Light emitting device

Abstract

The utility model discloses a light-emitting device. The light-emitting device comprises a carrier, a plurality of connecting pads, a plurality of light-emitting diode chips, an integrated circuit chip, five external connecting pads and a connecting assembly. The carrier comprises a first substrate, a second substrate and a third substrate. The second substrate is located between the first substrate and the third substrate. The plurality of connecting pads are arranged on the first substrate and are arranged at intervals. The plurality of light emitting diode chips and the integrated circuit chip are electrically connected with the plurality of connecting pads. The five external connection pads are arranged on the third substrate and are arranged at intervals. The connecting assembly is arranged on the second substrate. Part of the connecting assembly passes through the first substrate and the third substrate so as to electrically couple the plurality of connecting pads and the five external connecting pads.

Description

Technical Field

[0001] The utility model relates to a device, in particular to a light-emitting device. Background Art

[0002] like Figure 21 and Figure 22 As shown, a conventional light-emitting device X200 includes a carrier X210, an integrated circuit chip X220 and a plurality of light-emitting diode chips X230 disposed on the carrier X210, and four pads X240A and X240B located on the bottom of the carrier. The power supply voltage of the integrated circuit chip X220 and the anodes of the plurality of light-emitting diode chips X230 are commonly connected to one pad X240A, while the other three pads X240B are used to connect the input electrode (Din) and output electrode (Dout) of the integrated circuit chip X220, as well as the ground terminal (GND).

[0003] However, due to the design of the four pads X240A and X240B of the conventional light-emitting device X200, the input power supply voltage (VDD) of the integrated circuit chip X220 and the anode of the light-emitting diode chip X230 are connected to the same pad X240A. This further makes it impossible to perform a functional test on the integrated circuit chip X220 before the conventional light-emitting device X200 is mounted on a printed circuit board.

[0004] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles to finally propose a utility model that has a reasonable design and effectively improves the above defects. Utility Model Content

[0005] The technical problem to be solved by the present invention is to provide a light emitting device to address the deficiencies of the prior art.

[0006] An embodiment of the present invention discloses a light-emitting device, comprising: a carrier, including a first substrate, a second substrate, and a third substrate, wherein the second substrate is located between the first substrate and the third substrate; a plurality of pads, arranged on the first substrate, and the plurality of pads are spaced apart from each other; a plurality of light-emitting diode chips and an integrated circuit chip, electrically connecting the plurality of pads; five external connection pads, arranged on the third substrate, and the five external connection pads are spaced apart from each other; and a connecting component, arranged on the second substrate, a portion of the connecting component passes through the first substrate and the third substrate to electrically couple the plurality of pads and the five external connection pads.

[0007] Preferably, the five external connection pads include two anode external connection pads and three functional external connection pads, there is a first shortest distance between the two anode external connection pads, there is a second shortest distance between any anode external connection pad and any functional external connection pad, and the first shortest distance is smaller than the second shortest distance.

[0008] Preferably, the five external connection pads include two anode external connection pads and three functional external connection pads, wherein one of the anode external connection pads is electrically coupled to a power supply voltage (VDD) of the integrated circuit chip, and another of the anode external connection pads is electrically coupled to the anode ends of the plurality of light-emitting diode chips.

[0009] Preferably, the five external connection pads include two anode external connection pads and three functional external connection pads, wherein one of the anode external connection pads is electrically coupled to a power supply voltage (VDD) of the integrated circuit chip and the anode end of one of the light-emitting diode chips, and another of the anode external connection pads is electrically coupled to the anode ends of the other multiple light-emitting diode chips.

[0010] Preferably, the light emitting device further comprises a solder resist coating disposed on the third substrate, wherein the solder resist coating separates a plurality of configuration areas on the third substrate, wherein one of the configuration areas comprises two anode connection pads.

[0011] Preferably, two of the functional connection pads are electrically coupled to a data input electrode (DI) and a data output electrode (DO) of the integrated circuit chip respectively, and the other functional connection pad can be used for grounding.

[0012] Preferably, the plurality of pads are spaced apart from the side edge of the first substrate.

[0013] Preferably, each of the light-emitting diode chips has an anode end and a cathode end, each electrically connected to the pad. The pad electrically connected to the anode end is defined as an anode pad, and the pad electrically connected to the cathode end is defined as a cathode pad. The multiple anode pads and the multiple cathode pads are arranged in two rows, the multiple anode pads are arranged in a first row, and the multiple cathode pads are arranged in a second row.

