Small camera

By using seals and drying parts in small cameras combined with cooling components, the production difficulty and cost problems caused by vacuum extraction of CMOS sensors are solved, and efficient temperature control and imaging effects are achieved.

CN223274162UActive Publication Date: 2025-08-26LIGHT SPEED VISION BEIJING
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Patent Information

Application Number
CN202422308452.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-21
Publication Date
2025-08-26
Estimated Expiration
2034-09-21

AI Technical Summary

Technical Problem

The prior art requires the vacuum to remove the influence of moisture when cooling the CMOS sensor, but this increases production difficulty and cost.

Method used

The imaging chip is sealed between the light-transmitting plate and the sealing cavity using a sealing member, and a drying member absorbs moisture in the air. At the same time, the sealing cavity is cooled by a cooling component to avoid vacuum extraction, and temperature control is carried out in combination with a semiconductor refrigerator and a fan.

Benefits of technology

It reduces the sealing difficulty and manufacturing cost of the imaging chip environment, while improving the imaging effect and reducing the impact of moisture condensation on imaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of cameras, in particular to a small camera which comprises a front shell and a rear shell, a mounting cavity is formed between the front shell and the rear shell, an optical lens connecting seat is arranged on the front shell, and a hollow sealing cavity with an opening facing one side of the optical lens connecting seat is arranged in the mounting cavity. A circuit board and an imaging chip are arranged in the sealing cavity, the imaging chip is electrically connected to the circuit board, a photosensitive area of the imaging chip faces the opening end of the sealing cavity, a light-transmitting plate is arranged at the opening end of the sealing cavity, and a sealing piece used for sealing is arranged between the light-transmitting plate and the sealing cavity. A light filtering assembly used for filtering light penetrating through the optical lens connecting base is arranged in the mounting cavity, a cooling assembly used for cooling the imaging chip is arranged on the sealing cavity, and a drying piece is arranged on the sealing cavity and used for absorbing moisture in air between the sealing cavity and the light-transmitting plate. The utility model has the effects of automatically removing moisture, improving the imaging effect and reducing the manufacturing process.
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Description

Technical Field

[0001] The present application relates to the field of camera technology, and in particular to a small camera. Background Art

[0002] A camera is a video recording tool whose basic principle is to convert optical image signals into electrical signals for easy storage or transmission. The camera collects light reflected from an object through a lens, focuses it on the light-receiving surface of the camera device, and then converts the light into electrical energy to form a "video signal." The CMOS image sensor in the camera, with its high sensitivity, can capture more light, making the photos taken clearer and brighter. CMOS sensors also consume less power than traditional CCD sensors. This means that the camera can use less electricity.

[0003] The CMOS sensor is greatly affected by temperature. When the temperature of the CMOS sensor rises, the image quality, color accuracy, contrast and detail performance captured by the CMOS sensor will decline. Therefore, the CMOS sensor needs to be cooled. When the CMOS sensor is cooled, the moisture in the surrounding air will condense onto the CMOS sensor, which may cause damage to the CMOS sensor in severe cases.

[0004] Chinese patent publication number CN115529430A discloses a high-speed camera with forward heat dissipation of an image sensor chip, comprising a CMOS chip and a TEC (Transistor Cooling Plate) refrigeration plate. The cold surface of the TEC refrigeration plate adheres to the non-photosensitive area of ​​the CMOS chip, and the hot surface of the TEC refrigeration plate adheres to the front housing of the camera. A filter is integrated into the hot surface of the TEC refrigeration plate. The space enclosed between the photosensitive area of ​​the CMOS chip, the TEC refrigeration plate, and the filter is evacuated to form a vacuum area.

[0005] The above technology is to eliminate the influence of moisture in the enclosed space on the CMOS sensor by evacuating the space where the CMOS sensor is located into a vacuum. However, after the space where the CMOS sensor is located is evacuated into a vacuum, it needs to have a higher sealing requirement. High sealing corresponds to an increase in the cost and difficulty of camera production, which in turn increases the difficulty of its manufacturing process. Utility Model Content

[0006] In order to improve the problem that after the space where the CMOS sensor is located is evacuated to a vacuum, it requires greater production difficulty to achieve a higher sealing performance, the present application provides a small camera.

