Film pasting assembly for packaging semiconductor chip substrate

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a film pasting assembly for packaging a semiconductor chip substrate, which comprises a support frame provided with a first mounting platform; the first reel is rotationally arranged on the supporting frame, the film pressing mechanism is provided with a film pressing channel capable of being opened and closed, and the width of the film pressing channel is not smaller than that of a film; the film cutting mechanism is located on one side of the film pressing channel, a film cutting knife is arranged on the film cutting mechanism and can do reciprocating linear movement in the width direction of the film, and a preset film cutting distance is formed between the film cutting knife and the film pressing mechanism in the film moving direction; the film pulling mechanism is provided with a film pasting clamping jaw capable of being opened and closed, and the film pasting clamping jaw can do reciprocating linear movement relative to the first mounting platform; and the film pasting platform is arranged on the first mounting platform, a plurality of film pasting adsorption holes are formed in the film pasting platform, and the film pasting adsorption holes are connected with a negative pressure mechanism and used for adsorbing and fixing the film. By the adoption of the structure, continuous laying of the thin film can be achieved, and the laying efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a film assembly used for semiconductor chip substrate packaging. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] In the packaging process of chip substrates, the transportation and lamination of resin are essential steps. Usually, in order to facilitate the separation of the resin tray and the film, the film is laid under the resin tray. During the laying process of the film, the film needs to be cut so that the resin tray and the laid film can be transported to the resin powder spreading process together. Since the film will be cut, how to ensure the continuous and automatic laying of the film without manual intervention and improve the efficiency of film laying is an urgent problem that people in this field need to solve. Utility Model Content

[0004] The utility model provides a fully automatic semiconductor substrate film laminating assembly, which solves the problem of how to achieve continuous laying of the film when the film is cut in the above technical background, thereby eliminating the need for manual intervention and improving the film laying efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A film assembly for semiconductor chip substrate packaging, comprising:

[0007] A support frame, wherein a first mounting platform is provided on the support frame;

[0008] a first reel, rotatably mounted on the support frame, wherein a film is mounted on the first reel;

[0009] A film pressing mechanism is provided on the first mounting platform, wherein the film pressing mechanism is provided with an openable and closable film pressing channel, and the film pressing channel is not less than the width of the film;

[0010] a film cutting mechanism, disposed on the first mounting platform and located on one side of the film pressing channel, wherein a film cutting knife is provided on the film cutting mechanism, and the film cutting knife can move back and forth linearly along the width direction of the film, wherein a preset film cutting distance is provided between the film cutting knife and the film pressing mechanism in the direction of movement of the film;

[0011] A film-pulling mechanism is provided on the first mounting platform, wherein the film-pulling mechanism is provided with an openable and closable film-applying clamping jaw, and the film-applying clamping jaw can move back and forth linearly relative to the first mounting platform;

[0012] The film sticking platform is arranged on the first mounting platform. A plurality of film sticking adsorption holes are provided on the film sticking platform, and the film sticking adsorption holes are connected to the negative pressure mechanism.

[0013] In some embodiments, the support frame is provided with a second platform, the second platform is provided with a second adjustment rail, the axial direction of the second adjustment rail is consistent with the moving direction of the film clamping jaw, the second adjustment rail is provided with a second adjustment slider, the second adjustment slider is provided with a second adjustment base, and the first reel is rotatably provided on the second adjustment base;

[0014] It also includes a first support roller rotatably arranged on the first mounting platform and a second support roller rotatably arranged on the second adjustment base, the first support roller and the second support roller are arranged in parallel and staggered, and the height of the first support roller is adapted to the height of the film pressing channel, and the film is wound around the first support roller and the second support roller to the film pressing channel.

[0015] In some embodiments, a first motor is provided on the second adjustment base, and an output end of the first motor is transmission-connected to the first reel.

[0016] In some embodiments, the film pressing mechanism includes a film pressing base, a lower film pressing block and an upper film pressing block, the film pressing base is arranged on the first mounting platform, the lower film pressing block is fixedly arranged on the film pressing base, and the upper film pressing block can be raised and lowered on the film pressing base to form the film pressing channel, wherein the upper film pressing block can abut against the lower film pressing block.