[0014] Preferably, each of the light-emitting diode chips has an anode terminal and a cathode terminal, each electrically connected to the pad. The pad electrically connected to the anode terminal is defined as an anode pad, and the pad electrically connected to the cathode terminal is defined as a cathode pad. The plurality of anode pads and the plurality of cathode pads are arranged in a first row and a second row; the first row and the second row each have at least one anode pad and at least one cathode pad.

[0015] Preferably, the number of the plurality of light-emitting diode chips is M, where M is a positive integer not less than three; the connection component includes: M+5 connection conductive pads, which are arranged on the second substrate, and the M+5 connection conductive pads are arranged at intervals from each other; and a plurality of conductive columns, which pass through the first substrate and the second substrate, wherein a portion of the plurality of conductive columns are electrically coupled to the plurality of the pads and the M+5 connection conductive pads, and another portion of the plurality of conductive columns are electrically coupled to the five external connection pads and the M+5 connection conductive pads.

[0016] Preferably, the total area of ​​the M+5 connection pads is not less than 50% of the total area of ​​the second substrate.

[0017] In summary, the light-emitting device disclosed in the embodiment of the present invention can perform functional testing on the integrated circuit chip before being installed on the circuit substrate through the design of "five external connection pads are arranged on the third substrate and are spaced apart from each other" and "part of the connection component passes through the first substrate and the third substrate to electrically couple the multiple pads and the five external connection pads".

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a circuit diagram of the light-emitting device of the present invention.

[0020] Figure 2 It is a schematic plan view of the first substrate of the light-emitting device of the present invention.

[0021] Figure 3 It is a plan view of the second substrate of the light-emitting device of the present invention.

[0022] Figure 4 It is a plan view of the third substrate of the light-emitting device of the present invention.

[0023] Figure 5 This is a schematic plan view of a first substrate of a light-emitting device according to another embodiment of the present invention.

[0024] Figure 6 for Figure 5 A schematic plan view of the second substrate of the light-emitting device.

[0025] Figure 7 for Figure 5 A schematic plan view of a third substrate of a light-emitting device.

[0026] Figure 8 This is another circuit diagram of the light emitting device of the present invention.

[0027] Figure 9 This is a schematic plan view of a first substrate of a light-emitting device according to another embodiment of the present invention.

[0028] Figure 10 for Figure 9 A schematic plan view of the second substrate of the light-emitting device.

[0029] Figure 11 for Figure 9 A schematic plan view of a third substrate of a light-emitting device.

[0030] Figure 12 This is a schematic plan view of a first substrate of a light-emitting device according to another embodiment of the present invention.

[0031] Figure 13 for Figure 12 A schematic plan view of the second substrate of the light-emitting device.

[0032] Figure 14 for Figure 12 A schematic plan view of a third substrate of a light-emitting device.

[0033] Figure 15 This is a schematic plan view of a first substrate of a light-emitting device according to yet another embodiment of the present invention.

[0034] Figure 16 for Figure 15 A schematic plan view of the second substrate of the light-emitting device.

[0035] Figure 17 for Figure 15 A schematic plan view of a third substrate of a light-emitting device.

[0036] Figure 18 This is a schematic plan view of the first substrate of a light-emitting device according to yet another embodiment of the present invention.

[0037] Figure 19 for Figure 18 A schematic plan view of the second substrate of the light-emitting device.

[0038] Figure 20 for Figure 18 A schematic plan view of a third substrate of a light-emitting device.

[0039] Figure 21 It is a three-dimensional schematic diagram of a conventional light-emitting device.

[0040] Figure 22 FIG. 2 is another perspective schematic diagram of a conventional light emitting device. DETAILED DESCRIPTION

[0041] The following is an explanation of the disclosed embodiments of the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0042] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" used herein may include any one or more combinations of the associated listed items, depending on the actual situation. Furthermore, the term "electrically coupled" used herein refers to either "indirect electrical connection" or "direct electrical connection."