[0007] The present application provides a small camera that adopts the following technical solution:

[0008] A small camera comprises a front shell and a rear shell, wherein an installation chamber is formed between the front shell and the rear shell, an optical lens connecting seat is provided on the front shell, a sealed cavity is provided in the installation chamber, the cavity is hollow inside and open toward one side of the optical lens connecting seat, a circuit board and an imaging chip are provided in the sealed cavity, the imaging chip is electrically connected to the circuit board, the photosensitive area of ​​the imaging chip faces the open end of the sealed cavity, a light-transmitting plate is provided at the open end of the sealed cavity, a sealing member for sealing is provided between the light-transmitting plate and the sealed cavity, a filter component for filtering light passing through the optical lens connecting seat is provided in the installation chamber, a cooling component for cooling the imaging chip is provided on the sealed cavity, and a drying member is provided on the sealed cavity, the drying member is used to absorb moisture in the air between the sealed cavity and the light-transmitting plate.

[0009] By adopting the above technical solution, the designers seal the imaging chip between the light-transmitting plate and the sealed cavity through the sealing component, and then absorb the moisture in the air between the sealed cavity and the light-transmitting plate through the drying component. When the imaging chip is working, the cooling component cools the sealed cavity. Since the moisture in the air in the sealed cavity is absorbed, no water condenses. The light transmitted through the optical lens connector passes through the filter component and is projected onto the photosensitive area of ​​the imaging chip for imaging. In this process, since there is no need to evacuate the environment in which the imaging chip is located, the difficulty of sealing the environment in which the imaging chip is located is reduced, thereby reducing the manufacturing cost and difficulty.

[0010] Optionally, the drying element includes a drying tube connected to the interior of the sealed cavity, a desiccant is provided in the drying tube, and a sealing end plate is detachably provided at one end of the drying tube facing away from the sealed cavity.

[0011] By adopting the above technical solution, the desiccant in the drying tube absorbs moisture in the air in the sealed cavity through the connection between the drying tube and the sealed cavity, thereby reducing the possibility of water condensation on the imaging chip when the sealed cavity is cooled.

[0012] Optionally, the sealing member includes a fixed frame bolted to the open end of the sealing cavity, a light-transmitting opening is provided on the fixed frame, the light-transmitting plate is used to seal the light-transmitting opening on the fixed frame, a sealing ring is provided between the fixed frame and the sealing cavity, and the open end of the sealing cavity is provided with a receiving groove for accommodating the sealing ring.

[0013] By adopting the above technical solution, the designers placed the sealing ring in the receiving groove of the sealed cavity, and then sealed the open end of the sealed cavity by bolting the fixing frame. The light passing through the optical lens connector passes through the light-transmitting plate and then through the light-transmitting port to the photosensitive area of ​​the imaging chip, reducing the possibility of moisture in the external air entering the sealed cavity.

[0014] Optionally, a main control board is provided in the installation chamber, a heating plate is provided on the fixed frame, the heating plate is located on the side of the light-transmitting plate facing away from the fixed frame, and a heating resistor electrically connected to the main control board is provided on the heating plate.

[0015] By adopting the above technical solution, when the cooling component cools the imaging chip, a low temperature will be formed in the cavity where the imaging chip is located, and the low temperature will be transmitted to the side of the light-transmitting plate close to the imaging chip. Then the main control board controls the heating resistor on the heating plate to operate, so that the side of the light-transmitting plate facing away from the imaging chip is heated up, thereby reducing the possibility of moisture in the external air condensing into water droplets on the side of the light-transmitting plate facing away from the imaging chip, thereby reducing the impact on the imaging effect of the imaging chip.

[0016] Optionally, the cooling component includes a semiconductor cooler arranged between the sealed cavity and the circuit board, the hot end surface of the semiconductor cooler is attached to the inner side wall of the closed end of the sealed cavity, the closed end of the sealed cavity extends to the outside of the rear shell and is provided with a heat sink, a plurality of heat sink fins are provided on the side of the heat sink facing away from the sealed cavity, a fan electrically connected to the main control board is provided on the rear shell, and the fan faces the heat sink fins.

[0017] By adopting the above technical solution, the circuit board controls the operation of the semiconductor cooler, the cold end of the semiconductor cooler cools the imaging chip, the hot end of the semiconductor cooler transfers the temperature to the closed end of the sealed cavity, and transfers the heat to the heat dissipation fins through the heat dissipation plate, and then the main control board controls the operation of the fan, and the fan dissipates heat and cools the heat dissipation plate and the heat dissipation fins, thereby placing the imaging chip in a suitable low-temperature working environment, which is beneficial to improving the imaging effect of the imaging chip.