[0017] In some embodiments, it also includes a film pressing cylinder arranged on the film pressing base, and the free end of the film pressing cylinder is connected to the upper film pressing block, wherein two parallel film pressing guide shafts are also provided on the film pressing base, and the axis of the film pressing guide shaft is parallel to the moving path of the free end of the film pressing cylinder. The film pressing guide shaft is movably arranged on the film pressing base, and one end of the film pressing guide shaft is connected to the upper film pressing block.

[0018] In some embodiments, the film cutting mechanism further includes a first translation assembly, on which a first translation block is provided. The first translation block can move back and forth linearly along the width direction of the film, and the film cutting knife is provided on the first translation block.

[0019] In some embodiments, the first translation assembly includes a film cutting screw, a film cutting nut, a film cutting guide rail, a film cutting slider, and a film cutting motor. The film cutting screw is rotatably arranged on the film pressing base, the film cutting guide rail is arranged on the film pressing base and is relatively parallel to the film cutting screw, the film cutting nut is sleeved on the film cutting screw, the film cutting slider is arranged on the film cutting guide rail, the first translation block is connected to the film cutting nut and the film cutting slider, and the output end of the film cutting motor is connected to the film cutting screw.

[0020] In some embodiments, the film pulling mechanism also includes two parallel film supports and a film beam, the two film supports are arranged on the first mounting platform, the two ends of the film beam are movably arranged on the corresponding film supports and are arranged horizontally, the film beam can move back and forth linearly on the film support, and the film clamp is arranged on the film beam.

[0021] In some embodiments, the film pulling mechanism further includes a film sticking guide rail, a film sticking slider, a film sticking driving wheel, a film sticking driven wheel, and a film sticking synchronous belt, wherein the film sticking guide rail is correspondingly and parallelly arranged on the two film sticking brackets, the film sticking slider is arranged on the film sticking guide rail, and a portion of the film sticking crossbeam is connected to the corresponding film sticking slider, wherein the moving direction of the film sticking slider is parallel to the first mounting platform;

[0022] The film sticking driving wheel is rotatably set at one end of the two film sticking brackets, the film sticking driven wheel is set at the other end of the two film sticking brackets, the film sticking synchronous belt is wound around the film sticking driving wheel and the film sticking driven wheel, and the two ends of the film sticking beam are fixedly connected to the corresponding film sticking synchronous belts, wherein a film sticking shaft is set between the two film sticking driving wheels, the film sticking shaft is rotatably set on the film sticking bracket, and the two film sticking driving wheels are fixedly set on the film sticking shaft.

[0023] In some embodiments, the film clamping jaws include a main film clamping block, a secondary film clamping block and a film clamping cylinder, the film clamping cylinder is arranged on the film beam, the main film clamping block is arranged at the free end of the film clamping cylinder, the secondary film clamping block is arranged on the film beam, the main film clamping block and the secondary film clamping block can be opened and closed, and the clamping length of the main film clamping block and the secondary film clamping block is not less than the film width.

[0024] Compared with the prior art, the beneficial effects brought by the present invention are:

[0025] The present application fixes the film by setting up a film pressing mechanism, and at the same time sets a preset film cutting distance between the film cutting knife and the film pressing mechanism in the direction of film movement, so that the film leaves a preset length relative to the film pressing mechanism, which is convenient for the film clamping claws on the film pulling mechanism to clamp the film of preset length. At the same time, the film clamping claws can move back and forth in a straight line relative to the first mounting platform, driving the continuous pulling and laying of the film, combined with the multiple film adsorption holes set on the film sticking platform, so that the film is laid flat and stable.

[0026] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a first perspective view of a fully automatic semiconductor substrate lamination assembly according to the present invention;

[0028] Figure 2 This is a second perspective view of a fully automatic semiconductor substrate lamination assembly according to the present invention;

[0029] Figure 3 This is a first schematic diagram of the installation structure of the first reel of a fully automatic semiconductor substrate lamination assembly of the present invention;

[0030] Figure 4 This is a second schematic diagram of the installation structure of the first reel of a fully automatic semiconductor substrate lamination assembly of the present invention;

[0031] Figure 5 This is a third schematic diagram of the installation structure of the first reel of a fully automatic semiconductor substrate lamination assembly of the present invention;

[0032] Figure 6 This is a schematic diagram of a film laminating platform of a fully automatic semiconductor substrate film laminating assembly of the present invention in a film laminating position. DETAILED DESCRIPTION

