Full-automatic semiconductor chip substrate transmission assembly

Abstract

The utility model belongs to the field of semiconductor packaging, and provides a full-automatic semiconductor chip substrate transmission assembly, which comprises a support frame provided with a first mounting platform; the feeding conveying mechanism is arranged on one side of the first mounting platform, the discharging conveying mechanism is arranged on the other side of the first mounting platform, and the carrying mechanism is arranged between the feeding conveying mechanism and the discharging conveying mechanism; the feeding conveying mechanism comprises a first conveying rail, a scanning mechanism and a first traction mechanism, the first conveying rail comprises a first side plate and a second side plate, first conveying grooves are formed in the first side plate and the second side plate, the distance between the first side plate and the second side plate is adjustable, and the scanning mechanism is arranged on the first conveying groove. By the adoption of the structure, the adaptability of the first conveying track is improved, and the conveying efficiency of the chip substrates is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, and in particular to a fully automatic semiconductor chip substrate transmission component. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] The detection and transmission of chip substrates are essential steps. The spacing between the loading tracks for traditional chip substrate transmission is fixed or manually adjusted. When performing peak packaging of chip substrates of different widths, the chip substrates of the same batch width are often packaged before the spacing between the loading tracks is adjusted. The spacing between the loading tracks cannot adapt to the transmission of chip substrates of various widths, so manual reinstallation and repositioning are required. Manual positioning has low accuracy, and the replacement operation is troublesome, which wastes a lot of installation and calibration time and reduces packaging efficiency. Utility Model Content

[0004] The utility model provides a fully automatic semiconductor chip substrate transmission component, which solves the problem in the above technical background that the loading track of traditional packaging equipment is fixed and cannot be adaptively adjusted to accommodate chip substrates of various widths, resulting in the need for manual repeated adjustment of the spacing of the loading track, low manual adjustment accuracy, and a long process time, which reduces packaging efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] a support frame, on which a first mounting platform is provided;

[0007] A loading conveying mechanism, a transporting mechanism and a unloading conveying mechanism are arranged on the first mounting platform of the support frame, wherein the loading conveying mechanism is arranged on one side of the first mounting platform, the unloading conveying mechanism is arranged on the other side of the first mounting platform, and the transporting mechanism is arranged between the loading conveying mechanism and the unloading conveying mechanism;

[0008] The loading and conveying mechanism includes a first conveying track with adjustable spacing, a scanning mechanism and a first traction mechanism, the first conveying track includes a first side plate and a second side plate, the first side plate and the second side plate are provided with a first conveying groove, the scanning mechanism is arranged at the loading end of the first conveying track to scan the chip substrate, the first traction mechanism is provided with a first traction clamp, the first traction clamp is arranged between the first side plate and the second side plate and the first traction clamp moves back and forth in a straight line along the length direction of the first conveying track.

[0009] In some embodiments, the first traction mechanism is provided with a first traction slider, the first traction slider is provided with a first traction bracket, the first traction clamp is provided at one end of the first traction bracket, and the first traction slider can move back and forth linearly along the first mounting platform.

[0010] In some embodiments, the first traction mechanism also includes a first traction motor, a first traction screw, a first traction nut and a limiting guide rail. The first traction motor is arranged on the first mounting platform, the first traction screw is rotatably arranged on the first mounting platform, the first traction nut is sleeved on the first traction screw, the limiting guide rail is arranged on the first mounting platform, the limiting guide rail is arranged parallel to the first traction screw, a part of the first traction nut is clipped and adapted to the limiting guide rail, and the first traction slider is arranged on the first traction nut.

[0011] In some embodiments, the first traction clamp includes a first traction fixed claw and a first traction movable claw, the upper end surface of the first traction fixed claw is coplanar with the lower end surface of the first conveying trough, and the first traction movable claw can move closer to or away from the first traction fixed claw.

[0012] In some embodiments, the transport mechanism includes a first transport assembly disposed near the loading conveyor mechanism, a second transport assembly disposed near the unloading conveyor mechanism, and a preset platform disposed between the first transport assembly and the second transport assembly, wherein the preset platform is provided with a chip substrate placement area;

[0013] The first transport assembly includes a first transport swing arm, a second transport swing arm, and a first transport clamp. The fixed end of the first transport swing arm is rotatably disposed on the first mounting platform, the fixed end of the second transport swing arm is rotatably disposed on the free end of the first transport swing arm, and the first transport clamp is liftably disposed on the free end of the second transport swing arm.

[0014] The second conveying assembly includes an X-axis conveying module provided with a first conveying slider, a Y-axis conveying module provided with a second conveying slider, a Z-axis conveying module and a second conveying clamp, the Y-axis conveying module is fixedly set on the first mounting platform, the X-axis conveying module is set on the second conveying slider of the Y-axis conveying module, the Z-axis conveying module is set on the first conveying slider of the X-axis conveying module, and the second conveying clamp is set on the Z-axis conveying module.

