Novel module PCB structure

Abstract

The utility model discloses a novel module PCB structure, and relates to the technical field of circuit board processing. The PCB comprises a PCB, a plurality of groups of embedded grooves are arranged on the surface of the PCB in a penetrating manner, capacitors are mounted in the embedded grooves, a photosensitive chip is arranged on the back of the PCB, the positions of the embedded grooves can be adjusted according to the actual positions of the capacitors, an integrated circuit is arranged on the surface of the PCB, and the capacitors are fixed by coating solder paste on the contact area of the surface of the PCB and the capacitors. According to the utility model, through pre-embedding the capacitor, the minimization structure design can be completed without adding a mold or a high-cost process, the overall cost is not changed, and the problem that the minimization design of the camera is limited by the distance of elements and the size of the elements is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a novel module PCB structure. Background Art

[0002] PCB, also known as printed circuit board, is an important electronic component. It is the support body of electronic components and the carrier for the electrical connection of electronic components. When in use, various electronic components are often installed in an integrated manner on it.

[0003] Currently, module industry applications use capacitors attached to PCBs. There is a large safety gap between the capacitor and the module's photosensitive IC, and there must also be a sufficient safety gap between the capacitor and the lens bracket. Furthermore, the size of the capacitor also limits the module's miniaturization design. As mobile phone and tablet cameras are becoming increasingly lighter, smaller, and thinner, there are greater requirements for component size. Therefore, reducing the size of the camera is an inevitable solution, which leads to the following problems:

[0004] 1. In existing common camera designs, the photosensitive chip and filter capacitor are all attached to the PCB surface. The distance between components and the size of the components themselves have limited the camera's minimal design.

[0005] 2. Some companies use glue to fix the capacitor, and the lens bracket is attached to the capacitor, which solves the problem of the safe distance between the bracket and the photosensitive chip filter capacitor and the size of the capacitor body, but does not avoid the problem of the safe distance between the capacitor and the photosensitive chip.

[0006] In view of this, the present utility model is proposed. Utility Model Content

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, provide a new module PCB structure, and solve the problems raised in the above-mentioned background technology.

[0008] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0009] A novel module PCB structure includes: a PCB board, wherein a plurality of embedded slots are provided on the surface of the PCB board, capacitors are installed in the embedded slots, and a photosensitive chip is provided on the back of the PCB board. The position of the embedded slots can be adjusted according to the actual position of the capacitors.

[0010] Optionally, an integrated circuit is provided on the surface of the PCB board, the capacitor is fixed by coating solder paste in the contact area between the capacitor and the PCB board surface, and the capacitor pin extends out of the embedded slot and is connected to the integrated circuit.

[0011] Optionally, a conductive contact is provided on a side of the PCB board, and the conductive contact is composed of multiple groups of metal copper sheets. The conductive contact is connected to the integrated circuit at one end close to the PCB board.

[0012] Optionally, a mounting groove is provided on the back of the PCB board at a position corresponding to the photosensitive chip, circular grooves are provided at the four corners of the photosensitive chip, and positioning posts are provided at the four corners corresponding to the mounting groove, and the positioning posts and the side surfaces of the circular groove fit together.

[0013] Optionally, a heat dissipation ring is attached to the front of the PCB board, and a heat dissipation strip is provided in the center of the heat dissipation ring longitudinally and attached to the surface of the capacitor. The heat dissipation ring and the heat dissipation strip are both made of copper sheet material, and the heat dissipation ring is fixed to the PCB board by glue.

[0014] Optionally, mounting holes are provided at diagonal positions at both ends of the PCB board, and the size of the mounting holes needs to be determined according to the corresponding mounting columns of the actual PCB board.

[0015] Optionally, when the capacitor is installed in the embedded slot and fixed, it needs to maintain a certain safety distance from the bonding surface of the photosensitive chip.

[0016] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described below at the same time:

[0017] 1. The new module PCB structure has a simple process. By pre-embedded capacitors, this minimalist structural design can be completed without adding molds or high-cost processes. The overall cost remains unchanged, effectively solving the problem that component distance and component size have limited the camera's minimalist design.

[0018] 2. In this new module PCB structure, after the capacitor is built into the PCB board, the installation position of the photosensitive chip is expanded, and the corresponding overall module reduction rate can be minimized. Not only does it wrap the XY axis, but the module Z axis height can also remain unchanged or be reduced, thereby reducing the entire PCB structure and making it suitable for small machines with more compact structural space.