[0033] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0034] like Figure 1 and Figure 2As shown, a film assembly for semiconductor chip substrate packaging provided by the present invention mainly includes a support frame 100, on which a first mounting platform 101 is provided, a first reel 6028 is rotatably provided on the support frame 100, a film is provided on the first reel 6028, a film pressing mechanism is provided on the first mounting platform 101, the film pressing mechanism is provided with an openable and closable film pressing channel, and the width of the film pressing channel is not less than the width of the film, and the film pressing mechanism is mainly used for fixing the film during cutting; a film cutting mechanism is provided on the first mounting platform 101 and is located on one side of the film pressing channel, and a film cutting knife 60215 is provided on the film cutting mechanism, and the film cutting knife 60215 can cut along the width of the film The film is cut by reciprocating linear movement. It should be noted that a preset film-cutting distance is provided between the film cutting knife 60215 and the film pressing mechanism in the film moving direction, so that after one round of film laying is completed, the film is cut, leaving the film extending relative to the film pressing mechanism by a preset length, which is convenient for the subsequent film pulling mechanism to clamp and carry out a new round of film laying, thereby realizing continuous film laying; the film pulling mechanism is arranged on the first mounting platform 101, and is provided with an openable and closable film clamping claw, which can perform reciprocating linear movement relative to the first mounting platform 101, and the film clamping claw is used to clamp the preset length of the aforementioned film and drive the film to move;

[0035] The film sticking platform 6029 is provided on the first mounting platform 101. The film sticking platform 6029 is provided with a plurality of film sticking adsorption holes for adsorbing and fixing the film on the film sticking platform. The film sticking adsorption holes are connected to a negative pressure mechanism to provide adsorption force. The negative pressure mechanism can be a vacuum pump, an air pump, etc. In this embodiment, the film sticking platform 6029 is movably provided on the first mounting platform 101 and is used to transport the resin tray with the film stuck on it to the next process, i.e., the resin powdering process, for laying the resin. Figure 6 As shown, the film is being laid. Figure 1 and Figure 2 The middle is the powder spreading position for resin laying.

[0036] Specifically, a rotating first moving screw and a fixed first moving guide rail are provided on the first mounting platform 101, and a first moving guide rail is provided below the first moving slider, and the line of the first moving guide rail is parallel to the axis of the first moving screw. In this embodiment, the first moving screw is provided directly above the first moving guide rail, and a first moving nut is provided on the first moving screw, and the first moving nut is fixedly connected to the first moving slider. A first moving motor 60291 is provided at one end of the first moving screw, and the first moving motor 60291 is provided on the first mounting platform 101. The output end of the first moving motor 60291 is power-connected to one end of the first moving screw, and the first moving nut is moved back and forth linearly along the first moving screw through the forward and reverse rotation of the first moving motor 60291.

[0037] Furthermore, if Figure 1 As shown, a first mounting block 60292 is provided on the first movable nut, a platform lifting cylinder 60293 is provided on the first mounting block 60292, a film laminating platform 6029 is provided at the free end of the platform lifting cylinder 60293, and a mounting position is provided on the film laminating platform 6029 for placing a resin tray;

[0038] In one embodiment, Figure 3 and Figure 4 As shown, a second platform 102 is provided on the support frame 100, a second adjustment guide rail 1022 is provided on the second platform 102, a second adjustment slider 1021 is provided on the second adjustment guide rail 1022, a second adjustment base 1023 is provided on the second adjustment slider 1021, and the first reel 6028 is rotatably provided on the second adjustment base 1023, wherein a first support roller 60281 is provided on the first mounting platform 101, and a second support roller 60282 is provided on the second adjustment base 1023, the first support roller 60281 and the second support roller 60282 are staggered and relatively parallel, the film is wound around the first support roller 60281 and the second support roller 60282 to the film pressing mechanism, the height of the first support roller 60281 is adapted to the height of the film pressing channel, in this embodiment, the film is a planar structure from the first support roller 60281 to the film pressing channel, that is, the lower end surface of the film pressing channel is tangent to the first support roller 60281. Through the above structure, the first reel 6028 is slidably arranged, so that the tension of the film can be adjusted; the tension of the film can also be adjusted by setting the first support roller 60281 and the second support roller 60282 as a movable structure.