[0015] In some embodiments, the first carrying clamp and the second carrying clamp have the same structure, and the first carrying clamp includes a carrying base plate, two first rotating shafts that rotate relative to the carrying base plate and are symmetrically arranged, a plurality of first claws fixedly arranged on the first rotating shaft and distributed at intervals, two first connecting rods, a first rocker and a first driving member, the two first connecting rods are symmetrically arranged, the first connecting rod is fixedly connected to the first rotating shaft, and a first through groove is provided at the free end of at least one first connecting rod for movable connection between the two first connecting rods, the fixed end of the first rocker is connected to the first rotating shaft, and the free end of the first rocker is connected to the output end of the first driving member so that the first rocker drives the first rotating shaft to swing.

[0016] In some embodiments, the Z-axis transport module includes a Z-axis substrate, a Z-axis first slide and a Z-axis second slide, the Z-axis substrate is arranged on the first transport slide of the X-axis transport module, the Z-axis first slide is movably arranged on the Z-axis substrate, the Z-axis second slide is movably arranged on the Z-axis first slide, and the second transport clamp is arranged on the Z-axis second slide, wherein the moving directions of the Z-axis first slide and the Z-axis second slide are consistent.

[0017] In some embodiments, the Z-axis substrate is provided with a second lifting motor, a second lifting screw, a second lifting nut, a second lifting guide rail, and a second lifting slider. The second lifting screw and the second lifting guide rail are arranged in parallel, the second lifting nut is sleeved on the second lifting screw, the second lifting slider is arranged on the second lifting guide rail, the Z-axis first slide is arranged on the second lifting slider, and the second lifting nut is connected to the Z-axis first slide.

[0018] The first slide of the Z axis is provided with a third lifting guide rail, the third lifting guide rail is provided with a third lifting slider, and the second slide of the Z axis is provided on the third lifting slider;

[0019] Among them, third lifting synchronous wheels are set at both ends of the first Z-axis slide, and third lifting synchronous belts are sleeved on the two third lifting synchronous wheels. A first connecting block is set on the Z-axis substrate to be connected to the third lifting synchronous belt, and a second connecting block is set on the second Z-axis slide to be connected to the third lifting synchronous belt.

[0020] In some embodiments, a first clearance gap is provided on each of the first side panel and the second side panel, the first clearance gap is connected to the first conveying groove, a first substrate clamping clearance groove is provided at the first clearance gap, a first openable and closable pressure plate is provided at the first clearance gap, a second substrate clamping clearance groove is provided on the first pressure plate, the first substrate clamping clearance groove corresponds to the position of the second substrate clamping clearance groove, and corresponds to the number and position of the first claws.

[0021] In some embodiments, a counting detection mechanism is further included on the first mounting platform, wherein the counting detection mechanism is provided with a measuring instrument capable of reciprocating linear movement relative to the first mounting platform, and the measuring instrument is used to detect the number and volume of chips on the chip substrate, and the moving direction of the measuring instrument is consistent with the length direction of the chip substrate.

[0022] Compared with the prior art, the beneficial effects brought by the present invention are:

[0023] The present application realizes that the first conveying track of the loading and conveying mechanism is composed of a first side plate and a second side plate, wherein the spacing between the first side plate and the second side plate is adjustable without the need for manual adjustment. According to the width of the chip substrate, the spacing between the first side plate and the second side plate is adaptively adjusted to meet the transmission needs of chip substrates of different sizes and improve the transmission efficiency.

[0024] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a first perspective view of a fully automatic semiconductor chip substrate transfer assembly according to the present invention;

[0026] Figure 2 This is a structural diagram of the feeding port end of the feeding and conveying mechanism of the present invention;

[0027] Figure 3 This is a first perspective view of the feeding and conveying mechanism of the present invention;

[0028] Figure 4 for Figure 3 An enlarged view of the first side panel;

[0029] Figure 5 for Figure 4 Enlarged view of point D in the middle;

[0030] Figure 6 This is a second perspective view of the feeding and conveying mechanism of the present invention;

[0031] Figure 7It is a first perspective view of the first carrying clamping jaw of the carrying assembly of the present invention;

[0032] Figure 8 A second perspective view of the first carrying clamping jaw of the carrying assembly of the present invention;

[0033] Figure 9 This is a structural diagram of the first rocker of the first transport clamp of the present invention;

[0034] Figure 10 This is a structural diagram of the counting and detection mechanism of the present utility model;

[0035] Figure 11 This is a second perspective view of a fully automatic semiconductor chip substrate transfer assembly according to the present invention;

[0036] Figure 12 This is a schematic diagram of the three-dimensional structure of the second transport assembly of the present invention;