[0018] Optionally, the filter assembly includes a wheel rotatably mounted on the rear shell, a plurality of mounting holes being evenly arranged circumferentially on the wheel, each mounting hole being provided with a filter sheet for filtering light passing through the optical lens connecting seat, and a driving member for driving the wheel to rotate and an angle control for controlling the rotation angle of the wheel being provided on the rear shell.

[0019] By adopting the above technical solution, when photos with different filtering effects are needed, the user drives the wheel to rotate through the driving member, and the angle control controls the angle of rotation of the wheel, so that different filter sheets are rotated between the optical lens connecting seat and the light-transmitting plate, thereby obtaining photos with different filtering effects.

[0020] Optionally, the driving member includes a driving motor arranged on the rear shell and electrically connected to the main control board, and a friction sleeve is provided on the output shaft of the driving motor, and the circumferential outer wall of the friction sleeve is tightly attached to the circumferential outer wall of the wheel disc.

[0021] By adopting the above technical solution, the main control board controls the operation of the drive motor, the output shaft of the drive motor drives the friction sleeve to rotate, and the friction sleeve drives the wheel to rotate through friction. In this process, it is helpful to reduce the torque required to drive the wheel.

[0022] Optionally, the angle control includes an optocoupler transmitting end arranged on the main control board, a mounting post is provided on the rear shell, an extension plate is provided on the mounting post, an optocoupler receiving end electrically connected to the main control board is provided on the extension plate, the edge of the wheel is located between the optocoupler transmitting end and the optocoupler receiving end, and a plurality of positioning holes are evenly opened circumferentially on the wheel, the positioning holes correspond one-to-one to the filter sheets, and the optocoupler transmitting end points to the optocoupler receiving end through the positioning holes.

[0023] By adopting the above technical solution, when the wheel rotates, the positioning hole on the wheel will be staggered with the optocoupler transmitting end, and the signal emitted by the optocoupler transmitting end cannot be received by the optocoupler receiving end until the next positioning hole on the wheel is located on the line connecting the optocoupler transmitting end and the optocoupler receiving end. At this time, the filter lens conversion is completed, and photos with different filtering effects can be obtained.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. Designers use a seal to seal the imaging chip between the light-transmitting plate and the sealed cavity. Then, a desiccant absorbs moisture from the air between the sealed cavity and the light-transmitting plate. When the imaging chip is operating, the cooling component cools the sealed cavity. Because the moisture in the air in the sealed cavity is absorbed, condensation does not occur. Light transmitted through the optical lens connector passes through the filter component and strikes the photosensitive area of ​​the imaging chip to form an image. This process eliminates the need to evacuate the environment surrounding the imaging chip, reducing the difficulty of sealing the environment and, in turn, lowering manufacturing costs and complexity.

[0026] 2. The desiccant in the drying tube absorbs moisture from the air in the sealed cavity through the connection between the drying tube and the sealed cavity, thereby reducing the possibility of condensation on the imaging chip when the sealed cavity is cooled;

[0027] 3. The circuit board controls the operation of the semiconductor cooler. The cold end of the semiconductor cooler cools down the imaging chip. The hot end of the semiconductor cooler transfers the temperature to the closed end of the sealed cavity, and transfers the heat to the heat dissipation fins through the heat sink. Then the main control board controls the fan to work. The fan dissipates heat and cools the heat sink and heat dissipation fins, thereby keeping the imaging chip in a suitable low-temperature working environment, which is beneficial to improving the imaging effect of the imaging chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of an embodiment of the present application.

[0029] Figure 2 It is a cross-sectional view showing the positional relationship among the front shell, rear shell and sealed cavity in the embodiment of the present application.

[0030] Figure 3 It is a structural diagram of the positional relationship between the wheel, the optical coupler transmitting end and the optical coupler receiving end in the embodiment of the present application.

[0031] Figure 4 It is a structural diagram of the positional relationship among the heating plate, heating resistor and sealed cavity in the embodiment of the present application.

[0032] Figure 5 It is a cross-sectional view showing the positional relationship among the semiconductor cooler, the imaging chip and the sealed cavity in the embodiment of the present application.