[0039] In one embodiment, Figure 5 As shown, in order to further reduce the resistance during the film conveying process, a first motor 10231 is arranged on the second adjustment base 1023, and the output end of the first motor 10231 is connected to the first reel 6028. In this embodiment, specifically, a first driving wheel 10232 is arranged on the output shaft of the first motor 10231, and a first driven wheel 10234 is arranged on the first reel 6028. A first synchronous belt 10233 is wound around the first driving wheel 10232 and the first driven wheel 10234. The active rotation of the first reel 6028 is realized by the rotation of the first motor 10231, thereby reducing the tension during the film conveying process to prevent the film from being broken or torn.

[0040] Optionally, the output shaft of the first motor 10231 may be directly connected to the rotating shaft of the first reel 6028, or the synchronous belt and synchronous wheel assembly may be replaced by a gear assembly.

[0041] In one embodiment, reference is made to Figure 1 A film pressing mechanism is provided at one end close to the first reel 6028, and the film pressing mechanism includes a film pressing base 6024, a lower pressing module 60244 fixedly provided on the film pressing base 6024, and an upper film pressing block 60241 which can be raised and lowered relative to the film pressing base 6024. The opening and closing of the upper film pressing block and the lower film pressing block form a film pressing channel, and the film can be movably passed through the film pressing channel between the upper film pressing block 60241 and the lower pressing module 60244. When the upper film pressing block 60241 and the lower pressing module 60244 are abutted and closed, the film is fixed. The lifting and lowering of the upper film pressing block 60241 is controlled by the film pressing cylinder 60242. The upper film pressing block 60241 is arranged at the free end of the film pressing cylinder 60242. The film pressing cylinder 60242 is fixedly arranged on the film pressing base 6024. Two parallel film pressing guide shafts 60243 are also provided on the upper film pressing block 60241 to further provide stable support for the lifting and lowering movement of the upper film pressing block 60241. One end of the film pressing guide shaft 60243 is fixedly connected to the upper film pressing block 60241, and the other end thereof is movably passed through the film pressing base 6024. The installation direction of the film pressing guide shaft 60243 is consistent with the extension and retraction direction of the free end of the film pressing cylinder 60241.

[0042] In one embodiment, again referring to Figure 1 The film cutting mechanism also includes a first translation assembly, which is provided with a first translation block 602151. The first translation block 602151 can move back and forth in a straight line along the width direction of the film, thereby driving the film cutting knife 60215 set on the first translation block 602151 to move along the direction perpendicular to the film conveying to cut the film. Specifically, the first translation assembly includes a film cutting screw 60211 and a film cutting guide rail 60213, which are axially parallel to each other and are set on the film pressing base 6024. The film cutting screw 60211 and the film cutting guide rail 60213 are horizontally arranged relative to the first mounting platform 101. A film cutting nut 60212 is set on the film cutting screw 60211, and a film cutting slider 60214 is set on the film cutting guide rail 60213. The film cutting slider 60214 and the film cutting nut 60212 are connected by the first translation block 602151. A translation block is connected, the film cutting knife is arranged on the first translation block 602151, the film cutting motor 6021 is arranged on the first mounting platform 101, and the output end of the film cutting motor 6021 is power-connected to one end of the film cutting screw 60211. In this embodiment, power transmission is achieved by means of a synchronous wheel and a synchronous belt. Optionally, it can also be a gear meshing method, or the output shaft of the film cutting motor 6021 can be directly connected to the film cutting screw 60211 through a coupling.

[0043] Furthermore, a preset film cutting distance is set between the film cutting knife 60215 and the upper film pressing block 60241 in the direction of film movement, so that a preset length can be left after the film is cut, so that the film clamping block of the film beam 6026 can clamp the film for the next round of film laying.

[0044] In one embodiment, again referring to Figure 2 The film pulling mechanism includes two parallel film supports 6025 and a film beam 6026. The film supports 6025 are set at a certain distance from the first mounting platform 101. The film beam 6026 is slidably set on the two parallel film supports 6025, and the film beam is set horizontally. The film clamp is set on the film beam 6025, and the film beam 6026 moves on the two film supports 6025, thereby driving the film clamp to move back and forth.