[0043] See Figures 1 to 4 As shown, this embodiment provides a light emitting device 100A, which includes a carrier 1, a plurality of pads (ie, Figure 2 2A, 2B and 2C shown in FIG), a plurality of light emitting diode chips 3R, 3G, 3B, an integrated circuit chip 4, five external connection pads (ie, Figure 4 5A and 5F shown in FIG), and a connection component 6. The light-emitting device 100A is configured with five external connection pads, so that the integrated circuit chip 4 can be individually tested through the power supply voltage VDD, data input electrode Din, data output electrode Dout, and ground electrode VSS described later before the light-emitting device 100A is mounted on a circuit substrate (not shown), thereby ensuring the reliability of the light-emitting device 100A.

[0044] Before describing the light-emitting device 100A, it should be noted that in this embodiment, the light-emitting device 100A utilizes a flip-chip architecture. That is, the integrated circuit chip 4 and the plurality of pads are secured and electrically connected using a flip-chip method. However, the present invention is not limited to this. The following describes the various components of the light-emitting device 100A and their connections.

[0045] Cooperate Figures 2 to 4As shown, the carrier 1 in this embodiment is a multilayer structure, and the carrier 1 includes a first substrate 11, a second substrate 12, and a third substrate 13. The carrier 1 has a thickness direction (not marked), and the first substrate 11, the second substrate 12, and the third substrate 13 are stacked in sequence along the thickness direction, so that the second substrate 12 is located between the first substrate 11 and the third substrate 13. For ease of understanding, Figure 2 and Figure 3 The following description is based on the top view of the carrier 1. Figure 4 The description is made from the perspective of looking down at the carrier 1 .

[0046] Re-parameter Figure 2 As shown, a plurality of the pads (ie, Figure 2 In this embodiment, 2A, 2B, and 2C are made of a conductive metal material and are disposed on a side of the first substrate 11 away from the second substrate 12. The plurality of pads are spaced apart from each other. In other words, the plurality of pads are exposed on the surface of the carrier 1.

[0047] In practice, the sides of the plurality of pads may be spaced apart from the sides of the first substrate 11. That is, the pads do not extend onto the sides of the first substrate 11, so that the pads do not form a sidewall via on the side of the carrier 1.

[0048] like Figure 2 As shown, the plurality of light-emitting diode chips 3R, 3G, 3B and the integrated circuit chip 4 are arranged on the side of the first substrate 11 away from the second substrate 12, and the plurality of light-emitting diode chips 3R, 3G, 3B and the integrated circuit chip 4 are electrically connected to the plurality of pads.

[0049] In practice, cooperate Figure 1 and Figure 2 As shown, each of the light-emitting diode chips 3R, 3G, and 3B has an anode terminal R+, G+, and B+ and a cathode terminal (not marked) electrically connected to the pads. The pad electrically connected to the anode terminal R+, G+, and B+ is defined as an anode pad 2A, and the pad electrically connected to the cathode terminal is defined as a cathode pad 2C. The plurality of anode pads 2A and the plurality of cathode pads 2C can be arranged in a matrix (for example, a 6-by-2 matrix), that is, a portion of the plurality of pads are arranged in a matrix.

[0050] The cathode pads 2C may be arranged in a first row C1, and the anode pads 2A may be arranged in a second row C2 parallel to the first row C1. In other words, the electrodes of the pads in the first row C1 are anodes, and the electrodes of the pads in the second row C2 are cathodes (e.g., Figure 2 and Figure 5 ), but the present invention is not limited thereto.

[0051] For example, Figures 9 to 11 As for the light emitting device 100C in FIG. 1 , the first row C1 and the second row C2 may each have at least one anode pad 2A and at least one cathode pad 2C. In other words, the electrodes of the plurality of pads in the first row C1 include anodes and cathodes, and the electrodes of the plurality of pads in the second row C2 also include anodes and cathodes (e.g., Figure 9 shown).

[0052] In addition, another portion of the plurality of pads can be defined as chip pads 2B, and the plurality of chip pads 2B can be substantially covered by the integrated circuit chip 4 and electrically connected to the integrated circuit chip 4 .