[0033] Explanation of the reference numerals: 1. front shell; 2. rear shell; 3. mounting chamber; 4. optical lens connector; 5. sealing chamber; 6. circuit board; 7. imaging chip; 8. light-transmitting plate; 9. sealing member; 91. fixing frame; 92. light-transmitting port; 93. sealing ring; 94. receiving groove; 10. filter assembly; 101. wheel; 102. mounting hole; 103. filter sheet; 104. driving member; 1041. driving motor; 1042. friction bushing; 105. angle control member ;1051, optocoupler transmitting end;1052, mounting column;1053, extension plate;1054, optocoupler receiving end;1055, positioning hole;11, cooling component;111, semiconductor refrigerator;112, heat sink;113, heat sink fin;114, fan;12, drying element;121, drying tube;122, desiccant;123, sealing end plate;13, main control board;14, heating plate;15, heating resistor;16, mounting base;17, sealing ring. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-5 This application is described in further detail.

[0035] The embodiment of the present application discloses a small camera.

[0036] Reference Figure 1 A small camera includes a front shell 1 and a rear shell 2. The front shell 1 is bolted to the rear shell 2. A mounting seat 16 is welded on the rear shell 2. An installation chamber 3 is formed between the front shell 1 and the rear shell 2. An optical lens connecting seat 4 is bolted to the front shell 1. The optical lens connecting seat 4 can be bolted to optical lenses of different sizes and models. A USB interface (not shown in the figure) is bolted to the rear shell 2.

[0037] Reference Figure 2 、 Figure 3 and Figure 4A main control board 13 is arranged in the installation chamber 3. A sealed cavity 5 with a hollow interior and an opening toward the optical lens connecting seat 4 is arranged in the installation chamber 3. A circuit board 6 and an imaging chip 7 are arranged in the sealed cavity 5. The imaging chip 7 can adopt a CMOS sensor in the prior art. The circuit board 6 is electrically connected to the main control board 13, and the imaging chip 7 is electrically connected to the circuit board 6. The photosensitive area of ​​the imaging chip 7 faces the opening end of the sealed cavity 5.

[0038] Reference Figure 2 、 Figure 4 and Figure 5 A light-transmitting plate 8 is arranged at the open end of the sealed cavity 5. The light-transmitting plate 8 can be made of a transparent glass plate. A sealing member 9 for sealing is arranged between the light-transmitting plate 8 and the sealed cavity 5. The sealing member 9 includes a fixed frame 91 bolted to the open end of the sealed cavity 5. A light-transmitting opening 92 is opened in the center of the fixed frame 91. The light-transmitting plate 8 is used to seal the light-transmitting opening 92 on the fixed frame 91. A sealant is arranged between the light-transmitting plate 8 and the fixed frame 91.

[0039] Reference Figure 2 、 Figure 4 and Figure 5 A sealing ring 93 is provided between the fixed frame 91 and the sealing cavity 5. The sealing ring 93 is made of rubber material. A receiving groove 94 is provided at the open end of the sealing cavity 5 to accommodate the sealing ring 93. A heating plate 14 is bolted to the fixed frame 91. The heating plate 14 is located on the side of the light-transmitting plate 8 facing away from the fixed frame 91. A heating resistor 15 electrically connected to the main control board 13 is welded on the heating plate 14.

[0040] Reference Figure 2 、 Figure 4 and Figure 5 A drying element 12 is arranged on the sealed cavity 5. The drying element 12 is used to absorb moisture in the air between the sealed cavity 5 and the light-transmitting plate 8. The drying element 12 includes a drying tube 121 welded to the sealed cavity 5 and connected to the inside of the sealed cavity 5. The drying tube 121 passes through the rear shell 2. A desiccant 122 is placed in the drying tube 121. The desiccant 122 can be a silica gel desiccant 122 in the prior art. A sealing end plate 123 is bolted to one end of the drying tube 121 facing away from the sealed cavity 5. A sealing ring 17 is arranged between the sealing end plate 123 and the drying tube 121.

[0041] The designer bolts the fixing frame 91 to the open end of the sealed cavity 5 and seals the open end of the sealed cavity 5 through the sealing ring 93. Then, the sealing end plate 123 at the end of the drying tube 121 is unscrewed, and the desiccant 122 is placed into the drying tube 121. After tightening the sealing end plate 123 and sealing it through the sealing ring 17, the desiccant 122 will absorb the moisture in the air in the sealed cavity where the imaging chip 7 is located.