[0019] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0021] In the picture:

[0022] Figure 1 This is a front view of the structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the back side of the structure of the utility model;

[0024] Figure 3 This is a cross-sectional view of the structure of the utility model.

[0025] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0026] 1. PCB board; 2. Capacitor; 3. Photosensitive chip; 4. Solder paste; 5. Conductive contact; 6. Heat sink; 7. Mounting hole.

[0027] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0028] The present invention will now be described in further detail with reference to the accompanying drawings.

[0029] See also Figure 1-3 As shown, in this embodiment, a new module PCB structure is provided, including a PCB board 1, wherein a plurality of embedded grooves are provided on the surface of the PCB board 1, capacitors 2 are installed in the embedded grooves, and a photosensitive chip 3 is provided on the back of the PCB board 1, and the position of the embedded groove can be adjusted according to the actual position of the capacitor 2.

[0030] In this embodiment, in the PCB module industry, the structural principle of a conventional camera module is that the connector, photosensitive chip, filter capacitor of the photosensitive chip, lens bracket, etc. are all attached to the surface of the PCB board 1, and the signal and power connection with the customer's mainboard is carried out through the connector. The photosensitive chip capacitor is an essential component for providing clean power to the photosensitive chip.

[0031] An integrated circuit is provided on the surface of the PCB board 1, and the capacitor 2 is fixed on the surface of the PCB board 1 by coating solder paste 4 in the contact area between the capacitor and the integrated circuit. The pins of the capacitor 2 extend out of the embedded slot and are connected to the integrated circuit.

[0032] In this embodiment, during the SMT process, one side of the PCB photosensitive chip 3 is attached to the back of the PCB board 1, and the capacitor embedded in the PCB is attached to the front of the PCB board 1. Then, solder paste 4 is poured into it to make the capacitor and the PCB circuit conductive. When the capacitor 2 is completely embedded, the embedding time distance needs to be controlled, and the capacitor 2 can be fixed by cold pressing and then hot pressing.

[0033] Among them, a conductive contact piece 5 is provided on the side of the PCB board 1. The conductive contact piece 5 is composed of multiple groups of metal copper sheets. The conductive contact piece 5 is connected to the integrated circuit at one end close to the PCB board 1.

[0034] In this embodiment, the integrated circuit connects the capacitor and the conductive contact 5 to form a current loop, and the external power supply supplies power to the components on the PCB board 1 through the conductive contact 5 .

[0035] Among them, a mounting groove is opened at the corresponding position of the photosensitive chip 3 on the back of the PCB board 1, and circular grooves are opened at the four corners of the photosensitive chip 3. Positioning columns are set at the four corners corresponding to the mounting groove, and the positioning columns and the side surfaces of the circular groove fit together.

[0036] In this embodiment, the photosensitive chip 3 is fixedly attached by aligning the circular grooves at the four corners with the positioning posts in the installation groove, which is used to position the photosensitive chip 3 and fix it to prevent shaking.

[0037] Among them, a heat dissipation ring 6 is attached to the front of the PCB board 1, and a heat dissipation strip is provided in the center of the heat dissipation ring 6 and attached to the surface of the capacitor 2. The heat dissipation ring 6 and the heat dissipation strip are both made of copper sheet material, and the heat dissipation ring 6 is fixed to the PCB board 1 by glue.

[0038] In this embodiment, the heat dissipation ring 6 transfers and absorbs heat through the heat dissipation strip attached to the capacitor 2 to prevent the heat generated by the capacitor 2 from being unable to be discharged when working for a long time. The heat is transferred from the heat dissipation strip to the heat dissipation ring 6, and the larger surface area of ​​the heat dissipation ring 6 is used to quickly dissipate the heat to complete the cooling. The heat dissipation ring 6 needs to be thin enough to ensure that it does not affect the thickness of the entire PCB board 1.

[0039] Among them, mounting holes 7 are opened at the diagonal positions at both ends of the PCB board 1, and the size of the mounting holes 7 needs to be determined according to the corresponding mounting columns of the actual PCB board 1.

[0040] In this embodiment, the mounting holes 7 are aligned with the mounting posts on the PCB board 1 and inserted therein to fix the PCB board 1 .