[0053] Cooperate Figure 1 and Figure 8 As shown ( Figure 1 Schematic diagram of the circuit of the light emitting devices 100A and 100B. Figure 8 (See the circuit diagram of light-emitting devices 100C and 100D.) The integrated circuit chip 4 has an input power supply voltage VDD, a data input electrode Din, a data output electrode Dout, and a ground electrode VSS. The input power supply voltage VDD provides the operating voltage required by the integrated circuit chip 4. The ground electrode VSS serves as the zero potential reference point for the integrated circuit chip 4. The data input electrode Din is used to input an external signal to the multiple light-emitting diode chips 3R, 3G, and 3B for control, while the data output electrode Dout is used to connect the signal to the next light-emitting device.

[0054] Re-parameter Figure 4 As shown, in this embodiment, the five external connection pads are made of a conductive metal material and are disposed on a side of the third substrate 13 facing away from the second substrate 12. The multiple external connection pads are spaced apart from each other. In other words, the multiple external connection pads are also exposed on the surface of the carrier 1, and the light-emitting device can be electrically connected to other devices or components via the five external connection pads.

[0055] For the convenience of subsequent description, the five external connection pads are defined as two anode external connection pads 5A and three functional external connection pads 5F. Each of the anode external connection pads 5A can be understood as an external connection pad electrically coupled to either the anode pad 2A or the input power supply voltage VDD (i.e., the electrode is positive), and each of the functional external connection pads 5F can be understood as an external connection pad electrically coupled to either the data input electrode, the data output electrode, or the ground electrode.

[0056] In one embodiment, one of the anode external connection pads 5A is electrically coupled to the input power supply voltage VDD of the integrated circuit chip 4, and another anode external connection pad 5A is electrically coupled to the anode terminals R+, G+, and B+ of the plurality of light-emitting diode chips 3R, 3G, and 3B, but the present invention is not limited thereto.

[0057] In another embodiment, one of the anode external connection pads 5A is electrically coupled to the input power supply voltage VDD of the integrated circuit chip 4 and the anode terminal of one of the light-emitting diode chips 3R, and another anode external connection pad 5A is electrically coupled to the anode terminals of the other plurality of light-emitting diode chips 3G and 3B. In other words, one of the light-emitting diode chips 3R and the integrated circuit chip are connected to the same external connection pad (for example, Figure 11 and Figure 14 The light emitting devices 100C and 100D shown).

[0058] Preferably, the two anode external connection pads 5A can be designed to be adjacent to each other. Figure 4 、 Figure 11 、 Figure 14 and Figure 17 As shown, there is a first shortest distance D1 between the two anode external connection pads 5A, and a second shortest distance D2 between any one of the anode external connection pads 5A and any one of the functional external connection pads 5F. The first shortest distance D1 is smaller than the second shortest distance D2, but the present invention is not limited to this. For example, Figure 7 and Figure 20 As shown, the first shortest distance D1 may also be designed to be greater than the second shortest distance D2 as appropriate.

[0059] It should be noted that the existing light emitting device X200 uses four pads X240 (such as Figure 21 ,and Figure 22As shown, the power supply voltage of the integrated circuit chip X220 and the anodes of the multiple light-emitting diode chips X230 are commonly connected to one pad X240A. The other three pads X240B are used to connect the input electrode (Din) and output electrode (Dout) of the integrated circuit chip X220, as well as the ground terminal (GND). Therefore, the circuits of printed circuit boards currently on the market are also designed to match the four pads X240.

[0060] To this end, the two anode external connection pads 5A of the present invention can be designed so that the first shortest distance D1 is smaller than the second shortest distance D2, allowing the two anode external connection pads 5A to directly connect to commercially available printed circuit boards. This means that customers can install the light-emitting device X200 of the present invention without having to modify the circuitry of the printed circuit board.

[0061] Cooperate Figure 3 As shown, the connecting element 6 is disposed on the second substrate 12. Portions of the connecting element 6 pass through the first substrate 11 and the third substrate 13 to electrically couple the plurality of pads and the five external connection pads. In other words, the plurality of LED chips 3R, 3G, 3B and the integrated circuit chip 4 on the first substrate 11 can be connected to the five external connection pads on the third substrate 13 via the connecting element 6.

[0062] In practice, the connecting element 6 includes M+5 connecting pads 61 and a plurality of conductive pillars 62. The number of the plurality of LED chips 3R, 3G, and 3B is M, where M is a positive integer not less than three. In other words, there can be a corresponding relationship between the number of connecting pads 61 of the connecting element 6 and the number of the plurality of LED chips 3R, 3G, and 3B.