[0037] Figure 13 This is a first perspective view of the material feeding and conveying mechanism of the present invention;

[0038] Figure 14 This is a second perspective view of the material feeding and conveying mechanism of the present invention; DETAILED DESCRIPTION

[0039] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0040] In one embodiment, Figure 1 As shown, a fully automatic semiconductor chip substrate transmission assembly provided by the present invention mainly includes a support frame, on which a first mounting platform 101 is provided; a loading and conveying mechanism 301, a transport mechanism, and a unloading and conveying mechanism 304 are provided on the first mounting platform 101, wherein the loading and conveying mechanism 301 is provided on one side of the first mounting platform 101, the unloading and conveying mechanism 304 is provided on the other side of the first mounting platform 101, and the transport mechanism is provided between the loading and conveying mechanism 301 and the unloading and conveying mechanism 304;

[0041] like Figure 2-3As shown, the loading and conveying mechanism 301 includes a first conveying track, a scanning mechanism 3019 and a first traction mechanism. The spacing of the first conveying track is adjustable, and it includes a first side plate 3015 and a second side plate 3016. A horizontal first conveying trough 30161 is provided on the first side plate 3015 and the second side plate 3016. The scanning mechanism 3019 is provided above the loading end of the first conveying track to scan the chip substrate to extract the QR code information or barcode information on the chip substrate. The chip substrate that meets the process card will be sent to the next process. The unqualified products will be returned to the loading magazine 2010 by the first traction clamp, and the direction of the chip substrate will be read at the same time. After the identification is completed, the first traction clamp provided between the first side plate 3015 and the second side plate 3016 will clamp the scanned chip substrate and move it along the first conveying trough 30161 to a preset position. In this embodiment, as Figure 3 As shown, the first traction mechanism includes a first traction motor 3017, a first traction screw, a first traction nut, a first traction slider 3018 and a first traction bracket 3011. The first traction screw is rotatably arranged on the first mounting platform 101 through a bearing. The output end of the first traction motor 3017 is connected to one end of the first traction screw. The first traction nut is sleeved on the first traction screw through a threaded fit. The first traction slider 3018 is connected to the first traction nut and is clamped with the limiting guide rail. The installation direction of the limiting guide rail is consistent with the axis direction of the first traction screw and is parallel to each other. One end of the first traction bracket 3011 is fixedly set on the first traction slider 3 018, the first traction clamp is arranged at the other end of the first traction bracket 3011, the axial direction of the first traction screw is consistent with the direction of the first conveying groove 30161, the first traction clamp includes a fixed first traction claw 3014 and a first traction movable claw 3013, the first traction movable claw 3013 is controlled by the extension and contraction of the first clamping claw cylinder 3012, the upper end face of the first traction fixed claw 3014 is coplanar with the lower end face of the first conveying groove 30161, and the free end of the first clamping claw cylinder 3012 drives the first traction movable claw 3013 to move and control the distance between it and the first traction fixed claw 3014, thereby realizing the clamping and dragging of the chip substrate.

[0042] Specifically, refer to Figure 3 and Figure 6The first side panel 3015 is fixedly mounted on the first mounting platform 101, and the second side panel 3016 is arranged parallel to the first side panel 3015. At least two first adjustment shafts 30151 are arranged between the first side panel 3015 and the second side panel 3016. One end of the first adjustment shaft 30151 is fixed on the first side panel 3015, and a first adjustment guide sleeve 30162 is sleeved on the first adjustment shaft 30151. The first adjustment guide sleeve 30162 is fixedly connected to the second side panel 3016. The first adjustment shaft 30151 is arranged horizontally, so that the second side panel 3016 can be horizontally moved on the first adjustment shaft 30151 through the first adjustment guide sleeve 30162, thereby adjusting the distance between the first side panel 3015 and the second side panel 3016 to adapt to chip substrates of the same width. Furthermore, a first adjusting screw rod 30156 is provided between the two first adjusting shafts 3015, and a first adjusting nut 30153 is provided on the first adjusting screw rod 30156. The first adjusting nut 30153 is fixedly connected to the second side plate 3016. The axis of the first adjusting screw rod 30156 is parallel to the axis of the first adjusting shaft 30151. The first adjusting screw rod 30156 is rotatably arranged on the first mounting platform 101 through a bearing. The end of the first adjusting screw rod 30156 close to the first side plate 3015 is connected to the first spacing adjustment motor 30152. The first spacing adjustment motor 30152 drives the first adjusting screw rod 30156 to rotate forward and reverse, thereby realizing automatic adjustment of the spacing between the first side plate 3015 and the second side plate 3016.

[0043] Optionally, the adjustment mechanism of the first adjustment shaft 30151 and the first adjustment guide sleeve 30162 can also be replaced by a slider guide rail structure, for example, the slider is set on the second side plate 3016, and the guide rail is set on the first mounting platform 101, thereby realizing the horizontal sliding guide setting of the second side plate 3016.

