and effectively monitor the interaction between external devices and ATE equipment, thereby comprehensively and efficiently monitoring and managing the operating status of ATE equipment, ensuring the safety and stability of the test process.

[0064] It should be noted that the embodiments described in this application are only a part of the embodiments of this application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the above detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the application for protection, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0065] The words "first, second, third" and other similar terms in the specification and claims are only used to distinguish similar objects and do not represent a specific ordering of the objects. It is understandable that the specific order or sequence can be interchanged where permitted so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0066] In the above description, the numbers representing the steps involved do not necessarily mean that the steps must be executed. Intermediate steps may also be included or replaced by other steps. If permitted, the order of the previous and next steps may be interchanged or executed simultaneously.

[0067] The term "comprising" as used in the specification and claims should not be construed as limiting to what is listed thereafter; it does not exclude other elements or steps. Thus, it should be interpreted as specifying the presence of the features, integers, steps, or components mentioned, but not excluding the presence or addition of one or more other features, integers, steps, or components, or groups thereof. Thus, the expression "a device comprising means A and B" should not be limited to a device consisting solely of components A and B.

[0068] The term "one embodiment" or "an embodiment" mentioned in this specification means that the specific features, structures, or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places in this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. In addition, in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0069] Note that the above are only preferred embodiments of the present application and the technical principles employed. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the scope of protection of the present application, all of which fall within the scope of protection of the present application.

Claims

1. A monitoring and management device for monitoring and managing ATE equipment, the ATE equipment comprising a cabinet and a test head connected in communication, characterized in that: The monitoring and management device includes a communication-connected system management unit, a test head management unit, and a docking control unit; The system management unit is arranged in the cabinet of the ATE equipment, and includes a power management module, a first main control chip, a first sensor interface and a first control interface. The power management module is connected to the power distribution system in the cabinet and monitors and manages the operation of the power distribution system. The first main control chip is connected to at least one of the air path sensor, the temperature sensor and the smoke sensor through the first sensor interface, and monitors at least one of the air pressure, temperature and smoke of the cabinet. The first main control chip is also connected to the safety interlock door switch and the emergency stop button of the cabinet through the first control interface, and is used to perform interlock switch control and emergency stop control on the cabinet; The test head management unit is arranged in the test head of the ATE device, and includes a voltage monitoring module, a second main control chip, a second sensor interface and a second control interface. The voltage monitoring module is used to monitor and manage the board voltage and operating voltage of the test head. The second main control chip is connected to at least one temperature sensor through the second sensor interface and monitors the temperature of the test head. The second main control chip is also connected to the safety interlock door switch and emergency stop button of the test head through the second control interface, and is used to control the interlock switch and emergency stop of the test head. The docking control unit is arranged in the test head of the ATE device, and includes a third sensor interface and a third control interface. The third sensor interface is connected to the posture sensor and the docking sensor, and is used to monitor the posture parameters of the test head and the docking parameters of the test head and the external device. The third control interface is connected to the external controller, and is used to execute locking or unlocking control of the test head and the external device through the external controller.

2. The monitoring and management device according to claim 1, characterized in that: It also includes a host computer, which is connected to the system management unit through an Ethernet interface, and is used to receive monitoring data uploaded by the system management unit, the test head management unit and the docking control unit through a communication link, and issue corresponding control instructions through the communication link.

3. The monitoring and management device according to claim 1, characterized in that: The system management unit further includes a physical layer chip and a plurality of bus communication interfaces, and the physical layer chip is connected to at least one of the liquid cooling unit, the intelligent circuit breaker, and the cooling fan via the bus communication interface.

4. The monitoring and management device according to claim 1, characterized in that: The system management unit further includes a status indication interface, and the first main control chip is connected to at least one display module via the status indication interface for status display; and / or, The test head management unit also includes a protection cover detection port and a maintenance mode detection port connected to the second main control chip. The protection cover status of the test head is monitored through the protection cover detection port, and maintenance operations and status monitoring of the test head are performed through the maintenance mode detection port.

5. The monitoring and management device according to claim 1, characterized in that: The test head management unit further includes a physical layer chip and a plurality of bus communication interfaces, wherein the physical layer chip is connected to at least one of a service board and a cooling fan via the bus communication interface; and / or, The test head management unit further includes a calibration bus interface connected to the second main control chip, and is used to calibrate the test head through the calibration bus interface.

6. The monitoring and management device according to claim 1, characterized in that: The first main control chip of the system management unit is further connected to the control panel of the cabinet through the first control interface, so as to perform status monitoring and configuration management on the cabinet through the control panel; and / or, The second main control chip of the test head management unit is further connected to the control panel of the test head through the second control interface, and is used for monitoring the status and managing the configuration of the test head through the control panel.

7. The monitoring and management device according to claim 1, characterized in that: The docking control unit further includes a power distribution and monitoring module for performing voltage monitoring and power supply management on each module in the docking control unit; and / or, The docking control unit is also connected to the support of the test head through the third control interface, and performs status monitoring and movement management on the support of the test head.

8. The monitoring and management device according to claim 2, characterized in that: The communication link between the system management unit, the test head management unit and the docking control unit is formed via a 485 bus and / or a CAN bus.

9. The monitoring and management device according to claim 3 or 5, characterized in that: The bus communication interface includes at least one of a MODBUS interface, a 485 interface, a CAN interface and an IO interface.

10. An ATE test system, characterized in that: comprising an ATE device and a monitoring and management device according to any one of claims 1 to 9; The ATE equipment includes a cabinet and a test head connected in communication; The monitoring and management device includes a communication-connected system management unit, a test head management unit, and a docking control unit. The system management unit is arranged in the cabinet of the ATE device, and the test head management unit and the docking control unit are arranged in the test head of the ATE device.

Images