Hand-held GaAs laser wafer overturning jig

Abstract

The utility model relates to the technical field of wafer manufacturing, in particular to a handheld GaAs laser wafer overturning jig which comprises two bottom plates, one sides of the two bottom plates are fixedly connected to form a connecting side, the other sides of the two bottom plates are away from each other to form opening sides, a clamping gap used for clamping a wafer is formed between the two bottom plates, and a handheld handle is fixed to the outer wall of the connecting side of each bottom plate. An operator holds the handle by hand, aligns the opening side to the wafer and shovels the wafer into the clamping gap, the two bottom plates clamp the wafer, the operator turns over the handle to turn over the wafer, and the wafer is poured out of the clamping gap again. By means of the jig, hands are prevented from making direct contact with the wafer, so that the risk that the hands pollute the surface of the wafer is reduced, and the damage risk caused by manual overturning is also reduced. And unified and standardized operation procedures can be realized through the jig, and the efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer production, and in particular to a handheld GaAs laser wafer flipping fixture. Background Art

[0002] In the semiconductor manufacturing process, GaAs wafers are widely used in the production of laser chips due to their excellent optoelectronic properties. During processing, testing, and packaging, the wafers need to be flipped to process both sides. Currently, flipping wafers mainly relies on manual operation, which has the following problems:

[0003] 1. Surface contamination: Direct hand contact may cause the deposition of oil, fingerprints and other contaminants on the wafer surface, affecting product quality.

[0004] 2. Risk of damage: Manual flipping may cause scratches or cracks on the wafer due to improper operation, resulting in material loss.

[0005] 3. Inefficiency: Manually flipping wafers is inefficient and difficult to achieve standardized operations.

[0006] Therefore, developing a handheld flipping fixture specifically for GaAs laser wafers can solve the above problems and improve production efficiency and product quality. Utility Model Content

[0007] In order to solve the above problems, the present application provides a handheld GaAs laser wafer flipping fixture.

[0008] The handheld GaAs laser wafer flipping fixture provided in this application adopts the following technical solutions:

[0009] A handheld GaAs laser wafer flipping fixture includes two base plates, one side of the two base plates is fixedly connected as a connection side, and the other side is away from each other as an opening side. A clamping gap for clamping the wafer is formed between the two base plates, and a handle for holding is fixed on the outer wall of the connection side of the base plates.

[0010] By adopting the above technical solution, the operator holds the handle, aligns the open side with the wafer, and shovels the wafer into the clamping gap. The two base plates clamp the wafer. The operator flips the handle to turn the wafer over and then pours the wafer out of the clamping gap again. This fixture prevents direct contact between the hands and the wafer, thereby reducing the risk of surface contamination caused by the hands and the risk of damage caused by manual flipping. The fixture can also achieve a unified and standardized operating process, improving efficiency.

[0011] Preferably, the two bottom plates are symmetrically arranged, and the bottom plates include side edges on both sides, and the side edges of the two bottom plates facing each other are fixedly connected via side plates.

[0012] By adopting the above technical solution, the bottom plate clamps the wafer, and the side plates block the side edges of the wafer to prevent the wafer from falling out of the clamping gap.

[0013] Preferably, the side panel is arranged in a conical shape, and the length of the side of the side panel close to the opening side is greater than the length of the other side.

[0014] By adopting the above technical solution, the side plates are tapered so that the bottom plate is inclined, which makes it easier for operators to scoop up wafers.

[0015] Preferably, a filter paper detachably connected to the bottom plate is provided in the clamping gap.

[0016] By adopting the above technical solution, the filter paper prevents the bottom plate from directly contacting the wafer and causing scratches, and at the same time has a certain buffering effect when flipping, reducing the chance of fragmentation.

[0017] Preferably, the base plate includes a fixing portion and a scraping portion that are integrally fixed and connected, the fixing portion is semicircular, the connecting side is located on the arc edge, the scraping portion is fixed on the straight edge of the fixing portion, and inclined scraping edges are respectively provided on both sides of the scraping portion, one end of the scraping edge is connected to the fixing portion, and the other end is inclined away from the fixing portion.