[0041] Among them, when the capacitor 2 is installed into the embedded groove and fixed, it needs to maintain a certain safety distance from the bonding surface of the photosensitive chip 3.

[0042] In this embodiment, the capacitor 2 and the photosensitive chip 3 will be electrically conductive to each other and cause damage to the components. Therefore, it is necessary to avoid close bonding.

[0043] Working principle: By embedding capacitor 2 into the PCB, a portion of the area just below where the photosensitive chip 3 is attached can be hollowed out so that capacitor 2 can be embedded. Alternatively, capacitor 2 can be buried where the lens bracket is attached. This can maximize the solution to the problem of capacitor 2 body size and safety spacing, and the problem of no further size reduction can be solved.

[0044] There is no absolute requirement for the thickness of PCB 1 and capacitor 2. If PCB 1 is thinner than capacitor 2, some capacitors 2 may be exposed outside PCB 1. During assembly and testing, the capacitors can be partially hollowed out. This may result in the following two situations.

[0045] 1. Capacitor 2 is buried in PCB board 1: The capacitor cannot be seen on both sides of PCB board 1. When PCB board 1 is manufactured, the middle of the board needs to be hollowed out, and then capacitor 2 is placed in it. Then, a four-wire test is performed on the circuit to test the capacitance of circuit 2.

[0046] 2. Capacitor 2 is attached to the inside of PCB 1. If PCB 1 is not completely hollowed out, capacitor 2 can be seen on one side. When it is time to attach photosensitive chip 3, solder paste 4 is sprayed or otherwise added to the capacitor 2 position, and then heated to secure capacitor 2. When capacitor 2 is visible on the side where photosensitive chip 3 is attached, capacitor 2 must not be exposed from the PCB 1 surface, and capacitor 2 must not protrude after SMT.

[0047] The present invention is not limited to the above-described embodiments. Any structural changes made under the guidance of the present invention should be understood by anyone. Any technical solution that is the same or similar to the present invention falls within the scope of protection of the present invention. The technology, shape, and structure not described in detail in the present invention are all known technologies.

Claims

1. A new module PCB structure, characterized in that: include: A PCB (1) is provided with a plurality of embedded slots on the surface of the PCB (1), wherein capacitors (2) are installed in the embedded slots, a photosensitive chip (3) is provided on the back of the PCB (1), and the position of the embedded slots can be adjusted according to the actual position of the capacitors (2), an integrated circuit is provided on the surface of the PCB (1), and the capacitors (2) are fixed on the surface of the PCB (1) by coating solder paste (4) in a contact area between the capacitors (2) and the PCB (1), and the pins of the capacitors (2) extend out of the embedded slots and are connected to the integrated circuit.

2. The novel module PCB structure according to claim 1, characterized in that: A conductive contact sheet (5) is provided on the side of the PCB board (1), the conductive contact sheet (5) being composed of a plurality of groups of metal copper sheets, and the conductive contact sheet (5) is connected to the integrated circuit at one end close to the PCB board (1).

3. The novel module PCB structure according to claim 1, characterized in that: The back of the PCB board (1) is provided with a mounting groove at a position corresponding to the photosensitive chip (3), and circular grooves are provided at the four corners of the photosensitive chip (3). Positioning posts are provided at the four corners corresponding to the mounting groove, and the positioning posts and the side surfaces of the circular groove fit together.

4. The novel module PCB structure according to claim 1, characterized in that: A heat dissipation ring (6) is attached to the front of the PCB board (1), and a heat dissipation strip is provided in the center of the heat dissipation ring (6) in the longitudinal direction and attached to the surface of the capacitor (2). Both the heat dissipation ring (6) and the heat dissipation strip are made of copper sheet material, and the heat dissipation ring (6) is fixed to the PCB board (1) by glue.

5. The novel module PCB structure according to claim 1, characterized in that: Mounting holes (7) are provided at diagonal positions at both ends of the PCB board (1), and the size of the mounting holes (7) needs to be determined according to the corresponding mounting columns of the actual PCB board (1).

6. The novel module PCB structure according to claim 1, characterized in that: When the capacitor (2) is installed in the embedded groove and fixed, it is necessary to maintain a certain safety distance from the bonding surface of the photosensitive chip (3).

Images