Multi-channel ultra-wideband miniaturized frequency conversion module

Abstract

The utility model relates to the technical field of communication frequency conversion modules, in particular to a multichannel ultra-wideband miniaturized frequency conversion module, which comprises four layers of dielectric substrates which are longitudinally stacked, a top layer dielectric substrate is provided with a top layer micro-strip, a bottom layer dielectric substrate is provided with a bottom layer micro-strip, and a top layer micro-strip is arranged on the bottom layer micro-strip. The top-layer micro-strip and the bottom-layer micro-strip are connected through a signal column and form a vertical interconnection structure; a plurality of signal pins are also arranged on the outer sides of the top layer microstrip and the bottom layer microstrip; and the signal pins penetrate through the four layers of dielectric substrates and form connecting pins below. According to the frequency conversion module disclosed by the utility model, relatively better integration level is achieved, and the size of the frequency conversion module can be reduced, so that the application field of the frequency conversion module is expanded, and the frequency conversion module is more flexible and diversified to carry and use.

Description

Technical Field

[0001] The utility model relates to the technical field of communication frequency conversion modules, in particular to a multi-channel ultra-wideband miniaturized frequency conversion module. Background Art

[0002] Communication modules are becoming increasingly integrated. This high level of integration is leading to a growing number of layers in their structures, each housing multiple functional circuits. This results in complex module functionality. Currently, glass insulators are used for interconnection and signal transmission between layers within the module. This interconnection method is unsuitable for the miniaturization and lightweight requirements of various small platforms. Furthermore, conventional multi-channel frequency conversion modules cannot be integrated into the antenna front end in system applications due to their large size. Instead, the RF front end is added to the antenna and then connected to the frequency conversion module in the extension unit via cables. This results in a cumbersome and heavy system, hindering integration.

[0003] It can be seen that there is still room for improvement in the existing communication frequency conversion modules. They should be optimized to improve their integration, streamline their external dimensions and facilitate flexible installation. Therefore, it is necessary to propose more reasonable technical solutions to solve the technical problems existing in the existing technology. Utility Model Content

[0004] To overcome at least one of the above-mentioned defects, the present invention proposes a multi-channel ultra-wideband miniaturized frequency conversion module, which, through structural adjustment and optimization, streamlines the overall size for flexible installation and improves the module's integration.

[0005] In order to achieve the above objectives, the frequency conversion module disclosed in the present invention can adopt the following technical solutions:

[0006] The multi-channel ultra-wideband miniaturized frequency conversion module includes four layers of dielectric substrates stacked vertically. A top microstrip is provided on the top dielectric substrate, and a bottom microstrip is provided on the bottom dielectric substrate. The top microstrip and the bottom microstrip are connected by signal columns to form a vertical interconnection structure; a number of signal pins are also provided on the outside of the top microstrip and the bottom microstrip. The signal pins pass through the four layers of dielectric substrates and form connecting pins at the bottom.

[0007] The frequency conversion module disclosed above uses a composite dielectric material plate as the installation base and is processed through the SIP packaging process. The resulting frequency conversion module interconnects the radio frequency and control signals through a vertical interconnection structure. This structure will reduce the size of the interconnection connector and is conducive to the miniaturization of the overall structure.

[0008] Furthermore, various solutions are possible for disposing the signal posts, and these solutions are not intended to be exclusive. Here, we propose a feasible optimization option: longitudinally aligned signal vias are formed between the dielectric substrates, and the signal posts are disposed within the vias. In this solution, the signal posts and the dielectric substrates can employ an interference fit, a clearance fit, or a simultaneous connector on the top and bottom dielectric substrates to secure the signal posts. Alternatively, the signal posts can be secured by welding or sintering to form a single structure.

[0009] Furthermore, the dielectric substrate can be made of a variety of materials. To achieve better signal transmission in practical applications, we propose a feasible option: a dielectric substrate comprising a metal-ceramic plate. This solution reduces interference from external signals on internal signals, maintaining stable and reliable internal signal transmission.

