Multi-heat dissipation structure of computer chip

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a multi-heat-dissipation structure of a computer chip. Comprising a shell, the upper end of the shell is open, an inner cavity is formed in the side wall of the shell, the upper end of the shell is fixedly communicated with an outlet pipe and an inlet pipe, the outlet pipe and the inlet pipe are communicated with the inner cavity, a plurality of groove holes are formed in the peripheral side wall of the shell in the vertical direction, the ends, facing the center of the shell, of the groove holes incline upwards, and the groove holes are not communicated with the inner cavity. A plurality of fans are detachably and fixedly connected in the shell in the vertical direction, fins are fixed to the upper side and the lower side of a slotted hole in the outer side of the shell, and the included angle between the fins and the horizontal plane is equal to the included angle between the slotted hole and the horizontal plane. The shell and the boss are integrally formed, the shell and the boss directly participate in heat dissipation of the computer chip, the heat conduction performance is good, the surface area of the shell is large, the heat dissipation area is large, and the heat dissipation efficiency of the computer chip can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a multiple heat dissipation structure of a computer chip. Background Art

[0002] Computer chips are made of silicon material. They are thin and small in size. The chip is covered with unit circuits that generate pulsed current. Computer chips use these microcurrents to complete computer control operations. Because the work undertaken by computer chips is extremely large, they will generate a lot of heat when working due to the flow of current. If the chip is not cooled, it may cause the chip to overload with high temperature, making the chip unable to work normally. Existing computer chip cooling devices generally install air cooling or liquid cooling directly on the chip.

[0003] Patent document CN219842982U discloses a multi-layer heat dissipation structure for computer chips. When the chip is operating, a circulating water pump is activated, circulating water in the circulating water tank. The number of heat exchange plates can be adjusted based on the chip's load to avoid excessive heat dissipation performance and increased costs. To increase or decrease the number of heat exchange plates, simply turn the nut to disengage it from the heat pipe, remove the nut, and then add or remove the heat exchange plates. After the operation is complete, turn the nut back to tighten the heat exchange plates. When the device is operational, heat is conducted through the heat exchange plates and the heat pipe, achieving dual heat dissipation through the combined action of the heat exchange plates and the heat sink. Heat from the heat exchange plates is absorbed by the water in the connected pipe rack, achieving a cooling effect. When the chip stops operating, the circulating water pump is simply turned off. Because the heat exchange plates indirectly contact the chip through the heat sink, the area directly in contact with the chip for direct heat dissipation is small, which can lead to reduced thermal efficiency.

[0004] The patent document with publication number CN212781915U discloses a multiple heat dissipation structure of a computer chip, when in use, as the chip runs, heat is generated, and the generated heat is conducted through the third heat copper column arranged above it. During the conduction process, the contact area with the external air is expanded through the third aluminum fins, thereby increasing the heat dissipation efficiency of the third heat copper column. The second heat dissipation fan arranged above the third heat dissipation copper column can increase the flow speed of the air when the third aluminum fins contact the air, so that the air flow will carry away the heat during the heat dissipation of the third aluminum fins, thereby increasing the efficiency of metal thermal conductivity and heat dissipation. The second connecting fixing frame arranged above the second heat dissipation fan can provide support for the second heat dissipation fan when it is running, and the second heat dissipation fan is arranged to fit in the groove arranged at the bottom of the second aluminum fin so that the second heat dissipation fan can be connected to the second aluminum fins. The second heat dissipation copper column can be used to perform metal heat conduction and heat dissipation on the structure, and the second aluminum fins can be used to increase the second heat dissipation efficiency. And then the heat dissipation device is installed in the heat dissipation device, and the heat dissipation device is installed in the heat dissipation device, and the heat dissipation device is installed in the heat dissipation device, and the heat dissipation device is installed in the heat dissipation device. Similarly, in this structure, the first heat sink and the second heat sink are installed between the first heat sink, the second heat sink and the third heat sink. The area directly in contact with the computer chip and participating in direct heat dissipation is small, so it is easy to cause the problem of reduced thermal conductivity efficiency. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a multiple heat dissipation structure for computer chips with a large area directly involved in heat dissipation, high heat conduction efficiency and high heat dissipation efficiency.