[0042] Reference Figure 2 、 Figure 4 and Figure 5 A cooling component 11 for cooling the imaging chip 7 is arranged on the sealed cavity 5. The cooling component 11 includes a semiconductor cooler 111 arranged between the sealed cavity 5 and the circuit board 6. The cold end surface of the semiconductor cooler 111 is attached to the circuit board 6, and the imaging chip 7 is located on the side of the circuit board 6 facing away from the semiconductor cooler 111.

[0043] Reference Figure 2 、 Figure 3 and Figure 5 The hot end surface of the semiconductor cooler 111 is attached to the inner wall of the closed end of the sealed cavity 5. The closed end of the sealed cavity 5 extends to the outside of the rear shell 2 and is integrally formed with a heat sink 112. A plurality of heat dissipation fins 113 are integrally formed on the side of the heat dissipation plate 112 facing away from the sealed cavity 5. A fan 114 electrically connected to the main control board 13 is bolted to the rear shell 2, and the air outlet end of the fan 114 faces the heat dissipation fins 113.

[0044] When the imaging chip 7 is working, the circuit board 6 controls the semiconductor cooler 111 to work, the cold end of the semiconductor cooler 111 cools the imaging chip 7, and the hot end of the semiconductor cooler 111 transfers the temperature to the closed end of the sealed cavity 5, and diffuses the heat to the heat sink 112 and the heat dissipating fins 113 through heat transfer. Then the main control board 13 controls the fan 114 to work, and the fan 114 dissipates heat and cools the heat sink 112 and the heat dissipating fins 113, thereby achieving a rapid cooling effect on the closed end of the sealed cavity 5.

[0045] At this time, a low temperature will be formed in the sealed cavity where the imaging chip 7 is located, and the low temperature will be transferred to the side of the light-transmitting plate 8 close to the imaging chip 7. The side of the light-transmitting plate 8 close to the imaging chip 7 will cool down rapidly, and then the main control board 13 controls the heating resistor 15 on the heating plate 14 to work. The heating resistor 15 generates heat to heat up the heating plate 14. The heating plate 14 heats up and heats up the side of the light-transmitting plate 8 facing away from the imaging chip 7 through heat transfer, thereby reducing the moisture in the external air from condensing into water droplets on the side of the light-transmitting plate 8 facing away from the imaging chip 7.

[0046] Reference Figure 2 、 Figure 3 and Figure 5 A filter assembly 10 for filtering the light transmitted through the optical lens connector 4 is arranged in the mounting chamber 3. The filter assembly 10 includes a wheel 101 rotatably arranged on the rear housing 2. A plurality of mounting holes 102 are evenly opened circumferentially on the wheel 101. A filter sheet 103 is bonded to each mounting hole 102. The filter sheet 103 is used to filter the light transmitted through the optical lens connector 4. The filtering effect of each filter sheet 103 is different.

[0047] Reference Figure 2 and Figure 3 A driving member 104 for driving the wheel disc 101 to rotate is arranged on the rear shell 2. The driving member 104 includes a driving motor 1041 bolted to the rear shell 2 and electrically connected to the main control board 13. A friction sleeve 1042 is welded on the output shaft of the driving motor 1041. The circumferential outer wall of the friction sleeve 1042 is in close contact with the circumferential outer wall of the wheel disc 101. The driving member 104 can also be driven by installing a mutually meshing gear set between the output shaft of the driving motor 1041 and the wheel disc 101, or by a synchronous belt between the output shaft of the driving motor 1041 and the wheel disc 101.

[0048] Reference Figure 2 and Figure 3 An angle control 105 for controlling the rotation angle of the wheel 101 is arranged on the rear shell 2. The angle control 105 includes an optocoupler transmitting end 1051 welded to the main control board 13. A mounting column 1052 is bolted to the rear shell 2. An extension plate 1053 is welded to the mounting column 1052. An optocoupler receiving end 1054 electrically connected to the main control board 13 is welded to the extension plate 1053.

[0049] Reference Figure 2 and Figure 3 The edge of the wheel 101 is located between the optocoupler transmitting end 1051 and the optocoupler receiving end 1054. A plurality of positioning holes 1055 are evenly opened circumferentially on the wheel 101. The positioning holes 1055 correspond one-to-one to the filter lens 103. The optocoupler transmitting end 1051 points to the optocoupler receiving end 1054 through the positioning holes 1055.