[0010] Furthermore, to stably connect the signal post, a solution can be employed: solder pads are provided between adjacent dielectric substrates, with a solder pad through-hole disposed in the middle of the pads. The signal post passes through the solder pad through-hole and engages with the pads. In this solution, the solder pads securely connect the signal post to the dielectric substrate as a whole, and the solder pads can be made of metal.

[0011] Furthermore, the present invention incorporates the following structure in conjunction with the signal post: a matching diaphragm is formed between the second and third dielectric substrates, which is then sheathed onto the signal post and bonded to the pad. This arrangement helps store charge and stabilize voltage, thereby providing filtering and circuit protection.

[0012] Furthermore, the signal pin can be positioned in a variety of ways, not necessarily in a single manner. Here, we propose a feasible optimization method: a metal through-hole is provided on the dielectric substrate and connected to form a probe channel, and the signal pin is positioned within the probe channel. In this embodiment, the signal pin can be interference-fitted with the metal channel or welded or sintered to form an integrated structure.

[0013] Furthermore, the arrangement of the signal pins can be implemented in a variety of ways, and is not strictly limited. Here, we optimize and propose one feasible option: the signal pins are arranged circumferentially on the outside of the signal post, and the signal pins are arranged linearly on the outside of the top and bottom microstrips. In this arrangement, the signal pins are coaxial with the signal post.

[0014] Furthermore, in the present invention, microstrip grooves are provided on the top dielectric substrate and the bottom dielectric substrate and are used to install the top microstrip and the bottom microstrip respectively.

[0015] In practice, microwave signal interconnection utilizes a diaphragm-loaded microstrip-microstrip vertical interconnect structure. This structure utilizes a four-layer composite dielectric substrate with a metal matching diaphragm located in the middle metal layer. Microwave signals are transmitted from the top microstrip line to the signal via, and then output from the bottom microstrip line through the vertical interconnect structure. Signal pins surrounding the signal via are arranged in a circular array, forming a quasi-coaxial transmission zone.

[0016] Compared with the prior art, some of the beneficial effects of the technical solution disclosed in this utility model include:

[0017] The frequency conversion module disclosed in the present invention achieves a relatively better integration level and can reduce the size of the frequency conversion module, thereby expanding its application field and making its installation and use more flexible and diverse. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only represent some embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A schematic top view of the frequency conversion module.

[0020] Figure 2 This is a schematic diagram of the AA cross-section of the frequency conversion module.

[0021] Figure 3 The simulation model and simulation results of the frequency conversion module.

[0022] Figure 4 4 is a block diagram of a multi-channel ultra-wideband miniaturized frequency conversion module in an embodiment.

[0023] Figure 5 2 is a principle block diagram of the frequency conversion functional unit in the embodiment.

[0024] Figure 6 It is a principle block diagram of the frequency conversion control functional unit in the embodiment.

[0025] Figure 7 1 is a principle block diagram of the local oscillator and main control functional units in the embodiment.

[0026] In the above drawings, the meanings of the various marks are as follows:

[0027] 1. Dielectric substrate; 101. Top dielectric substrate; 102. Bottom dielectric substrate; 2. Top microstrip; 3. Bottom microstrip; 4. Signal column; 5. Signal pin; 6. Pad; 7. Matching diaphragm. DETAILED DESCRIPTION

[0028] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments.

[0029] In view of the fact that existing frequency conversion modules have low integration and large structural dimensions, resulting in inflexible applications, the following embodiments are optimized to overcome the defects in the prior art.

