Mixed-voltage stepped high-frequency multilayer blind hole circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a mixed-voltage stepped high-frequency multilayer blind hole circuit board, which comprises a stepped high-frequency multilayer board, a plurality of blind holes are arranged at the top of the stepped high-frequency multilayer board, a frame body is inserted on the outer side of the stepped high-frequency multilayer board, a plurality of supporting strips are mounted at the bottom of the frame body, and the blind holes are communicated with the blind holes. And a connecting assembly is arranged between the connecting plate and the mounting frame. According to the utility model, the mounting frame is firstly fixed on a mounting hole position of equipment through the screw and the fixing hole, then the pull rod is pulled to enable the insertion rod to slide and the spring to be stretched, then the connecting plate is inserted into the limiting groove, the pull rod is opened, the insertion rod can be inserted into the insertion hole through the restoring force of the spring, the connecting plate is fixed on the mounting frame, and the mounting of the circuit board is completed. And during disassembly, the two pull rods are close to each other, so that the mounting frame and the equipment mounting hole do not need to be disassembled even if subsequent frequent disassembly is carried out, and the situation that the mounting hole is damaged due to frequent disassembly is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a mixed-voltage stepped high-frequency multi-layer blind hole circuit board. Background Art

[0002] Circuit boards miniaturize and visualize circuits, playing an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. With the development of electronic information technology, the requirements for circuit boards are becoming increasingly stringent. Multilayer boards are increasingly used due to their high assembly density, small size, light weight, and the ability to increase the number of wiring layers, thereby increasing design flexibility. They can form circuits with a certain impedance, high-speed transmission circuits, and the ability to set circuit and magnetic circuit shielding layers.

[0003] Chinese Utility Model Publication No. CN218772540U discloses a mixed-voltage stepped high-frequency multi-layer blind-hole circuit board, comprising a multi-layer board, wherein the upper and lower ends of the multi-layer board are jointly equipped with an anti-bending device, the upper left portion and the upper right portion of the multi-layer board are each provided with a plurality of conductive blind holes, the left and right ends of the multi-layer board are each provided with a connecting frame, the upper front and rear ends of the two connecting frames are each provided with a No. 1 screw hole, the upper ends of the two connecting frames are jointly equipped with a connecting protection device, and the opposite ends of the two connecting frames are jointly equipped with a buffer device. The mixed-voltage stepped high-frequency multi-layer blind-hole circuit board described in this utility model can not only avoid misalignment between the two boards through the connection protection device, but also protect the multi-layer board and reduce scratches on the front of the multi-layer board. The buffer device can effectively reduce the shaking of the multi-layer board, and the anti-bending device can reduce the degree of bending of the multi-layer board when subjected to force, thereby increasing the service life of the multi-layer board.

[0004] The applicant found that this patent had some shortcomings in use: the mounting base was installed on the mounting hole of the device by means of mounting screws, but frequent disassembly and assembly would damage the structure of the mounting hole of the device, which may cause the subsequent fixing of the mounting base and the mounting hole to be unstable.

[0005] Therefore, the present invention designs a mixed-voltage stepped high-frequency multi-layer blind hole circuit board to solve the problems existing in the prior art. Utility Model Content

[0006] The purpose of the utility model is to provide a mixed-voltage stepped high-frequency multi-layer blind hole circuit board to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a mixed-pressure stepped high-frequency multilayer blind hole circuit board, comprising: a stepped high-frequency multilayer board, a plurality of blind holes being opened on the top of the stepped high-frequency multilayer board, a frame being plugged into the outside of the stepped high-frequency multilayer board, a plurality of support bars being installed on the bottom of the frame, a limiting assembly for limiting the stepped high-frequency multilayer board being provided on the frame, damping spring shock absorbers being provided at the four corners of the bottom of the frame, the bottoms of the two damping spring shock absorbers on both sides being fixedly installed to the two ends of the top of the two connecting plates respectively, a mounting frame being provided below both ends of the connecting plate, a connecting assembly being provided between the connecting plate and the mounting frame, and a fixing hole being provided at the bottom of the mounting frame.

[0008] Preferably, the limiting assembly includes two moving frames, which are respectively slidably connected to the top two sides of the stepped high-frequency multilayer board. The inner side wall of the frame is provided with a sliding groove slidably connected to the moving frame. A bolt is rotatably installed on one side of the moving frame through a bearing. The bolt is rotatably connected to the frame through a thread. A guide rod slidably connected to the frame is fixedly installed on one side of the moving frame. The bolt is rotated to make the moving frame slide out of the sliding groove to limit the top of the circuit board, thereby improving the stability of the circuit board.

