RTA machine annealing slide glass jig

Abstract

The utility model provides an RTA machine table annealing slide glass jig, which comprises a bearing disc, a plurality of slide glass grooves are arranged on the bearing disc, the slide glass grooves are used for bearing wafers to be annealed, each slide glass groove comprises an annular upper slide glass table and a circular lower slide glass table, the lower slide glass table is arranged in the annular shape of the upper slide glass table and is coaxial with the upper slide glass table, and the upper slide glass table and the lower slide glass table are arranged on the bearing disc. The inner diameter of the upper slide holder is the same as the diameter of the lower slide holder, the groove depth of the lower slide holder is larger than that of the upper slide holder, a plurality of stand columns are arranged in the lower slide holder, the height of the stand columns is the same as the difference between the groove depth of the lower slide holder and the groove depth of the upper slide holder, the edge of a wafer is arranged on the upper slide holder, and the middle of the wafer is arranged on the stand columns. The upper slide holder and the plurality of vertical columns are used for supporting a wafer, an arc-shaped wafer taking groove is formed in the upper slide holder, and the bottom of the wafer taking groove is flush with the bottom of the lower slide holder. According to the RTA machine annealing slide glass jig provided by the utility model, friction scratches on the surface of a wafer are effectively reduced, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, in particular to an RTA machine annealing wafer fixture. Background Art

[0002] A wafer refers to a chip used to make semiconductor circuits. The LED chip preparation process mainly uses a wafer as a substrate, and then goes through multiple processes such as thin film deposition, etching, and cleaning on the wafer substrate in sequence and repeats these processes many times to make the wafer substrate into a chip that meets the requirements.

[0003] Wafer RTA (Rapid Thermal Annealing) annealing is an important step in chip preparation using wafers as substrates. The core of RTA technology is rapid heating and cooling, which can help materials reach higher temperatures while quickly cooling them down, thereby optimizing semiconductor material and device performance. Wafer annealing is mainly performed in RTA machines and mainly includes front annealing and back annealing.

[0004] The wafers undergoing annealing are relatively thin. During the annealing process, the wafer is in contact with the entire surface of the wafer stage, and the upper and lower surfaces of the wafer will rub against the wafer stage. When the operator loads and unloads the wafer, the wafer source will also be in contact with the entire surface of the wafer stage, causing friction, which can easily cause scratches on the wafer source. In addition, since the annealed wafers are relatively thin, broken wafers may be generated during the annealing process. The broken wafers are difficult to remove, wasting a lot of the operator's time. Utility Model Content

[0005] Based on this, the purpose of the present invention is to provide an RTA machine annealing wafer fixture to solve the technical problems existing in the prior art.

[0006] The utility model provides an RTA machine annealing wafer carrier fixture, comprising a carrier plate, wherein the carrier plate is provided with a plurality of carrier grooves, the carrier grooves are used to carry wafers to be annealed, the carrier grooves include an annular upper wafer loading platform and a circular unloading wafer platform, the unloading wafer platform is arranged in the annular area of ​​the upper wafer loading platform and is coaxial with the upper wafer loading platform, the inner diameter of the upper wafer loading platform is the same as the diameter of the unloading wafer platform, the groove depth of the unloading wafer platform is greater than the groove depth of the upper wafer loading platform, a plurality of columns are provided in the unloading wafer platform, the height of the columns is the same as the difference in groove depth between the unloading wafer platform and the upper wafer loading platform, the edge of the wafer is placed on the upper wafer loading platform, the middle part of the wafer is placed on the plurality of columns, the upper wafer loading platform and the plurality of columns are used to support the wafer, the upper wafer loading platform is provided with an arc-shaped wafer taking groove, the bottom of the wafer taking groove is flush with the bottom of the unloading wafer platform.

[0007] Preferably, the supporting plate is a square supporting plate, the side length of the square supporting plate is 355 mm, the thickness is 4.7 mm, and the chamfer radius of the four sides is 2 mm.

[0008] Preferably, at least nine wafer carrier grooves are provided on the carrier plate, and an array of nine wafer carrier grooves is arranged on the carrier plate.