[0050] When the user needs to obtain photos with different filtering effects, the main control board 13 controls the drive motor 1041 to work. The output shaft of the drive motor 1041 drives the friction sleeve 1042 to rotate. The friction sleeve 1042 drives the wheel 101 to rotate through friction. During the rotation of the wheel 101, the positioning hole 1055 on the wheel 101 will first be offset from the optical coupler transmitting end 1051. At this time, the signal transmitted by the optical coupler transmitting end 1051 is blocked by the wheel 101 and cannot be received by the optical coupler receiving end 1054.

[0051] Until the next positioning hole 1055 on the wheel 101 is located on the line connecting the optocoupler transmitting end 1051 and the optocoupler receiving end 1054, at this time the optocoupler receiving end 1054 receives the signal from the optocoupler transmitting end 1051, the main control board 13 controls the drive motor 1041 to stop working, and the wheel 101 drives the filter sheet 103 with different filtering effects to be located between the optical lens connecting seat 4 and the light-transmitting plate 8, so that photos with different filtering effects can be taken.

[0052] The implementation principle of a small camera in an embodiment of the present application is as follows: the designer bolts the fixing frame 91 to the open end of the sealed cavity 5, and seals the open end of the sealed cavity 5 through the sealing ring 93, then unscrews the sealing end plate 123 at the end of the drying tube 121, and places the desiccant 122 into the drying tube 121. After tightening the sealing end plate 123 and sealing through the sealing ring 17, the desiccant 122 will absorb the moisture in the air in the sealed cavity where the imaging chip 7 is located.

[0053] When the imaging chip 7 is working, the circuit board 6 controls the semiconductor cooler 111 to work, the cold end of the semiconductor cooler 111 cools the imaging chip 7, and the hot end of the semiconductor cooler 111 transfers the temperature to the closed end of the sealed cavity 5, and diffuses the heat to the heat sink 112 and the heat dissipating fins 113 through heat transfer. Then the main control board 13 controls the fan 114 to work, and the fan 114 dissipates heat and cools the heat sink 112 and the heat dissipating fins 113, thereby achieving a rapid cooling effect on the closed end of the sealed cavity 5.

[0054] At this time, a low temperature will be formed in the sealed cavity where the imaging chip 7 is located, and the low temperature will be transferred to the side of the light-transmitting plate 8 close to the imaging chip 7. The side of the light-transmitting plate 8 close to the imaging chip 7 will cool down rapidly, and then the main control board 13 controls the heating resistor 15 on the heating plate 14 to work. The heating resistor 15 generates heat to heat up the heating plate 14. The heating plate 14 heats up and heats up the side of the light-transmitting plate 8 facing away from the imaging chip 7 through heat transfer, thereby reducing the moisture in the external air from condensing into water droplets on the side of the light-transmitting plate 8 facing away from the imaging chip 7.

[0055] When the user needs to obtain photos with different filtering effects, the main control board 13 controls the drive motor 1041 to work. The output shaft of the drive motor 1041 drives the friction sleeve 1042 to rotate. The friction sleeve 1042 drives the wheel 101 to rotate through friction. During the rotation of the wheel 101, the positioning hole 1055 on the wheel 101 will first be offset from the optical coupler transmitting end 1051. At this time, the signal transmitted by the optical coupler transmitting end 1051 is blocked by the wheel 101 and cannot be received by the optical coupler receiving end 1054.

[0056] Until the next positioning hole 1055 on the wheel 101 is located on the line connecting the optocoupler transmitting end 1051 and the optocoupler receiving end 1054, at this time the optocoupler receiving end 1054 receives the signal from the optocoupler transmitting end 1051, the main control board 13 controls the drive motor 1041 to stop working, and the wheel 101 drives the filter sheet 103 with different filtering effects to be located between the optical lens connecting seat 4 and the light-transmitting plate 8, so that photos with different filtering effects can be taken.