[0044] Further, if Figure 4 and Figure 5As shown, a first clearance gap 30154 is also provided on the first side plate 3015 and the second side plate 3016. The first clearance gap 30154 extends to and is connected to the first conveying groove 30161. The length of the first clearance gap 30154 is not less than the length of the chip substrate. It is mainly used to move the chip substrate away from the first conveying groove 30161. A first pressing plate 30153 is set at the first clearance gap 30154, and the length of the first pressing plate 30153 matches the length of the first clearance gap 30154. A second substrate clamping clearance groove 301531 is set on the first pressing plate, corresponding to the position of the first substrate clamping clearance groove 30155. The first pressing plate 30153 is rotated on the first side plate 3015 and the second side plate 3016 by a flip shaft. When the first pressing plate 30153 is in a pressed state, the first pressing plate 30153 and the lower end surface of the first conveying groove 30161 form the first conveying groove 30161, thereby preventing the chip substrate from warping during the traction process. When the first pressing plate 30153 is opened, the first conveying assembly 302 can clamp the chip substrate through the first clearance gap 30154. In this embodiment, the flipping of the first pressure plate 30153 is controlled by the flipping push rod cylinder 30163, the free end of the flipping push rod cylinder 30163 is connected to the first pressure plate 30153, and the pressing and opening of the first pressure plate 30153 are controlled by the extension and contraction of the free end of the flipping push rod cylinder 30163.

[0045] In one embodiment, Figure 1 、 Figure 6 、 Figure 11 as well as Figure 13 As shown, the conveying mechanism includes a first conveying component 302, a second conveying component 303 and a preset platform 305. The first conveying component 302 is arranged near the side of the loading conveying mechanism 301, and is used to convey the chip substrate on the first conveying slot 30161 for chip quantity detection and chip volume measurement. After the detection is completed, the chip substrate is placed on the preset platform 305 and waits for the second conveying mechanism 303 to transport it. The second conveying component 303 is arranged near the unloading conveying mechanism 304, and is used to transport the chip substrate after detection on the preset platform 305 to the next process. The preset platform 305 is placed between the two for temporary placement of the chip substrate after detection.

[0046] Specifically, if Figure 6As shown, the first transport assembly 302 includes a first transport swing arm 3021, a second transport swing arm 3022, and a first transport clamp 3023. The fixed end of the first transport swing arm 3021 is rotatably mounted on the first mounting platform 101, the fixed end of the first transport swing arm 3021 is rotatably mounted on the free end of the first transport swing arm 3021, and the first transport clamp 3023 is rotatably mounted on the free end of the second transport swing arm 3022. In this embodiment, the swinging of the first transport swing arm 3021 and the swinging of the second transport swing arm 3022 are both achieved by the rotation of the output shaft of the motor. Similarly, the swinging of the first transport clamp 3023 is also achieved by the rotation of the output shaft of the motor. In this embodiment, the first transport swing arm 3021 and the second transport swing arm 3022 both swing in a plane, and the plane in which their swing trajectories lie is parallel to the first mounting platform 101.

[0047] Specifically, if Figure 7-9 As shown, the first transport clamp 3023 includes a transport base plate 30231, two first rotating shafts 30233, a plurality of first claws 30236 spaced apart on the first rotating shaft 30235, two first connecting rods 30234, a first rocker 30233 and a first driving member 30232. The transport base plate 30231 is rotatably arranged relative to the second transport swing arm 3022. The two first rotating shafts 30235 are rotatably arranged on the transport base plate 30231 through a hole-axis structure and are symmetrically arranged relative to the transport base plate 30231. The first connecting rod 30234 is provided on each of the two first rotating shafts 30235. The first rotating shafts 30235 are movably connected through the two first connecting rods 30234, that is, the connection points of the two first connecting rods 30234 can move relative to each other. At the same time, when the first claw 30236 is tightened or opened, a preset angle is provided between the two first connecting rods 30234. In order to enable the two first connecting rods to swing, at least one of the first connecting rods 30234 is provided with a first U-shaped groove 302332 to compensate for the relative movement at the connection points of the two first connecting rods 30234, so that the two first connecting rods 30234 can rotate around their corresponding first rotating shafts 30235 to avoid rotational interference. One end of the first rocker 30233 is connected to one of the first rotating shafts 30235, and the free end of the first driving member is movably connected to the other end of the first rocker 30233. In this embodiment, the first driving member is preferably a cylinder. Since the cylinder is more sensitive, the free end of the cylinder push rod is movably connected to the other end of the first rocker 30233, that is, a second U-shaped groove 302331 is provided on the first rocker 30233. The cylinder push rod is extended and retracted to drive the first rocker 30233 to swing, thereby realizing the rotation of the first rotating shaft 30235 and driving the first claw 30236 to open and close. Correspondingly, as Figure 4-5 as well as Figure 7As shown, a plurality of first substrate clamping and making way grooves 30155 are provided at the first making way notches of the first side plate and the second side plate, the number and position of which correspond to the number and position of the plurality of first claws 30236, so that the plurality of first claws 30236 can enter the position below the chip substrate and lift the chip substrate.