[0030] Example

[0031] like Figure 1 、 Figure 2 As shown, this embodiment provides a multi-channel ultra-wideband miniaturized frequency conversion module, including four dielectric substrates 1 stacked vertically, a top microstrip 2 provided on the top dielectric substrate 101, and a bottom microstrip 3 provided on the bottom dielectric substrate 102. The top microstrip 2 and the bottom microstrip 3 are connected by a signal column 4 to form a vertical interconnection structure; a plurality of signal pins 5 are further provided on the outer sides of the top microstrip 2 and the bottom microstrip 3. The signal pins 5 pass through the four dielectric substrates 1 and form connecting pins at the bottom.

[0032] The frequency conversion module disclosed in this embodiment uses a composite dielectric material plate as an installation base and is processed through a SIP packaging process. The resulting frequency conversion module interconnects radio frequency and control signals through a vertical interconnection structure. This structure will reduce the size of the interconnection connector and facilitate the miniaturization of the overall structure.

[0033] The frequency conversion module provided in this embodiment is a multifunctional frequency conversion module with integrated front-end and frequency conversion. The pins can be spread out through connection methods such as quick plug-in and the like, and can also be spread out through packaging forms such as QFN, and has strong compatibility. It uses a multi-layer ceramic substrate as a medium, which can fundamentally solve the problem of vertical signal interconnection. It is based on the SiP packaging process, which can fundamentally solve the size and weight problems of this type of module. Its miniaturization and packaged integration are conducive to the expansion and integration of multiple channels of the system.

[0034] There are various options for positioning the signal post 4, and these are not intended to be exclusive. This embodiment optimizes and employs one feasible option: longitudinally aligned signal vias are formed between the dielectric substrates 1, and the signal post 4 is disposed within the vias. In this arrangement, the signal post 4 and the dielectric substrates 1 can employ an interference fit, or a clearance fit, with connectors provided on the top dielectric substrate 101 and the bottom dielectric substrate 102 to secure the signal post 4, or the signal post 4 can be secured by welding or sintering to form an integral structure.

[0035] The dielectric substrate 1 can be made of a variety of materials. To achieve better signal transmission in practical applications, this embodiment optimizes and adopts one feasible option: the dielectric substrate 1 comprises a metal-ceramic plate. In this solution, the metal-ceramic plate helps reduce interference from external signals on internal signals, maintaining stable and reliable internal signal transmission.

[0036] To stably connect the signal posts 4, another solution can be adopted: solder pads 6 are provided between adjacent dielectric substrates 1, with solder pad through-holes defined in the middle of the solder pads 6. The signal posts 4 pass through the solder pad through-holes and connect to the solder pads 6. In this solution, the solder pads 6 securely connect the signal posts 4 to the dielectric substrate 1 as a whole, and the solder pads 6 can be made of metal.

[0037] This embodiment also incorporates the following structure in conjunction with signal post 4: a matching diaphragm 7 is formed between the second dielectric substrate 1 and the third dielectric substrate 1. The matching diaphragm 7 is sheathed around the signal post 4 and attached to the pad 6. This solution helps store charge and stabilize voltage, thereby providing filtering and circuit protection.

[0038] The signal pin 5 can be positioned in a variety of ways, and is not limited to a single method. This embodiment optimizes and adopts one feasible option: a metal through-hole is provided on the dielectric substrate 1, which is connected to form a probe channel, and the signal pin 5 is positioned in the probe channel. In this solution, the signal pin 5 can have an interference fit with the metal channel, or be welded or sintered to form an integral structure.

[0039] The arrangement of the signal pins 5 can be implemented in a variety of ways, and is not limited to a single arrangement. This embodiment optimizes and employs one feasible option: the signal pins 5 are arranged circumferentially around the outside of the signal post 4, and the signal pins 5 are arranged linearly around the outside of the top microstrip 2 and bottom microstrip 3. In this arrangement, the signal pins 5 are coaxial with the signal post 4.

[0040] In this embodiment, microstrip grooves are provided on the top dielectric substrate 101 and the bottom dielectric substrate 102 and are used to install the top microstrip 2 and the bottom microstrip 3 respectively.