[0045] Specifically, parallel film sticking rails 60251 are respectively provided on the two parallel film sticking brackets 6025, and the film sticking rails 60251 are horizontally provided. At least one film sticking slider 602511 is respectively provided on the two film sticking guide rails 60251, and the film sticking crossbeam 6026 is connected to the film sticking slider 602511, and the film sticking crossbeam 6026 is perpendicular to the two film sticking brackets 6025. A film sticking driving wheel 6022 and a film sticking driven wheel 6023 are provided at both ends of the film sticking bracket 6025, and are connected to the power by a film sticking synchronous belt 60221. Part of the film sticking crossbeam 6025 is fixed to the film sticking synchronous belt 60221. Furthermore, in order to avoid a large span of the film sticking crossbeam 6026, uneven power, and a stuck response during movement, the film sticking driving wheel 6022, the film sticking driven wheel 6023 and the film sticking The synchronous belt 60221 is simultaneously arranged on the two film-sticking brackets 6025, and a film-sticking shaft 6027 is arranged between the two film-sticking driving wheels 6022 for fixed connection. The film-sticking shaft 6027 is rotatably arranged on the film-sticking bracket 6025, and the two ends of the film-sticking beam 6026 are respectively connected to the two film-sticking synchronous belts 60221. In this embodiment, in order to facilitate the installation of the film-sticking motor 60272 and occupy less installation space, the film-sticking motor 60272 is arranged on the first installation platform 101, and a first driven transmission pulley 60271 is arranged on the film-sticking shaft 6027, and a first driving transmission pulley 60273 is arranged on the output shaft of the film-sticking motor 60272. The first driven synchronous pulley 60271 and the first driving transmission pulley 60273 are connected in power through the first transmission synchronous belt 60274. Optionally, in this embodiment, the film-sticking motor 60272 can also be directly connected to the film-sticking shaft through a coupling for power transmission, or the power transmission between the film-sticking motor 60272 and the film-sticking shaft 6027 can be performed through gear meshing.

[0046] Furthermore, in order to ensure the automation of film laminating, a film clamping claw is provided on the film laminating beam 6026, and the film clamping claw includes a film clamping cylinder 60261, a main film clamping block 60262 and an auxiliary film clamping block 60263. The fixed end of the film clamping cylinder 60261 is provided on the film laminating beam 6026, and the free end of the film clamping cylinder 60261 is connected to the main film clamping block 60262 to drive the main film clamping block 60262 to move up and down, thereby realizing the clamping and movement of the film with a preset length left at the film pressing mechanism. In this embodiment, the up and down lifting direction is the perpendicular direction to the first mounting platform 101; the clamping width of the main film block 60262 and the auxiliary film block 60263 is greater than the width of the film, so that the film can be completely clamped between the main film block 60262 and the auxiliary film block 60263. In this embodiment, the clamping part of the main film block 60262 is an L-shaped structure, so that the film with a preset length left by the film cutting knife 60215 can be clamped.

[0047] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A film assembly for semiconductor chip substrate packaging, characterized in that: include: A support frame, wherein a first mounting platform is provided on the support frame; a first reel, rotatably mounted on the support frame, wherein a film is mounted on the first reel; A film pressing mechanism is provided on the first mounting platform, wherein the film pressing mechanism is provided with an openable and closable film pressing channel, and the film pressing channel is not less than the width of the film; a film cutting mechanism, disposed on the first mounting platform and located on one side of the film pressing channel, wherein a film cutting knife is provided on the film cutting mechanism, and the film cutting knife can move back and forth linearly along the width direction of the film, wherein a preset film cutting distance is provided between the film cutting knife and the film pressing mechanism in the direction of movement of the film; A film-pulling mechanism is provided on the first mounting platform, wherein the film-pulling mechanism is provided with an openable and closable film-applying clamping jaw, and the film-applying clamping jaw can move back and forth linearly relative to the first mounting platform; The film sticking platform is arranged on the first mounting platform. A plurality of film sticking adsorption holes are provided on the film sticking platform, and the film sticking adsorption holes are connected to the negative pressure mechanism.

2. The film assembly for semiconductor chip substrate packaging according to claim 1, characterized in that: The support frame is provided with a second platform, the second platform is provided with a second adjustment rail, the axial direction of the second adjustment rail is consistent with the moving direction of the film clamping claw, the second adjustment rail is provided with a second adjustment slider, the second adjustment slider is provided with a second adjustment base, and the first reel is rotatably provided on the second adjustment base; It also includes a first support roller rotatably arranged on the first mounting platform and a second support roller rotatably arranged on the second adjustment base, the first support roller and the second support roller are arranged in parallel and staggered, and the height of the first support roller is adapted to the height of the film pressing channel, and the film is wound around the first support roller and the second support roller to the film pressing channel.