[0009] Preferably, the outer diameter of the annular upper film loading platform is 102mm±1mm, the inner diameter is 94mm±2mm, the groove depth of the upper film loading platform is 0.5mm±0.1mm, and the groove depth difference between the lower film loading platform and the upper film loading platform is 0.5mm±0.1mm.

[0010] Preferably, at least seven columns are provided in the unloading platform.

[0011] Preferably, seven columns are provided in the unloading platform, one of which is located at the center of the unloading platform, and the remaining six columns are arranged in a circular array with the center of the unloading platform as the center.

[0012] Preferably, the array circle radius of the columns arranged in a circular array is 50 mm.

[0013] Preferably, the pillar is a circular pillar, and the diameter of the circular pillar is 3mm±0.5mm.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: it comprises two stepped wafer carriers, the lower wafer carrier is located in the middle of the annular upper wafer carrier, and the groove depth of the lower wafer carrier is greater than the groove depth of the upper wafer carrier; a number of columns are provided on the lower wafer carrier, and the edges and the middle of the wafer are supported by the lower wafer carrier and the columns respectively, which improves the support effect of the wafer on the one hand, and on the other hand, when the wafer produces intermediate fragments during the annealing process, the effective support of the columns can prevent the central area of ​​the wafer after the fragmentation from contacting and rubbing with the bottom of the wafer carrier groove, thereby reducing scratches on the wafer source and improving the product yield; further, an arc-shaped wafer removal groove is provided on the upper wafer carrier, and the bottom of the wafer removal groove is flush with the lower wafer carrier; on the one hand, it is conducive to ensuring that the wafer carrier is heated evenly and the temperature field is consistent, thereby ensuring consistent annealing temperature of the wafer source; on the other hand, the wafer removal groove can more effectively enable the wafer picking and placing tool to extend into the bottom of the wafer to take out the wafer, thereby reducing the difficulty of operation, shortening the operation time, reducing scratches on the wafer source, improving the product yield, and being suitable for large-scale promotion.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1This is a schematic diagram of the structure of the RTA machine annealing fixture provided by the utility model;

[0017] Figure 2 This is a schematic structural diagram of the RTA machine annealing fixture provided by the utility model from another perspective;

[0018] Figure 3 for Figure 1 Schematic diagram of the middle support platform structure.

[0019] Description of main component symbols:

[0020] 10. Carrying plate; 11. Wafer groove; 12. Upper wafer stage; 13. Lower wafer stage; 14. Column; 15. Wafer trough; 20. Wafer.

[0021] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Specifically, such as Figures 1 to 3As shown, the RTA machine annealing wafer fixture provided by the present invention includes a carrier plate 10, a plurality of carrier grooves 11 are provided on the carrier plate 10, the carrier grooves 11 are used to carry the wafers 20 to be annealed, the carrier grooves 11 include an annular upper wafer loading platform 12 and a circular unloading wafer platform 13, the unloading wafer platform 13 is arranged in the annular inner part of the upper wafer loading platform 12 and is coaxial with the upper wafer loading platform 12, the inner diameter of the annular upper wafer loading platform 12 is the same as the diameter of the circular unloading wafer platform 13, and the unloading wafer platform 13 is provided in the annular inner part of the upper wafer loading platform 12 and is coaxial with the upper wafer loading platform 12. The groove depth of the platform 13 is greater than the groove depth of the upper loading platform. Several columns 14 are provided in the unloading platform 13. The height of the columns 14 is the same as the groove depth difference between the unloading platform 13 and the upper loading platform 12. The edge of the wafer 20 is placed on the upper loading platform 12, and the middle of the wafer 20 is placed on several columns 14. The upper loading platform 12 and several columns 14 are used to support the wafer 20. An arc-shaped wafer retrieval groove 15 is provided on the upper loading platform 12, and the bottom of the wafer retrieval groove 15 is flush with the bottom of the unloading platform 13.