[0063] For example, when the light emitting device (e.g., the light emitting device 100A, 100B, 100C, 100D) has three light emitting diode chips 3R, 3G, 3B for red, blue, and green light (i.e., M is 3), the connecting component 6 has eight connecting conductive pads 61 (e.g., Figure 3 、 6 , 10, 13). For another example, when the light emitting device (e.g., the light emitting device 100E, 100F) has four light emitting diode chips 3R, 3G, 3B, 3W for white light, red light, blue light, and green light (i.e., M is 4), the connecting component 6 has nine connecting conductive pads 61 (e.g., Figure 16 、 19 shown).

[0064] Specifically, the M+5 connection pads 61 are disposed on the second substrate 12, spaced apart from each other. In this embodiment, each connection pad 61 is rectangular and L-shaped, and the M+5 connection pads 61 substantially occupy the side surface of the second substrate. Preferably, the total area of ​​the M+5 connection pads 61 is no less than 50% of the total area of ​​the second substrate 12.

[0065] In addition, multiple conductive columns 62 are provided through the first substrate 11 and the second substrate 12, wherein a portion of the multiple conductive columns 62 electrically couples the multiple pads and the M+5 connection pads 61, and another portion of the multiple conductive columns 62 electrically couples the five external connection pads and the M+5 connection pads 61.

[0066] It is worth noting that Figure 4 As shown, the light-emitting device 100A may further include a solder resist coating 7 disposed on the third substrate 13. The solder resist coating 7 separates a plurality of configuration areas CA on the third substrate 13, and each configuration area CA is provided with at least one external connection pad. Alternatively, the solder resist coating 7 separates the five external connection pads to reduce mutual interference between the five external connection pads.

[0067] In one embodiment, if Figure 4 As shown, the solder resist 7 is generally T-shaped, resulting in three configuration areas CA. Two anode external connection pads 5A and one functional external connection pad 5F are configured in one configuration area CA, and the first shortest distance D1 between the two anode external connection pads 5A is less than the second shortest distance D2 between any one anode external connection pad 5A and any one functional external connection pad 5F.

[0068] In another embodiment, if Figure 11 and Figure 14 As shown, the solder resist 7 is generally cross-shaped, resulting in four configuration areas CA. Two anode external connection pads 5A are configured in one configuration area CA, and three functional external connection pads 5F are respectively configured in the other three configuration areas CA. The first shortest distance D1 between two anode external connection pads 5A is less than the second shortest distance D2 between any anode external connection pad 5A and any functional external connection pad 5F.

[0069] In another embodiment, if Figure 7As shown, the solder resist 7 is generally cross-shaped, resulting in four configuration areas CA. One of the configuration areas CA is configured with one anode connection pad 5A corresponding to the input power supply voltage VDD and one functional connection pad 5F. Another configuration area CA is configured with one anode connection pad 5A and one functional connection pad 5F corresponding to the anode terminals of the plurality of LED chips. The remaining two functional connection pads 5F are each configured in the other two configuration areas CA. In other words, the anode connection pad 5A corresponding to the input power supply voltage VDD and one of the functional connection pads 5F are adjacent to each other.

[0070] In summary, in order to facilitate understanding of the technical effects of the light emitting device of the present invention, the following is Figures 2 to 4 The light emitting device 100A is used as an example for explanation. Figure 4 The anode external connection pad 5A on the left side is electrically coupled to the anode pads 2A of the three LED chips 3R, 3G, and 3B via the connection element 6. Figure 4 The anode external connection pad 5A in the middle is electrically coupled to the input power supply voltage VDD of the integrated circuit chip 4 via the connection element 6. In other words, the circuits of the integrated circuit chip 4 and the circuits of the three light-emitting diode chips 3R, 3G, and 3B have been separated and do not share the same external connection pad (e.g., Figure 1 As shown). Accordingly, in the case of the circuit of the integrated circuit chip 4 and the circuit of the three light-emitting diode chips 3R, 3G, and 3B, the light-emitting device of the present invention can perform a separate functional test on the integrated circuit chip 4 before being mounted on the circuit substrate. Similarly, the light-emitting devices of other embodiments of the present invention also have the same technical effects under the same circuit architecture (for example: Figures 5 to 7 The light emitting device 100B).