[0041] In practice, microwave signal interconnection utilizes a diaphragm-loaded microstrip-microstrip vertical interconnect structure. This structure employs a four-layer composite dielectric substrate 1 with a metal matching diaphragm 7 located in the middle metal layer. Microwave signals are transmitted from the top microstrip 2 to the signal via, and then output from the bottom microstrip 3 via the vertical interconnect structure. Signal pins 5 surrounding the signal via are arranged in a circular array, forming a quasi-coaxial transmission zone.

[0042] In specific applications, such as Figure 2 The simulation model and simulation results of this technology are shown in Figure 2.

[0043] The simulation results show that the top dashed curve is the microstrip line S11 curve, which has an S11 below -25dB within the required frequency band, an insertion loss less than 0.25dB, and an intra-band ripple of 0.2dB. The solid curve is the single-mode loaded S11 curve, which has an S11 below -28dB within the required frequency band and an insertion loss less than 0.1dB. The bottom curve is the theoretical case of a 50-ohm load match, which has an S11 below -34dB within the required frequency band and an insertion loss less than 0.1dB. This shows that microwave signals transmitted through loaded microstrip-microstrip vertical interconnection transition holes have extremely low insertion loss and reflection. The simulation results also confirm that it is superior to conventional microstrip via structures and can replace coaxial connectors to achieve vertical interconnection of microwave signals.

[0044] Here is a practical example to illustrate the application of the frequency conversion module. Figure 3 As shown, in response to the technical requirements and problems of the above-mentioned multi-channel ultra-wideband miniaturized frequency conversion module, a method for addressing these technical requirements and problems for a 5-channel ultra-wideband miniaturized frequency conversion module (the number of channels can be expanded) is proposed. Figure 3 This is the module block diagram of the multi-channel ultra-wideband miniaturized frequency conversion module.

[0045] Among them, the three functional units of the multi-channel ultra-wideband miniaturized frequency conversion module are described in detail.

[0046] The first is the "frequency conversion" functional unit. It mainly completes the front-end amplification and down-conversion of 5-channel 0.35~18GHz signals or the up-conversion of 1.8GHz intermediate frequency signals. The fixed gain of down-conversion is about 37dB, the maximum instantaneous bandwidth supports 1GHz, the spurious suppression is not less than 60dBc, and the in-band flatness is not greater than ±2dB (needs to use Figure 1 、 Figure 2 The laminated structure design shown in the figure can achieve this indicator. Conventional designs can only achieve this indicator of ±3dB). The scalable dynamic range is 30dB. The up-conversion gain is 22dB, the instantaneous bandwidth supports a maximum of 1GHz, the non-harmonic spurious suppression is not less than 60dB, and the harmonic spurious suppression is not less than 40dBc. The channel amplitude consistency is not more than 2dB, and the channel phase consistency stability is not more than 20°@18GHz test. It has triple frequency conversion capability. Figure 4 This is its principle block diagram.

[0047] The second is the "frequency conversion control" functional unit. The frequency conversion control functional unit is mainly used to control the attenuation, switch, filter group, etc. in the "frequency conversion" functional unit, and generate various power supplies required by the "frequency conversion" functional unit. At the same time, it collects the status of the entire frequency conversion SiP module and outputs it to the outside through RS422 / RS232 / LVTTL and other interfaces. Figure 5 This is its principle block diagram.

[0048] This solution reorganizes the second and third units and designs them based on the SiP packaging process. The final design is a SiP module with independent frequency conversion function. The size of a single channel is close to 30×30mm and the weight is no more than 25g. Depending on different application scenarios, the module pin fan-out method can be QFN or connector. (It is necessary to use Figure 2 、 Figure 3 The signal transmission method and laminated structure design can avoid the use of connectors or insulators in the signal transmission process, and finally the size can be reduced to 30×30mm and the weight can be less than 25g).