[0048] Furthermore, a first limiting plate 30237 is provided under the conveying substrate 30231. The size of the first limiting plate 30237 matches the length and width of the chip substrate. When the chip substrate is clamped by the first claw 30236, the first claw 30236 is limited so that the chip substrate is only subjected to the lifting force of the first claw, thereby preventing the chip substrate from being clamped and damaged during transportation.

[0049] In this embodiment, Figure 9 As shown, the first rocker arm 30233 and one of the first connecting rods 30234 are integrally arranged.

[0050] Furthermore, the second conveying assembly 303 includes an X-axis conveying module 3031 provided with a first conveying slider, a Y-axis conveying module 3032 provided with a second conveying slider 30323, a Z-axis conveying module 3033 and a second conveying clamp 30340, the Y-axis conveying module 3032 is fixedly set on the first mounting platform 101, the X-axis conveying module 3031 is set on the second conveying slider 30323 of the Y-axis conveying module 3032, the Z-axis conveying module 3033 is set on the first conveying slider 30314 of the X-axis conveying module 3031, and the second conveying clamp 30340 is set on the Z-axis conveying module 3033.

[0051] Specifically, if Figure 12As shown, the Y-axis transport module 3032 includes two first crossbeam supports 30322 arranged in parallel and at intervals. The upper end of the crossbeam support 30322 is provided with a first spacing from the first mounting platform 101 so that the second transport clamp 30340 can be lifted and lowered on the Z-axis transport module 3033. A second transport slider 30323 that can move back and forth is provided on the crossbeam support 30322. In this embodiment, there are two second transport sliders 30323, which are driven in forward and reverse directions by two second transport motors 30321. The two second transport sliders 30323 achieve reciprocating movement through a screw nut structure of the same structure. The X-axis transport module 303 A second crossbeam support 30314 is provided, with both ends of the second crossbeam support 30314 respectively fixedly connected to two second transport sliders 30323. The second crossbeam support 30314 is arranged perpendicularly relative to the first crossbeam support 30322. In this embodiment, only one second transport motor 30321 can be used to drive one set of screw nut structures to drive the reciprocating movement of the second transport slider 30323. The other second transport slider 30323 is connected via a guide rail slider structure or a guide sleeve guide shaft structure, which can also realize the reciprocating movement of the X-axis transport module 3031 along the first crossbeam support 30322 of the Y-axis transport module 3032.

[0052] Furthermore, the driving structure of the X-axis transport module 3031 is the same as the structure on the single first crossbeam support 30322 of the Y-axis transport module 3032, and will not be described in detail here. To ensure the stability of the Z-axis transport module 3033, a second guide rail 30312 and a second slider 30313 are provided on the second crossbeam support 30314 of the X-axis transport module 3031. The second slider 30313 is slidably provided on the second guide rail 30312. The axial direction of the second guide rail 30312 is parallel to the moving direction of the first transport slider. A second connecting plate 30314 is provided between the second slider 30313 and the first transport slider for connection. The Z-axis transport module is provided on the second connecting plate 30314, thereby making the Z-axis transport module 3033 more stable when moving.

[0053] The Z-axis transport module 3033 includes a Z-axis substrate 30334, a Z-axis first slide 30336 that is raised and lowered relative to the Z-axis substrate 30334, a Z-axis second slide 30338 that is raised and lowered relative to the Z-axis first slide 30336, and a second transport clamp 30340 is set on the Z-axis second slide 30338. In this example, the lifting and lowering movement direction is simultaneously perpendicular to the movement direction of the first transport slider of the X-axis transport module 3031 and the movement direction of the second transport slider 30323 of the Y-axis transport module 3032.

[0054] Specifically, if Figure 12As shown, a second lifting motor 30331, a second lifting screw rod 30332, a second lifting nut 30333, a second lifting guide rail 30335 and a second lifting slider are set on the Z-axis substrate 30334. The second lifting screw rod 30332 is set vertically, the second lifting guide rail 30335 is set parallel to the second lifting screw rod 23033, and the second lifting slider is slidably set on the second lifting guide rail 30335. The output end of the second lifting motor 30331 is connected to one end of the second lifting screw rod 30332, and the second lifting screw rod 30332 is rotatably set on the Z-axis substrate 30334 through a bearing. The second lifting nut 30333 is threadedly fitted on the second lifting screw rod 30332. The Z-axis first slide 30336 is connected to the first lifting slider and fixedly connected to the first lifting nut 30333. The first lifting nut 30333 moves relative to the first lifting screw rod 30332, driving the Z-axis first slide 30334 to be raised and lowered.