[0009] Preferably, a rotating rod is rotatably installed at the bottom of the movable frame, and the rotating rod is rollingly connected to the top of the stepped high-frequency multilayer board. The rotating rod rolls on the top of the circuit board to reduce the friction between the movable frame and the circuit board.

[0010] Preferably, the connecting assembly includes four fixing plates, which are respectively installed at the two ends of the bottom of the two connecting plates, and a plug rod is slidably installed on the fixing plate. A connecting block is installed at one end of the plug rod, and a spring is connected between the connecting block and the fixing plate. A socket for plugging with the plug rod is opened on the installation frame. When disassembling, the two connecting blocks are brought close to each other, and the plug rod slides on the fixing plate and leaves the socket, and the connecting plate can be taken out upward to complete the disassembly.

[0011] Preferably, a pull rod is installed on one side of the connecting block, and the pull rod facilitates the staff to stretch the connecting block.

[0012] Preferably, a limiting groove for plugging into the connecting plate is provided on the top of the installation frame, and the connecting plate is plugged into the limiting groove, which can improve the stability of the connecting plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] 1. The utility model first fixes the mounting frame to the mounting hole of the equipment through screws and fixing holes, then pulls the pull rod to make the insertion rod slide and stretch the spring, and then inserts the connecting plate into the limit slot. The pull rod is then opened, and the restoring force of the spring allows the insertion rod to be inserted into the insertion hole, fixing the connecting plate to the mounting frame, completing the installation of the circuit board. When disassembling, the two pull rods can be brought close to each other. Even if the subsequent disassembly is frequent, the installation frame and the equipment mounting hole do not need to be disassembled, avoiding the situation where the mounting hole is damaged due to frequent disassembly;

[0015] 2. The utility model inserts the circuit board into the frame, supports it with support bars, and then rotates the bolts to slide the movable frame into the slide groove, thereby limiting the top of the circuit board and stabilizing it in the frame. The frame and support bars can improve the overall bending strength of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main view of the utility model;

[0017] Figure 2 This is a schematic diagram of the support bar structure of the utility model;

[0018] Figure 3 This is a bottom view schematic diagram of the limit assembly structure of the present utility model;

[0019] Figure 4 This is a schematic diagram of the connection assembly structure of the utility model;

[0020] Figure 5 This is a schematic diagram of the installation frame structure of the utility model.

[0021] In the figure: 1. Stepped high-frequency multilayer board; 2. Blind hole; 3. Frame; 4. Support bar; 5. Limiting assembly; 501. Moving frame; 502. Slide groove; 503. Bolt; 504. Guide rod; 505. Rotating rod; 6. Damping spring shock absorber; 7. Connecting plate; 8. Mounting frame; 9. Connecting assembly; 901. Fixed plate; 902. Insert rod; 903. Connecting block; 904. Spring; 905. Pull rod; 906. Socket; 907. Limiting slot; 10. Fixing hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1-5The utility model provides an embodiment: a mixed-pressure stepped high-frequency multi-layer blind hole circuit board, comprising: a stepped high-frequency multi-layer board 1, a plurality of blind holes 2 are opened on the top of the stepped high-frequency multi-layer board 1, a frame 3 is inserted into the outside of the stepped high-frequency multi-layer board 1, a plurality of support bars 4 are installed at the bottom of the frame 3, a limiting component 5 for limiting the stepped high-frequency multi-layer board 1 is provided on the frame 3, damping spring shock absorbers 6 are provided at the four corners of the bottom of the frame 3, the bottoms of the two damping spring shock absorbers 6 on both sides are fixed to the two ends of the top of the two connecting plates 7 respectively, and mounting frames 8 are provided below both ends of the connecting plates 7, a connecting component 9 is provided between the connecting plate 7 and the mounting frame 8, and a fixing hole 10 is opened at the bottom of the mounting frame 8. The damping spring shock absorber 6 can improve the seismic resistance of the stepped high-frequency multi-layer board 1.

[0024] See also Figure 3 In this embodiment: the limiting assembly 5 includes two moving frames 501, which are respectively slidably connected to the top two sides of the stepped high-frequency multilayer board 1. The inner side wall of the frame 3 is provided with a sliding groove 502 which is slidably connected to the moving frame 501. A bolt 503 is rotatably installed on one side of the moving frame 501 through a bearing. The bolt 503 is rotatably connected to the frame 3 through a thread. A guide rod 504 which is slidably connected to the frame 3 is fixedly installed on one side of the moving frame 501.

[0025] See also Figure 3 In this embodiment, a rotating rod 505 is rotatably installed at the bottom of the movable frame 501, and the rotating rod 505 is rollingly connected to the top of the stepped high-frequency multilayer board 1.