[0026] Optionally, when the wafer is annealed on the RTA machine, the thickness is relatively thin, only a few hundred microns. If friction or scratches are left on the surface, the quality of the wafer will be greatly affected. In this embodiment, the RTA machine annealing fixture includes a carrier plate 10. The carrier plate 10 can be made of heat-conducting material. A plurality of carrier grooves 11 are provided in the carrier plate 10. The carrier grooves 11 are stepped structures, including an upper carrier stage 12 located above and a lower carrier stage 13 located below. The two carrier stages are coaxial, and the lower carrier stage 13 is provided on the lower plate. Located in the middle of the annular upper wafer loading platform 12, the groove depth of the lower wafer stage 13 is greater than the groove depth of the upper wafer loading platform 12; a number of columns 14 are provided on the lower wafer stage 13, and the lower wafer stage 13 and the columns 14 respectively support the edge and the middle of the wafer, on the one hand, improving the support effect of the wafer, on the other hand, when the wafer produces intermediate fragments during the annealing process, the effective support of the columns 14 can prevent the center area of ​​the wafer after the fragments from contacting and rubbing with the bottom of the wafer loading groove, thereby reducing scratches on the wafer source and improving product yield.

[0027] Furthermore, an arc-shaped wafer taking groove 15 is provided on the upper wafer loading platform 12. The wafer taking groove 15 is distributed on the edge of the wafer loading groove 11 and can be roughly the same size as the tweezers, which is convenient for accommodating wafer taking and placing tools; the wafer taking groove is concave, and the concave depth is consistent with the total groove depth, that is, the bottom of the wafer taking groove 15 is flush with the lower wafer loading platform 13, which is conducive to ensuring that the wafer loading platform is heated evenly and the temperature field is consistent, and the annealing temperature of the wafer source is consistent; when taking the wafer, it can be clamped with tweezers; the wafer taking groove 15 can more effectively enable the wafer taking and placing tool to extend from under the wafer 20 to take out the wafer, reduce the difficulty of operation, shorten the operation time, reduce the scratches on the wafer source, and improve the product yield.

[0028] Optionally, in this embodiment, the carrier plate 10 is a square carrier plate, the side length of the square carrier plate is 355 mm, the thickness is 4.7 mm, and the chamfer radius on all sides is 2 mm; it can be understood that in other optional embodiments, the carrier plate 10 can also be of other sizes, which is not limited here.

[0029] Optionally, at least nine wafer carrier grooves 11 are provided on the carrier plate 10. In this embodiment, Figure 1 As shown, nine wafer carrier grooves 11 are provided on the carrier plate 10, and the nine wafer carrier grooves 11 are symmetrically arranged in a "3×3" form on the carrier plate 10; further, the outer diameter of the annular upper wafer carrier 12 is 102mm±1mm, and the inner diameter is 94mm±2mm. The groove depth of the upper wafer carrier 12 is 0.5mm±0.1mm, and the groove depth difference between the lower wafer carrier 13 and the upper wafer carrier 12 is 0.5mm±0.1mm; preferably, the outer diameter of the annular upper wafer carrier is 102mm, and the inner diameter is 94mm. The diameter of the wafer is located between the outer diameter and the inner diameter of the annular upper wafer carrier 12, forming a limit for carrying the wafer 20; the groove depth of the upper wafer carrier is 0.5mm, and the groove depth difference between the lower wafer carrier and the upper wafer carrier is 0.5mm.

[0030] Optionally, at least seven columns 14 are provided in the unloading platform 13. In this embodiment, Figure 2 and Figure 3 As shown, there are seven columns 14 in the unloading platform 13, one of which is located at the center of the unloading platform 13, and the other six columns are arranged in a circular array with the center of the unloading platform 13 as the center and the unloading platform 13 as the plane. The angle between the centers of each column 14 is 60 degrees. Figure 3 As shown, the radius of the column array circle arranged in a circular array is 50 mm, the columns are circular columns, and the diameter of the circular columns is 3 mm ± 0.5 mm; in this embodiment, the diameter of the circular columns is 3 mm;