[0071] Technical effects of the embodiment of the utility model

[0072] In summary, the light-emitting device disclosed in the embodiment of the present invention can perform functional testing on the integrated circuit chip before being installed on the circuit substrate through the design of "five external connection pads are arranged on the third substrate and are spaced apart from each other" and "part of the connection component passes through the first substrate and the third substrate to electrically couple the multiple pads and the five external connection pads".

[0073] The above description is only a preferred feasible embodiment of the present invention and is not intended to limit the scope of protection of the present invention. All equivalent changes and modifications made according to the claims of the present invention should fall within the scope of protection of the claims of the present invention.

Claims

1. A light emitting device, characterized in that: The light emitting device comprises: a carrier comprising a first substrate, a second substrate, and a third substrate, wherein the second substrate is located between the first substrate and the third substrate; A plurality of pads are disposed on the first substrate, and the plurality of pads are spaced apart from each other; A plurality of light-emitting diode chips and an integrated circuit chip are electrically connected to the plurality of pads; Five external connection pads are disposed on the third substrate, and the five external connection pads are spaced apart from each other; and A connecting component is disposed on the second substrate, and a portion of the connecting component passes through the first substrate and the third substrate to electrically couple the plurality of pads and the five external connection pads.

2. The light emitting device according to claim 1, wherein The five external connection pads include two anode external connection pads and three functional external connection pads. There is a first shortest distance between two anode external connection pads, and there is a second shortest distance between any anode external connection pad and any functional external connection pad. The first shortest distance is smaller than the second shortest distance.

3. The light emitting device according to claim 1, wherein The five external connection pads include two anode external connection pads and three function external connection pads, one of the anode external connection pads is electrically coupled to a power supply voltage of the integrated circuit chip, and another of the anode external connection pads is electrically coupled to anode terminals of the plurality of light emitting diode chips.

4. The light emitting device according to claim 1, wherein The five external connection pads include two anode external connection pads and three functional external connection pads, one of the anode external connection pads is electrically coupled to a power supply voltage of the integrated circuit chip and the anode end of one of the light-emitting diode chips, and the other anode external connection pad is electrically coupled to the anode ends of the other multiple light-emitting diode chips.

5. The light emitting device according to any one of claims 3 and 4, characterized in that: The light emitting device further includes a solder resist coating disposed on the third substrate. The solder resist coating separates a plurality of configuration areas on the third substrate, wherein one of the configuration areas includes two anode connection pads.

6. The light emitting device according to any one of claims 3 and 4, characterized in that: Two of the functional connection pads are electrically coupled to a data input electrode and a data output electrode of the integrated circuit chip respectively, and the other functional connection pad can be used for grounding.

7. The light emitting device according to claim 1, wherein: The plurality of pads are spaced apart from the side of the first substrate.

8. The light emitting device according to claim 1, wherein Each of the light-emitting diode chips has an anode terminal and a cathode terminal, each electrically connected to the pad. The pad electrically connected to the anode terminal is defined as an anode pad, and the pad electrically connected to the cathode terminal is defined as a cathode pad. The multiple anode pads and the multiple cathode pads are arranged in two rows, the multiple anode pads are arranged in a first row, and the multiple cathode pads are arranged in a second row.

9. The light emitting device according to claim 1, wherein: Each of the light-emitting diode chips has an anode terminal and a cathode terminal, each electrically connected to the pad. The pad electrically connected to the anode terminal is defined as an anode pad, and the pad electrically connected to the cathode terminal is defined as a cathode pad. The plurality of anode pads and the plurality of cathode pads are arranged in a first row and a second row; the first row and the second row each have at least one anode pad and at least one cathode pad.

10. The light emitting device according to claim 1, wherein The number of the plurality of light-emitting diode chips is M, where M is a positive integer not less than three; and the connecting component comprises: M+5 connection pads are provided on the second substrate, and the M+5 connection pads are spaced apart from each other; as well as A plurality of conductive pillars are provided through the first substrate and the second substrate, wherein a portion of the plurality of conductive pillars are electrically coupled to the plurality of pads and the M+5 connection pads, and another portion of the plurality of conductive pillars are electrically coupled to the five external connection pads and the M+5 connection pads.

11. The light emitting device according to claim 10, characterized in that The total area of ​​the M+5 connection pads is not less than 50% of the total area of ​​the second substrate.

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