[0018] By adopting the above technical solution, the scraping edges on both sides of the scraping part make the opening side of the scraping part triangular, and the center area of ​​the scraping part is smaller, which is convenient for scraping the wafer. The fixing part is semicircular and adapts to the shape of the wafer, which facilitates the clamping and fixing of the wafer.

[0019] Preferably, a tapered scraping blade extending away from the fixing portion is fixed at the middle position of the scraping portion, and one end of the scraping edge away from the fixing portion is connected to the scraping blade.

[0020] By adopting the above technical solution, the wafer can be scooped by a shovel, which is easy to operate.

[0021] Preferably, the plane where the shovel blade is located is inclined to the axis of the handle, and the end of the shovel blade away from the crystal shoveling part is inclined in a direction away from the axis of the handle.

[0022] By adopting the above technical solution, the shovel blade is set at an angle, which makes it easier for operators to scoop up wafers.

[0023] Preferably, the fixing portion is made of soft elastic material.

[0024] By adopting the above technical solution, the fixing part can provide sufficient friction force to fix the wafer without scratching the wafer surface.

[0025] Preferably, the surface of the bottom plate is provided with an antistatic coating.

[0026] By adopting the above technical solution, static electricity accumulation on the bottom plate is prevented from attracting dust.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. Can effectively solve the problem of wafer flipping fragments;

[0029] 2. Effectively prevent contamination caused by technicians’ hands;

[0030] 3. Standardized operation can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the embodiment.

[0032] Description of reference numerals:

[0033] 1. Bottom plate; 11. Fixing part; 12. Crystal scraping part; 121. Scraping edge; 2. Clamping gap; 3. Handle; 4. Side plate; 5. Filter paper; 6. Scraping blade. DETAILED DESCRIPTION

[0034] The present application is further described in detail below in conjunction with all the accompanying drawings. Example

[0035] The present application embodiment discloses a handheld GaAs laser wafer flipping fixture, referring to Figure 1 , including a bottom plate 1, a side plate 4 and a handle 3. The outer walls of the bottom plate 1, the side plate 4 and the handle 3 are all coated with an antistatic coating.

[0036] Reference Figure 1 There are two bottom plates 1 and two side plates 4, and the bottom plates 1 are symmetrically arranged with each other, and the side plates 4 are symmetrically arranged with each other. A clamping gap 2 for clamping wafers is formed between the bottom plates 1 and the side plates 4 are located on both sides of the clamping gap 2 to block the two sides of the clamping gap 2 and prevent the wafer from falling off from the sides of the clamping gap 2.

[0037] Reference Figure 1 The bottom plate 1 includes a fixing portion 11 and a scraping portion 12. The fixing portion 11 is semicircular and has an arc edge and a straight edge. The center positions of the arc edges of the two bottom plates 1 are fixedly connected as the connecting side, and the straight edges are away from each other and do not touch each other as the opening side. The arc edge also includes side edges on both sides of the connecting side. The side plate 4 is fixed between the side edges of the two bottom plates 1 that are directly opposite to each other. The two side plates 4 and the two bottom plates 1 are fixedly connected to form a clamping gap 2 with only one opening.

[0038] Reference Figure 1, the side panel 4 is set to be conical, and the length of the side of the side panel 4 close to the opening side is greater than the length of the other side. The handle 3 is long and the end of the handle 3 is fixedly connected to the outer wall of the connection side, which is convenient for the operator to hold. The bottom plate 1 is connected to the side panel 4 so that the bottom plate 1 is tilted, and the plane where the bottom plate 1 is located is tilted to the axis of the handle 3, and the end of the bottom plate 1 away from the connection side is tilted away from the axis of the handle 3. The clamping gap 2 is tapered as a whole, and the opening of the clamping gap 2 is opened outward to facilitate scooping of the wafer, and the bottom spacing of the clamping gap 2 is small, which is convenient for clamping and fixing the wafer.

[0039] Reference Figure 1 The fixing portion 11 is made of a soft elastic material, such as polyurethane, etc. The fixing portion 11 can provide sufficient friction to fix the wafer without scratching the wafer surface.