[0031] The RTA machine annealing wafer fixture provided in this embodiment includes two stepped wafer stages, the lower wafer stage 13 is located in the middle of the annular upper wafer stage 12, and the groove depth of the lower wafer stage 13 is greater than the groove depth of the upper wafer stage 12; a plurality of columns 14 are provided on the lower wafer stage 13, and the edges and the middle of the wafer are supported by the lower wafer stage 13 and the columns 14 respectively, on the one hand, the supporting effect of the wafer is improved, and on the other hand, when the wafer generates middle fragments during the annealing process, the effective support of the columns 14 can prevent the wafer after the fragments from being broken. The center area of ​​the circle is in contact and friction with the bottom of the wafer carrier groove, which reduces scratches on the wafer source and improves the product yield; further, an arc-shaped wafer removal groove 15 is provided on the upper wafer carrier 12, and the bottom of the wafer removal groove 15 is flush with the lower wafer carrier 13; on the one hand, it is beneficial to ensure that the wafer carrier is heated evenly and the temperature field is consistent, thereby ensuring the consistent annealing temperature of the wafer source; on the other hand, the wafer removal groove 15 can more effectively enable the wafer placement tool to extend into the bottom of the wafer 20 to remove the wafer, reducing the difficulty of operation, shortening the operation time and reducing scratches on the wafer source, thereby improving the product yield, and is suitable for large-scale promotion.

[0032] It should be noted that the above implementation process is only for illustrating the feasibility of the present application, but it does not mean that the RTA machine annealing wafer fixture of the present application only has the above implementation process. On the contrary, as long as the RTA machine annealing wafer fixture of the present application can be implemented, it can be included in the feasible implementation plan of the present application.

[0033] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, mechanisms, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, mechanisms, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0034] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An RTA machine annealing fixture, characterized in that: The wafer loading platform is provided with a plurality of wafer loading grooves, the wafer loading grooves are used to carry wafers to be annealed, the wafer loading grooves include an annular upper wafer loading platform and a circular unloading wafer loading platform, the unloading wafer loading platform is arranged in the annular area of ​​the upper wafer loading platform and is coaxial with the upper wafer loading platform, the inner diameter of the upper wafer loading platform is the same as the diameter of the unloading wafer loading platform, the groove depth of the unloading wafer loading platform is greater than the groove depth of the upper wafer loading platform, a plurality of columns are provided in the unloading wafer loading platform, the height of the columns is the same as the difference in groove depth between the unloading wafer loading platform and the upper wafer loading platform, the edge of the wafer is placed on the upper wafer loading platform, the middle part of the wafer is placed on the plurality of columns, the upper wafer loading platform and the plurality of columns are used to support the wafer, the upper wafer loading platform is provided with an arc-shaped wafer taking groove, the bottom of the wafer taking groove is flush with the bottom of the unloading wafer loading platform.

2. The RTA machine annealing wafer fixture according to claim 1, characterized in that: The supporting plate is a square supporting plate with a side length of 355 mm, a thickness of 4.7 mm, and a chamfer radius of 2 mm on all sides.

3. The RTA machine annealing wafer fixture according to claim 1, characterized in that: At least nine wafer carrier grooves are provided on the carrier plate, and the nine wafer carrier groove arrays are arranged on the carrier plate.

4. The RTA machine annealing wafer fixture according to claim 1, characterized in that: The outer diameter of the annular upper film loading platform is 102mm±1mm, the inner diameter is 94mm±2mm, the groove depth of the upper film loading platform is 0.5mm±0.1mm, and the difference in groove depth between the lower film loading platform and the upper film loading platform is 0.5mm±0.1mm.

5. The RTA machine annealing wafer fixture according to claim 1, characterized in that: At least seven columns are provided in the film unloading platform.

6. The RTA machine annealing wafer fixture according to claim 5, characterized in that: Seven columns are provided in the unloading platform, one of which is located at the center of the unloading platform, and the remaining six columns are arranged in a circular array with the center of the unloading platform as the center.

7. The RTA machine annealing wafer fixture according to claim 5, characterized in that: The array circle radius of the columns arranged in a circular array is 50 mm.

8. The RTA machine annealing wafer fixture according to claim 1, characterized in that: The column is a circular column, and the diameter of the circular column is 3mm±0.5mm.

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