[0026] See also Figure 4 In this embodiment: the connecting assembly 9 includes four fixed plates 901, which are respectively installed at the two ends of the bottom of the two connecting plates 7, and a plug rod 902 is slidably installed on the fixed plate 901. A connecting block 903 is installed at one end of the plug rod 902. A spring 904 is connected between the connecting block 903 and the fixed plate 901, and a socket 906 for plugging with the plug rod 902 is opened on the installation frame 8.

[0027] See also Figure 4 In this embodiment, a pull rod 905 is installed on one side of the connecting block 903.

[0028] See also Figure 5 In this embodiment, a limiting groove 907 for plugging into the connecting plate 7 is provided on the top of the mounting frame 8 .

[0029] Working principle: Insert the stepped high-frequency multilayer board 1 into the frame 3, and support the stepped high-frequency multilayer board 1 with the support bars 4. Use several support bars 4 to avoid affecting the heat dissipation at the bottom of the stepped high-frequency multilayer board 1. Then rotate the bolt 503 to slide the mobile frame 501 out of the mobile frame 501. Use the rotating rod 505 to reduce the friction between the mobile frame 501 and the stepped high-frequency multilayer board 1. The mobile frame 501 limits the top of the stepped high-frequency multilayer board 1, making the stepped high-frequency multilayer board 1 more stable in the frame 3. The strength of the stepped high-frequency multilayer board 1 is improved by the frame 3 and the support bars 4. Insert the screws into the fixing holes 10 and then fix the mounting frame 8 to the mounting hole position of the equipment. 906, and the connecting plate 7 is fixed on the mounting frame 8 to complete the installation of the stepped high-frequency multilayer board 1. When disassembling, the two pull rods 905 can be brought close to each other again. Even if disassembly is frequent, the mounting holes of the equipment will not be damaged, thereby avoiding the situation where the installation is not firm after damage. The content not described in detail in this description belongs to the existing technology known to professional and technical personnel in this field.

[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A mixed-voltage ladder high-frequency multi-layer blind hole circuit board, comprising: A stepped high-frequency multilayer board (1) is characterized in that: a plurality of blind holes (2) are provided on the top of the stepped high-frequency multilayer board (1); a frame (3) is plugged into the outside of the stepped high-frequency multilayer board (1); a plurality of support bars (4) are installed at the bottom of the frame (3); a limiting component (5) for limiting the stepped high-frequency multilayer board (1) is provided on the frame (3); damping spring shock absorbers (6) are provided at the four corners of the bottom of the frame (3); the bottoms of the two damping spring shock absorbers (6) on both sides are fixedly installed to the two ends of the top of two connecting plates (7); a mounting frame (8) is provided below both ends of the connecting plate (7); a connecting component (9) is provided between the connecting plate (7) and the mounting frame (8); and a fixing hole (10) is provided at the bottom of the mounting frame (8).

2. The mixed-voltage stepped high-frequency multi-layer blind via circuit board according to claim 1, characterized in that: The limiting assembly (5) includes two movable frames (501), and the two movable frames (501) are respectively slidably connected to the top two sides of the stepped high-frequency multilayer board (1). The inner side wall of the frame body (3) is provided with a sliding groove (502) slidably connected to the movable frame (501). A bolt (503) is rotatably installed on one side of the movable frame (501) through a bearing. The bolt (503) is rotatably connected to the frame body (3) through a thread. A guide rod (504) slidably connected to the frame body (3) is fixedly installed on one side of the movable frame (501).

3. The mixed-voltage stepped high-frequency multi-layer blind via circuit board according to claim 2, characterized in that: A rotating rod (505) is rotatably mounted on the bottom of the movable frame (501), and the rotating rod (505) is rollingly connected to the top of the stepped high-frequency multilayer board (1).

4. The mixed-voltage stepped high-frequency multi-layer blind via circuit board according to claim 1, characterized in that: The connecting assembly (9) comprises four fixing plates (901), the four fixing plates (901) being respectively mounted at the two ends of the bottom of the two connecting plates (7), an insertion rod (902) being slidably mounted on the fixing plates (901), a connecting block (903) being mounted at one end of the insertion rod (902), a spring (904) being connected between the connecting block (903) and the fixing plate (901), and a socket (906) being connected to the insertion rod (902) being provided on the mounting frame (8).

5. The mixed-voltage stepped high-frequency multi-layer blind via circuit board according to claim 4, characterized in that: A pull rod (905) is installed on one side of the connecting block (903).

6. The mixed-voltage stepped high-frequency multi-layer blind via circuit board according to claim 4, characterized in that: The top of the installation frame (8) is provided with a limiting groove (907) for plugging into the connecting plate (7).

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