[0006] In order to achieve the above purpose, the technical solution provided by the utility model is:

[0007] A multiple heat dissipation structure for a computer chip includes a shell, the upper end of the shell is open, an inner cavity is defined in the side walls of the shell, an outlet pipe and an inlet pipe are fixedly connected to the upper end of the shell, the outlet pipe and the inlet pipe are connected to the inner cavity, a plurality of slots are defined in the vertical direction of the side walls around the shell, the slots are inclined upward toward one end of the center of the shell, and the slots are not connected to the inner cavity, a plurality of fans are detachably fixedly connected in the vertical direction of the shell, fins are fixed on the upper and lower sides of the slots on the outside of the shell, and the angle between the fins and the horizontal plane is equal to the angle between the slots and the horizontal plane.

[0008] Specifically, mounting rods are rotatably mounted at the four corners of the lower end of the shell, one end of the mounting rod is rotatably connected to the shell, and a long slot is opened on the mounting rod, and the length direction of the long slot is parallel to the length direction of the mounting rod.

[0009] Specifically, the fan is fixedly installed in the bracket, two upper and lower adjacent brackets are detachably fixedly connected through an upper rod, and the lowermost bracket is detachably fixedly connected to the bottom plate of the shell through a lower rod.

[0010] Specifically, a boss is fixed to the lower end of the shell, and the boss is integrally formed with the shell.

[0011] Specifically, the lower end of the inlet pipe is communicated with the lower part of the inner cavity, and the lower end of the outlet pipe is communicated with the upper part of the inner cavity.

[0012] Specifically, the shell and the boss are both made of copper.

[0013] Specifically, the inlet pipe and the outlet pipe are connected to the circulation pump and the water tank.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. The shell and the boss are integrally formed, and the shell and the boss are directly involved in the heat dissipation of the computer chip, with good thermal conductivity. The surface area of ​​the shell is large, the heat dissipation area is large, and the heat dissipation efficiency of the computer chip can be improved.

[0016] 2. The coolant can flow in the inner cavity of the shell, which can further improve the heat dissipation efficiency of the computer chip.

[0017] 3. The fan is installed in the housing. This heat dissipation structure takes up little space. After the fan is started, the air outside the housing enters the housing through the slots and is then discharged from the upper end of the housing, which can further improve the heat dissipation efficiency of the computer chip.

[0018] 4. Fins are provided on the outside of the shell, which can increase the heat dissipation area and thus improve the heat dissipation efficiency of the shell.

[0019] 5. The slot hole is tilted upwards towards the center of the shell, and the angle between the fin and the horizontal plane is equal to the angle between the slot hole and the horizontal plane. When the fan is started, the air flow rate inside and outside the shell can be increased, which can improve the heat dissipation efficiency.

[0020] 6. The mounting rod can be rotated, and a long slot is provided on the mounting rod. When the housing is installed through the mounting rod, it can be adapted to mounting holes in different positions. The housing is easy to install and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the heat dissipation structure.

[0022] Figure 2 This is a top view of the heat dissipation structure.

[0023] Figure 3 for Figure 2 Middle AA section view.

[0024] The names of the parts in the accompanying drawings are: 1. Shell, 101. Inner cavity, 102. Boss, 2. Inlet pipe, 3. Outlet pipe, 4. Fin, 5. Slot, 6. Fan, 7. Bracket, 8. Lower rod, 9. Upper rod, 10. Mounting rod, 11. Long slot. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0026] Example 1: Reference Figure 1-Figure 3 As shown, a multi-layer heat dissipation structure for computer chips includes a housing 1 with an open top. An inner cavity 101 is defined within the sidewalls of the housing 1. An outlet pipe 3 and an inlet pipe 2 are fixedly connected to the upper end of the housing 1. The outlet pipe 3 and the inlet pipe 2 are in communication with the inner cavity 101. Specifically, the inlet pipe 2 and the outlet pipe 3 are in communication with a circulation pump and a water tank. The lower end of the inlet pipe 2 is in communication with the lower portion of the inner cavity 101, and the lower end of the outlet pipe 3 is in communication with the upper portion of the inner cavity 101.

[0027] A plurality of slots 5 are formed in the vertical direction on the side walls of the shell 1 . The slots 5 are tilted upwards at one end toward the center of the shell 1 . The slots 5 are not connected to the inner cavity 101 .

[0028] Multiple fans 6 are detachably fixedly connected in the vertical direction of the housing 1. Specifically, the fans 6 are fixedly installed in brackets 7, and two adjacent brackets 7 are detachably fixedly connected by upper rods 9, and the lowest bracket 7 is detachably fixedly connected to the bottom plate of the housing 1 by lower rods 8.