[0049] The third is the "local oscillator and main control" functional unit. The local oscillator and main control functional unit is mainly used to control all internal frequency conversion SiP modules, local oscillator phase-locked loop and other circuits, and also has external communication functions. The three units can be customized according to the different packaging forms of the frequency conversion SiP, and can also be adapted for patch or connector installation and interconnection. Figure 6 、 Figure 7 As its principle block diagram, (need to use Figure 2 、 Figure 3 Only by using the signal transmission method and stacked structure design can the local oscillator signal be transmitted inside the small-sized platform. The conventional connector + cable method will increase the volume and weight of signal transmission).

[0050] Targeting the integrated reconnaissance, direction finding, and countermeasure fields of ultra-wideband (0.35-18GHz) and high instantaneous bandwidth (1GHz) radar communications, and especially the requirements for installation on various micro-sized platforms, the multi-channel ultra-wideband miniaturized frequency conversion module provided in this embodiment can be used to construct a multi-channel, ultra-wideband, high-bandwidth, large dynamic range, small size, and lightweight multi-channel transceiver system.

[0051] Due to its wide frequency range, large instantaneous bandwidth, and high integration, it is widely applicable to radar reconnaissance and countermeasures, communication reconnaissance and countermeasures, and integrated radar and communication systems. Furthermore, due to its small size and light weight, it is perfectly suited for various micro-UAV platforms, micro-swarm systems, and various missile-borne platforms.

[0052] The above are the implementation methods listed in this embodiment, but this embodiment is not limited to the above optional implementation methods. Those skilled in the art can arbitrarily combine the above methods to obtain other various implementation methods. Anyone can derive other various implementation methods based on the inspiration of this embodiment. The above specific implementation methods should not be understood as limiting the scope of protection of this embodiment. The scope of protection of this embodiment should be based on the definition in the claims.

Claims

1. Multi-channel ultra-wideband miniaturized frequency conversion module, characterized by: The invention comprises four dielectric substrates (1) stacked in a longitudinal direction, a top microstrip (2) being arranged on the top dielectric substrate (101), a bottom microstrip (3) being arranged on the bottom dielectric substrate (102), the top microstrip (2) and the bottom microstrip (3) being connected via a signal column (4) to form a vertical interconnection structure; and a plurality of signal pins (5) are further arranged on the outside of the top microstrip (2) and the bottom microstrip (3), the signal pins (5) passing through the four dielectric substrates (1) and forming connection pins at the bottom.

2. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1, characterized in that: A longitudinally aligned signal through hole is formed between the dielectric substrates (1), and the signal column (4) is arranged in the signal through hole.

3. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1 or 2, characterized in that: The dielectric substrate (1) comprises a metal ceramic plate.

4. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1 or 2, characterized in that: A soldering pad (6) is provided between adjacent dielectric substrates (1), a soldering pad through-hole is provided in the middle of the soldering pad (6), and the signal column (4) passes through the soldering pad through-hole and is connected and matched with the soldering pad (6).

5. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 4, characterized in that: A matching diaphragm (7) is formed between the second dielectric substrate (1) and the third dielectric substrate (1), and the matching diaphragm (7) is sleeved with the signal column (4) and fitted with the soldering pad (6).

6. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1, characterized in that: The dielectric substrate (1) is provided with metal through holes that are connected to form a probe channel, and the signal needle (5) is provided at the probe channel.

7. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1 or 6, characterized in that: The signal needles (5) are arranged at circumferential intervals on the outside of the signal column (4), and the signal needles (5) are arranged at linear intervals on the outside of the top microstrip (2) and the bottom microstrip (3).

8. The multi-channel ultra-wideband miniaturized frequency conversion module according to claim 1, characterized in that: Microstrip grooves are provided on the top dielectric substrate (101) and the bottom dielectric substrate (102) and are used to install the top microstrip (2) and the bottom microstrip (3) respectively.

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