[0055] Further, if Figure 12As shown, a third lifting guide rail 30337 is provided on the first Z-axis slide 30334, and a third lifting slider is provided on the third lifting guide rail 30337, wherein the axial direction of the third lifting guide rail 30337 is parallel to the axial direction of the second lifting guide rail 30335, and a Z-axis second slide 30338 is provided on the third upper lifting slider, and the second carrying clamp 30340 is arranged on the Z-axis second slide 30338. In order to reduce the driving device, two third lifting synchronous wheels are set on the first Z-axis skateboard 30334, and the positions of the two third lifting synchronous wheels correspond to the two end positions of the third lifting guide rail 30337. A third lifting synchronous belt 303362 is wound between the two third lifting synchronous wheels. The third lifting synchronous belt 303362 is arranged parallel to the first Z-axis skateboard 30334 and parallel to the axis of the third lifting guide rail 30337. The second Z-axis skateboard 30338 is fixedly connected to the third lifting synchronous belt 303362 on the side close to the first Z-axis skateboard 30336 through the second connecting block 303381. A fixed first connecting block 303341 is set on the Z-axis substrate 30334 and is fixedly connected to the third lifting synchronous belt 303362 on the side away from the first Z-axis skateboard 30336. The specific process is as follows: when the second lifting nut 30333 descends along the second lifting screw rod 30332, it drives the Z-axis first slide 30336 to move downward. Since the third lifting synchronous belt 303362 is fixedly connected to the Z-axis base plate 30334 through the first connecting block 303341, the distance between the third lifting synchronous wheel located at the upper end of the Z-axis first slide 30336 and the first connecting block 303341 is reduced, and the distance between the second connecting block 303381 located on the Z-axis second slide 30336 and the first connecting block 303341 increases, that is, the Z-axis second slide 30338 descends along the third lifting guide rail 30337, thereby causing the second carrying clamp 30340 to descend to grab the chip substrate. Conversely, the second lifting nut 30333 ascends along the second lifting screw rod 30332, driving the Z-axis first slide 30336 and the Z-axis second slide 30338 to ascend, lifting the second carrying clamp 30340.

[0056] In order to avoid the problem of insufficient lifting stroke of the second handling clamp 30340, as Figure 12 As shown, a third lifting cylinder 30339 is also provided on the second slide 30336 of the Z axis. The extension and retraction direction of the free end of the third lifting cylinder 30339 is consistent with the moving direction of the second slide 30338 of the Z axis, and the second carrying clamp 30340 is arranged at the free end of the third lifting cylinder 30339.

[0057] In this embodiment, the pre-positioning platform 305 is provided with two substrate mounting positions, each with a corresponding third clearance groove 3051. The third clearance groove 3051 corresponds to the first claw 30236 of the first and second transport clamps 3023 and 30340. Accordingly, there are also two third lifting cylinders 30339 and two second transport clamps 30340. The structure of the second transport clamp 30340 is identical to that of the first transport clamp 3023, as previously described, and will not be further elaborated upon here.

[0058] In one embodiment, a counting detection mechanism is further included on the first mounting platform 101. The counting detection mechanism 306 includes a measuring instrument 3064. The measuring instrument 3064 can move back and forth linearly relative to the first mounting platform 101. The measuring instrument 3064 is mainly used to detect the number of chips and the chip volume on the chip substrate, thereby feeding back the measured data to the resin providing mechanism, so that the resin providing mechanism can release and lay the resin in a quantitative manner.

[0059] Specifically, if Figure 10 As shown, the counting detection mechanism 306 is arranged below the first mounting platform 101, and a detection slot 1011 is arranged on the first mounting platform 101. The detection slot 1011 is larger than the size of the chip substrate so that the chip substrate is completely exposed. The counting detection mechanism 306 also includes a first detection motor 3061, a first detection screw rod arranged at the output end of the first detection motor 3061, the first detection screw rod is located on one side of the detection slot 1011, a first detection nut 3062 arranged on the first detection screw rod, a first detection guide rail 3065 arranged on the other side of the detection slot, a first detection slider 3066 arranged on the first detection guide rail, the axis of the first detection guide rail 3065 is parallel to the axis of the first detection screw rod, a first detection bracket 3063 corresponding to the position of the detection slot 1011, and a measuring instrument 306. The first detection bracket 3063 is provided with one end thereof, connected to the first detection slider 3066, and the other end thereof is connected to the first detection nut 3062. The first detection motor 3061 drives the first detection nut 3062 to move back and forth linearly, thereby driving the first detection bracket 3063 and the measuring instrument 3064 provided on the first detection bracket 3063 to move back and forth linearly along the length direction of the detection notch 1011, thereby completing the detection of the number of chips on the chip substrate and the measurement of the chip volume.