3. The film assembly for semiconductor chip substrate packaging according to claim 2, characterized in that: A first motor is provided on the second adjustment base, and an output end of the first motor is transmission-connected to the first reel.

4. The film assembly for semiconductor chip substrate packaging according to claim 1, characterized in that: The film pressing mechanism includes a film pressing base, a lower film pressing block and an upper film pressing block. The film pressing base is arranged on the first mounting platform, the lower film pressing block is fixedly arranged on the film pressing base, and the upper film pressing block can be raised and lowered on the film pressing base to form the film pressing channel, wherein the upper film pressing block can abut against the lower film pressing block.

5. The film assembly for semiconductor chip substrate packaging according to claim 4, characterized in that: It also includes a film pressing cylinder arranged on the film pressing base, and the free end of the film pressing cylinder is connected to the upper film pressing block, wherein two film pressing guide shafts parallel to each other are also provided on the film pressing base, and the axes of the film pressing guide shafts are parallel to the moving path of the free end of the film pressing cylinder. The film pressing guide shafts are movably passed through the film pressing base, and one end of the film pressing guide shafts is connected to the upper film pressing block.

6. The film assembly for semiconductor chip substrate packaging according to claim 5, characterized in that: The film cutting mechanism further includes a first translation assembly, on which a first translation block is provided. The first translation block can move back and forth linearly along the width direction of the film, and the film cutting knife is provided on the first translation block.

7. The film assembly for semiconductor chip substrate packaging according to claim 6, characterized in that: The first translation assembly includes a film cutting screw, a film cutting nut, a film cutting guide rail, a film cutting slider, and a film cutting motor. The film cutting screw is rotatably arranged on the film pressing base, the film cutting guide rail is arranged on the film pressing base and is relatively parallel to the film cutting screw, the film cutting nut is sleeved on the film cutting screw, the film cutting slider is arranged on the film cutting guide rail, the first translation block is connected to the film cutting nut and the film cutting slider, and the output end of the film cutting motor is connected to the film cutting screw.

8. The film assembly for semiconductor chip substrate packaging according to claim 1, characterized in that: The film pulling mechanism also includes two parallel film supports and a film beam. The two film supports are arranged on the first mounting platform. The two ends of the film beam are movably arranged on the corresponding film supports and are arranged horizontally. The film beam can move back and forth linearly on the film support. The film clamp is arranged on the film beam.

9. The film assembly for semiconductor chip substrate packaging according to claim 8, characterized in that: The film pulling mechanism further includes a film sticking guide rail, a film sticking slider, a film sticking driving wheel, a film sticking driven wheel, and a film sticking synchronous belt. The film sticking guide rail is correspondingly and parallelly arranged on the two film sticking brackets. The film sticking slider is arranged on the film sticking guide rail. Parts of the film sticking crossbeam are connected to the corresponding film sticking slider. The moving direction of the film sticking slider is parallel to the first mounting platform. The film sticking driving wheel is rotatably set at one end of the two film sticking brackets, the film sticking driven wheel is set at the other end of the two film sticking brackets, the film sticking synchronous belt is wound around the film sticking driving wheel and the film sticking driven wheel, and the two ends of the film sticking beam are fixedly connected to the corresponding film sticking synchronous belts, wherein a film sticking shaft is set between the two film sticking driving wheels, the film sticking shaft is rotatably set on the film sticking bracket, and the two film sticking driving wheels are fixedly set on the film sticking shaft.

10. The film assembly for semiconductor chip substrate packaging according to claim 8, characterized in that: The film clamping claw includes a main film clamping block, an auxiliary film clamping block and a film clamping cylinder. The film clamping cylinder is arranged on the film clamping beam, the main film clamping block is arranged at the free end of the film clamping cylinder, and the auxiliary film clamping block is arranged on the film clamping beam. The main film clamping block and the auxiliary film clamping block can be opened and closed, and the clamping length of the main film clamping block and the auxiliary film clamping block is not less than the width of the film.

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