[0040] Reference Figure 1 Filter paper 5 is removably connected to base plate 1 within clamping gap 2. Two sheets of filter paper 5 are provided, one attached to each base plate 1. The filter paper 5 and base plate 1 are connected using glue or tape. The filter paper 5 prevents direct contact between base plate 1 and the wafer, potentially causing scratches. It also provides a cushioning effect during wafer flipping, reducing the chance of fragmentation.

[0041] Reference Figure 1 The scraping part 12 is conical and fixedly connected to the fixed part 11 as a whole. The scraping part 12 is fixed on the straight edge of the fixed part 11. Inclined scraping edges 121 are provided on both sides of the scraping part 12, one end of the scraping edge 121 is connected to the fixed part 11, and the other end is inclined in the direction away from the fixed part 11. A scraping blade 6 extending in the direction away from the fixed part 11 is fixed in the middle position of the scraping part 12, and the end of the scraping edge 121 away from the fixed part 11 is connected to the scraping blade 6. The scraping blade 6 and the base plate 1 are located on the same plane, that is, the plane where the scraping blade 6 is located is inclined to the axis of the handle 3, and the end of the scraping blade 6 away from the scraping part 12 is inclined in the direction away from the axis of the handle 3. The scraping blade 6 is convenient for scooping the wafer.

[0042] The implementation principle of the handheld GaAs laser wafer flipping fixture of the embodiment of the present application is: the operator sticks the filter paper 5 to the inner wall of the base plate 1 with tape, the operator holds the handle 3, aligns the shovel 6 with the bottom of the wafer to scoop the wafer, inserts the wafer into the clamping gap 2 through the opening side, the fixing part 11 clamps the wafer, the operator flips the handle 3 to flip the wafer 180°, and then pours the wafer out from the opening side.

[0043] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. Handheld GaAs laser wafer flipping fixture, characterized by: The invention comprises two bottom plates (1), one side of the two bottom plates (1) is fixedly connected as a connection side, and the other side is away from each other as an opening side, a clamping gap (2) for clamping a wafer is formed between the two bottom plates (1), and a handle (3) for holding is fixed on the outer wall of the connection side of the bottom plates (1).

2. The handheld GaAs laser wafer flipping fixture according to claim 1, characterized in that: The two bottom plates (1) are symmetrically arranged, and the bottom plates (1) include side edges located on both sides. The side edges of the two bottom plates (1) facing each other are fixedly connected via the side plates (4).

3. The handheld GaAs laser wafer flipping fixture according to claim 2, characterized in that: The side plate (4) is arranged in a conical shape, and the length of the side of the side plate (4) close to the opening side is greater than the length of the other side.

4. The handheld GaAs laser wafer flipping fixture according to claim 1, characterized in that: A filter paper (5) detachably connected to the bottom plate (1) is provided in the clamping gap (2).

5. The handheld GaAs laser wafer flipping fixture according to claim 1, characterized in that: The base plate (1) includes a fixing portion (11) and a scraping portion (12) that are integrally fixed and connected. The fixing portion (11) is semicircular, and the connecting side is located on the arc edge. The scraping portion (12) is fixed on the straight edge of the fixing portion (11). Both sides of the scraping portion (12) are respectively provided with inclined scraping edges (121). One end of the scraping edge (121) is connected to the fixing portion (11), and the other end is inclined in a direction away from the fixing portion (11).

6. The handheld GaAs laser wafer flipping fixture according to claim 5, characterized in that: A conical scraping blade (6) extending away from the fixing portion (11) is fixed at the middle position of the scraping portion (12), and one end of the scraping edge (121) away from the fixing portion (11) is connected to the scraping blade (6).

7. The handheld GaAs laser wafer flipping fixture according to claim 6, characterized in that: The plane where the shovel blade (6) is located is inclined with respect to the axis of the handle (3), and the end of the shovel blade (6) away from the crystal shoveling portion (12) is inclined in a direction away from the axis of the handle (3).

8. The handheld GaAs laser wafer flipping fixture according to claim 5, characterized in that: The fixing portion (11) is made of soft elastic material.

9. The handheld GaAs laser wafer flipping fixture according to claim 1, characterized in that: The surface of the bottom plate (1) is provided with an antistatic coating.

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