[0060] In one embodiment, Figure 13 、 Figure 14As shown, the unloading conveyor mechanism shares the same principle as the loading conveyor mechanism. The unloading conveyor mechanism is primarily used to transfer packaged chip substrates to the magazine 2010. Compared to the loading conveyor mechanism, the unloading conveyor mechanism's first unloading pusher can be raised and lowered, and a thickness sensor assembly is also provided on the unloading conveyor mechanism to detect the thickness of the packaged chip substrates.

[0061] Specifically, a material unloading transmission mechanism 304 is provided with a material unloading pushing assembly, which includes a first material unloading motor 3041, a first material unloading active pulley 3042, a first material unloading synchronous belt 30421, a first material unloading driven pulley, a first material unloading guide rail 3043, a first material unloading slider 30431, a first material unloading cylinder 30432, and a first material unloading pushing block 30433. The first material unloading motor 3041 is fixedly arranged on a side plate of the material unloading transmission mechanism 304, the first material unloading active pulley 3042 is arranged on the output shaft of the first material unloading motor 3041, the first material unloading driven pulley is rotatably arranged on the aforementioned side plate, the first material unloading synchronous belt 30421 is wound around the first material unloading active pulley 3042 and the first material unloading driven pulley, and the first material unloading slider 30431 is arranged on the first On the unloading guide rail 3043, the first unloading guide rail 3043 is arranged on the aforementioned side plate, the first unloading guide rail 3043 is arranged parallel to the first unloading synchronous belt 30421, the first unloading slider 30431 is connected to the first unloading synchronous belt 30421, the first unloading cylinder 30432 is fixedly set on the first unloading slider 30431, and the first unloading push block 30433 is set at the free end of the first unloading cylinder 30432. The width of the first unloading push block 30433 is smaller than the width of the magazine 2010, and its thickness is slightly larger than the thickness of the chip substrate, so that only one chip substrate can be pushed at a time. The first unloading cylinder 30432 is lifted and lowered, which can drive the first unloading push block 30433 to lift and lower to make way for the packaged chip substrate.

[0062] Optionally, the transmission components of the first unloading active pulley 3042, the first unloading synchronous belt 30421 and the first unloading driven pulley can be replaced by a screw slider assembly, or a push rod cylinder can be used to directly push the first unloading push block.

[0063] Furthermore, the thickness sensing assembly includes a second detection bracket 30471 and a thickness sensor 30472. The thickness sensor 30472 is fixedly mounted on the second detection bracket 30471. The second detection bracket 30471 enables the thickness sensor 30472 to be positioned directly above the track of the unloading conveyor mechanism 304, thereby facilitating detection of chip substrates on the track of the unloading conveyor mechanism 304. The transmission mechanism of the thickness sensing assembly is similar to the structural principle of the unloading and pushing assembly, and will not be further described here. This mechanism drives the second detection bracket 30471 and the thickness sensor 30472 to move linearly, thereby fully detecting the thickness of the packaged chip substrates.

[0064] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A fully automatic semiconductor chip substrate transfer assembly, characterized in that: include: a support frame, on which a first mounting platform is provided; A loading conveying mechanism, a transporting mechanism and a unloading conveying mechanism are arranged on the first mounting platform of the support frame, wherein the loading conveying mechanism is arranged on one side of the first mounting platform, the unloading conveying mechanism is arranged on the other side of the first mounting platform, and the transporting mechanism is arranged between the loading conveying mechanism and the unloading conveying mechanism; The loading and conveying mechanism includes a first conveying track with adjustable spacing, a scanning mechanism and a first traction mechanism, the first conveying track includes a first side plate and a second side plate, the first side plate and the second side plate are provided with a first conveying groove, the scanning mechanism is arranged at the loading end of the first conveying track to scan the chip substrate, the first traction mechanism is provided with a first traction clamp, the first traction clamp is arranged between the first side plate and the second side plate and the first traction clamp moves back and forth in a straight line along the length direction of the first conveying track.

2. The fully automatic semiconductor chip substrate transfer assembly according to claim 1, characterized in that: The first traction mechanism is provided with a first traction slider, the first traction slider is provided with a first traction bracket, the first traction clamp is provided at one end of the first traction bracket, and the first traction slider can move back and forth linearly along the first mounting platform.

3. The fully automatic semiconductor chip substrate transfer assembly according to claim 2, characterized in that: The first traction mechanism also includes a first traction motor, a first traction screw, a first traction nut and a limiting guide rail. The first traction motor is arranged on the first mounting platform, the first traction screw is rotatably arranged on the first mounting platform, the first traction nut is sleeved on the first traction screw, and the limiting guide rail is arranged on the first mounting platform. The limiting guide rail is arranged parallel to the first traction screw, a part of the first traction nut is clamped and adapted to the limiting guide rail, and the first traction slider is arranged on the first traction nut.