[0029] Fins 4 are fixed on both the upper and lower sides of the slot hole 5 on the outer side of the shell 1. The angle between the fin 4 and the horizontal plane is equal to the angle between the slot hole 5 and the horizontal plane.

[0030] A boss 102 is fixed to the lower end of the housing 1, and the boss 102 is integrally formed with the housing 1. Both the housing 1 and the boss 102 are made of copper.

[0031] After housing 1 is installed, boss 102 contacts the computer chip, and housing 1 and boss 102 directly contribute to the heat dissipation of the computer chip, providing excellent thermal conductivity. The large surface area of ​​housing 1 provides a large heat dissipation area, which can improve the heat dissipation efficiency of the computer chip. Thermally conductive silicone can be applied between boss 102 and the chip to further improve thermal conductivity.

[0032] After the circulation pump is started, the coolant can flow in the inner cavity 101 of the housing 1 , which can further improve the heat dissipation efficiency of the computer chip.

[0033] The fan 6 is installed in the housing 1. This heat dissipation structure occupies a small space. After the fan 6 is started, the air outside the housing 1 enters the housing 1 through the slot 5 and is then discharged from the upper end of the housing 1, which can further improve the heat dissipation efficiency of the computer chip.

[0034] Fins 4 are provided on the outside of the housing 1 , and the fins 4 can increase the heat dissipation area, thereby improving the heat dissipation efficiency of the housing 1 .

[0035] Since the angle between the fin 4 and the horizontal plane is equal to the angle between the slot 5 and the horizontal plane, the fan 6 can increase the flow rate of air inside and outside the housing 1 after it is started, thereby improving the heat dissipation efficiency.

[0036] Example 2: Based on Example 1, refer to Figure 1 As shown, mounting rods 10 are rotatably mounted at the four corners of the lower end of the shell 1 , one end of the mounting rod 10 is rotatably connected to the shell 1 , and a long slot 11 is provided on the mounting rod 10 , and the length direction of the long slot 11 is parallel to the length direction of the mounting rod 10 .

[0037] The mounting rod 10 is rotatable and has a long slot 11 thereon. When the housing 1 is mounted via the mounting rod 10 , the mounting holes at different positions can be adapted to the mounting holes. The housing 1 is easy to mount and has a wide range of applications.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multi-heat dissipation structure for a computer chip, comprising a housing (1), the upper end of the housing (1) being open, characterized in that: An inner cavity (101) is provided in the side wall of the shell (1); an outlet pipe (3) and an inlet pipe (2) are fixedly connected at the upper end of the shell (1); the outlet pipe (3) and the inlet pipe (2) are connected to the inner cavity (101); a plurality of slots (5) are provided in the vertical direction of the side walls around the shell (1); one end of the slot (5) is tilted upward toward the center of the shell (1); the slot (5) is not connected to the inner cavity (101); a plurality of fans (6) are detachably fixedly connected in the vertical direction of the shell (1); fins (4) are fixed to the upper and lower sides of the slot (5) outside the shell (1); and the angle between the fin (4) and the horizontal plane is equal to the angle between the slot (5) and the horizontal plane.

2. The multi-heat dissipation structure of a computer chip according to claim 1, characterized in that: The four corners of the lower end of the housing (1) are all rotatably mounted with mounting rods (10), one end of the mounting rod (10) is rotatably connected to the housing (1), and a long slot (11) is provided on the mounting rod (10), and the length direction of the long slot (11) is parallel to the length direction of the mounting rod (10).

3. The multi-heat dissipation structure for a computer chip according to claim 1, characterized in that: The fan (6) is fixedly installed in the bracket (7), and the two upper and lower adjacent brackets (7) are detachably fixedly connected via an upper rod (9), and the lowermost bracket (7) is detachably fixedly connected to the bottom plate of the housing (1) via a lower rod (8).

4. The multi-heat dissipation structure for a computer chip according to claim 1, characterized in that: A boss (102) is fixed to the lower end of the shell (1), and the boss (102) and the shell (1) are integrally formed.

5. The multi-heat dissipation structure for a computer chip according to claim 1, characterized in that: The lower end of the inlet pipe (2) is in communication with the lower part of the inner cavity (101), and the lower end of the outlet pipe (3) is in communication with the upper part of the inner cavity (101).

6. The multi-heat dissipation structure for a computer chip according to claim 4, characterized in that: The housing (1) and the boss (102) are both made of copper.

7. The multi-heat dissipation structure for a computer chip according to claim 1, characterized in that: The inlet pipe (2) and the outlet pipe (3) are in communication with a circulation pump and a water tank.

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