[0057] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A small camera, characterized in that: The invention comprises a front shell (1) and a rear shell (2), wherein an installation chamber (3) is formed between the front shell (1) and the rear shell (2), an optical lens connection seat (4) is provided on the front shell (1), a sealed cavity (5) which is hollow inside and opens toward one side of the optical lens connection seat (4) is provided in the installation chamber (3), a circuit board (6) and an imaging chip (7) are provided in the sealed cavity (5), the imaging chip (7) is electrically connected to the circuit board (6), a photosensitive area of ​​the imaging chip (7) faces the open end of the sealed cavity (5), and the sealed cavity (5) is provided with a plurality of holes. ) is provided with a light-transmitting plate (8) at the open end thereof, a sealing member (9) for sealing is provided between the light-transmitting plate (8) and the sealed cavity (5), a filter assembly (10) for filtering light transmitted by the optical lens connector (4) is provided in the mounting cavity (3), a cooling assembly (11) for cooling the imaging chip (7) is provided on the sealed cavity (5), and a drying member (12) is provided on the sealed cavity (5), and the drying member (12) is used to absorb moisture in the air between the sealed cavity (5) and the light-transmitting plate (8).

2. A small camera according to claim 1, characterized in that: The drying element (12) comprises a drying tube (121) in communication with the interior of the sealed cavity (5), a desiccant (122) is provided in the drying tube (121), and a sealing end plate (123) is detachably provided at one end of the drying tube (121) facing away from the sealed cavity (5).

3. The small camera according to claim 1, wherein: The sealing member (9) comprises a fixed frame (91) bolted to the open end of the sealing cavity (5), a light-transmitting opening (92) is provided on the fixed frame (91), the light-transmitting plate (8) is used to block the light-transmitting opening (92) on the fixed frame (91), a sealing ring (93) between the fixed frame (91) and the sealing cavity (5), and a receiving groove (94) for receiving the sealing ring (93) is provided at the open end of the sealing cavity (5).

4. A small camera according to claim 3, characterized in that: A main control board (13) is provided in the installation chamber (3), a heating plate (14) is provided on the fixing frame (91), the heating plate (14) is located on the side of the light-transmitting plate (8) facing away from the fixing frame (91), and a heating resistor (15) electrically connected to the main control board (13) is provided on the heating plate (14).

5. A small camera according to claim 4, characterized in that: The cooling component (11) includes a semiconductor cooler (111) arranged between the sealed cavity (5) and the circuit board (6), the hot end surface of the semiconductor cooler (111) is attached to the inner side wall of the closed end of the sealed cavity (5), the closed end of the sealed cavity (5) extends to the outside of the rear shell (2) and is provided with a heat dissipation plate (112), a side of the heat dissipation plate (112) facing away from the sealed cavity (5) is provided with a plurality of heat dissipation fins (113), and the rear shell (2) is provided with a fan (114) electrically connected to the main control board (13), and the fan (114) faces the heat dissipation fins (113).

6. The small camera according to claim 4, characterized in that: The filter assembly (10) comprises a wheel (101) rotatably arranged on the rear housing (2); a plurality of mounting holes (102) are uniformly opened on the wheel (101) in a circumferential direction; a filter lens (103) is provided on each mounting hole (102); the filter lens (103) is used to filter light transmitted through the optical lens connection seat (4); and a driving member (104) for driving the wheel (101) to rotate and an angle control member (105) for controlling the rotation angle of the wheel (101) are provided on the rear housing (2).

7. The small camera according to claim 6, characterized in that: The driving member (104) comprises a driving motor (1041) arranged on the rear housing (2) and electrically connected to the main control board (13); a friction sleeve (1042) is arranged on the output shaft of the driving motor (1041); and the circumferential outer wall of the friction sleeve (1042) is in close contact with the circumferential outer wall of the wheel disc (101).

8. The small camera according to claim 7, characterized in that: The angle control (105) comprises an optical coupler transmitting end (1051) arranged on the main control board (13); a mounting post (1052) is arranged on the rear shell (2); an extension plate (1053) is arranged on the mounting post (1052); an optical coupler receiving end (1054) electrically connected to the main control board (13) is arranged on the extension plate (1053); an edge of the wheel (101) is located between the optical coupler transmitting end (1051) and the optical coupler receiving end (1054); a plurality of positioning holes (1055) are uniformly opened circumferentially on the wheel (101); the positioning holes (1055) correspond one-to-one to the filter lens (103); the optical coupler transmitting end (1051) points to the optical coupler receiving end (1054) through the positioning holes (1055).

Citation Information

Patent Citations

  • High-speed camera with forward heat dissipation of image sensor chip

    CN115529430A