4. The fully automatic semiconductor chip substrate transfer assembly according to claim 1, characterized in that: The first traction clamp includes a first traction fixed claw and a first traction movable claw. The upper end surface of the first traction fixed claw is coplanar with the lower end surface of the first conveying trough. The first traction movable claw can move closer to or farther away from the first traction fixed claw.

5. The fully automatic semiconductor chip substrate transfer assembly according to claim 1, characterized in that: The transport mechanism includes a first transport component arranged near the loading conveyor mechanism, a second transport component arranged near the unloading conveyor mechanism, and a preset platform arranged between the first transport component and the second transport component, wherein the preset platform is provided with a chip substrate placement area; The first transport assembly includes a first transport swing arm, a second transport swing arm, and a first transport clamp. The fixed end of the first transport swing arm is rotatably disposed on the first mounting platform, the fixed end of the second transport swing arm is rotatably disposed on the free end of the first transport swing arm, and the first transport clamp is liftably disposed on the free end of the second transport swing arm. The second conveying assembly includes an X-axis conveying module provided with a first conveying slider, a Y-axis conveying module provided with a second conveying slider, a Z-axis conveying module and a second conveying clamp, the Y-axis conveying module is fixedly set on the first mounting platform, the X-axis conveying module is set on the second conveying slider of the Y-axis conveying module, the Z-axis conveying module is set on the first conveying slider of the X-axis conveying module, and the second conveying clamp is set on the Z-axis conveying module.

6. The fully automatic semiconductor chip substrate transfer assembly according to claim 5, characterized in that: The first carrying clamp and the second carrying clamp have the same structure, and the first carrying clamp includes a carrying base, two first rotating shafts that rotate relative to the carrying base and are symmetrically arranged, a plurality of first claws fixedly arranged on the first rotating shaft and distributed at intervals, two first connecting rods, a first rocker and a first driving member, the two first connecting rods are symmetrically arranged, the first connecting rod is fixedly connected to the first rotating shaft, and a first through groove is provided at the free end of at least one first connecting rod for movably connecting the two first connecting rods, the fixed end of the first rocker is connected to the first rotating shaft, and the free end of the first rocker is connected to the output end of the first driving member so that the first rocker drives the first rotating shaft to swing.

7. The fully automatic semiconductor chip substrate transfer assembly according to claim 5, characterized in that: The Z-axis transport module includes a Z-axis substrate, a first Z-axis slide and a second Z-axis slide. The Z-axis substrate is arranged on the first transport slider of the X-axis transport module. The first Z-axis slide is movably arranged on the Z-axis substrate. The second Z-axis slide is movably arranged on the first Z-axis slide. The second transport clamp is arranged on the second Z-axis slide, wherein the moving directions of the first Z-axis slide and the second Z-axis slide are consistent.

8. The fully automatic semiconductor chip substrate transfer assembly according to claim 7, characterized in that: The Z-axis base plate is provided with a second lifting motor, a second lifting screw, a second lifting nut, a second lifting guide rail, and a second lifting slider. The second lifting screw and the second lifting guide rail are arranged in parallel. The second lifting nut is sleeved on the second lifting screw. The second lifting slider is arranged on the second lifting guide rail. The Z-axis first slide is arranged on the second lifting slider. The second lifting nut is connected to the Z-axis first slide. The first slide of the Z axis is provided with a third lifting guide rail, the third lifting guide rail is provided with a third lifting slider, and the second slide of the Z axis is provided on the third lifting slider; Among them, third lifting synchronous wheels are set at both ends of the first Z-axis slide, and third lifting synchronous belts are sleeved on the two third lifting synchronous wheels. A first connecting block is set on the Z-axis substrate to be connected to the third lifting synchronous belt, and a second connecting block is set on the second Z-axis slide to be connected to the third lifting synchronous belt.

9. The fully automatic semiconductor chip substrate transfer assembly according to claim 6, characterized in that: A first clearance gap is provided on each of the first side panel and the second side panel, the first clearance gap is connected to the first conveying groove, a first substrate clamping clearance groove is provided at the first clearance gap, a first openable and closable pressing plate is provided at the first clearance gap, a second substrate clamping clearance groove is provided on the first pressing plate, the first substrate clamping clearance groove corresponds to the position of the second substrate clamping clearance groove, and corresponds to the number and position of the first claws.

10. A fully automatic semiconductor chip substrate transfer assembly according to any one of claims 1 to 9, characterized in that: It also includes a counting and detection mechanism arranged on the first mounting platform, and the counting and detection mechanism is provided with a measuring instrument that can move back and forth linearly relative to the first mounting platform. The measuring instrument is used to detect the number and volume of chips on the chip substrate, and the moving direction of the measuring instrument is consistent with the length direction of the chip substrate.

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